update on simulation and sensor procurement for clicpix prototypes

Update on Simulation and Sensor procurement for CLICPix prototypes

Mathieu Benoit

Outline

• Possible prototype – HV-CMOS with Ivan Peric– VTT Active edges sensors– Microns/MPI HLL sensor– Sensor processing (Thinning)

• Simulation – CLICpix model– Deployement to lxbatch– Digitization strategy– Some results

Prototypes

• Timepix3 not available before the end of next year

• We can take advantage of the common footprint for medipix1,2,3 and timepix1,3 to begin thinking about producing sensors to study various properties– Various thickness– Implant size

Varying implant width• Pulse risetime, charge sharing can vary

according to E Field distribution in pixel cell

VTT Sensor production

Edge processing

VTT SummaryCharacteristics values

Thickness(es) 50 – 500 um

Wafer size(s) 6 ’’

Process Single/double sided

Wafer type(s) P(10kOhm) FZ, N(7kOhm) FZ

Edge characteristics 50-100um pixel to edge distance using active edge technology

HV-CMOS Active diodes• ATLAS is planning a MPR in 180nm process

for HV-CMOS sensors– Total run cost : 157k€

• 28 masks (6 Metal layers, MiM Capacitor, deep-nwell) : 126k€

• 8x 8’’ wafers 19.8k€• Die size 21 x 21 mm

• Ivan has agreed that a medipix-like structure could be planned in the production, but would only cover part of the timepix chip– Detection diode + Preamplifier– Capacitive coupling (glue)

• Possibility to do sub-pixelisation (ATLAS like)– Sub-pixels with different gain and pedestal– Pixel ID is determine from ToT Value

Pros• Thin depleted depth allows for

thinning without paying in Signal to noise ratio

• Capacitive coupling (no bump bonding)

• Some intelligence can be put on sensor

Cons• Gluing procedure need test with thin

structure, with sensor smaller than chip (UMB bumps present?)

• Preamp power need to be provided to sensor• New PCB, double sided wire

bonds• Glue might not be mechanically

reliable, or radiatino hard

Timepix : 14.08x14.08mm active area16.120mm x 14.111mm total area

HV-CMOS :

4x2mm chip, bonding 1mm from chip edge

Timepix balcony

Active area

HV-CMOS

Microns Semiconductors

• Possibility to do dedicated run or to participate with UK partners in MPR

• Experience with Microstrips for D0, PHENIX, BRAHMS, HERMES, LHCb VELO

• Experience with ATLAS FE-I3 and FE-I4 pixel sensors

MICRONS SummaryCharacteristics values

Thickness(es) 3’’-> 15-500 um4 ’’->15-2000 um6’’->100->2000 um

Wafer size(s) 3’’, 4’’, 6’’

Process Single/double sided

Wafer type(s) P,N FZ, MCz

Edge characteristics Guard ring structures (100-500 um) + dead edges (50-200 um)

MPI HLL

• MPI HLL developped a process to produce thin sensor (75um) produced in house.

• First experience with thin strip sensor encouraging https://indico.cern.ch/getFile.py/access?contribId=14&sessionId=4&resId=0&materialId=slides&confId=114255

• SLID interconnect technology also available • Possibility of MPR unknown, but feasable with

adequate input of money

Thinning (Chip)

Thinning (Chip)

Thinning (Chip)

Thinning (Sensor)• Sensor thinning is more delicate

– Each side need a mirror polish finish • (grinding, then 9um grain, 3um grain, 1 um grain, colloidal solution (Nalco) )

• 3 possible approaches– With junction

• Backside implantation done prior to thinning (Ohmic contact)• Thinning and polishing do outside fab (Rockwood)• Wafer get back to fab for frontside processing

– Epi wafers (ALICE)• Wafer front processed • Epi layer etched except for the last few microns forming a ohmic contact with a

deposited metal layer

– SOI wafers• Wafer front processed • Oxide etched away and backside processed (after bump bonding)

Timepix availability

• Not clear if timepix chips are still available

• Michael Campbell was contacted to inquire on possibilities, waiting for the answer back

SIMULATION

GEANT4 simulation + digitization

• The software was ported to lxbatch system allowing large scale production– Python script to generate sim template and launch prod and analysis

• Possibility now to scan pixel size, thickness, incident angles, beam type and energy

• Produced some preliminary analysis with 20x20um pixel, 50 um thickness

• Some Geometry handling bugs to be solved , timing needs to be added in the digitizer/ handled in the framework

Digitization for HV-CMOS

• I started to look at how to include in the simulation for a digitizer for HV-CMOs type sensor but information is limited

• Reiterated emails around to get access to TCAD software (IT Dept, RD50, Electronics Depth)

Full detector Simulation

Digitizer Clustering + Hit reconstruction

ILCsoft reconstruction etc. Residuals, efficiency

dE/dX ?

Conclusion

• Many possibilities to produce CLIC like prototypes for next year

• Availability of readout chips an issue

• Simulation ongoing, some bug need to be fixed in clustering, geometry, but the machinery is there to produce large scale studies, TB simulation