back up stave test program status eric vigeolas pixel week december 2000 pre production status...

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Back up stave test program status Eric VIGEOLAS Pixel week December 2 •Pre production status •Assembling phase comments •Geometrical control •Stave Qualification Tube pressure tests Tube pressure cycles Stave thermal conduction Stave thermal distortion Stave thermal stability •Stave connection •Stave insulation •Schedule and budget

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Page 1: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Back up stave test program status

Eric VIGEOLAS Pixel week December 2000

•Pre production status•Assembling phase comments•Geometrical control•Stave Qualification

– Tube pressure tests– Tube pressure cycles– Stave thermal conduction– Stave thermal distortion– Stave thermal stability

•Stave connection•Stave insulation•Schedule and budget

Page 2: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Pre Production status

Eric VIGEOLAS Pixel week December 2000

Up to now 5 back up staves was assembled.

One have been fully tested for the June mechanical review.

One stave was broken during the shipment (but one half was tested to confirm the thermal distortions observed on the previous stave)

Three additional stave was manufactured two with an aluminium tube without parylene, the last one was manufactured with Parylene coated tube.

This pre production have confirmed that the assembling tools foreseen for the baseline stave was suitable for the Back up stave. Only one additional sequences is needed during the assembling phase (the grease deposition on the tube which take a few minutes).

One Sequence in the baseline assembling was changed, the Omega glue deposition. An manual deposition which consist to wet the two wings of the Omega was chosen in order to reduce the amount of Glue.

Page 3: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Assembling phase Comments

Eric VIGEOLAS Pixel week December 2000

One important result of the stave assembling technique is that due to the pressure applied on the Omega in the gluing phase, the thickness of Omega glue is bellow the expected 0.1mm.

0.1 mm was the nominal grease thickness foreseen. This amount of grease was foreseen to permit to the tube to have a degree of freedom to avoid thermal mismatch. Therefor the tube is in contact with the C-C.

The main effects of this observation is:

– More thermal deformations due to CTE mismatch, but those deformations are reduced by the use of 5 supports points (presented later), and stays in the requirements

– Better thermal efficiency of the cooling pipe

– The tube grease layer is less determining is the stave reliability.

0.1mm

0.1mm

Pressure applied during the assembling on the Omega

The tube is in contact with the C-C

Page 4: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

PLan relative altitude missalignment

-0,02

0

0,02

0,04

0,06

0,08

0,1

0,12

0,14

-350 -300 -250 -200 -150 -100 -50 0

mm

mm

Pitch

Roll

Surface Flatness

Individual plan flatness Roll Pitch46 microns ( sigma=8microns) <0,3° <0,2°

Geometrical Control (June stave)

Each tilted plan of the stave was measured in order to estimate the accuracy reached after the machining and the assembling.

The individual plan geometry accuracy is listed in the table bellow.

The relative plan location (in R an Z direction ) accuracy is:

– Z: ± 50m– R: ± 100m

The R location inaccuracy is mainly due to the natural bowing if the stave (composite material, thermal curing…)

Eric VIGEOLAS Pixel week December 2000

Individual plan flatness Roll Pitch46 microns ( sigma=8microns) <0,3° <0,2°

Page 5: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Eric VIGEOLAS Pixel week December 2000

Module Plan and its Averaged Plan Representation

Measure Z

Geometrical Control (2 November staves)

On the new staves received at CPPM the planarity of the Tilted plan was measure:

– each plans presented the same “S” shape– The average planarity on 24 plan is 41 m– The sigma is 13 m– The best planarity was 19 m– The worst one was 67 m

The main risk of a poor planarity is the difficulty to deposit a module on the surface with the required glue thickness. Two consequences are suspected:

– Silicon temperature dispersion if the glue thickness is not controlled

– Impossibility to reduce the remaining force to 0 grams during the deposition.

Two stave was equipped with Si by using the CPPM module assembling tool. The main results are:

– During the thermal test no important temperature dispersion was shown

– Remaining forces on Si was existing on a minority of plan (< 100 grams), The consequences of such parameter have to be understood (not yet done).

Planéité 51.602

Module Plan and its Averaged Representation

Measure Z

Page 6: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationTube pressure tests

Eric VIGEOLAS Pixel week December 2000

0

10

20

30

40

50

60

70

0 2 4 6 8 10 12 14 16

Bars

F (m)

F

The Aluminium Tube was individually pressurised in order to control it pressure stiffness. The tube flat edge deformation was measured to control eventual remaining distortions.

The tube has resist to an internal pressure of 15 bar without remaining deformations.

At 4 Bars absolute the tube have a flat face bowing of 15 m.

At 8 Bars the flat face bowing is about 25 m.

Page 7: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationTube pressure Cycles

Eric VIGEOLAS Pixel week December 2000

500 Pressure cycles was applied from 1 Bar to 7.5 Bar in order to control if any creep appear. The creep rate observed after the full tests was 0.1% which is negligible.

By maintaining the pressure in the tube after the tests no leaks was observed. Further leak tests will be done with He.

Flat tube face deformation under Pressure Cycles (1-->7.5 Bar)

0

5

10

15

20

25

30

0 50 100 150 200 250 300 350 400 450 500

Number of Cycles

Mic

rons

Page 8: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationStave Thermal Cycles

Eric VIGEOLAS Pixel week December 2000

Thermal cycles

-38,00

-33,00

-28,00

-23,00

-18,00

-13,00

-8,00

-3,00

2,00

900 1900 2900 3900 4900 5900

Time (s)

°C

0,00

0,20

0,40

0,60

0,80

1,00

1,20

1,40

1,60

1,80

2,00

Bar

abs

olut

e

PT_T_IN[C] PT_1[C] PT_2[C] PT_3[C] PT_4[C] PT_5[C] PT_6[C]

PT_7[C] PT_8[C] PT_9[C] PT_10[C] PT_11[C] PT_12[C] PT_13[C]

PT_T_OUT[C] AVER_AMB[C] Exhaust[BARa]

Thermal Chock: -35°C

Page 9: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationStave Thermal Cycles

Eric VIGEOLAS Pixel week December 2000

The Thermal cycles was performed with full power on the stave (134W), by just switching on and off the power supply. The main variation in the temperature are driven by the inertia of the cooling system (stabilisation of the intern stave pressure, flow rate stabilisation…) than by any effect of the stave thermal conduction changes.

Before this test thermal chocks was also applied (power on on one side of the stave and power off on the other side and vice and versa (temperature decrease up to -35°C) + switch off of the cooling with an immediate switch on (temperature goes up to 60°C) ).

Moreover during these tests the stave was handle on two points, with allows the mobility of this one. This was the worst conditions (high displacements) to test the reliability of the thermal conduction.

Finally this test gave precious informations about the reliability of the NEA123 UV Glue + CGL7018 Grease for the module attachment.

Page 10: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationStave Thermal conduction (June stave)

Eric VIGEOLAS Pixel week December 2000

Silicon emperature along the stave

-30

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14

Si Number

°C

C-C sensors

Tube sensors

The Temperature measured at full power was uniform along the stave. The average Silicon temperature is -12°C.

The pressure drop was < 0.05 bar, this involve a very low T along the tube < 2°C.

The temperatures measured on the C-C shows a low T in the cross section of the silicon <3°C. The T between the fluid and the silicon is < 12°C

The Back up stave meet perfectly the thermal requirements.

Page 11: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationStave Configuration (June stave)

Eric VIGEOLAS Pixel week December 2000

The stave configuration was as follow: one Pt100 sensor was glued on each silicon(13 sensors),4 Pt100 was glued on the edge of the C-C, Two Pt100 was glued on the tube at the inlet and the outlet. The maximum power applied was 107 Watts on the full stave.

This test was done at CERN with C3F8 fluid.

Back thermal sensor on C-C

Heaters

Estimations of C-C temperature by calculations shows that it is very close to the silicon one (-11°C)

Estimations of Silicon temperature by calculations shows that the uniformity of the temperature(T on Si) is < 5°C

Page 12: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationStave Configuration (November stave)

Eric VIGEOLAS Pixel week December 2000

The stave configuration was as follow: one Pt100 sensor was glued on each silicon(13 sensors), Two Pt100 was glued on the tube at the inlet and the outlet. The maximum power applied was 134 Watts on the full stave.

This test was done at CERN with C3F8 fluid.

Thermal Sensor

Heaters

Page 13: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationStave thermal conduction test (November stave, before pressure cycles)

Eric VIGEOLAS Pixel week December 2000

The Si temperature average values is -11.07 °C on the tilted Si, and -7.05°C on the middle Si.

The Pressure drop along the stave is 0.1 Bar.

Silicon Temperature (Power dissipated 134W)

0,12 Bar

1,72 Bar (absolute)

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14

°C

0,00

0,40

0,80

1,20

1,60

2,00

Bar

Silicon temperature Tube in & Tube out Temperature Ambiant temperature Pressure Drop Pressure in the stave (absolute)

Page 14: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Stave QualificationStave thermal conduction test (November stave, After the Temperature cycles)

Eric VIGEOLAS Pixel week December 2000

The Si temperature average values is -12.96 °C on the tilted Si, and -7.34°C on the middle Si.

The Pressure drop along the stave is 0.2 Bar.

Thermal conduction after Thermal and pressure cycles (Power dissipated 134W)

0,25

1,45 (absolute)

-30

-25

-20

-15

-10

-5

0

0 2 4 6 8 10 12 14 16

°C

0,00

0,20

0,40

0,60

0,80

1,00

1,20

1,40

Bar

Silicon Temperature Ambiant Temperature Tube In & Tube out Temperature Pressure Drop Pressure in the stave (absolute)

Page 15: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Eric VIGEOLAS Pixel week December 2000

Two measurements was done in a cold box for a T of 25°C.

On of the measurement was done without silicon glued on the stave, the second one with silicon glued on the stave in order to control the module influence on the stave deformation.

0 100 200 300 400 500 600 700 800 900

0.05

0.03

0.01

0.01

0.03

0.05

0.07

0.09

0.11

0.13

Stave thermal deformations

X coordinate along the stave (mm)

devi

atio

n fo

r 25

°C v

aria

tion

(m

m)

0.149

0.021

ajust X i

Yi

ajust1 X i

T i

827.5999.727 X i

The stave shows an asymmetric behaviour in the two configurations. On side stays within the requirements with a maximal R displacement of 30 m. The other side get out of the specifications. This asymmetry was shown on all the staves measured. Phenomena to be studied..

Stave QualificationStave thermal distortion on three aligned points test (June stave)

Page 16: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Deformations on 5 points

-0,04

-0,03

-0,02

-0,01

0

0,01

0,02

0,03

0,04

-500 -400 -300 -200 -100 0 100 200 300 400

mm

mm

Eric VIGEOLAS Pixel week December 2000

This measurement was done in a cold box for a T of 25°C.

The stave was equipped with Si heaters

The stave shows an asymmetric behaviour. On side have a maximal R displacement of 10 m. The other side have a maximal R displacement of 30 m . This confirm what was said before about the asymmetry shown on every staves.

Stave QualificationStave thermal distortion on five aligned points test (November stave)

Page 17: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Eric VIGEOLAS Pixel week December 2000

The Maximum displacement after Three modules off was 3 m (indicative value which is inside the tolerance of our CMM)

Stave QualificationStave thermal stability on five aligned points test (November stave)

This test was done on half of the stave. This consist of applying a power on Si to maintain a T of 10°C in between The Si and The Coolant.

And switch off the power on one and three modules in between two support to control the stave mobility.

The Cooling system available at CPPM works at constant cooling power (and not at Temperature constant as for C3F8). This is a worst condition because more parts of the stave will have temperature changes, which involve more displacements.

Module1

Module2Module3

Supports

Page 18: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Eric VIGEOLAS Pixel week December 2000

Stave QualificationStave thermal stability on five aligned points test (November stave)

Stave stability with power on/ off on one module and three modules

-3

-2

-1

0

1

2

3

4

5

0 50 100 150 200 250 300 350 400 450 500

mm

micr

on

Stave displacements with module 2 Off Stave displacements with the modules 1 2 3 off

Page 19: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Eric VIGEOLAS Pixel week December 2000

Stave ConnectionConnection project still under study. This subject

have took two months of delay due to the use of the induction Power supply by an other experiment.

Meanwhile the first Cupro-Nickel Tests pieces was Brazing. The design program is:

– Complete the study concerning the Cupro-Nickel

– Study the feasibility of an Aluminium pieces brazing

Each study is split in several qualifications tests :– Corrosion inspection (visual inspection after a metallurgical polishing)– Pressure test (leak tests coupled with pressure cycles)– Traction and shear tests coupled with He leak tests

Remaining studies concerns:– The layout of the piping (designed as close as possible than the baseline one)– The scenarios of the the pipes assembling (staves connection and

deconnection).– ….

Page 20: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Eric VIGEOLAS Pixel week December 2000

Stave Insulation

The stave insulation will be handle by the Parylene deposition on the tube.

The insulation resistance is > 20MOhm (limit of our measurement instrument) in between the internal face of the tube (non coated) and the external one.

The first stave prototype equipped with a Parylene coated tube was assembled a few weeks ago, and the thermal conduction of this one should be done by January (to verify the effected of the additional thermal resistance due to Paryelene).

Page 21: Back up stave test program status Eric VIGEOLAS Pixel week December 2000 Pre production status Assembling phase comments Geometrical control Stave Qualification

Eric VIGEOLAS Pixel week December 2000

Schedule and Budget

Concerning the additional tasks required for the Back up stave assembling, this have no influence on the schedule of the Baseline stave assembling (the additional tasks take a few minutes). All these tasks will be done at Plyform Which actually is involved in the baseline assembling and which have built the three previous backup staves.

The tube delivery is 7 weeks + 4 weeks needed for the Parylene deposition.

The tube price plus the Parylene deposition have a price of 50000 ChFr.

The additional cost due the the new tasks needed at Plyform is not known.