3m - presentation thermo siphons 3-07
TRANSCRIPT
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3 Innovation 1
3M Thermosyphon Technology for Passive 2-Phase Cooling of Electronics
March 2007
Phil E. TumaAdvanced Application Development Specialist
3M Electronic Markets Materials Division651-737-9895
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3 Innovation 2
Introduction• 3M has manufactured fluorinated heat
transfer fluids since the 1950s
• Historically, these fluids were used in high value military or specialty applications
• For the past few years, 3M has been researching passive 2-phase or “Thermosyphon” technology for use in mainstream electronics
– 3M has published papers and builds thermosyphon prototypes to showcase that technology and prove feasibility
– 3M hopes to sell working fluids and boiling surfaces for thermosyphon manufacturers
– 3M works with electronics OEMs to help pull through the technology
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3 Innovation 3
Air Cooled Thermosyphon
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3 Innovation 4
• Terminology
– Thermosyphon performance characterized by the sink-to-ambient thermal resistance, Rsa=Rsf+Rfa
– The Evaporator performance is characterized by the sink-to-fluid thermal resistance,
Rsf=(Ts-Tf)/Q
– The Condenser performance is characterized by the fluid-to-ambient thermal resistance,
Rfa=(Tf-Ta)/Q
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3 Innovation 5
• Product/Technology Offerings– 3M Will Supply Materials and technologies to spur the adoption of
thermosyphon technology.
Working Fluid
Boiling Materials/Technology
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3 Innovation 6
• 3M Novec™ Hydrofluoroether Working Fluids– Clear, colorless, nearly odorless– Excellent toxicological properties– Non-conductive Dielectrics– Environmentally favorable properties
• This is not true of HFC refrigerants which are discouraged by global environmental regulations
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3 Innovation 7
Working Fluid
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3 Innovation 8
Working Fluid
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3 Innovation 9
0
2
4
6
8
10
12
0 20 40 60 80 100Q" [W/cm2]
H [W
/cm
2 -K]
Prior Art, Fluorinert ~1atmPrior Art, Water 4kPaPrior Art, Fluorinert ~1 atmSmooth Flat Surface, Novec ~1 atm3M Coating, Flat Surface, Novec ~1atm3M Coating, Fins, Novec~1atm
Performance of 3M Boiling Enhancement Coating under conditions of uniform heat flux
Q” = Q / AreaH = Q” / (Tw-Tsat)
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3 Innovation 10
Typical Rsf Values for 3M boilers applied to various heat source sizes
Taken from: Tuma, P.E. , “Evaporator/Boiler Design for Thermosyphons Utilizing Segregated Hydrofluoroether Working Fluids,” Proc. Semitherm 2006
Typical ModernMicroprocessor
Values
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3 Innovation 11
Specifications (cont)Condenser Design #7 in Figure Below
Note: 1m3/min=35CFM
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3 Innovation 12
Example – Air Cooled Thermosyphon
SpecificationsCondenser Dimensions 115x120x19mmMass 380gCapacity 200W
Design Orientations 2 (90°apart)
Horizontal Mother Board Vertical Mother Board
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3 Innovation 13
Specifications (cont)Condenser Design #7 in Figure Below
Taken from: Tuma, P.E., et al , “Condenser Design for Thermosyphons Utilizing Segregated Hydrofluoroether Working Fluids,” Proc. Semitherm2007
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3 Innovation 14
• This thermosyphon was tested on a 25x25mm copper heater from 50-200W – “Chip” temperature, Tc, was measured 1mm from the
heater surface– “Ambient” temperature, Ta, was measured at fan inlet– Fan was Panasonic FBL12G12H
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3 Innovation 15
1x1mm Thermocouple “Sink” Groove, Ts
66x112mm Mounting Plate120mm Thermosyphon
Thermocouple Well, Tsat
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3 Innovation 16
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3 Innovation 17
• 3M has built and tested a 120mm thermosyphon that will produce Rsa<0.08 C/W at over 200W with <2 m3/min airflow at ΔP~2mm H2O
• Rsa<0.068 C/W is possible with a deeper 120mm condenser like #8 and has been demonstrated
• Remote form factors are possible
• Clear evaporators can be employed for gaming applications
Conclusion/Summary
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3 Innovation 18
3M Thermosyphon in ATX Chassis
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3 Innovation 19
Clear glass evaporator with immersion-cooled high intensity LED to illuminate boiling process
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3 Innovation 20
Evaporator Close up
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3 Innovation 21
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3 Innovation 22
3M Thermosyphon in Dell E520
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3 Innovation 23
Install
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3 Innovation 24
Evaporator Close up
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3 Innovation 25
3M Thermosyphon in Xbox 360
CPU GPUStock Heat Sinks 43.4 31.2Thermosyphon 23.9 19.2
ΔTja
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3 Innovation 26
3M Thermosyphon, 320gBrass Copper Const.92x92mm face area
690g XP90C4 heat pipe heat sinkAll Copper95x95mm face area
Case-to-ambient thermal resistance on 25mm heat source with same 92mm fan