usm mini tgl chem eng briefing
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9th May 2015
Course Content
Agenda & Program Flow
Team Grouping & Challenge Statement
Judging Criteria
Scope & Mode Presentation
Pitching Guideline
Q&A
Agenda: 20th November
Time Activity
8:00am-8:30am Registration/Breakfast
8:30am-12:30pm Proposal Preparation & Mentoring
12:30pm-2:30pm Lunch/Break
2:30pm Submission of Proposal Slides to Mentors/CREST rep
2:45pm-4:45pm Pitching Session
4:45pm-5:15pm Closing Ceremony
• Teams of 5 members
• Team will be assign Team number and 1 Challenge Statement
Form Teams
• Time period: 2 weeks
• Discuss and identify a product/design on Challenge Statement
• Prepare proposal (ppt format)
• Max 7 - 10 slides
Project • Team leader forward ppt to mentor/CREST rep by 2.30pm 20th Nov
• Team presents to panel of judges
• 7 minutes presentation
• 3 minutes Q&A
Pitching
Program Flow
Team Grouping
Panel Team
Number Name Challenge Statement
PANEL 1
1
QUAH JIA XIN Penchem (PCH 01):
THIEN YU JIE UV and weather degradation of transparent epoxy polymers under outdoor applications
DHIVIAN A/L T NITHIASELVAN
MUHAMMAD SYAFIEQ BIN ABD HALIM
NURUL FATIRAH BINTI MOHD SHUKOR
2
TONG SIEW HUI Penchem (PCH 02):
SYED ZULFADLI BIN SYED PUTRA
Synthesis of silicone polymer with high refractive index greater than 1.7
LYE YU YANG
KEE LI EN
NURLINA BINTI GAFOOR
3
LEE WEN JIE Penchem (PCH 01):
TEO LEONG HER UV and weather degradation of transparent epoxy polymers under outdoor applications
NUR SYAHIRAH ADIBAH BINTI PAKIR
WONG HUI YIN
NURUL FARHANA BINTI SHAHBUDIN
4
KOH MING HOOI Penchem (PCH 02):
DINA LIYANA BINTI MOHAMED ROSHDIN MURAD
Synthesis of silicone polymer with high refractive index greater than 1.7
AHMAD RIDHWAN BIN MOHD YUNUS
SITI ZUBAIDAH BINTI ABU SEMAN
LAU BOON KEY
Team Grouping
Panel Team
Number Name Challenge Statement
PANEL 1
5
SIEW SEOK LI Penchem (PCH 01):
AHMAD FUZAMY BIN MOHD ABD FATAH
UV and weather degradation of transparent epoxy polymers under outdoor applications
NURUL EZATI BINTI MAT SIDEK
MOHAMMAD HASIF BIN YAACOB
CHOW LILY
6
LAW LI CHIN Penchem (PCH 02):
TAN YEE LING
Synthesis of silicone polymer with high refractive index greater than 1.7
MUHAMMAD HAZWAN BIN RAHAMATHULLA
ELAINE OOI CHIN WEN
HASIF BIN MIOR HAKIM
7
LOH KAR WOON Penchem (PCH 01):
NOOR IZZATTY SHAMIRA BINTI SAMSUDIN
UV and weather degradation of transparent epoxy polymers under outdoor applications
MUHAMAD SHARAFEE BIN SHAMSUDIN
CHIN ZHI YAN
T. PARRIMALAN A/L THIRUCHELVAN
8
ONG HUI SIN Penchem (PCH 02):
NORATASYA BINTI ROSLI
Synthesis of silicone polymer with high refractive index greater than 1.7
SYAFIQAH BINTI MAD ZIN
MUHAMAD NU'AIM BIN SOFIAN
CHIN WAI SING
Team Grouping Panel
Team Number
Name Challenge Statement
PANEL 2
9
GOH SENG SHI CREST (CR 01):
PAVEETHRA BHAI A/P MURUGAN Renewable polymer for industry application (electronics, food packaging)
MOHAMAD AZZAM BIN CHE RAHIM
RASYID BIN HASSAN
LEE LYE QING
10
SOON KAH AIK CREST (CR 02):
SYAHAZMIR BIN AHMAD SHAH
In-molding polymerisation for semiconductor packaging
SITI NUR FAZURA BINTI HALIM
CHAN PEI JUAN
EZA EDAYU BINTI ZALAZILAH
11
LIEW SAN SIANG CREST (CR 01):
NUR AMIRAH HANI BINTI MOHD AZMI Renewable polymer for industry application (electronics, food packaging)
SITI NATASHA BINTI ABDUL AZIZ
TAN JUN YING
MUHAMMAD ASWAR BIN MD.EUSOFF
12
LIM ZHI HUEI CREST (CR 02):
SYUIB AMEER BIN HAJI AZAMAN
In-molding polymerisation for semiconductor packaging
NUR HAJAR BINTI ROSELY
NUR MUNIRAH AQMA BINTI MAZALI
SELVENTHIRAN A/L DASARATAAN
Team Grouping
Panel Team Number Name Challenge Statement
PANEL 2
13
WONG WIN YEE CREST (CR 01):
CHONG YU NONG Renewable polymer for industry application (electronics, food packaging)
NUR DINA BINTI ZAULKIFLEE
VASYANTHAN A/L PANDIYAN
NURUL AZRIN BINTI ABDUL RAHIM
14
LIM WEI MEI CREST (CR 02):
KAVITRRA A/P RAJENDRAM
In-molding polymerisation for semiconductor packaging
EKMAL HARRIS BIN ABDUL MALEK
MOHD KHAIRI BIN OTHMAN
KONG KA MAN
15
CHAN CHUH YIING CREST (CR 01):
MOHAMED FADHIL BIN MOHAMED VAISUL Renewable polymer for industry application (electronics, food packaging)
MARYAM MUNIRAH BINTI SUHAIMI
KONG WEI QING
NURUL 'AQILAH BINTI ABDUL RAHMAN
16
OOI ZI SHING CREST (CR 02):
NG SOK YENG
In-molding polymerisation for semiconductor packaging
SITI NORHASLIZA BINTI AHMAD
EU KEAN WEI
MUHAMAD HAFEEDZ ISKANDAR BIN MOHD ALIAS
Challenge Statements
No Challenge Statement
1
Penchem (PCH 01):
UV and weather degradation of transparent epoxy polymers under outdoor applications
Background:
Transparent epoxies are often used in electronic devices like LEDs for outdoor applications. Current epoxy materials can hardly withstand the harsh sunlight and wet weather conditions of tropical countries for more than a year.
Expected Deliverables:
• Develop clear, transparent epoxy resin and formulation thereof for long term (> 5 years) outdoor applications. • Describe clear plan with timeline to research, develop, validate performance and scale up the new resin and formulation.
2
Penchem (PCH 02):
Synthesis of silicone polymer with high refractive index greater than 1.7
Background:
Transparent silicones are often used as lens material in LEDs for high power lighting applications. Current silicone materials have refractive index of 1.5 or less. Higher refractive index lens material will enable the LED device to extract light more effectively and hence be brighter.
Expected Deliverables:
• Design and synthesize a clear, transparent heat or UV curable silicone vinyl resin with high refractive index greater than 1.7 for very high brightness LED applications. • Describe clear plan with timeline to research, design, synthesis, formulate, validate performance and scaling up the new resin and formulation.
Challenge Statements
No Challenge Statement
3
CREST (CR 01):
Renewable polymer for industry application (electronics, food packaging)
Background:
Use of petroleum based resin like Bisphenol-A based resin is widely known in electronic industry and food containers. This compound is known as toxic and potentially cause to cancer in human. With the advancement of renewable polymers from natural resources, could we develop an alternative to the petroleum based rain and reduce human interaction with the toxic materials?
Expected Deliverables:
• Properties and performance comparison of renewable polymers to petroleum based polymers used in electronic and food packaging industry • Strategy, polymer design, synthesis and formulation of renewable polymer for electronic or food packaging application • Describe clear plan with timeline to research, design, synthesis, formulate, validate performance and scaling up the new resin and formulation.
Challenge Statements
No Challenge Statement
4
CREST (CR 02):
In-molding polymerisation for semiconductor packaging
Background:
• As electronic product getting more sophisticated and smaller, so does the size of semiconductor packages. As the size getting smaller, the challenges to produce reliable product increases. Problems related to incomplete molding, crack die and delamination are possible challenges due to miniaturisation especially with the using of B-stage epoxy holding compound to protect the die and electronic circuits. • A new method with low viscosity monomers and oligomers could be an alternative to the B-stage epoxy holding compound used for semiconductor encapsulation.
Expected Deliverables:
• Understanding of current semiconductor molding process and its limitations for the advanced packaging i.e. 2D and 3D packaging. • Strategy, design of equipment and materials for in-molding polymerisation of semiconductor packages. • Describe clear plan with timeline to research, design, synthesis, formulate, validate performance of in-mold semiconductor packages.
Judging Criteria
Design
W:3x
Presentation
W: 1x
Innovation
W:3x
Project Value
W:3x
Scope
Project
Duration: • 1 - 2 semester/Internship Period • Time Management
Outcome/Expectation: • Design Project/Prototype/Proof of Concept • Detailed explanation on design and implementation • Project Scheduling & Problems
Effort: • Teamwork • Contribution from each member’s expertise • Presentation in English. In terms of content, organization
& clarity, presentation style and appropriateness & effectiveness
Contribution: • 10%
14
• Identification Research/ground visits to find out and
understand problems
Research into company background, products, customers, technology
Motivation/Requirements from user/community
• Analysis Depth to which the problem was analysed and
researched
Supported by Data/Statistics
Target Users/ Environment
Occupation, end product, ecosystem Outdoor, indoor Specific place/application Size and condition of area
Problem Definition
Scope
15
• Innovation
Better solutions that meet new requirements and/or unarticulated needs
Materials/Components
Choice of materials/components – suitability to design (size, electrical parameters, easy to purchase)
Software/Hardware/Process/Materials/ Structure
Cost of components (Bill of Materials)
• Elegance
Usability, Simplicity of design and robustness of solution
Design
Scope
16
• Effectiveness
Accuracy and consistency of solution in solving identified problems
Challenges/Problems that might arise
User/Electrical safety Limitation on distance, speed Cost/time/green technology Competing products/technology
• Ease of Implementation
Ease of implementation and maintenance of the solution
Ease of being accepted by target population
Impact
Scope
17
• Marketability
How much impact the community/industry needs?
How big is the market? Internal/External customer Marketability of product in Malaysia, global
market/market segment
Financial Cost, Selling Price, uniqueness, economical aspect Competing technology/market
Project Management Project Scheduling – Gantt Chart
Project Value
Scope
18
A
B
C
A B
Mode of Presentation
Flowchart, Circuit Diagram, Block Diagram, Mechanical Drawing, Picture, Safety, Real Environment
Heat Sink
Design HeatSink
To cool a device by dissipating into surrounding
Electrical Load
+ -
- ++
Piping System (heat
source)Heat Sink
Cathode Anode
Cold Collector
Hot Emitter
Generator Mode of Presentation
Bill of Materials
Components Number Price per Unit
(RM) Total(RM)
PIR sensor 2 25.00 50.00
Ultrasonic sensor 2 39.00 78.00
Resistor 20 0.05 1.00
Arduino Uno Board 1 70.00 70.00
Switch 1 1.00 1.00
LED lights 20 0.10 2.00
Total Cost 202.00
Mode of Presentation
• Submission of soft copy presentation slides by 2.30pm 20th November to mentor/CREST rep. Presentation via CREST laptop.
• Be punctual • All team members must be present during pitching • Team members are required to introduce their names
and discipline of studies via 1st slide • 7 minutes to pitch • 3 minutes for Q&A • Feedback will be given each panel of judges • Announcement of Winner during closing
Pitching Guideline
Tips on Resume Writing
Clearly state the following in your resume:
Purpose of application i.e. Internship/Fresh Graduate Hiring
Availability Date Intern: Internship Period (please specify start and end date of internship)
Fresh Graduate: Date Available to Start Work (it does not have to be after convocation, it may be after your final examination/viva)
Full Name, Home Address, Mobile Number and E-mail address
University, Discipline of Study and Current CGPA State education details only from SPM level
Please include description/list of types of projects that you have completed (keep it straight to the point, elaborate more on your Internship/FYP project)
i.e. Individual/Group/Design Projects, Internship Project, Final Year Project
Please clearly specify the Hardware/Software/Materials/Tools that you have utilize in the projects in order to display your technical skills/knowledge.
If you have completed your internship/have relevant industry working experience State the name of the company, your department and your roles & responsibilites/projects. Specify
the start & end date of your internship/employment.
Include your extra-curricular activities (keep it brief)
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