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Rad Hard Microelectronics

A comprehensive range of radiation hardened integrated circuit solutions

SHORT-FORM PRODUCT CATALOG

Honeywell – Your Total Integrated Circuit (IC) Provider

SOI CMOS Delivers Low Noise And High Performance Ideal for Analog and Mixed Signal ICs

To endure harsh environments in space,

including total dose radiation, transient

phenomena and extreme temperatures,

aerospace systems require intelligent,

radiation-hardened components.

Honeywell’s products and foundry services

offer benefits beyond a high reliability

radiation hardened construction to ensure

systems perform accurately under severe

radiation environments and operating

conditions. Honeywell’s Silicon On

Insulator (SOI) CMOS process offers high

levels of integration, minimized power

dissipation and high performance to

enable reliable, cost-effective products for

space military and commercial markets.

Our customers benefit from Honeywell’s

ASIC, System-on-Chip (SoC) and

MultiChip Module solutions to facilitate

reduction in size, weight and power.

Honeywell is the first facility to offer

150-nanometer radiation hardened

technology in the world. When coupled

with our patented SOI process, our

products are the most reliable, high

performing integrated circuits available

in the industry. Best of all, our customers

benefit from the reliability and cost-

effective advantages of our leading

technologies.

Value-added services

Whether your needs are on a project-by-

project or ongoing basis, we provide the

flexibility you need by offering a complete

package of engineering and production

services:

• Design services – advanced design

expertise and customer support to

ensure success of your strategic ICs,

from existing, standard designs to next-

generation, high-density standard cell

and gate array ASICs.

• Test services – cost-effective testing

of your products using advanced test

hardware and software tools. Our test

data management system combines

the hardware for data storage, mapping,

analysis and customized reporting.

• Packaging services – packages

manufactured and screened to meet

the demanding electrical, thermal

and radiation requirements of space

and military applications.

As the Future BringsMore Options, WeProduce Flexible,Complete SolutionsOver the past three decades, Honeywell

has been a leading provider of high

reliability Integrated Circuit (IC) solutions

for aerospace using advanced

technologies designed to withstand

the harshest of elements produced

by aerospace environments.

To ensure future generation products

launched into space and integrated

into military systems can stand the test

of time, we continue to expand our

technology capabilities, ASIC platforms,

design capabilities and standard products.

Honeywell has a 150 nanometer* SOI

process for development of multi-million

gate HX5000 radiation hardened and

radiation tolerant ICs. HX5000 is

supported by the Synopsys ASIC

design tools and flow. This technology

has also spawned higher density

SRAM/MRAM products, 3.18Gb/s

SERDES macros and cost efficient

Structure ASICs.

By optimizing our unique, reliable

technology, Honeywell will enable

commercial and military customers

to produce the highest performing,

reliable products needed for electronic

computer systems in satellites, strategic

missiles, space borne systems and

tactical applications.

By partnering with Honeywell for your

program products or foundry services,

you’re teaming up with a world leader

in SOI technology with over 30 years of

experience in specialized IC designing,

development and manufacturing.

150nm Radiation Hardened QML Process and Products

• 3Gb/s SERDES

• 14 Bit ADC, 125MS/s

• Digital ASICs up to 15M gates

• 16M Monolithic SRAM

RADIATION TYPE SPECIFICATION

Total Dose > 1Mrad

Dose Rate Survivability > 1x1012 rad(Si)/s

Dose Rate Upset > 1x1010 rad(Si)/s

Neutron ≥ 1x1014 N/cm2

Latchup SOI CMOS Immune to latchup

Single Event Upset < 1x10-15 Data Bit Errors/Bits Sent (SERDES)

Honeywell – Your Total Integrated Circuit (IC) Provider

SOI CMOS Delivers Low Noise And High Performance Ideal for Analog and Mixed Signal ICs

To endure harsh environments in space,

including total dose radiation, transient

phenomena and extreme temperatures,

aerospace systems require intelligent,

radiation-hardened components.

Honeywell’s products and foundry services

offer benefits beyond a high reliability

radiation hardened construction to ensure

systems perform accurately under severe

radiation environments and operating

conditions. Honeywell’s Silicon On

Insulator (SOI) CMOS process offers high

levels of integration, minimized power

dissipation and high performance to

enable reliable, cost-effective products for

space military and commercial markets.

Our customers benefit from Honeywell’s

ASIC, System-on-Chip (SoC) and

MultiChip Module solutions to facilitate

reduction in size, weight and power.

Honeywell is the first facility to offer

150-nanometer radiation hardened

technology in the world. When coupled

with our patented SOI process, our

products are the most reliable, high

performing integrated circuits available

in the industry. Best of all, our customers

benefit from the reliability and cost-

effective advantages of our leading

technologies.

Value-added services

Whether your needs are on a project-by-

project or ongoing basis, we provide the

flexibility you need by offering a complete

package of engineering and production

services:

• Design services – advanced design

expertise and customer support to

ensure success of your strategic ICs,

from existing, standard designs to next-

generation, high-density standard cell

and gate array ASICs.

• Test services – cost-effective testing

of your products using advanced test

hardware and software tools. Our test

data management system combines

the hardware for data storage, mapping,

analysis and customized reporting.

• Packaging services – packages

manufactured and screened to meet

the demanding electrical, thermal

and radiation requirements of space

and military applications.

As the Future BringsMore Options, WeProduce Flexible,Complete SolutionsOver the past three decades, Honeywell

has been a leading provider of high

reliability Integrated Circuit (IC) solutions

for aerospace using advanced

technologies designed to withstand

the harshest of elements produced

by aerospace environments.

To ensure future generation products

launched into space and integrated

into military systems can stand the test

of time, we continue to expand our

technology capabilities, ASIC platforms,

design capabilities and standard products.

Honeywell has a 150 nanometer* SOI

process for development of multi-million

gate HX5000 radiation hardened and

radiation tolerant ICs. HX5000 is

supported by the Synopsys ASIC

design tools and flow. This technology

has also spawned higher density

SRAM/MRAM products, 3.18Gb/s

SERDES macros and cost efficient

Structure ASICs.

By optimizing our unique, reliable

technology, Honeywell will enable

commercial and military customers

to produce the highest performing,

reliable products needed for electronic

computer systems in satellites, strategic

missiles, space borne systems and

tactical applications.

By partnering with Honeywell for your

program products or foundry services,

you’re teaming up with a world leader

in SOI technology with over 30 years of

experience in specialized IC designing,

development and manufacturing.

150nm Radiation Hardened QML Process and Products

• 3Gb/s SERDES

• 14 Bit ADC, 125MS/s

• Digital ASICs up to 15M gates

• 16M Monolithic SRAM

RADIATION TYPE SPECIFICATION

Total Dose > 1Mrad

Dose Rate Survivability > 1x1012 rad(Si)/s

Dose Rate Upset > 1x1010 rad(Si)/s

Neutron ≥ 1x1014 N/cm2

Latchup SOI CMOS Immune to latchup

Single Event Upset < 1x10-15 Data Bit Errors/Bits Sent (SERDES)

Static Random Access Memory (SRAM)PART NUMBER CONFIGURATION VOLTAGE (V) MAXIMUM ACCESS/CLOCK (NS) TOTAL DOSE

(RAD[SI])SINGLE-EVENT UPSET (UPSETS/BIT-DAY)

PROMPT-DOSE UPSET (RAD[SI]/S)

PROMPT-DOSE SURVIVABILITY(RAD[SI]/S)

LATCHUP PACKAGE QUALIFIED SMD NO.

HX6256 32k x8 5.0 <25 1M <1x10-10 ≥1x109 ≥1x1011 Immune 28 CQFP36 CQFP

QML V, Q 5962-95845

HLX6256 32k x8 3.3 <25 1M <1x10-10 ≥1x109 ≥1x1011 Immune 28 CQFP 36 CQFP

HX6356 32k x8 5.0 <25 1M <1x10-10 ≥1x1011 ≥1x1012 Immune 28 CQFP 36 CQFP

5962-95845

QML V, Q 5962-98537

HX6136 1k x36 FIFO 5.0 R: <36, W: <24 1M <1x10-10 ≥1x109 ≥1x1011 Immune 132 CQFP

HX6408 512k x8 3.3 <20 1M <1x10-10 ≥1x1010 ≥1x1012 Immune 36 CQFP QML V, Q 5962-06203

HXS6408 512k x8 1.8 or 3.3 R: <15, W: <10 1M <1x10-10 ≥1x109 ≥1x1011 Immune 36 CQFP QML V, Q 5962-08215

HRT6408 512k x8 1.8 or 3.3 R: <15, W: <10 300k <1x10-10 ≥1x109 ≥1x1011 Immune 36 CQFP

HXSR01608 2M x8 1.8, 2.5, 3.3 R: <20, W: <12 1M <1x10-12 ≥1x1010 ≥1x1012 Immune 40 CQFP QML V, Q 5962-08202

HLXSR01608 2M x8 1.5, 3.3 R: <25, W: <12 1M <1x10-12 ≥1x1010 ≥1x1012 Immune 86 CQFP QML V, Q 5962-08202

HXSR01632 512k x32 1.8, 2.5, 3.3 R: <20, W: <12 1M <1x10-12 ≥1x1010 ≥1x1012 Immune 86 CQFP QML V, Q 5962-08203

HLXSR01632 512k x32 1.5, 3.3 R: <25, W: <12 1M <1x10-12 ≥1x1010 ≥1x1012 Immune 86 CQFP QML V, Q 5962-08203

HXSR06432 2M x32 1.8, 2.5, 3.3 R: <20, W: <12 1M <1x10-12 ≥1x1010 ≥1x1012 Immune 86 CQFP QML V, Q

Non-Volatile Magneto-Resistive Random Access Memory (MRAM)PART NUMBER CONFIGURATION VOLTAGE (V) MAXIMUM ACCESS/CLOCK (NS) TOTAL DOSE

(RAD[SI])SINGLE-EVENT UPSET(UPSETS/BIT-DAY)

HXNV0100 64k x16 1.8, 3.3 R: <80, W: <140 1M <1x10-10 ≥1x109 ≥1x1012 Immune 64 CQFP QML V, Q Not yet available

HXNV01600 16Mb (x8 or x16) 3.3 R: <90, W: <150 1M <1x10-10 ≥1x109 ≥1x1012 Immune 76 CQFP

Digital LogicPART NUMBER CONFIGURATION VOLTAGE (V) PROP DELAY (NS) TOTAL DOSE

HXNAND00 Quad 2-input 3.3 4.0 (typ), 6.6 (max) 300k NA 1x109 1x1012 Immune 14 pin CFP QML V, Q 5962-07A07

PART NUMBER CONFIGURATION VOLTAGE (V) CLOCK FREQUENCY (MHZ) TOTAL DOSE (RAD[SI])

SINGLE-EVENT UPSET (UPSETS/DEVICE-DAY)

HX1750 16 bit 5.0 40 100k <1x10-5 NA NA Immune 121 PGA112 LCC100 PGA

QML Q 5962-05207

RHPPC 32 bit (603e) 3.3 80 300k <1x10-5 NA NA Immune 240 CQFP255 LGA/BGA

QML V, Q 5962-07A01

SRAM and Non-Volatile MRAM Memory Products

For high speed, low power consumption

data storage applications, including

strategic systems, Honeywell’s SOI

Static Random Access Memory (SRAM)

and Non-Volatile Magneto-Resistive RAM

(MRAM) family provides reliable solutions.

Our SRAM product family is fabricated

with our patented SOI CMOS technology

and is available in sizes ranging from

256k bits to 16 Mbits in a monolithic

chip, with 64 Mbits and greater in

MultiChip Modules (MCM).

Notes: R= READ, W=WRITE

Processors