3d s en sor testbeams at fnal
Post on 01-Jan-2016
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3D s en sor testbeams at FNAL. M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira. FBK ATL A S09 ( QUALIFICATION BATCH ). Different wafer thicknesses: 200- 230 -250 m m Slim edge (200 m m on two sides). Expected low leakage current and high breakdown. 1E. 1E. 1E. 1E. - PowerPoint PPT Presentation
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3D sensor testbeams at FNAL
M. Arneodo, M. Obertino, M. Ruspa, A. Solano, A. Vilela Pereira
1E
FBK ATLAS09 (QUALIFICATION BATCH)
CMS pixel detectors
1E
1E
Different wafer thicknesses: 200-230-250 m
Slim edge (200 m on two sides)
1E
Lots of wafers available, but …waiting for a general agreement with ATLAS about the use of CMS sensors
Expected low leakage current and high breakdown.
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