introducing pactech - packaging technologies corporate

Introducing

PacTech - Packaging Technologies

Corporate Profile

Technology & Product Overview

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PacTech Group - Corporate Profile

1995 PacTech GmbH founded in Berlin, Germany as spin-off

from Fraunhofer-IZM

1997 1st Manufacturing facility: PacTech GmbH, Nauen, Germany

2001 2nd Manufacturing facility: PacTech USA Inc., CA, USA

2005 Equipment Field Service & Support Center, Thailand

2006 NAGASE & Co., Ltd. takes 60% shares in PacTech

2008 3rd Manufacturing facility: PacTech Asia Sdn. Bhd., Malaysia

2009 NAGASE & Co., Ltd. increases shares in PacTech to 74%

2012 >800 Production Machines in the field

2013 >115 patents granted

2013 NAGASE & Co., Ltd. increases shares in PacTech to 97%

PacTech Group (Europe, USA, Asia): 240 employees

Annual sales revenue PacTech Group (2012): 35.75 Mio. €

(consolidated)

PacTech Europe (HQ)

PacTech USA

PacTech Asia

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Pac Tech Group - Worldwide Locations

PacTech / Nagase facilities

PacTech Asia Sdn. Bhd.Penang, Malaysia

Sales Agent / Distributor

NagaseTokyo, JapanNagase

Shanghai, China

PacTech GmbH Nauen, Germany

Tech

PacTech Customer Service CentreBangkok, Thailand Philippines

Taiwan

Singapore

Israel

Italy

France

Denmark

Sweden Finland

Korea

TokyoBoston

UK & IrelandRussia

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NAGASE & CO., Ltd.

Founded: June 18, 1832

Paid-in Capital: 100 million US$

Sales: 7.94 billion US$

Net Income: 154 million US$

Employees: 5,500 (Consolidated)

Stock: Listed TSE-1, OSE-1

Business Segments:

Chemicals: Petrochemicals, pigments, solvents, additives

Plastics: Resins, plastics, film or sheet products etc

Electronics: Materials for LCDs, semiconductor, consumer electronics etc

Life Science: Pharmaceuticals, food materials, cosmetics etc

25 mfg sites & 13 sales offices in Japan

17 mfg sites & 37 sales offices offshore

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Sales Revenue

0 €

10 €

20 €

30 €

40 €

1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

1,66 1,833,65

5,74 5,934,97

7,69

14,01

16,94

21,29

18,49

15,76

21,81

24,00

35,75

Milli

on

Eu

ro

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Selection of Key Customers

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PacTech Quality System Overview and Roadmap

PacTech GmbH has more than 18 years of quality manufacturing

experience in semiconductor industry

All PacTech sites are certified according to ISO quality system

standards

PacTech Germany – ISO 9001 & TS16949

PacTech USA – ISO 9001

PacTech Asia – ISO 9001 & ISO 14001

PacTech Asia is in progress for ISO/TS16949 certification

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Worldwide Subcontractor Services

Wafer Level Bumping & Packaging

Subcon Locations Available Processes Technology Roadmap

PacTech Asia

Penang, Malaysia

55,000 sqft

PacTech Europe

Nauen, Germany

20,000 sqft

PacTech USA

Santa Clara, CA, USA

10,000 sqft

Wafer Bumping

UBM & OPM Plating, e.g. eless NiAu

& NiPdAu, e-plate Cu & Au

NiFe Plating for MEMS

Solder Ball Attach / Solder Jetting

Wafer Level RDL (Low Volume)

CSP & BGA Ball Rework

Wafer Backside Metallization

Wafer Thinning

Single Wafer Etch

TiNiAg & TiNiAu Evaporation

Backend & Die Sort

Laser Marking, Sawing, Electrical Test,

Tape & Reel

FC-Assembly

Inspection

AOI

X-Ray Inspection

2014

Cu Pillars

Cu RDL

Die Embedding (fan out)

50µm Wafer Thinning

2015

Laser Dicing

TSV

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Advanced Packaging Equipment

PacTech Asia PacTech Europe PacTech USA

Sales & Demo Centre

Solder Jetting & BGA Rework/Repair:

SB²-M, SB²-SM, SB²-Jet

Wafer Level Solder Balling:

Ultra-SB² 200/300

Wafer Level Solder Rework/Repair:

Ultra-SB² 200/300 WLR

Flip Chip Bonder:

LAPLACE- FC, LAPLACE-Cap/-Can

Electroless Bumping Line:

PacLine 200/300 A50

Spin Coating System:

SpinPac ASC 200/300

Plasma Cleaning/Ashing:

PlasPac 200

Wafer Backside Marking:

LS² 200/300

Customized equipment for photovoltaic & solar

industry

LAPLACE-SOLTEC, LAPLACE-HT

Reflow Oven:

RFM/RFA 200/300

Sales & Demo Centre

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Business Unit A

Wafer Level Bumping & Packaging

- Subcontractor Service -

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PacTech’s WLP Services Overview

60%15%

10%

8%4% 3%

Fields of Application

Handphone/Tablet

Computer/ConsumerElectronics

Automotive

Medical

Defense/Aerospace

Others

25%

50%

10%

7%

4% 2% 2%

Device Types

Discretes

Power MOSFET

RFID

Filters

Optoelectronics

MEMS

Others

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Business Unit

Wafer Level Bumping & Packaging

- Wafer Level UBM -

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Electroless NiAu / NiPdAu Plating & Bumping Services

1. E-less Bumping RFID attach by adhesive on

antenna

LCD driver

2. E-less UBM

for solder ball

attach

Wafer Level CSP

Flip chip

3. E-less OPM

for fine pitch wire

bonding

Automotive high rel./ high

temp. wire bonding

Copper wire bonding

Wire bonding on active pad

Aluminum or Copper

4. E-less Metallization

for Power MOSFET

application

Clip attached

Wire bonding and soldering

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Process Flow – Ni/Au & Ni/Pd/Au Bumping

Al Pad

Zinkating

Cu Pad

Pd Seed

Ni Plating

Pd Barrier

Flash Au

OPM for Wire Bonding

Flash Au

UBM for FC & WLCSP

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PacTech Group Worldwide

Wafer Bumping Capacity - ENIG

0 K

400 K

800 K

PacTech Europe PacTech USA PacTech Asia

4"-8" Wafer/Year 600 600 600

12" Wafer/Year 450 450 450

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Business Unit

Wafer Level Bumping & Packaging

- Wafer Level Solder Bumping -

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Solder Bumping and Other Applications

1. Solder ball Attach Wafer Level CSP

2. Solder ball Attach Flip Chip bumps

3. Fluxless and speciality

laser assisted solder

attach

3D HDD modules

3D Camera modules

High rel. Aerospace solder

bumping

Rework and Repair

4. Customized Soldering

of components attached

on wafers, single dies and

substrates

Special capacitor resistor

and component attach on

wafer level

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Wafer Level Solder Sphere Transfer 1/4

Vacuum picking of

solder spheres from

reservoir to stencil

Removal of excess

balls by US

&

optical inspection of

balls in stencil

Bond Tool

Mask

Solder Ball

Vibration

Vacuum

Air knife

Floating Solder

Balls by US

Jumping Solder Balls

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Wafer Level Solder Sphere Transfer 2/4

Placement of solder

spheres

&

optical inspection of

balls on wafer

Per robot back to

cassette

Next step: Reflow

Mask

Wafer

Solder Ball

UBM

Flux

Bond Tool

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Wafer Level Solder Sphere Transfer 3/4

Ultra-SB² 200/300 Dual end effector & Pre-aligner

Stencil mounted on vacuum

transfer head200/300mm wafer chuck

Solder Ball Transfer by Ultra-SB²

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Solder Sphere Jetting (SB²) 1/2

Schematic diagram of Solder Ball Bumping (SB²) process:

Ball ReservoirLaser

Optical sensor

Pressure sensorN2

Optical

sensors

Capillary

Search levelN2 gas

Reflowed

solder balls

Semiconductor wafer

Singulation Disk

Bond pad

Bond level

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Solder Sphere Jetting (SB²) 2/2

Process video for solder jetting and solder stacking

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Business Unit B

Advanced Packaging Equipment

- Manufacturing & Sales -

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PacTech Equipment

BGA, CSP Solder Rework

SB²-M SB²-SM

Solder Jetting

SB²-Jet

Solder Jetting

Wafer Level Solder Balling

Ultra-SB² 300 Ultra-SB² 300 WLR

WL Solder Ball Rework

PacLine 300 A50

Electroless Plating Line

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PacTech Equipment

Wafer Level Flux Cleaning

MegaPac 200/300 SpinPac ASC 200/300

Wafer Level Spin Coater

Reflow Oven RFM 300

Wafer Level Reflow

Plasma Cleaning

PlasPac 200/300 Ultra-SB² 300 WLR

High Throughput Laser

Bonding

LAPLACE-FC

Flip Chip Bonding

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Equipment for Electroless Ni/Au UBM

Turnkey Solution

- Equipment

- Process

- Chemistry

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Turnkey Bumping Solutions

One Source!

Volume Wafer Bumping matched to Customer’s Supply Chain Requirements.

3 location worldwide:

2nd sourcing!

Development Support in customer’s R&D Center Time Zone

Turnkey Process Transfer to customer possible at Any Time

Worldwide Support and Highest Quality

through Turnkey Process Ownership!

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Business DevelopmentInstalled Equipment for ENIG & ENEPIG UBM/OPM & Technology Transfer/Licenses of PacTech

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PacLine 300 A50ENEPIG Plating Systems in the Field @ major OEM’s

300 mm

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PacLine 300 A50

Parallel processing of multiple baskets

UPH: ~150 wafer 8"/hour or ~75 wafer 12"/hour (5µm Ni/Au UBM)

Automated Ni tank maintenance while process is running

Ni bath control with ConPac 2.0 bath conditioner & control set

Siemens PLC with Profi Bus system

Additional security tanks for each module and pump system

Automatic chemical delivery & drain system

Design will be adapted to customer’s facility

Multi recipe software management & SECS GEM Interfacing

User interface for interactive failure dignostic & troubleshooting

The system fulfills the fire safety standard FM 49100

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Business Unit

SB²-Jet Equipment

- Laser assisted Solder Jetting -

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PacTech Equipment for Solder Jetting

BGA, CSP Solder Rework

SB²-M SB²-SM

Solder Jetting

SB²-Jet

Solder Jetting

Solder Jetting for Camera

Modules

SB²-SMs SB²-Jet-SG

Solder Jetting for

HGA & HSA

SB²-SM R2R

Solder Jetting on flexible

Substrates

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Advantages of SB2 Solder Jetting

Solder ball diameter capability:

- 40µm - 760µm (qualified for volume production)

- 30µm (in qualification)

Solder alloys: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi

No tooling

No flux

No mechanical stress/contact

No thermal stress

No additional reflow

No cleaning of flux residues

Fine pitch applications (< 80µm)

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SB2 - Jet Applications

BGA / cLCC Balling

Rework/ Repair of BGA-like packages

Hard Disk Drive (HGA, HSA, Hook-Up)

Camera Modules

Wafer Bumping

Wafer Level CSP Bumping

Optoelectronics/ Microoptics

Filter Devices (SAW, BAW)

MEMS & 3D-Packaging

HGA for HDD (Source: Seagate)

Solder Jetting for Microoptics

Reworked Package

Camera Module

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SB2 – Solder Jet Speed & Ball Diameter:

Roadmap

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Business Unit

Equipment for

- Wafer Level Solder Ball Transfer-

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Process Flow Ultra-SB2 300

Wafer Loading

Fluxing

Solder Ball Vacuum Pick-up (US agitation)

High Speed 2D Wafer Inspection (Stencil)

Alignment of Stencil to Wafer (Dual Camera)

Solder Ball Transfer to Wafer

High Speed 2D Inspection (Wafer)

Reflow

Wafer Unloading

Standard

Optional

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Automatic Wafer Level Solder Ball Transfer with

Ultra-SB2 300

Cassette to Cassette robot handling for wafer up to 12"

Integrated rework capability for yield Improvement

(optional)

2x optical inspection (optional)

ball sizes: 60µm - 500µm

Integrating fluxing (optional)

Integrated reflow oven (optional)

UPH 8" >40 wafer/hour *

UPH 12" >25 wafer/hour *

* depending on ball size and on I/O count

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Application for Mirco Ball Placement with

Ultra-SB2

8" wafer

Pitch 200µm

400,000 I/O’s

100µm SnAgCu

12" wafer

Pitch 225µm

740,000 I/O’s

100µm SnAgCu

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Business Unit

Equipment for

- Wafer Level Solder Ball Rework -

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Process Flow Ultra-SB2 300

Wafer Loading

Wafer Alignment

High Speed 2D Wafer Inspection

Removal of misaligned & excessive balls

Re-fluxing of repair locations (dispense)

Placement of spheres

High Speed 2D Wafer Inspection

Wafer Unloading

Standard

Optional

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Automatic Wafer Level Solder Ball Rework with

Ultra-SB2 300 WLR for yield improvement

Cassette to Cassette robot handling for wafer up to 12"

Integrated 2-D AOI

- missing ball

- double ball

- ball shape etc.

Integrated rework capability for yield improvement

- single ball placement

- single ball removal

Ball sizes: 60µm - 500µm

UPH 8" ~25 wafer/hour

UPH 12" ~25 wafer/hour

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Business Unit

LAPLACE Equipment for

- Flip Chip Bonding

- Capacitor Bonding

- Cantilever Bonding

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LAPLACE with Reel-To-Reel-System

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LAPLACE Flip Chip Bonding

Flip Chip placement

and laser reflow

Final assembled Flip

Chip

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LAPLACE Capacitor Bonding

LAPLACE Capacitor Attach on PCB

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Cantilever Assembly Line for Probe Cards

3. Cantilever Bonder1. Cantilever Sorter

Input: MEMS substrates

Inspection of cantilever

Laser cutting with the Laser

Placement of cantilever in

waffle packs

Solder Jetting on

ceramic substrate

Solder Balls sizes:

30 – 760 µm

Solder alloys capability:

PbSn, SnAgCu or AuSn

Cantilever supplied in waffle packs

Cantilever pick & rotation in vertical position

Substrate height measurement

Dual camera for x, y alignment of cantilever

to the substrate

Probe tip z alignment

Laser bonding of cantilever

Post inspection

Cantilever rework capability

2. SB2-Jet: Solder Jetting

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Cantilever Bonder Specifications

Linear axis or gantry system

Probe card sizes up to 13 inch

Full process control

Alignment control by position bonding

Placement Accuracy: down to +/- 2µm

High power laser for bond reflow

Height control: 1µm accuracy

Cantilever thickness: 20 – 100µm

Pitch: down to 60µm

High mechanical stability of probes

Process suitable for rework and complete card assembly

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Global Sales

Global Marketing

marketing@pactech.de

EUROPE: sales@pactech.de

ASIA: sales@pactech.com

USA: sales@pactech.com

Contacts