electrical engineering department robert mackinnon jr.prof. mustafa guvench presenter: robert...

Electrical Engineering DepartmentElectrical Engineering DepartmentPresenter: Robert MacKinnon Jr.Robert MacKinnon Jr. Advisor: Prof. Mustafa GuvenchProf. Mustafa Guvench

Coauthor: Joshua WardJoshua Ward

Electrical Engineering DepartmentElectrical Engineering DepartmentPresenter: Robert MacKinnon Jr.Robert MacKinnon Jr. Advisor: Prof. Mustafa GuvenchProf. Mustafa Guvench

Coauthor: Joshua WardJoshua Ward

Frequency Response of a

SOI-MEMS Resonator

Magnitude(yellow) & Phase(blue)

MEMS wire bonding diagram

SOI- MEMS chip, size 5 mm x 5 mm wire bonded

to a 44-pin J-LDCC gold package

Thick Film Heater, temperature as a function of power

Lab View Master Virtual Instrument

Computer Controlled Test System

Design of a Computer Controlled Test System for a SOI-MEMS Design of a Computer Controlled Test System for a SOI-MEMS Resonator Gas Sensor for High Temperature CharacterizationResonator Gas Sensor for High Temperature Characterization

This project involves the development of a computer-controlled test This project involves the development of a computer-controlled test system to measure and characterize the response of a Silicon on system to measure and characterize the response of a Silicon on Insulator (SOI) Micro-Electro-Mechanical Resonator (MEMR) to various Insulator (SOI) Micro-Electro-Mechanical Resonator (MEMR) to various gas mixtures and concentrations. This miniature device, developed by gas mixtures and concentrations. This miniature device, developed by Professor Guvench of the University of Southern Maine, will be Professor Guvench of the University of Southern Maine, will be ultimately be used for gas sensing and frequency control applications ultimately be used for gas sensing and frequency control applications in high temperature environments. The chip will be packaged in in high temperature environments. The chip will be packaged in combination with a thermocouple and heater element to facilitate combination with a thermocouple and heater element to facilitate testing of the chip for high temperature characterization. The control testing of the chip for high temperature characterization. The control system developed employs Lab View as the software platform for system developed employs Lab View as the software platform for interfacing, communication, data acquisition and control. A PID interfacing, communication, data acquisition and control. A PID control loop has been developed within the master Lab View program control loop has been developed within the master Lab View program to measure, monitor and maintain the temperature of the chip at a to measure, monitor and maintain the temperature of the chip at a predetermined test temperature. An IOtech Personal DAQ/Series 3000 predetermined test temperature. An IOtech Personal DAQ/Series 3000 data acquisition module is used to coordinate communication data acquisition module is used to coordinate communication between the Lab View Program and all inputs and outputs for the test between the Lab View Program and all inputs and outputs for the test system. The Lab View program also controls the injection time and system. The Lab View program also controls the injection time and flow rate of the gases and measures the frequency response of the flow rate of the gases and measures the frequency response of the resonator. The mechanical portions of the test system were designed resonator. The mechanical portions of the test system were designed to facilitate both redundancy and ease of replacement should to facilitate both redundancy and ease of replacement should maintenance become necessary.maintenance become necessary.

The project was funded by grants from:The project was funded by grants from:

NASA, Maine Space Grant Consortium and USM Faculty SenateNASA, Maine Space Grant Consortium and USM Faculty Senate