cnfet technology

Carbon Nanotube Field Effect Transistor

Economics

Speed

Reliability/Ease of Use

Packing more functions into an IC

DONE BY SHRINKING SIZE!!!

Since 1960 Electronics Industry has been driven by:

Ref: [9]

Mantra of Electronic manufacturers:

BEAT THE MOORE’s LAW

Ref: [10]

2016: Gate length<10 nm

E=𝑉

𝐿

Reason:

• Some of the device parameters such as bandgap (Eg) and built in junction potential are material parameters and cannot be scaled.

• The threshold (Vth) cannot be scaled due to leakage considerations.

Leakage Currents Extreme Short Channel Effects High Field Effects Process variation

Vth

Id

Vgs

90mV/decade (usually)60mV/decade (highest possible)

Leakage current

As size decreases, electric field in channel increases which leads to high kinetic

energy of electrons and holes (hot carriers) which penetrate into the gate oxide

and temper the threshold voltage.

Ref: [1]

DIBL-Drain Induced Barrier Lowering& Punch through

Fig Ref: Prof. Saraswat Lecture notes, Stanford University

The two main factors in process variation are:

1.Variation in process parameters such as the oxide thickness, impurity concentration and diffusion depths (causes variation in threshold voltage and sheet resistance)

2. Variation due to lithographic limits (causes W/L ratios to deviate)

As the gate length reaches nanometer range, the number of atoms comprising the gate will shrink and the properties of bulk do not hold.

In the nanometer range, process variation has the potential to cause drastic changes to the transistor parameters.

Ref: Rabaey, J.M., Chandrakasan, A. , Nikolic, B., Digital Integrated Circuits Second Edition, 2002, Prentice-Hall

Due to the sp2 hybridization, the geometry of graphene is planar with the three bonds being at an angle of 120 degrees to each other.

The planar geometry of sp2 hybrid orbitals gives rise to a hexagonal lattice structure of graphene.

Ref: [5]

𝐶ℎ = 𝑛1. 𝑎1 + 𝑛2. 𝑎2

Wrapping vector

The indices (n1, n2) give different properties to the nanotube. Accordingly, three different kind of nanotube can be identified:1. Armchair (n1 = n2)2. Zig Zag (n1 = 0 or n2 = 0)3. Chiral (all other cases)

Ref: [5]

𝐶ℎ = 𝑛1. 𝑎1 + 𝑛2. 𝑎2

Wrapping vector

Electrical conductivity:

1.Metallic (when |n1−n2| is a multiple of 3) with zero bandgap2.Semiconducting with finite bandgap.

Ref: [5]

Currently based on the operation mechanism of CNFETs, they can be categorized as:

Schottky Barrier controlled FET: Their conductivity is controlled by the majority of carriers tunneling through the Schottky Barrier at the end contacts. Their performance and the ON current are determined not by the channel conductance, but by the contact resistance due to tunneling barriers at drain and source contacts. They exhibit ambipolarbehavior.

MOSFET like FET: These CNFETS have unipolar behavior as they either suppress electron or hole transport for pFET and nFET respectively. The conductivity is modulated by the gate to source bias voltage.

Ref: [4]

• The carbon nanotube field effect transistor is a three terminal device similar to the MOSFET.

• The semiconducting channel between the two contacts called drain and source consists of the nanotube.

• The channel is turned on/off electrostatically via the third contact: gate

Planar Device Coaxial Device

Ref: [4]

To determine the PMOS/NMOS ratio for CMOS, the transistor width (W) is modified.

In a CNFET, the number of CNTs is changed because a CNFET uses CNTs for the conducting channel between the source and the drain.

The width of the CNFET is increased when the number of CNTs in a CNFET is increased (similar to the width change in a MOSFET).

Quasi 1-D (ballistic) transport of electrons and holes:

The electrons in a carbon nanotube are confined to the atomic plane of the graphene. Since the structure of the CNT is quasi 1-D, the electrons in the tube are constrained. The electrons can only move along the axis of the tube.

Only forward and backward scattering is possible for the electrons and holes in the nanotube.

Experimentally observed mean-free-path is of the order of 1um (1,000 times the diameter of the tube) implies that carbon nanotubes have ballistic transport capability. [4]

High Drive Current/Large Transconductance:

For the p-CNTFET, the on-current per unit ~1500 μA/μm at a gate overdrive of 0.6V. This value is considerably higher than the ~500 μA/μm for a p-MOSFET at a gate overdrive of 0.6V.[14]

The maximum transconductance (dI/dVg) is observed to be 20uA/V at Vg = -0.9. This, as compared to a typical MOSFET, is a significantly better current generation by the device. [3]

Ref: [8]

Fig. Simulated I-V characteristicsof the CNFET [8]

High temperature resilience/ Strong covalent bond:

The atoms within a carbon nanotube molecule bond covalently in hexagonal rings, and this graphite-like structure has great strength and stability.

Electrically, this helps in significantly reducing electromigration, thereby allowing high current operation. [4]

Furthermore, carbon nanotubes conduct heat nearly as well as diamond, so extremely high device-packing densities should be possible [4]

Apart from these the CNFET has low intrinsic capacitance and near ideal sub-threshold slope. [2]

A 3 :1 (PMOS:NMOS) ratio is used when designing an inverter.

For the CNFET, a 1:1 (pFET:nFET) ratio is used because the nFET and the pFET have almost the same current driving capability with same transistor geometry [12]

The PDP and the maximum leakage power of the 32nm CNFET are about 100 times and 75 times lower than for the 32nm MOSFET.

Ref: [13]

Inverter Char at 32nm

The most attractive feature of the CNFET is its ballistic transport mechanism which gives a high intrinsic performance.

Process variation has less severe effects due to the inherent device structure and gate geometry.

While superior I-V characteristics of CNFET over MOSFET has been shown, no standard process technology is available and predictions on large circuits can only be made through simulations.

The present day large scale manufacturing is at 32nm node with Intel announcing 22nm node to be a reality very soon.

[1] Rabaey, J.M., Chandrakasan, A. , Nikolic, B., Digital Integrated Circuits Second Edition, 2002,

Prentice-Hall

[2] Ale, I., Hasan, M., Islam A. , Abbasi, S.A., “Optimized Design of a 32-nm CNFET-Based Low-

Power Ultra wideband CCII” IEEE Transactions On Nanotechnology, vol. 11, no. 6, pp. 1100-1108,

Nov. 2012

[3] P. L. McEuen, M. S. Fuhrer, and P. Hongkun, “Single-walled carbon nanotube electronics” IEEE

Transactions on Nanotechnology., vol. 1, no. 1, pp. 78–85, Mar. 2002

[4] Leonardo de Camargo e Castro, (2006) Modelling of Carbon Nanotube Field-Effect Transistor,

(Doctoral Dissertation), University of British Columbia

[5] Deng, J. (2007) Device Modelling And Circuit Performance Evaluation For Nanoscale Devices:

Silicon Technology Beyond 45 Nm Node And Carbon Nanotube Field Effect Transistors (Doctoral

Dissertation), Stanford University.

[6] Cho G, Kim Y-B, and Lombardi F: “Assessment of CNTFET based circuit performance and

robustness to PVT variations”. In Proceedings of the MWSCAS '09 52nd IEEE International

Midwest Symposium on Circuits and Systems: August 2–5: Cancun. New York: IEEE 2009,

2009:1106–1109.

[7] Moradinasab, Mahdi. Fathipour, Morteza. “High Performance SRAM based on CNFET”,

Ultimate Integration of Silicon, 2009. Pp.317-320, Mar. 2009

[8] A. Javey, J. Guo, D. B. Farmer, Q. Wang, E. Yenilmez, R. G. Gordon, M. Lundstrom, and H.

Dai, “Self-aligned ballistic molecular transistors and electrically parallel nanotube arrays,” Nano

Lett., vol. 4, no. 7, pp. 1319–1322, 2004.

[9] Murrae J. Bowden, “Moore’s Law and the Technology S-Curve” Current Issues in Technology

Management, winter 2004 Issue 1 Volume 8.

[10] Semiconductor Industry Association. (2005). International Technology Roadmap for

Semiconductors-2005, Update: Overview and Summaries, [Online]. Available:

http:ww.itrs.net/Links/2005, ITRS/Home 2005.htm

[11] D. J. Frank, R. H. Dennard, E. Nowak, P. M. Solomon, Y. Taur, and H. S. P.Wong, “Device

scaling limits of SiMOSFETS and their application dependencies,” in Proc. IEEE, vol. 89, no. 3,

pp. 259–288, Mar. 2001.

[12] J. Deng, and H.-S. P. Wong, "A Circuit-Compatible SPICE model for Enhancement Mode

Carbon Nanotube Field Effect Transistors," Proc. Intl. Conf. Simulation of Semiconductor

Processes and Devices, pp. 166-169, Sept., 2006

[13] Geunho Cho, Yong-Bin Kim, Fabrizio Lombardi , “Assessment of CNTFET Based Circuit

Performance and Robustness to PVT Variations” Circuits and Systems, 2009. MWSCAS '09. 52nd

IEEE International Midwest Symposium pp. 1106 – 1109

[14] S. Thompson, et al., IEDM Tech Digest, p. 257 (2001).

Kunwar M. Rehan

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