confidential pressure cure oven (pco). confidential system overview pressure cure oven (pco) or...
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![Page 1: CONFIDENTIAL Pressure Cure Oven (PCO). CONFIDENTIAL System Overview Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion](https://reader036.vdocument.in/reader036/viewer/2022062421/56649e5c5503460f94b543d3/html5/thumbnails/1.jpg)
CONFIDENTIAL
Pressure Cure Oven (PCO)
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CONFIDENTIAL
System Overview
Pressure Cure Oven (PCO) or Autoclave is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
PCO pressurizes air into a rigid vessel and heats & cools with forced convection¬Heaters, heat exchangers and blowers are internal to
the pressure vessel
When the curing process is complete, the pressure oven automatically relieves its pressure to 1atm and cools
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CONFIDENTIAL
Pressure Cure Applications
Underfill Curing
Die Attach Curing
Wafer Lamination
Film & Tape Bonding
PCO
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CONFIDENTIAL
Process Specification• Process time: Generally 120 min or
User’s spec
• Operating temp: 60oC ~ 200oC
• Maximum temp: 220oC
• Operating pressure: 1 bar – 10 bar
• Capacity: 24 Magazines (typical)
• Cooling method: PCW (17oC - 23oC)
• Cooling water pressure: 25 – 40 psi
200℃
60℃
0
Temp.
30min 90min 120min Time
10 bar
0
20min 90min 110min Time
Cooling process
Curing process
Rising process
Pressure.
Representative Pressure/Temp Profiles (User Configurable)
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CONFIDENTIAL
PCO System Dimensions
1700mm
1700mm2200mm
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CONFIDENTIAL
PCO System Chamber
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CONFIDENTIAL
Chamber Dimensions
7
440mm
189mm
199.5mm
608mm
716.5mm
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CONFIDENTIAL
Chamber with Shelves Extended
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CONFIDENTIAL
System Air Flow
9
Door inside cover
Return air assistance damper
Heater module
radiator
Fan motor & mechanical seal
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CONFIDENTIAL
Vacuum Module Option
• Vacuum Module (Optional)
Vacuum pump
GaugeVacuum in/out line