External Use

TM

Automotive Product Portfolio UpdateEUF-IND-T0590

J U N E . 2 0 1 4

TM

External Use 1

Increased Microcontroller Content in Electronics Systems

Hybrid/EVPowertrainStop/StartRegenerative Braking

Driver InformationInfotainmentTelematicsTheater Quality Multimedia

Powertrain ControlEngine ControlGasoline ManagementFuel Injection

Safety

Body Control ModuleSeat, Door, and Window ControlRemote ControlHVAC ControlLighting Control/Bending/Leveling

Automotive Networking/Communication

CANLINFlexRayEthernetMOST

Breaking SystemsElectronic Power SteeringActive Suspension

Body Electronics

Chassis

Airbags with Faster Impact DetectionElectronic Stability ProgramCollision Avoidance and Adaptive Cruise Control

TM

External Use 3

Vehicle Architectural Trends

Today Future

Distributed Electronic Control UnitsOne ECU per mechanical function- Connected by

multiple CAN and LIN interfaces Distributed ComputingMajor computing nodes on a high performance network

organized by “domains” which control “zones”

ECU

ECU

ECU ECU

TorqueManagement

Driver Interface(HMI)

Body, Security Lighting

Engine Transmission Electric Motor GeneratorSeats Mirrors Doors Lighting

Navigation Instruments

Multimedia/Telematics

EntertainmentDriver

Controls

SteeringDampers ADAS

(Radar,Camera)Airbags Tensioners

Ped. Protection BrakesDynamics

Sensors

• Up to 80 individual ECUs• Local and proprietary network structures• Increasing software complexity• Increasing cabling weight• Increasing ... everything

• Increasing data traffic• Ethernet as the backbone• Central Gateway will have an Ethernet Switch• Lower power: Partial/pretended networking• Autosar 4.0

Gateway

VehicleDynamics &

Safety

OBD

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External Use 4

Overview Car Network (w/o Ethernet)

• Various network protocols in the car: CAN, LIN, PSI5, MOST, FlexRay, etc.

• Different characteristics per network: data rate, latency, communication direction (peer-to-peer, single master, multi-master, etc.), quality of service, determinism, etc.

• Driving force: cost optimization (cable, plug, number of pins, silicon area, etc.)

Instrument cluster, dash

board

Central ECU, Gateway

Audio/Video player

Video disp.

Speaker

Navigation

Telephone

Engine mgmt

Gearbox

Vehicle dynamics

Wheel nodes

Seats

Air condition

Doors

Airbag

Lighting

Sensors Squibs

Electric motors

Electric motors

Lights

Electric motors

LIN

LIN

LIN

LIN

PSI5, DSI

CAN

MOST

FlexRay

OBD

CAN,

CAN,

CAN, FlexRay

Simplified example

TM

External Use 5

Overview Car Network (w/ Ethernet)

• Various network protocols in the car: CAN, LIN, PSI5, MOST, FlexRay, Ethernet

• Different characteristics per network: data rate, latency, communication direction (peer-to-peer, single master, multi-master, etc.), quality of service, determinism, etc.

• Driving force: − cost optimization (cable, plug, number of pins, silicon area, etc.)− Bandwidth to program (flash) the car

Instrument cluster, dash

board

Central ECU, Gateway

Audio/Video player

Engine mgmt

Gearbox

Vehicle dynamics

Wheel nodes

Seats

Air condition

Doors

Airbag

Lighting

CamerasSensors Squibs

Electric motors

Electric motors

Lights

Electric motors

LIN

LIN

LIN

LIN

PSI5, DSI

CAN

FlexRaySimplified example

Ethernet

OBD

CAN, Ethernet

Ethernet

Switch

Video disp.

Speaker

Navigation

Telephone

Switch

TM

External Use 6

S088-bit MicrocontrollerFamilies

S1216-bit MicrocontrollerFamilies

S12 MagniV16-bit with AnalogASSP/MCUs

Qorivva32-bit Single-Core Microcontr.Families

Qorivva32-bit Dual-Core Microcontr.Families

System Basis Chip (SBC), Network Interconnect

High Side Switches (eXtreme Switch), H-Bridges, Switch Monitoring

Door, Window, Seat, HVAC, Other Body

BCM and Gateway

Motor Control, Lighting, etc.

Body Solutions – Freescale Portfolio Overview

TM

External Use 7 ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.

Kinetis for Automotive 32-Bit ARM® MCU

TM

External Use 8

Kinetis 32-Bit ARM® MCU Comes to Automotive

• Kinetis E Auto provides an automotive grade scalable 32-bit portfolio with ARM− 32-bit M0+ and M4 optimized for high performance and low

power− 8K to 2M embedded flash, pin to pin compatible− Peripherals including CAN, LIN(SCI), SPI, IIC…− AEC Q100 certificated, automotive IP on board − Ta = -40˚C to 125˚C− Vdd = 2.7 - 5.5V, 3.3V or 5V convenience

• Start your design easily today!− Complete ARM ecosystem− Massive options of development tools, SW and HW

references− Samples and Evaluation Boards (8K to 128KB) available now!

More info on Kinetis Auto

ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.

TM

External Use 9

KEA Block Diagram - KEA128

• Applications:− Automotive general purpose

• Operating Characteristics− Voltage range: 2.7 to 5.5 V− Temperature range (ambient): -40 to

125°C• Key Features:

− ARM Cortex M0+ core− Up to 128K embedded flash− Up to 16K RAM− External OSC and internal ICS for

clock− System functions: LVD, WDG, CRC,

SWD, BITBAND, BME, LP modes− Communication interfaces: SPI, SCI,

IIC, CAN− Multiple timers: FTM, PWM, PIT, PWT,

RTC− 12-bit ADC and ACMP

• Packages:− 16TSSOP, 24QFN, 32LQFP, 64LQFP,

80LQFP− Pin compatible within KEA family

Communications I/O System

6+2+2ch16bit Flex

Timer(2)

2I2C

2SPI

3SCI (LIN)

2KBI

12ch,12bit ADC w/8 FIFO

1PWT

2AnalogComp-arators

Peripheral Bus

SWDDebugger

DebugSystem

PeripheralBridge

Flash >128KB

1xWDT

1-Cycle GPIO

BME(1)

RAM>16KB

PMC2.7-5.5V

POR

Ext Osc (1-20M, 32K)

FLL Clk Mult

Int R/C OSC(~32KHz 2%)Int LP Osc

(1KHz)

LVD NV

IC

1-C

Y M

UL

ARM Cortex M0+ 48MHz Core Freq

(1) Support bit operation in RAM(2) Faster timer running 2 x core clock

1MSCANRTC

Open-Drain IO,

KBI,GPIO

1PIT

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External Use 10

Applications:• Infotainment connection module• GPS/Radio companion MCU• Motorcycle CDI/EFI• Pump/Fan controller• Passive keyless Push Start• BCM/HVAC• Windows/Door/Sun-roof• Seats/Mirror/Wiper Ambient lighting• DC/BLDC Motor control

Reference Solutions:• Fan controller with DC motor control• Pump controller with BLDC motor control• HVAC BLDC blower motor control• Vehicle Ambient lighting• Low power LIN/CAN nodes and gateway• Motor cycle CDI/EFI

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External Use 11

Functional Safety for Automotive & Industrial

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External Use 12

Functional Safety Simplified

• Functional safety is the absence of unreasonable risk due to hazards caused by malfunctioning behavior of electrical/electronic systems

Simplifies the process of system complianceSolutions designed to address the requirements of automotive and industrial functional safety standards

Reduces the time and complexity required to develop safety systems Comply with ISO 26262 and IEC 61508 standards

Supports the most stringent Safety Integrity Levels (SILs)Enabling designers to build with confidence

Zero defect methodologyFrom design to manufacturing to ensure our products meet the stringent demands of safety applications

More info functional Safety

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External Use 13

Functional Safety for Automotive & Industrial ApplicationsQorivva MPC574xP( 2x e200z4 200MHz, 2.5M Flash) 32bit Power Architecture™ Processor

• MPC574xP meets highest functional safety− Built around safety concept, targeting ISO 26262 ASIL D− Safety architecture with cores, DMA in delayed lock step− End-to-end error correction coding (e2eECC), − Duplicated periphery, start-up self-test (LBIST and MBIST)− Voltage regulator redundancy and supply monitoring− ADC self-test, and a fault collection unit (FCCU)− Sample available now!

• Targeted ApplicationsAutomotive IndustrialElectric Power Steering (EPS) Aerospace and Defense

Electronic stability control Non-Automotive Transportation

Vehicle dynamic and chassis control Factory Automation

Safety domain control

Adaptive Cruise Control

Blind spot detection

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External Use 14

MPC574xP 2.5 MB Block Diagram• Core

− Dual up to 200MHz PowerTM ISA e200 zen4 core ( Z420)− 32 bit Reg File, 64 bit BIU with E2E ECC, − 64kB RAM of D-LMEM with MPU for fast context switch + local

data− 8KB 2-way I-cache / 4KB 2-way D-Cache− 1x Scalar FPU (compiler supported) per core− Safety enhanced Cores – VLE only− No Signal processing unit extension + NO MMU− Delayed Lock Step configuration only

• Memory− 2.5 MBytes NVM with ECC (with add. Safety measure for address). − 64kB EEE (Data Flash) available incl. ECC− Up to 384 Kbyte global system SRAM with ECC (Addr + Data)

• I/O− 3 x FlexCAN (64+2x32 message buffers)− 1 x FlexRay (Dual Channel 64 msg. buffers)− 2 x LINFlex (Uart/Lin protocol driver)− 4 x DSPI (4 cs each) − 2x FlexPWM (2x 12ch for 2 independent Motors Controlled)− 3 x eTimer modules (18 channel total)− 4 x SAR ADC – 1MS/s target 5V input capable− 2 x Cross-triggering unit for motor control automatism− 2x SENT

• System− Interprocessor I/F SIPI (– approx 300Mbaud)− Safe DMA − Fault Collection unit, WDG, T-sens, & CRC computing unit− Nexus debug interface – Aurora− Dual-PLL (Peripheral + System Core)− 3.3 V Single supply: internal regulator with external power stage

or External supply− 3.3 V I/Os (ADC 5 V capable)− 144 LQFP / 257 MAPBGA 0.8 mm pitch / Tj = 150°C . Extended

Temperature at 165”C Option (separate P/N)

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External Use 15

PowerSBC10 – MC33907

Voltage Supervisor

Case study – MPC574xP & PowerSBC Functional Safety interactions

Vcca - 3.3 / 5.0V

VI/O - 3.3 / 5.0V

Vcore 2.4MHz1.2 to 3.3V configurableBoost Driver

Vpre440kHz Buck

Battery sense

ConfigurableI/Os (6)

Fail Safe Inputs

SecuredSPI

INT

Analog Multiplexer

Energy Management

State Machine

Fail Safe Output

Vcan - 5.0V

RSTFail Safe

State Machine

CAN Physical Layer

Fail Safe Inputs

MCUChallengerAnalog

& DigitalBIST

2.5 VRef.

Temp.

MPC574xP

Data & Instruction System

Systemintegration

e200z4CPU SPE

Communications

Timed I/O System

Vcore supply• OV, UV detection• Independent checkerVcca

Interrupt• error informed• diagnostic

Battery Mngt• Sense : AMUX• Own FSM supply

Analog Mux• 2.5V reference• Battery Sense• Temperature• I/Os

Fail Safe Inputs• FCCU monitoring• bistable protocol

Fail Safe Outputs• Safety output driver in case of MCU lock• ABIST safety check

Secured SPI• 8-bit check• parity• register read back

Challenger• algorithm of WD refresh• RST counter• LBIST

IndependantFS state Machine

Lock Step Mode• Dual core• self check• fit for ASILD

Reset• config timing• error generator• diagnostics• ABIST checks

Fault Collection and Control Unit

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External Use 16

New

Integration, Low Power, Security &

SafetyFunctional Safety and SecuritySecurity modules protect ECUs against various attack scenarios and Safety modules ensure robust operation per ISO 26262

Low Power ManagementNew low-power modes, analog comparators, and pretended networking support help meet stringent next generation power budgets and ensure greener vehicles

Unprecedented IntegrationSingle-chip solution offering multicore architecture and advanced networking protocols for next generation communication requirements while reducing the quantity of body control/gateway ECUs

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External Use 18

256kSRAM

(with ECC)

256kSRAM

(with ECC)

MPC5748C/G - Development Device and High End Gateway/BCM Solution

• Applications:− High end Gateway and Body Modules

• Key Characteristics:− 2x e200z4 + 1x z2 cores, FPU on z4 cores− 160 MHz max for z4s and 80 MHz on z2 − HSM Security Module option supports both

SHE and EVITA low/medium standard− Media Local Bus supports MOST

communication − 2 x USB 2.0 (1 OTG and 1 Host module)

support interfacing to 3G modem and infotainment domain

− 2x Ethernet 10/100 Mbps RMII, MII, +1588, AVB

− Ethernet switch− CAN module optionally supports CAN FD− SDHC provides standard SDIO interface− Low Power Unit provides reduced CAN, LIN,

SPI, ADC functionality in low power mode− Designed to ISO26262 process for use in

ASIL B − -40 to +125C (ambient)− 3.0V to 5.5V

• Packages:− 176 LQFP, 256 BGA, 324 BGA

Communications I/O System

48ch*ATD10bit

eMIOS96ch

4I2C,

3 SAI

4 DSPI

6SPIs

8CAN

18LINFlex

32ch*ATD12bit

CTU

3AnalogComp-arators

CROSSBAR SWITCHMemory Protection Unit (MPU)

Crossbar Masters

3x NexusClass 3+

JTAG

DebugSystem

PeripheralBridge

HSM

256kSRAM

(with ECC)

Flash controller

SIUL16xPIT+RTI

3xSWT

3xSTM

SSCM

STCU(MBIST/LBIST)

FCCUBAF/BAR

16xSemaphore

DMA MUX

6MFlash

incl EE emulation(with ECC)

VReg

RTC/API

8-40MHz Osc

FMPLL

32KHz Osc

16MHz IRC

128KHz IRC

MLB

SDH

C

Flex

Ray

2x U

SB

2.0

Ethe

rnet

e200z2Core

e200z4Core

e200z4Core

*Mixture of internal and external channelsFeatures available depend on package and device version

1CRC

5747C 5748C 5747G 5748G

Cores 2 2 3 3

Flash 4M 6M 4M 6M

RAM 512k 768k 768k 768k

MLB N N Y Y

USB N N Y Y

Low PowerUnit

Interface

32ch

eD

MA

Ethe

rnet

X

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External Use 19

Performance Analog Portfolio

System PowerManagement

Embedded System Power Management (PF0100/0200)System Basis Chips (SBC): power mgmt + comm + safetyCAN bus and LIN connectivity transceivers

Battery & Energy Management

Battery Monitoring System (BMS): 12V Pb, 14V Li-ion, 24V+Alternator Regulator ChipStop/Start MOSFETsLi-Ion Linear Battery Charger

System Management &

Automation

Engine ManagementBraking: ABS, ESC, WSS controlAirbag: power mgmt + comm + safety, squib driversMillimeter Wave Radar: 77GHz transmit & receiveDSI sensor Interfaces

Power Drivers

High & low voltage H-Bridge driversLow side driversProgrammable solenoid controllersH-Bridge and 3-phase motor pre-driversIntelligent Distributed Controllers (IDC)

Power Analog Switches

18V & 36V/24A eXtreme Switches: High side FET w/ smart controlMulti-Switch Detect Interface (MSDI)Mini/Micro Hi-Speed USB2.0 Switch Interface

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External Use 20

Features• Pin-to-pin compatible with MC33399 & 33661 • Excellent EMI performance thanks to bus active

wave shaping • High EMC immunity and ESD robustness• Very low emissions:

‒ 50dBµV max in low frequency‒ 7dBµV max in high frequency

• Fast slew rate selectable (>100kb)• J2602 / LIN2.1 options part number selectable• Automatic compatibility w 3.3 and 5.0V MCUs• Low sleep current (typical @ 6µA)• Short to ground proof• Single battery supply (no 5.0 Vdd required)• Dedicated dual edge sensitive wake-up input • Control of external voltage regulator through INH• Tx permanent dominant timeout

One Page Overview – MC33662 LIN 2.1 / J2602-2 Physical Layer

Key characteristicsBus TypeData RateIQ Low Power ModeLIN ESD/150pF, 330ΩOperating voltageOperating temp.

LIN 2.1 / J2602-210kb or 20kb / >100kb6 µA ±15kV5.5V - 27V -40°C<Tamb<125°C

8 SOIC-NB

Target MarketAll LIN Nodes

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External Use 21

Part Number 33662 3391xG5 33902 33903 33903S 33903D 33904 33905S 33905DProduct Status QS PPAP PPAP PPAP PPAP PPAP PPAP PPAP PPAP

VMCU (Vdd) - 5.0V110mA

- 5.0V/3.3V100mA+/‐2%

5.0V/3.3V150mA+/‐2%

5.0V/3.3V150mA+/‐2%

5.0V/3.3V150mA+/‐2%

5.0V/3.3V150mA+/‐2%

5.0V/3.3V150mA+/‐2%

VMCU Pw Sharing. - - - ‐ Yes/+300mA Yes/+300mA Yes/+300mA Yes/+300mA Yes/+300mA

Vaux (ballast) - - - - - - 5.0/3.3V 5.0/3.3V 5.0/3.3V

Vcan - - 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA

CAN HS P/L - - 1 1 1 1 1 1 1

LIN2.1 / J2602 P/L 1 1 - - 1 2 - 1 2

I/Os 1 2 1 1 3 3 4 4 4

LowQ Voff/Von 6µA 33µA 15µA 15/25 µA 15/25 µA 15/25 µA 15/25 µA 15/25 µA 15/25 µA

Battery sense - Yes - - Yes Yes Yes Yes Yes

AMUX - Yes - - Yes Yes Yes Yes Yes

Fail Safe - - - - Yes Yes Yes Yes Yes

Watch Dog - Yes - Yes / Adv Yes / Adv Yes / Adv Yes / Adv Yes / Adv Yes / Adv

SPI - 8b pseudoSPI 16b / Safe 16b / Safe 16b / Safe 16b / Safe 16b / Safe 16b / Safe

Package SO8 LQFP32 SO14 SOIC32eP SOIC32eP SOIC32eP SOIC32eP SOIC32eP SOIC54eP

Attach strategyMCU Supply

- SO8S12XS

Low endSO8

SO8S12XSS12XE

S12XEMPC5604BMPC5604PMPC5634M

S12XEMPC5604BMPC5604PMPC5634M

S12XEMPC5604BMPC5604PMPC5634M

S12XEMPC5604BMPC5604PMPC5634M

S12XEMPC5604BMPC5604PMPC5634M

Freescale SBC Solutions – Features Table Overview

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External Use 22

Motor Control Integrated Solutions

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External Use 23

Introduction to MagniV S12ZVMBLDC, PMSM & DC Motor Control

• Innovative single chip MCU with HV Analog − LL18UHV Technology: Low leakage 180nm + 40V UHV− NVM, EEPROM, S12Z core, SCI/SPI, A/D, Timers…− Low-High Side, Relay/MOSFET Drivers, Voltage Reg,

LIN/CANPhy

• Accelerate your design, save on cost− Reduced BOM− Improved Quality− Lower power consumption− Reduced PCB Size

• Build a demo in record time− No need to be a motor control expert− S12ZVM provides unique combination of hardware

integration and a complete tools and software ecosystem.− S12ZVM enables extremely compact and sophisticated 12V

motor control solutions with Ta up to 150˚C

S12ZVM Complete Enablement

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External Use 24

Target Application:

Benefits:

Enablement:

HVAC BlowerWipers

AC Compressor

FuelWater

Oil Pump

Sliding DoorsPowered Liftgate

CompactSingle chip

saves PCB space

PerformanceLower power/ noise

High temp (Ta 150˚C)Sensorless

Scalable32 to 128K Flash

CAN & LINHW & SW re-use

HardwareEval Board

MC Development Kit Mini Eval Board

SoftwareDevelopmentProduction

Compiler, Debugger

LibrariesOptimized Math &

Motor Control algorithms

Motor Control with MagniV S12ZVMIntegrated solution for BLDC, PMSM & DC Motor Control

TM

External Use 25

VREG(8pin)

LIN phy(8pin)

MCUor

DSC(48pin)

Gate Driver(48pin)

Op-amps

Discrete Solution

20+3+

2+

S12ZVM Solution:• ~ 50 fewer solder joints• - 4 to 6 cm2 PCB space

S12ZVM Concept : Replace up to 5 IC

4cm~1 ½ in.

64pin

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External Use 26

Key Features:• S12Z CPU @ 50MHz bus speed

• 6ch Gate Drive Unit (GDU) with 50-150nC total Gate Charge drive capability, incl charge pump for High-Side, Bootstrap diodes for charging external bootstrap capacitors

• Embedded VREG with switchable 5V/20mA sensor supply

• LIN PHY, LIN2.1 / 2.2 / J2602 compliant

• Dual 12bit list-based ADC (LADC), synch with PWM through Programmable Trigger Unit (PTU)

• 2x Op-amp for current sensing

High-VoltageComponents

DigitalComponents

5V AnalogueComponents

MCU Coreand Memories

Options:• Package: 64-LQFP-EP, 48 LQFP-EP• Memory: 16kB / 32kB / 64kB / 128kB Flash• Option -L with LIN phy• Option -C with 2nd Vreg for external CAN phy• Temperature: V / M / W (up to 150°C Ta per

AEC-Q100 Grade 0)

Target applications:• Sensorless BLDC or PMSM motor control

• Bidirectional DC motors (H-Bridge)

• Various pumps (oil, fuel, water, vacuum)

• Cooling fan and HVAC blower

SPI

SCI 0SCI 1

MSCAN

512B EEPROM

(ECC)

16-128 KB Flash (ECC)

S12Z 50MHz Bus

2-8kB RAM(ECC)

PLLRCosc.+/-1.3%

PierceOsc.

VsupsenseVreg

1#EVdd

12-Bit LADC

TempSense

12-Bit LADC

LIN/HV -PHY

Current Sense(2 x Op-Amp)

GDU 6chMOS-FET-Predriver

Charge Pump

2chPTU

6ch PMF(PWM)

TIM 16b4ch

GPIO

BDMBDC KWU Win

Wdog

Bootstrap Diodes

Product Summary - S12ZVM FamilyBLDC/PMSM motor control

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External Use 27

S12ZVL - familyIntegrated General Purpose LIN Node - Summary

Key Features:• S12Z-core (up to 32MHz bus frequency) compatible within

MagniV• On chip 12V Vreg with Supply-capability:

‒ 70mA total (170mA with ext. Ballast)

• LIN-PHY, LIN2.x / J2602 compliant• On chip RC Oscillator; trimmed to +/- 1,3% tolerance over

full temperature range• Robust 12V inputs Vsup-sense & HVI (with ADC)• 1x E-Vdd (20mA source capability)• 1-3x N-GPIO (25 mA sink capability)• 5x5mm footprint 32QFN-package optional• ASIL-A compliancy

KNOXS12ZVL S12ZVLS

Application orientation generic small sensorsPackage 48LQFP 32LQFP 32QFNFlash Memory (ECC) 32/16/8 kB 32/16/8 kB 32/16 kBNGPIO (GPIO with 25mA NMOS) 3 1 310‐Bit ADC 10ch 6ch 6ch

SPI

TIM 16b6+2ch 128B

EEPROM(ECC)

8-32KB Flash (ECC)

S12Z 32MHz BusIIC

LIN-PHY 10-Bit ADC

TempSense

1kB RAM(ECC)

PLLRCosc.+/-1.3%

PierceOsc.

HV Input1#E-Vdd

1-3#NGPIO

SCI 1 SCI 0

GPIO

Vreg

70, or up to 170mAwith ext. Ballast

PWM 8ch 8bor 4ch 16b

Vsupsense

BDMBDC KWU Win

Wdog

High-VoltageComponents

DigitalComponents

5V AnalogueComponents

MCU Coreand Memories

Target Applications:• Any kind of automotive LIN-node• LIN-sensors / actuators• LIN switchpanel / userinterface• LIN RGB LED lighting• Ultrasonic sensors• …

Family options:• Flexible Memory Options: 8kB to 32kB Flash version

• 32-LQFP , 48-LQFP or 32QFN-Packaging

• C / V / M Temperature options (up to 125°C Ta)

TM

External Use 28

Target Applications

LIN-Sensors LIN-switchpanels LIN-Actuator

Product Function• Hooking up sensors into

automotive LIN-Network (with signal pre-conditioning

Market Requirements• LIN-PHY, 12V-Vreg, MCU• Small formfactor (QFN)• ADC, SPI

Product Function• Reading multiple switch-

positions and feeding into LIN-network

Market Requirements• LIN-PHY, 12V-Vreg, MCU• Multiple GPIOs• ADC

Product Function• Converting LIN-

command into an activity (eg driving LEDs)

Market Requirements• LIN-PHY, 12V-Vreg, MCU• Drivers (3x25mA drive

strength in case of RGB-LED)

• ADC

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External Use 29

High Temperature and Automotive Qualification

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External Use 30

AEC Q100

All Freescale Automotive MCU are certified AEC Q100

125˚C

All Freescale Automotive MCU

support up to 125˚C ambient temperature

150˚C

Extended temperature up to 150˚C ambient on

several product lines (S08SG, S12G, S12ZV, Qorivva)

Low PPM

Benefit of one of the lowest PPM level in

the industry

Largest portfolio with automotive qualification gradeHigh temperature for space constraint applications•Fuel, oil, water pumps, sensor and actuators…

Automotive Grade for Challenging Environment

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External Use 31

Software and Enablement

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External Use 32

Prototype in 24 Hours: Typical Development Flow

choose your hardware

Install Development Suite

1

2

3 Prototype with Demo Code

• Demo boards • Reference solutions• USB Starter Kits

• Low-level drivers: CAN, LIN, Flash• Demo code: CAN wakeup, LIN comms• Peripheral enhancement routines

• Initialisation / autocoding• Compiler• Debug

TM

External Use 33

Body Chassis/Safety

Software Products Overview by Segment

Autosar 3.x

Powertrain

MCAL

OS

MCAL

OS

MCAL

OS

560xB/C/D, 564xB/C, 5668G

Non-Autosar Ethernet/AVB

Camera Appl SW

Instruction Set Self Test (Power Arch e200 cores)

Autosar 4.0

560xP, 5604E, 564xL, 567xK

560xP, 564xL, 567xK 563xM, 564xA, 567xF

563xM, 564xA, 567xF560xB/C/D, 564xB/C, 5668G

MCAL

OS

MCAL

OS

MCAL

OS

560xB/C/D, 564xB/C574xB/C/G

560xP, 564xL

560xP, 564xL, 567xK 564xA, 5676R

563xM, 564xA, 567xF

5604E

5604E

Initialization

Motor Ctrl TB 564xL, 567xK

RAPPID for 560xP, 564xL, 567xK

e200 Power Arch MCUs

560xB/C/D, 564xB/C574xB/C/G

Math & MC LibMath & MC Lib

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External Use 34

Development Tools (expl. MPC5646B/C) Part number Price Description

XPC56xxMB2 $375 generic motherboard with connectors for Mini-Modules

XDC564B256BSB3M $120 Mini Module with 256MAPBGA socketed siliconXDC564B208QSB3M $120 Mini Module with 208LQFP socketed siliconXDC564B176QSB3M $120 Mini Module with 176LQFP socketed silicon

XKT564B256BSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code.

XKT564B208QSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code.

XKT564B176QSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code.

CodeWarrior Compiler Free Free permanent license limited to 128KB code.

Rappid pin wizzard Free I/O allocation tool with graphical interfaces, and outputs documentation, saves engineers a few hours.

U-MULTILINK $119 USB interface to PC, Universal Multilink Development Interface

USB Multilink (P&E)

U-MULTILINK-FX $399 USB interface to PC, Universal Multilink FX High-Speed Development Interface

USB Multilink (P&E)

CYCLONE_MAX $899 Programming tool, see options and add-ons on P&E website (eg automatisation for series prod, Ethernet extension…)

CYCLONE_MAX_PE $899 powerful stand-alone in-circuit programmer and debugger for Freescale’s high-end architectures

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External Use 35

Making the World a Smarter Place.

TM

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