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Page 1: CFP MSA MECHANICAL LAYOUTcfp-msa.org/Documents/CFP_MSA_Host-Mechanical-Drawings.pdf · page 15 revision 14 pcb layouts – 10.0 host board single side layout requirements – 10.1

page 1revision 14

CFP MSA MECHANICAL LAYOUT

17MAR10 REV 14

Page 2: CFP MSA MECHANICAL LAYOUTcfp-msa.org/Documents/CFP_MSA_Host-Mechanical-Drawings.pdf · page 15 revision 14 pcb layouts – 10.0 host board single side layout requirements – 10.1

page 2revision 14

OPTICAL MODULE TO HOST CONNECTOR MATED VIEW – 1.1

OPTICAL MODULE & KEY COMPONENTS – 1.2

CONNECTOR VIEWS – 1.0

OPTICAL MODULE ASSEMBLY

FIGURE 1

FIGURE 2

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CONNECTOR VIEWS – (CONT)

OPTICAL MODULE & KEY COMPONENTS -1.2 (CONT)

MODULE CONNECTOR ASSEMBLY

HOST SIDE COMPONENT DESCRIPTIONS – 1.3

HOST CONNECTOR

HOST CONNECTOR COVER ASSEMBLY

FIGURE 3

FIGURE 4

FIGURE 5

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GUIDE RAIL

BACKER PLATE ASSEMBLY

EXTERNAL BRACKET ASSEMBLY

CONNECTOR VIEWS – (CONT)

HEAT SINK

HOST SIDE COMPONENT DESCRIPTIONS – 1.3 (CONT)

FIGURE 6

FIGURE 7

FIGURE 8

FIGURE 9

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OPTICAL MODULE ASSEMBLY - 2.0

OPTICAL MODULE GENERAL ASSEMBLY DIMENSIONS – 2.1

FIGURE 10

THIS PAGE INTENTIONALLY LEFT BLANK

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OPTICAL MODULE ASSEMBLY – (CONT)

OPTICAL MODULE GENERAL ASSEMBLY DIMENSIONS – 2.1 (CONT)

FIGURE 11

THIS PAGE INTENTIONALLY LEFT BLANK

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-B-

K

K

-B-

H H

0.1 B A C59.20 0.10

2X 0.1 B A C

57.90 0.10

-A-4.00 0.08

0.1 B A C61.05 0.08

0.1 B A C65.95 0.08

148X 0.08 B A C

0.35 0.03

6.00 0.08

0.1 B A C61.05 0.05

2X 29.2

146X 0.8

9.80 0.10

2.20 0.10

0.08 B C A2.62 0.08

0.08 B C A2.18 0.08

2.00 0.10

2.20 0.05

17.80 0.15

2X 5.60 0.10

-C-60.05 0.08

0.1 A C B1.00 0.08

0.8 0-0.1

9.08 0.15

1.20 0.10

1.7

2.71 MAX

2X MIN0.402X MIN30

HOUSING 148X CONTACT

SECTION K-K

1 X 30 CHAMFER (2X)

SECTION H-H

PCB HARD STOP

OPTICAL MODULE CONNECTOR ASSEMBLY - 3.0

MODULE CONNECTOR DIMENSIONAL REQUIREMENTS– 3.1

FIGURE 12

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-E- -G-A

A

2.3 0.05

8.1 0.1

9.3 0.13

0.85 0.08

2.15 0.13

0.85 0.13

1.85 0.13

1.05 0.1

4.65 0.1

( )0.1

TYP1.575 0.05

5.2 0.05

6.2 0.08

5.3 0.05

1.65 0.04

2.55146X 0.8

TYP1.575 0.05

5.35 0.1

5.35 0.1

63.5 0.05

-D-0.1 E B

2 0.1

2X 2.55 0.05

( )58.4

60.2 0.05

63.5 0.05

65.5 0.13

1.4 0.05

148X 0.1 E B D

0.15 0.05

-B-2 0.05

x45TYP

0.75

* DATUM -G- IS COINCIDENT WITH HOST PCB TOP SURFACE

PIN #1

PIN #148

PIN #74

PIN #75

0.1 G

148 SOLDER LEADS148 SOLDER LEADS

SECTION A-ASCALE 15:1

SEE DETAIL B

DETAIL BTYPICAL

SCALE 20:1

HOST CONNECTOR - 4.0

HOST CONNECTOR DIMENSIONAL REQUIREMENTS – 4.1

FIGURE 13

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HOST CONNECTOR COVER ASSEMBLY - 5.0

COVER ASSEMBLY DIMENSIONAL REQUIREMENTS – 5.1

FIGURE 14

-A-

-B-

-B-

2X 0.05 A B C3.2 0.08

M3x0.5TAPPED HOLE

0.1 A B C66 0.15

0.1 A B C14.5 0.15

0.1 A B C61.7 0.13

0.1 A B C67.6 0.13

2X 1.4 0.1

0.1 A B C3.05 0.05

0.1 A B C3 0.1

0.1 A B C3.05 0.05

-C-85.6 0.15

2X 3.4 0.1

2X 5

2X 7.25

80.8

38.1 0.13 2X 1.2 0.13

17.85 0.13

2X 4.1 0.13

30.25 0.1

60.5 0.15

2X M3x0.5 THREADED

0.50.15 A B C

80.8

2X 2.25 9.6

0.1 A B C72 0.13

2X 12.5 0.13

2X13.95 0.13

5.3

19.05 0.15

2X 7.3 0.05

9.8 0.1

-C-

-C-GASKET

M3x0.5

GASKET

-C-

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HOST GUIDE RAILS - 6.0

GUIDE RAIL DIMENSIONAL REQUIREMENTS – 6.1

FIGURE 15

-A-

-B-

-A-

-C-86 0.1

8.1 0.1

5.6 0.05

2X M x0.5 THREAD0.1 A B H3

0.08 A B C-H-

3.1 0.05

73

0.1 A B H3.1 0.05

0.08 A B H2.45 0.05

2X 3.3 0.08

0.1 B A C105.4 0.15

7.3

2.25 0.05

6.1

2X 0.08 A B C1.6 0.05

2X 0.1 B A C5.8 0.05

2X 0.1 B A C3 0.05

0.1 B A C97.4 0.15

43

3.7

5

3.5

555

3.5

2X 0.1 A B H3.2 0.05

2X 2-56UNC THREAD0.1 A B H

x450.5

4.7 0.05

4.25 0.05

2X 2

2X 9.6 0.1

SEE DETAIL D

DETAIL DSCALE 15:1

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HOST BACKER PLATE ASSEMBLY - 7.0

HOST BACKER PLATE ASSEMBLY DIMENSIONAL REQUIREMENTS – 7.1

FIGURE 16

-A-

4X 2-56UNC THRU0.1 A B C

4X 5.4

-C-

-B-85.6 0.15

11 0.1

-C-17.6 0.1

2.6 0.1

2.5 0.1

2X 0.1 A B C2.15 0.05

0.1 A B C6 0.05

0.1 A B C69.7 0.1

0.1 A B C78 0.1

4X 39.4

-B-0.1 A B C

74 0.1

2X 40.825

2X 0.1 A B C5.8 0.1

0.1 A B C7.6 0.1

0.1 A B C14.2 0.1

0.2

OF 5.80SLOT

CLIP THICKNESS0.1 0.01

6.2 0.1

4X R 0.5 0.1

8X R MAX0.13

SEE DETAIL X

2X GUIDE RAILRETAINING CLIPS0.1 A

DETAIL XSCALE 10:1

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-A-

J

J

0.1 A B C14.6 0.05

4X 39.4

4X 5.4

-B-85.6 0.15

17.9 0.15

4X 2.352.2

CLEARANCE HOLEFOR UNC 2-56

0.08 A B C3.8

0.1 A B C82 0.05

24.7 0.15

-C-17.6 0.1

0.45 0.08

0.1 A B C14.2 0.05

0.2

OF 5.8 SLOT

0.1 A B C5.8 0.1

0.1 A B C74 0.1

0.1 A B C78 0.1

0.1 A B C82.6 0.05

0.1 A B C69.7 0.1

2X 5.5 0.1

2X 2.55 0.05 0.35 0.1

2X 0.1 A B C6.2 0.05

2X 0.1 A B C

3.2 0.05

0.1 A B C79.7 0.05

4X R 0.5 0.1

8X R MAX0.13

-C-

0.1 A

-C-

SECTION J-JSCALE 10:1 GASKET

HOST EXTERNAL BRACKET ASSEMBLY - 8.0

EXTERNAL BRACKET DIMENSIONAL REQUIREMENTS – 8.1

FIGURE 17

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HOST ASSEMBLY - 9.0

HOST ASSEMBLY GENERAL ENVELOPE DIMENSIONS – 9.1

FIGURE 18

MIN MODULE PITCH = 86MM

113.25 MIN

116.25 MAX

( 1mm MIN3mm MAX)

( )85.6

18.0 0.15mm

HOST CONNECTOR LOCATION DATUM1

1

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HOST ASSEMBLY – (CONT)

HOST ASSEMBLY GENERAL ENVELOPE DIMENSIONS – 9.1 (CONT)

FIGURE 19

( )17.6

0.11.5

MAX25.05

( )103.5

( )85.6

MAX25.05

( )72

( )17.6

( )5.3

( )0.9

( )2

HOST CONNECTOR LOCATING DATUM

HARD STOP FOR OPTICAL MODULE

1

2

HEAT SINK

2

1

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PCB LAYOUTS – 10.0

HOST BOARD SINGLE SIDE LAYOUT REQUIREMENTS – 10.1

FIGURE 20

-Y-

-X-

-A-

63.5

UNPLATED

0.1 A X Y-C-

2.1 0.05

31.75UNPLATED

0.1 A X Y-B-

2.1 0.05

12X 0.1 A B C3.2 0.05

4.95

80.8

68.45

8.65

2.0252.975

7.025

25.625

20.62522.125

37.125

2

11.25

432

91.625

95.12596.625

862

103.5 0.5

BSC1

BSC

1

4X 0.1 A B C3.2 0.05 2

( )9.25

DATUM DETERMINED BY OEM

OPTIONAL HOLES FOR M3 SCREW USED FOR CHASSIS MOUNTING

SINGLE SIDED BOARD THICKNESS 2.99+/-0.63mm

1

2

3

TOP SIDE OF BOARD

SEE FIGURE 23

POSITIVESTOP

AREA DENOTESCOMPONENT KEEP OUT(TRACES PERMITTED)

RECOMMENDED PCB LAYOUT FOR SINGLE SIDE MOUNTINGSCALE 3:1

22

2

2

2

2

1

1

3

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PCB LAYOUTS – (CONT)

HOST BOARD BELLY TO BELLY LAYOUT REQUIREMENTS – 10.2

FIGURE 21

-A-

80.8

8.65

20.62525.625

91.62596.625

( )-B-

2.1

4X 0.1 A B C3.2 0.05

( )-C-

2.1

( )63.5

BELLY TO BELLY BOARD THICKNESS 3.40+/-0.40mm1

1

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PCB LAYOUTS – (CONT)

HOST BOARD COMPONENT AND TRACE KEEPOUT AREAS – 10.3

FIGURE 22

2X MIN8.7

2X MIN2.42X MIN5.5

2X MIN18.32X MIN2.8

2X MIN19.25

2X MIN3.75

2X 1.25 0.25

7.6 0.25

6.825 0.25

MIN2.9

10.675 0.25

( )2.1

EXPOSED PLATED ANDSOLDER MASK PULLED BACK

TOP SIDE OF BOARD

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PCB LAYOUTS – (CONT)

HOST BOARD CONNECTOR PAD DETAIL – 10.4

OPTICAL TRANSCEIVER BOARD MODULE CONNECTOR PAD DETAIL– 10.5

FIGURE 23

FIGURE 24

-A-

2.55

73X 0.8

9.8

4.14.9 3.9

( )-B-

2.1

( )-C-

2.1

148X 0.05 A C B

1.4 0.03

148X 0.05 A C B

0.35 0.03

( )63.5

PIN 1PIN 74

PIN 75

PIN 148

-D-

-A-

-B-60.9 0.1

0.16ACROSS PADS1.6

2X 0.87 0.152X 60

74X 0.8

148X 0.05 D B A

1.00 0.03

148X 1.84

148X 0.05 D A B

0.45 0.03

45.0

2X0.50 0.10

29.2

RECOMMENDED PCB MODULE DIMENSIONSSCALE 8:1

2X

CENTERLINE OF DATUM -B-

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SYSTEM PANEL OPENING – 11.0

PANEL OPENING AND LOCATION REQUIREMENTS TO HOST BOARD -11.1

FIGURE 25

X

X

( )31.75103.5 0.5

116.25 MAX

113.25 MIN

MIN 3 MAX

1

3 0.114.8 0.1

0.15 B82.8 0.1

4X R MAX0.5

0.1 0.1

( )2.1

MIN4X2 FLATNESS OF 0.15mm

WITHIN THIS AREATO ASSURE PROPERGASKET CONTACT

SECTION X-X

SEE DETAIL Y

CHASSISPANEL

PANEL OPENING IS LOCATED 31.75FROM HOST BOARD -B- HOLE

DETAIL YSCALE 8:1