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    CHEMICAL VAPOR DEPOSITION OF

    MOLYBDENUM METAL COATINGS ON

    SILICON NITRIDE SUBSTRATES

    Submitted by

    Kamilah Turner

    University of Michigan

    to

    University Research Alliance

    Amarillo, Texas

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    Abstract

    The storage of nuclear waste has been a problem for years. To reduce the amount and

    time of nuclear waste storage, new methods are being developed to mutate spent nuclear

    waste into less hazardous materials. One of the processes being developed results in an

    equipment failure with the mutation of transuranic (TRU) nitride particles. To avoid this

    failure, molybdenum metal as a coating has been evaluated to determine its effectiveness

    in preventing the failure with the nitride particles. Two methods of deposition were

    investigated; however, chemical vapor deposition was determined to be the method of

    choice. Each method was used to coat a surrogate nitride material with molybdenummetal to determine feasibility of metal coating and deposition conditions. Molybdenum

    coated samples were analyzed using x-ray photoelectron spectroscopy (XPS) and

    scanning electrode microscopy (SEM). The molybdenum coatings were found to be

    highly dispersed, resulting in a very uneven coating at each of the experimental

    temperatures. Islands of molybdenum and oxygen of various sizes were found

    throughout the sample surface. Molybdenum metal was also found to be extremely air

    sensitive; passivation of the material before exposure to air and reduction to the metal

    state was required to properly analyze the coating. The design of the deposition

    apparatus was found to be ineffective in coating the molybdenum metal to the nitride

    substrate. Further experimentation and development of coating apparatus must be

    completed to successfully assess the effectiveness of molybdenum coating and deposition

    conditions.

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    Introduction

    One of the key challenges in the nuclear power industry is the storage of nuclear wastes.

    The current United States approach to the disposal of high level nuclear waste is to store

    the unreprocessed spent fuel in a geologic repository (1). By some estimates, the storage

    areas will be completely filled with spent nuclear fuel by 2015 (1). This indicates that

    other waste repositories will need to be identified in the near future, or a process that

    could reduce the amount of nuclear waste being stored would have to be developed. In

    1999, the U.S. Congress directed the Department of Energy (DOE) to develop a reduction

    process under the Accelerator-Driven Transmutation of Waste (ATW) Program (1).

    Thus far, Los Alamos National Labs (LANL) has led the development of ATW as an

    alternative technological option to the disposition of nuclear waste (1). This technology

    allows for spent fuel to be sent to an ATW site where transuranics (TRUs) and particular

    long-lived fission products would be destroyed by fission or transmutation within the

    facility. There are four key elements in the implementation of the ATW program: system

    definition, accelerator, fuel treatment, and target/blanket (2). The focus of research

    described in this report is related to the fuel treatment element.

    Problem Statement

    The ATW fuel treatment portion of the program is focused on the selection of a process

    to recover un-transmuted transuranics from irradiated fuel for recycle through the ATW

    recycle system. Currently, the ATW program is investigating different processes such as

    the volatility process (1). In one process, an irradiated fuel, which consists of solid fuel

    particles, is dispersed into a zirconium metal matrix to dilute the high level of fissile

    material in the fuel particles. It is in this matrix that the particles will be transmuted to a

    non-radioactive or less radioactive species by neutron bombardment.

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    The TRU fuel particles contain large amounts of fissile material. The heat generated

    from the particles is so high, that there is a need to dilute the fuel. To dilute the particles,

    they have been dispersed into the metal matrix. Zirconium is an attractive metal for the

    matrix material because it has a low neutron absorption cross section, is compatible with

    a variety of reactor coolants, has a reasonable thermal conductivity, and melts at high

    temperature. The particle recovery process involves removing the TRUs and fission

    products from the zirconium (3). In the case of TRU nitride fuel particles, there is a

    concern for interactions between the fuel particle and the zirconium matrix at their

    interface during normal operation of the fuel at temperatures greater than 1000C. The

    interaction of concern is the formation of a zirconium nitride or oxide. This formation

    could lead to a redistribution of the fissile material that could in turn lead to a failure of

    the fuel element. To prevent the possible interactions between the nitride fuel

    particles and the zirconium metal matrix, it was proposed that a refractory metal be

    deposited onto the surface of the fuel particles.

    The goal of research described in this report was to investigate the deposition of

    molybdenum on nitride fuel particles. The following objectives were established to

    achieve the project goal:

    1) Determine a refractory metal for deposition

    2) Determine the best conditions for deposition

    3) Develop an initial schematic for deposition of metal on spherical particles

    Refractory Metal Selection

    The refractory metals initially chosen for this project were molybdenum, tungsten, and

    niobium. These refractory metals were chosen because they were not expected to interact

    with the fuel or zirconium, have good oxidation resistance at high temperatures, and

    methods for their deposition have already been defined. Due to time constraints,

    molybdenum became the refractory metal of choice. Molybdenum was the metal of

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    choice because the research group supporting the project has substantial expertise

    regarding its properties and characteristics.

    Deposition Conditions

    There are a number of coating processes that can be used to deposit Mo including

    chemical vapor deposition (CVD) and physical vapor deposition (PVD). The CVD

    process allows for gases containing the deposition material to be introduced into a

    reaction chamber and deposited on a substrate to form a coating (4). After evaluating

    various methods and equipment availability, CVD was the chosen process for depositing

    Mo. In determining a good coating method, it is important to identify the size of the

    particles that the material will be deposited on. In the case of the nitride particles, the

    optimum particles size is not defined. Work at Argonne National Labs (ANL) is

    currently being done to determine the optimum size. The ideal particle size is probably in

    the few-hundred micron range. A uniform dispersion needs to be achieved to minimize

    the overlap of damage zones.

    Determining the deposition conditions was done using flat wafers instead of actual

    spherical particles. An important factor in CVD is the geometry of the system during the

    coating process. Discovering the best geometry and deposition conditions

    simultaneously is a major task; therefore, it has been decided to first determine the

    deposition conditions, and then take on the task of determining methods to coat spherical

    particles.

    Deposition on Spherical Particles

    After determining the conditions to uniformly coat Mo, an investigation was to be done

    to formulate ideas on methods to coat spherical particles in the final system. A literature

    search was used to accomplish this objective.

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    Experimental Design

    Material Deposition

    Two different methods deposition were involved in experimentation: salt deposition and

    chemical vapor deposition (CVD). Salt deposition involves placing the nitride substrate

    in a Mo salt solution and heating the water off to leave a Mo salt coating. The substrate

    was then reduced in H2 at 800C leaving the Mo metal. The second deposition involves

    chemical vapor deposition (CVD). In the CVD method, MoCl5 was reduced under H2 on

    a heated substrate (900 -1300C) at atmospheric pressure (5). Another more common

    method of coating Mo involves the use of a molybdenum hexacarbonyl, Mo(CO)6 (6,12).

    Due to safety concerns, this precursor was not used.

    The molybdenum precursor, molybdenum (V) chloride (Sigma-Aldrich, 98% purity), is

    sensitive to air and moisture. A special reactor was designed to address this issue. This

    is discussed in the next section with more detail. Also, for the purposes of

    experimentation, instead of a uranium nitride substrate, a radioactive substance, silicon

    nitride (Si3N4) wafers were used as a surrogate material. The wafers were made by

    University of Michigan Professor, Erdogan Gulari. Silicon nitride was deposited on a

    silicon substrate using low pressure CVD (LPCVD); the Si3N4 layer is approximately

    2000 angstroms thick. The wafers were broken along its structural lines into 1-cm2

    pieces for the reactor. Each wafer, before being placed in the reactor was cleaned with a

    trichloroethylene/acetone/methanol/de-ionized (DI) H2O rinse to remove all

    contaminants. The rinse process is detailed in Appendix A.

    In the first method, a 10% ammonium heptamolybdate, (NH4)6Mo7O24-4H2O

    (Mallinckrodt, crystals), in DI H2O solution was gently stirred and heated moderately

    until the salt completely dissolved. The wafer was then placed in the solution and heated

    up to100C until the water completely evaporated. This typically resulted in a very

    uneven coating of the salt. The sample was then placed in a reactor rube heated by a PID-

    controlled split tube furnace (Applied Test Systems, Inc.) for 3 hours at 800C. Due to

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    the large and apparent non-uniformity of the coating, this method was not further

    investigated.

    As stated above, the second deposition process is routed in conventional CVD. In a

    heated reactor tube, the MoCl5 precursor and silicon nitride substrate were heated

    simultaneously while passing H2, the reactant gas, and Ar, the carrier gas, through the

    reactor (6).

    HClMoHMoCl ++0

    25

    A complete diagram can be found of the reaction and reactor design in the Appendix B.

    Due to extreme reaction temperatures, the reactor tubing was made of quartz. The reactor

    tube has a diameter is 1.8 cm (0.71 in.) and a length of 30 cm (11.8 in.). The precursor

    was kept in a small quartz boat. A small quartz easel-like stand was used for the

    substrate. The reactor tube was assembled in a nitrogen-filled glove box (Vacuum

    Atmospheres, MO-20) to avoid entry of air into the system. The reactor tube and system

    were purged with argon before introducing hydrogen into the system. The furnace was

    ramped to 450C, then heated to the final reaction temperature which was in the range of

    900-1100C. At the reaction temperature, the H2 gas was introduced into the reactor a

    varying flow rates (20-30cc/min). After a 3-hour reaction time, the H2 was shut off and

    the reactor cooled. Once reaching temperatures less than 35C, the coated substrate was

    passivated in a mixture of 1%O2 /He at 20 cc/min for 3 hours. A scrubber containing DI

    water followed the reactor tube to react with the hydrogen chloride gas by-product before

    emitting into the hood. Litmus paper (EM-Science, ColorpHast) was used before and

    after each reaction to determine how much HCl(g) was converted to its acid form. After

    every 4th

    run, the reactor tube was disassembled and cleaned to remove residual Mo.

    Characterization

    X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) were

    used to characterize the molybdenum samples. XPS was carried out on a Perkin

    (OPHU3+, XVLQJ D0J .. [UD\ VRXUH DW : N9 7KH LQVWUXPHQW ZDV

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    calibrated using the reference binding energies of Au 4f7/2 at 84.00eV, Cu 3p at 75.13

    eV, and Cu 2p3/2 at 932.66 eV. A broad survey spectrum from 600-0eV was initially

    taken. The spectra were charge-corrected to carbon 1s at 287 eV. Next, a high-resolution

    scan of oxygen and molybdenum was obtained to quantify composition and to determine

    the chemical states. Also, a gas phase reactor allowed samples to be heated and reduced

    from the passivated state and moved to the XPS analysis chamber without exposure to

    air. Curve fitting of the XPS spectra was performed with a nonlinear least squares

    method using Gaussian distributions. SEM was carried out on a Phillips XL30 using a

    thermally assisted Schottky (5kV) field emission gun for high intensity probe formation.

    The system uses a zirconated tungsten filament and has a vacuum of ~10-6 torr.

    Results and Discussion

    Effect of Passivation

    Experiments were done at various temperatures in the range of 900-1100C and flow rate

    ratios of Ar to H2. Some of the initial runs were conducted at 1000 C. The passivation

    effects on the Mo coating are shown in Figures 1-3. Table 1 lists binding energies and

    characteristics of Mo and some of its oxidation states. These samples, based on substrate

    weight change, were coated with approximately 125 microns of Mo metal.

    Without passivation, analysis by XPS shown in Figure 4 indicates MoO3 was the only

    form of Mo present on the substrate surface.

    Compound Binding Energy (eV) Doublet/Singlet: Separation (eV)

    Mo 227.7 Doublet: 3.15

    MoO2 229.4 Doublet: 3.20

    MoO3 232.7 Doublet: 3.20

    Table 1. Binding Energies of Mo and MoOx compounds(7)

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    22 022523 023524 0

    Binding Energy (eV )

    N

    (E

    Figure 1. NON-PASSIVATED 1000C: MoOx (2

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    situ, the Mo multiplex shown in Figure 3 indicated a 66% increase in the Mo metal

    content and a 27% decrease in the Mo oxide content.

    220225230235240

    Binding Energy

    N(E

    Figure 3. IN-SITU REDUCED: Mo metal, MoOx

    This clearly shows there is definite Mo coverage on the wafer before passivation. It also

    verifies that the intermediate MoOx species found before passivation is reducible. Longer

    reduction times of approximately 5-6 hours are likely to show complete oxide removal

    and Mo metal coating. In addition to the increase in Mo metal between the passivated and

    reduced Mo multiplex, there was also a decrease in the oxygen atomic concentration,indicating reduction was successfully taking place. The time required to complete in-situ

    reduction using the XPS facilities on each sample was too intensive for this study.

    Consequently, the characterization of other samples was completed using the passivated

    sample.

    Oxygen Content

    The initial survey scans showed large percentages of oxygen in the sample. As with Mo,

    a multiplex scan was completed to further investigate the O1s peak. Oxygen is found in

    the vicinity of 530 eV. The oxygen 1s peak was also found to have shoulder peaks. The

    shoulder peak is indicative of the different forms of oxygen present. The separation

    between the shoulder and the O1s peak is related to the form of MoOx found in the

    MoOx

    Mo

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    material. The number of shoulder peaks with the O1s peak and their location should

    correspond with the number and types of molybdenum oxides present in the Mo

    multiplex scan, as shown in Figures 4 and 5 and Table 2 below, for the samples prepared

    at Ar:H2 ratio of 1:1.

    % L Q G L Q J ( Q H U J \

    1

    (

    &

    &

    &

    Figure 4. Oxygen multiplex

    22 0225230235240

    Bind ing Energy (eV)

    N

    (E

    1100C

    1000C

    900C

    Figure 5. Mo multiplex

    Temperature(C) # of Oxygen shoulder Peaks # of MoOx peaks

    900 2 2

    1000 2 2

    1100 2 2

    Table 2. Number of O shoulder and MoOx peaks

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    This observation holds for all samples and further confirms that the same type of Mo

    species is present in each sample.

    Surface Coverage

    Three survey scans were taken of all samples. The Mo and O multiplex scans were taken

    based on these initial surveys. As shown in the example in Figure 6, each of these initial

    scans also contains Si and N peaks.

    1 0 02 0 03 0 04 0 05 0 06 0 0

    Binding Energy(eV)

    N

    (E

    N 1s

    BE 401eV

    Si 2p3

    BE 102 eV

    Figure 6. IN-SITU REDUCED: Initial Survey

    This indicates that there is not an even film of reduced Mo metal on the Si 3N4 substrate.

    Scanning electron microscopy (SEM) was used further investigate this observation. The

    following micrographs shown in Figures 7 and 8 represent an example of the Mo/MoOx

    coating.

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    Figure 7. SEM Scan 1000X (900C ,1:1)

    Figure 8. SEM Scan 5000x (900C, 1:1)

    These micrographs clearly show how sparse the coating actually is. This type of coating

    is believed to represent all samples. An elemental analysis, energy dispersive x-ray

    spectroscopy (EDX), was done to evaluate the composition of adsorbate islands on the

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    substrate surface shown in Figure 8. The EDX found larger amounts of O and Mo in

    these islands. The amount of O in comparison to Mo was large. This correlates to the

    XPS data shown in Figure 6 as Mo has a much higher sensitivity than O, and is found in

    much lower percentages than O. (Mo: 2.867, O: 0.711) EDX also showed very small

    quantities of oxygen on the surface where there were no islands.

    Achieving an even Mo coating has been a difficult task. The reason could be due to

    system geometry, and temperature and flow profiles. The diameter of the reactor tube is

    1.8 cm with a cross-sectional area of 5.67 cm2. The area of the wafer is 1 cm2. The

    distance between the precursor boat and the wafer is ~2 cm. This distance may not be

    enough to allow for controlled flow. The Reynolds number was calculated using

    viscosity and density of argon, as this is the carrier gas. The Reynolds number was found

    to be on the order of 106

    indicating turbulent flow. (Viscosity was calculated at 1000C.)

    Turbulent flow consists of large rotational eddies near walls, that degenerate

    progressively into smaller eddies. These rotational eddies are likely to be preventing the

    Mo from coating the substrate in an even and controlled manner. The Mo appears to be

    splattering on the surface. This may be controlled by moving the boat further away from

    the substrate, or by possible cooling down the substrate. In the reactor tubing past the

    wafer, there was a significant amount of MoOx that condensed in the quartz tubing, aswell as in the Swagelok tubing. This shows that the Mo was definitely moving in the

    vapor phase towards the wafer. The condensation in the tubing indicates that a reactor

    design which integrates a cooling function could have resulted in a more even coating.

    Effect of Temperature and Flow Rate Effects

    Two series of runs were completed at temperatures of 900,1000, and 1100C using Ar:H2

    ratios of 2:1, and 1:1. In the runs using a 2:1 ratio, Mo metal was found along with MoO x

    in the 900C and 1000C runs, as shown in Figure 10. However, in the 1100C run, there

    was no Mo metal observed using XPS. In these runs, data also showed an increase in the

    weight change with increasing temperature after each run was completed.

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    Temperature(C) Weight Increase (mg) % Weight Increase

    900 0.4 0.20

    1000 0.6 0.29

    1100 0.8 0.38

    Table 3. Mo Deposition Uptake w.r.t. CVD Temperature

    Table 3 shows that as reaction temperature increased there was more Mo and MoOx on

    the substrate. As mentioned above, no reduced Mo metal was seen in the 1100C run. A

    possible reason as to why Mo is not seen yet there is a weight change increase is related

    to the passivation of the Mo coating before removing from the reactor. The passivation

    reaction is believed to occur as follows:

    xMoOOMo + 20

    With the increase in weight change of the substrate, it is clear more Mo is being coated.

    Because there is more Mo metal on the surface, there is a concentration increase in

    reactant, and the reaction will move much more rapidly to form a thicker oxide product

    layer. Also, the strength of interaction between the substrate and adsorbate is often lower

    at higher loadings as shown in Figure 11. This could allow more reduced Mo metal to be

    oxidized (8).

    Figure 11. Surface and Adsorbate Interactions

    Surface-Adsorbate Interactions

    Adsorbate-Adsorbate Interactions

    Surface-Adsorbate Interactions

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    At 1100C, it is proposed that MoOx forms completely over the Mo metal in a uniform

    subsurface layer of approximately 10-20 angstroms, such that no Mo metal is within sight

    of the XPS scans. In the 900C and 1000C runs at the 2:1 reactant gas ratio, there is less

    Mo metal on the substrate, meaning lower local Mo concentration. As a results, the

    substrate has a much stronger interaction with the adsorbate and oxidation occurs at a

    slower rate over a smaller volume.

    % L Q G L Q J ( Q H U J \ H 9

    1

    (

    &

    &

    0 R0 R 2 0 R 2

    Figure 10. Mo multiplex.

    While in 900C there appears to be more Mo metal than molybdenum oxide, it is also

    shown that the amount of oxide increases between 900C to 1000C. The ratio of Mo0

    to

    Mo+x

    was calculated based on peak intensities for both runs. As shown in Table 4, the

    ratio does not change much, even though there is an increase in weight change. Both of

    these observations give more support to the idea that the amount of Mo on the surface

    affects how well the passivation reaction will occur.

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    Temperature (C) Mo0:Mo

    +x*

    900 0.45

    1000 0.42

    1100 ---

    *Note: 2

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    theory of passivation occurring on materials that have more Mo. The initial passivation at

    1100C occurs faster, and more oxygen is able to diffuse into the passivation layer.

    Deposition on Spherical Particles

    The focus of this project was to determine how Mo metal coated to silicon nitride to give

    an idea of how the metal would coat with uranium nitride. All experimentation was done

    on flat wafer. The actual application occurs with spherical particles. The reactor design

    used here is not applicable. The conventional method of coating spheres is through open

    bounce pan configuration (9). In this method, the bounce is induced by piezoelectric

    transducers that control lateral and transverse motions to the pan. Issues arise when the

    capsule mass and diameter change due to the addition of the coating. This requires

    constant calibration of the bounce pan and its motion. Another important issue with this

    conventional method and other methods is the geometry of deposition source and

    aperture (opening to chamber with substrate) size. Both of these vary with the deposition

    that is being achieved.

    A better method to coat Mo on nitride spheres uses pulsed-gas levitation (9).

    Figure 12. Pulsed-gas levitation (9)

    The capsule moves by oscillating a partial flow of the reactant gas beneath it. The

    diameter of the pulsed-gas inlet tube is 70-80% of the capsule diameter. The flow of the

    capsule

    Gas inlet

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    pulsed-gas is varied throughout to account for weight changes and to have an even

    coating. This flow variation can be determined by energy balances of forces and changes

    in capsule lateral or transverse movements. Hydrogen and argon would travel through

    the gas inlet, and argon would travel through the tubing to levitate the capsule. The

    system must be air-tight and heated for the deposition to occur.

    Conclusion

    Molybdenum metal coating on Si3N4 was prepared using a basic CVD method.

    Passivation of the coating is needed to prevent exposure to air from converting Mo

    completely to MoO3. This method results in an non-uniform film. The Mo metal will

    deposit on the nitride substrate, however it the results is a severely uneven coating in the

    experimental reactor design. Further development of a more efficient reactor design may

    results in a more uniform coating.

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    References

    1. Venneri et. al, Disposition of Nuclear Wastes Using Sub-critical Accelerator-Driven Systems, The Uranium Institute 24th Annual Symposium, 1999, London.

    2. A Roadmap for Developing Accelerator Transmutation of Waste, A Report toCongress, October, 1999.

    3. Laidler, J. Bresee, J. Pyrochemical Processing of Irradiated Transmuter Fuel.

    4. Holmberg K, Matthews A. Coatings Tribology: Properties, Techniques and Applications in Surface Engineering, Tribology Series 28, Dowson D. (ed.)Elsevier: Amsterdam, 1994; 3,7-29.

    5. Galasso F., Chemical Vapor Deposited Materials, CRC Press, Inc. 1991

    6.

    Endler et. al, Chemical Vapour deposition of MoS2 coatings using the precursorsMoCl5 and H2S, Surface and Coatings Technology 120-121 (1999) 482-488.

    7. Handbook of X-Ray Photoelectron Spectroscopy, Physical Electronics Division,Perkin Elmer Corporation, Minnesota, 1979.

    8. Somorajai, Gabor, Introduction to Surface Chemistry and Catalysis:, John Wileyand Sons, Inc. 1994.

    9. Jankowski et al., Chambered capsule coatings, Thin Solid Films, 398-399 (2001587-590.

    10.Briggs D., Seah M.P. Practical Surface Analysis b Auger and X-rayPhotoelectron Spectroscopy, John Wiley & Sons, 1983.

    11.Chemical Vapor Deposition, Surface Engineering Series Vol.2, ASMInternational, The Materials Information Society, 2001.

    12.Chemical Vapor Deposition- Principles and Applications, Academic Press, 1993.

    13.Ivanova et al., Investigation of CVD molybdenum oxide films, Materials Letters,53 (2002) 250-257).

    14.Mikhailov et al., The behaviour of the molybdenum-CVD diamond interface athigh temperature, Diamond and Related Materials 4 (1995) 1137-1141.

    15.Perrys Chemical Engineers Handbook, 6th edition, McGraw Hill, 1984.

    16.Petigny et al., Molybdenum deposition on TiO2 (110) surfaces with differentstoichiometries, Applied Surface Science 142 (1999) 114-119.

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    17.Surface Characterization of Advanced Polymers, edited by L. Sabbatini and P.Zambonin, VCH Verlagsgesesllschaft mbH, D-6940 Weinheim, 1993.

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    Appendix A

    TCE Rinse: Initial Wafer Clean

    Procedure:

    1) If fingerprints or other residue appears on the wafer surface, swab it clean with aQ-tip dipped in trichloroethylene.2) Immerse in warm TCE for 5 minutes. (Room temperature for new wafers.) Pour

    used TCE slowly into a designated TCE waste bottle.3) Immerse in acetone for 3 minutes. This immersion removes the TCE residue and

    acts as a further cleaning solvent. Pour used acetone into waste solvent container.

    4) Immerse in methanol for 3 minutes. This rinse removes the acetone residue. Pourused methanol slowly into the waste solvent bottle.

    5) Rinse in running DI water for 3 minutes.

    Reference:http://mitghmr.spd.louisville.edu/sops/sop1.html

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    Appendix B

    REACTION SCHEMATIC

    Vent to

    MoCl5

    Si3N4

    H2O

    30 cm

    Dimensions of furnace: dia: 3.0 cm, length =15 cm

    Dimensions or rxtr. tube: dia: 1.8 cm, length = 30 cm

    furnace

    Metal caps

    Valves

    Thermocouple

    DEPOSITION SCHEMATIC

    Scrubber

    Three way

    vents

    H2

    Ar

    O2/H2O traps

    M

    M3-way (vent)2-way

    HeatHeat

    MoCl5 vapor Reacts with H2

    Mo

    Not drawn to scale