AMS Working Group February 13, 2013

Agenda

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Time Item 10:00 a.m. Opening Remarks

Dr. Abhijit Gupta, SanDisk 10:10 a.m. Linda Fosler, Mentor Graphics

PDK Road Map 10:30 a.m. Jingwen Yuan, Synopsys

IP Alliance and iPDK Update 10:50 a.m. Jim Culp, IBM

Open Access, Open PDK update 11:10 a.m. Paul Poenisch, X-Fab

PCM Checklist Project 11:30 pm Working Group Discussion 12:00 pm Logistics & Wrap-up

Mentor Graphics Design Kit Status

Linda Fosler, Mentor Graphics, Director of Marketing, Deep Submicron Division This presentation addresses Mentor Graphics Design Kit Overview and Strategy. We will address problems conquered by moving to an open PDK environment. Next the presentation covers the efforts of Mentor Graphics and others in supporting IPL’s (Interoperable PDK Libraries) iPDK and Si2’s OpenPDK efforts.

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IP Alliance and iPDK Update

Jingwen Yuan, Synopsys, Strategic Alliance Manager, and President of the IPL Alliance This presentation provides an Overview of the IPL (Interoperable PDK Libraries) alliance and their iPDK efforts. Through the cooperation of Foundries, EDA vendors, and users, the alliance has made great strides in generating open standards for industry use. The alliance works with other industry PSK efforts, while continuing to grow and contribute to open PDK development and adoption.

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Open PDK Update

JimCulp, IBM, Senior Technical Staff Member, and Chair of Si2’s Open PDK working group This presentation provides an update for Si2’s OpenPDK efforts. Topics covered include the ISDA Alliance perspective on open standards, the process to define and implement these standards, and an in-depth review of the benefits of using an OpenPDK.

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Process Control Monitor (PCM)

The Process Control Monitor (PCM) Checklist was originally released in 2008. In 2012 deliverables discussion, the AMS working group determined that an update was in order. X-Fab volunteered to lead this effort and now presents an introduction to issues encountered when considering generating this list, as well as presenting a draft for working group review.

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AMS Core Team Review (1/3)

Core Team Teleconference January 2013, 2013

Welcomed new members form Mentor Graphics, Cadence, and IBM

Deliverables Discussion Discussion centered on efforts to define an open PDK in

Interoperable PDK format. This led to the February meeting theme and presentations Reviewed the task list and agreed to completeness. Noted that we need to generate a Vision statement Agreed that biweekly calls would begin after February

meeting Everyone requested to provide their Foundry contact points

so that Harrison and Abhijit can recruit their support Need Volunteer to lead this effort

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AMS Core Team Review (2/3)

Core Team Teleconference January 2013, 2013

Other Potential Deliverables Process Control Monitor (PCM) Checklist – X-Fab driving Emerging AMS Requirements for advanced process nodes Impact of 3D IC Technology on AMS Design EDA Tools – to be discussed after February meeting

Discussed ways to improve meeting attendance

Proposal to change meeting time Morning allows European colleagues to attend Evening allows Asian colleagues to attend Afternoon is best for Silicon Valley attendance Proposed that we increase marketing efforts (GSA) and

individual recruiting (internally and externally)

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AMS Core Team Review (3/3)

Core Team Teleconference January 2013, 2013

Future meeting themes: May Theme: Implementation for Open Access and

Interoperability August Theme: AMS Verification (Tentative) Modeling Challenges RF-CMOS Design Hi Voltage Design

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AMS Working Group

Next core Team Call Details March 27th, 10am PDT Dial In Numbers:

Int'l Toll: 1-719-457-6209 US/CAN Toll free: 1-866-398-2885 Participant Passcode: 842 910 4881

2Q13 Working Group Meeting May 15th, 2013; 2pm – 5pm (PDT) Hosted by TBD – Any Volunteers? Theme: Implementation for Open Access and

Interoperability

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GSA Events to Attend

Silicon Summit (http://www.gsaglobal.org/events/2013/0418/) April 18, Computer History Museum, 9am – 2:30pm Session One: Disruptive Innovation – Enabling Technology for the Mobile Industry of Tomorrow

Mark Miscione, VP, RF Technology Solutions, Peregrine Dr. Naveed Sherwani, President & CEO, Open-Silicon Dr. Ely Tsern, VP & Chief Technologist, Semiconductor Business Group, Rambus

Session Two: Technology Drivers for the Internet of Things – From Concepts to Reality

Dr. John Heinlein, VP, Marketing, Physical IP Division, ARM Kamran Izadi, Director, Sourcing & Supplier Management, Cisco Oleg Logvinov, Director of Market Development, Industrial and Power Conversion Division, STMicroelectronics Martin Lund, Senior VP, Research and Development, SoC Realization Group, Cadence

Session Three: Integration Challenges and Opportunities Jim Aralis, CTO, Microsemi Dr. Misha Burich, CTO, Altera Dr. William Chen, ASE Fellow & Senior Technical Advisor, ASE Dr. Robert Rogenmoser, Senior VP, Product Development & Engineering, SuVolta

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Silicon Summit More-than-Moore

Session One: Disruptive Innovation – Enabling Technology for the Mobile Industry of Tomorrow With the industry’s long-term focus on scaling now joined by functional diversification, this session will

open with an overview on how More than Moore is enabling the mobile landscape of today and shaping the future of tomorrow.

A panel will follow, discussing current and emerging applications that continue to drive the More than Moore adoption as well as the process technologies enabling this development.

Session Two: Technology Drivers for the Internet of Things – From Concepts to Reality From the Swarm Lab to the smart bulb, the Internet of Things is showing evidence of becoming a

reality. However today’s productivity trails what is needed to make the Internet of Things a truly ubiquitous system, and at the heart of the matter is developing the low power, mixed-signal technology that will enable chips and systems to communicate to the real world with minimal or without battery power. This session will open with an overview on where the industry stands in applying the concept of More than Moore to drive the Internet of Things.

A panel will follow, assessing the industry requirements, obstacles, and advancements in developing the technology required to make the Internet of Things a reality.

Session Three: Integration Challenges and Opportunities Furthering the advancement of More than Moore involves unifying silicon technologies with novel

integration concepts; application software convergence; and new supply chain business models. This session will open with an overview identifying the key industry trends, challenges and opportunities to realize higher density, greater functional performance and boosted power for ICs.

A panel will follow, discussing possible collaborative solutions to the challenges of integration and its impact on business market growth and investment.

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