ams multi-spectral sensor - system plus · 2017. 12. 6. · ©2017 by system plus consulting | ams...
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©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
ams Multi-Spectral SensorTrue Color ambient light sensor from Apple iPhone XIMAGING report by Stéphane ELISABETHDecember 2017 – version 1
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o ams
o ams portfolio
o Apple iPhone X Teardown
o Module View & Dimensions
Physical Analysis 20
o Summary of the Physical Analysis 21
o Package 23
Package View & Dimensions
Package Opening
Package Cross-Section:
Materials, Flex PCB, Wire Bonding, Glass Window, Diffuser
o Sensor Die 39
Sensor Die View & Dimensions
Sensor Die Overview:
Optical Isolation, Sensing Cells
Sensor Delayering & main Blocs
Sensor Die Process
Sensor Die Cross-Section:
Substrate, Metal layers, Optical Isolation, Filters, Photodiode Area
Sensor Die Process Characteristic
Sensor Manufacturing Process 62
o Global Overview
o Sensor Die Front-End Process & Fabrication Unit
o Packaging Process & Fabrication unit
Cost Analysis 75
o Summary of the cost analysis 76
o Yields Explanation & Hypotheses 78
o Sensor die 80
Sensor Die Front-End Cost
Sensor Filter Front-End Cost
Sensor Die Probe Test, Thinning & Dicing
Sensor Die Wafer & Die Cost
o Packaged Component 84
Packaging Cost
Package Cost per steps
Back End: Final Test
Component Cost
Estimated Price Analysis 89
Customer Feedbacks 93
Company services 95
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology data, manufacturingcost and selling price of the Multi-spectral Sensor in the Apple iPhone X supplied by ams.
• Located in the phone’s front, above the main speaker, the ALS shares the flex PCB with the proximitysensor and the front microphone. The custom version provided by ams is a multi-spectral ALS in very long,narrow packaging (6 x 0.9mm).
• The ALS’ architecture allows for large spectral sensing. Combined with a diffuser, the die sensor features sixdifferent cells, probably dedicated to UV, red, green, blue, NIR1, and NIR2, thus providing a broad lightspectrum. This allows the sensor to adapt the display color and brightness towards warm or cool-whitebased on the correlated color temperature (CCT) level of the phone’s environment.
• This report analyzes the complete multi-spectral ALS, from the sensor die to the custom packagingdeveloped for the device. This report also includes a complete analysis of the package and sensor die, alongwith a cost analysis and a price estimate for the device.
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 4
Overview / Introduction
Company Profile & Supply Chain o amso ams Portfolioo Apple iPhone X teardown
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Apple iPhone X Teardown
Apple iPhone X Overview©2017 by System Plus Consulting
Apple iPhone X Front, Side and Back View©2017 by System Plus Consulting
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 5
Overview / Introduction
Company Profile & Supply Chain o amso ams Portfolioo Apple iPhone X teardown
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Spectral Sensor Module
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Summary of the Physical Analysis
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Package Views & Dimensions
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Package Cross-Section
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Package Cross-Section – Bottom Glass Window
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Sensor Die – Die View & Dimensions
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Sensor Die – Die Overview – Sensing Cells
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Sensor Die – Die Cross-Section – Optical Isolation Layer
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Sensor Die – Die Cross-Section – Filters
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Sensor Die – Die Cross-Section – Filters
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Package Viewo Package Cross-Sectiono Sensor Die Viewo Sensor Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Sensor Die – Die Cross-Section – Photodiodes Area
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Global Overviewo Sensor Die Processo Packaging Process
Cost Analysis
Selling Price Analysis
Feedbacks
About System Plus
Packaging Process Flow 1/5
PCB Panel
• PCB Substrate
PCB Panel
• Sensor Die bonding
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Sensor Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
Feedbacks
About System Plus
Sensor Front-End Cost
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Sensor Wafer & Die Costo Back-End Costo Component Cost
Selling Price Analysis
Feedbacks
About System Plus
Packaging Cost
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Financial Ratioso Manufacturer Price
Feedbacks
About System Plus
Multi-Spectral Ambient Light Sensor Estimated Manufacturer Price
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING• ams Ambient Light Sensor (ALS)• STMicroelectronics Time of Flight Proximity Sensor in the Apple iPhone 7 Plus• MEMS Packaging: Reverse Technology Review
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
IMAGING• 3D Imaging and Sensing 2017 • Status of the CMOS Image Sensor Industry 2017 • Status of the MEMS Industry 2017
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 21
COMPANYSERVICES
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 by System Plus Consulting | ams Multi-Spectral Sensor in Apple iPhone X 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
About System Pluso Company serviceso Related reportso Contacto Legal
Contact
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