semiconductor - kec.co.kr · 2008. 3. 18 1/7 semiconductor technical data khb3d0n70p/f n channel...

2008. 3. 18 1/7

SEMICONDUCTORTECHNICAL DATA

KHB3D0N70P/FN CHANNEL MOS FIELD

EFFECT TRANSISTOR

Revision No : 2

General Description

This planar stripe MOSFET has better characteristics, such as fast

switching time, low on resistance, low gate charge and excellent

avalanche characteristics. It is mainly suitable for switch mode power

supplies.

FEATURES ·VDSS= 700V, ID= 3A

·Drain-Source ON Resistance

: RDS(ON)= 3.5Ω @VGS = 10V

·Qg(typ.) = 20.5nC

MAXIMUM RATING (Tc=25)

* : Drain current limited by maximum junction temperature.

G

D

S

CHARACTERISTIC SYMBOLRATING

UNITKHB3D0N70P KHB3D0N70F

Drain-Source Voltage VDSS 700 V

Gate-Source Voltage VGSS ±30 V

Drain Current@TC=25 ID 3.0 3.0*

APulsed (Note1) IDP 12 12*

Single Pulsed Avalanche Energy

(Note 2)EAS 345 mJ

Repetitive Avalanche Energy

(Note 1)EAR 8.0 mJ

Peak Diode Recovery dv/dt

(Note 3)dv/dt 4.0 V/ns

Drain Power

Dissipation

Tc=25PD

113 50 W

Derate above25 0.91 0.34 W/

Maximum Junction Temperature Tj 150

Storage Temperature Range Tstg -55∼150

Thermal Characteristics

Thermal Resistance, Junction-to-Case RthJC 1.1 2.5 /W

Thermal Resistance, Junction-to-

AmbientRthJA 62.5 62.5 /W

DIM MILLIMETERS

TO-220IS

A

A

B

B

C

C

D

D

E

E

F

F

G

G

H

H

1.47 MAX

13.0 MAXJJ

K

K

L

L

M

M MN

N

O

O

P

Q

Q

1 2 3 1. GATE

2. DRAIN

3. SOURCE

3.18 0.1+_

0.8 0.1+_

3.3 0.1+_

0.5 0.1+_

10.16 0.2+_

15.87 0.2+_

12.57 0.2+_

2.54 0.2+_

2.54 0.2+_

2.76 0.2+_

6.68 0.2+_

4.7 0.2+_

3.23 0.1+_

6.5

P

KHB3D0N70F

2008. 3. 18 2/7

KHB3D0N70P/F

Revision No : 2

ELECTRICAL CHARACTERISTICS (Tc=25)

Note 1) Repetivity rating : Pulse width limited by junction temperature.

Note 2) L =71mH, IS=3.0A, VDD=50V, RG=25Ω, Starting Tj=25.

Note 3) IS≤3.0A, dI/dt≤200A/, VDD≤BVDSS, Starting Tj=25.

Note 4) Pulse Test : Pulse width ≤ 300, Duty Cycle ≤ 2%.

Note 5) Essentially independent of operating temperature.

CHARACTERISTIC SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT

Static

Drain-Source Breakdown Voltage BVDSS ID=250μA, VGS=0V 700 - - V

Breakdown Voltage Temperature Coefficient ΔBVDSS/ΔTj ID=250μA, Referenced to 25 - 1 - V/

Gate Threshold Voltage Vth VDS=VGS, ID=250μA 2.0 - 4.0 V

Drain Cut-off Current IDSS VDS=700V, VGS=0V, - - 10 μA

Gate Leakage Current IGSS VGS=±30V, VDS=0V - - ±100 nA

Drain-Source ON Resistance RDS(ON) VGS=10V, ID=1.5A - 3.0 3.5 Ω

Dynamic

Total Gate Charge Qg

VDS=560V, ID=3.0A

VGS=10V (Note4, 5)

- 20.5 25.6

nCGate-Source Charge Qgs - 3 -

Gate-Drain Charge Qgd - 10.5 -

Turn-on Delay time td(on)

VDD=350V, RG=25Ω

ID=3.0A (Note4, 5)

- 11.5 33

nsTurn-on Rise time tr - 48.5 107

Turn-off Delay time td(off) - 50 110

Turn-off Fall time tf - 57.5 125

Input Capacitance Ciss

VDS=25V, VGS=0V, f=1.0MHz

- 642 835

pFOutput Capacitance Coss - 67.2 87.4

Reverse Transfer Capacitance Crss - 10.2 13.3

Source-Drain Diode Ratings

Continuous Source Current IS

VGS<Vth

- - 3.0A

Pulsed Source Current ISP - - 12

Diode Forward Voltage VSD IS=3.0A, VGS=0V - - 1.6 V

Reverse Recovery Time trr IS=3.0A, VDD=350V,

dIs/dt=100A/μs (Note 4)

- 730 - ns

Reverse Recovery Charge Qrr - 3.2 - μC

2008. 3. 18 3/7

KHB3D0N70P/F

Revision No : 2

2008. 3. 18 4/7

KHB3D0N70P/F

Revision No : 2

2008. 3. 18 5/7

KHB3D0N70P/F

Revision No : 2

2008. 3. 18 6/7

KHB3D0N70P/F

Revision No : 2

2008. 3. 18 7/7

KHB3D0N70P/F

Revision No : 2