easy ic layout & verification on windows since 199 0 what’s...

Easy IC Layout & Verification on Windows since 1990

April 2014

What’s New

MyChip StationTM Pro 2013 April 2014

V1.0


April 2014

Copyright Information MyChip Station Pro 2013 is produced by SELOCO Incorporated. Unauthorized copying, duplication, or other reproduction is prohibited without the written consent of SELOCO,Inc.. This document is protected by copyright and distributed under licenses restricting its use, copying, and distribution. No part of this document may be reproduced in any form by any means without prior written authorization of SELOCO,Inc and its licensors, if any. Copyright © 1992 – 2014, SELOCO Incorporated. Copyright © 1992 – 2014, MyCAD Incorporated. All rights reserved. Confidential. Online documentation may be printed by licensed customers of SELOCO Incorporated for internal business purposes only. Published: April 2014 SELOCO, Inc. 3F Jangwon Bldg, Songpa-dong 95-55 Songpa-gu, Seoul, 138-848 Korea Phone: +82-2-3432-1210 Fax: +82-2-3432-8855 E-mail: [email protected], [email protected] Home page: http://www.seloco.com MyCAD, Inc. 3000 Scott Boulevard, Ste 201, Santa Clara, CA 95054, USA Phone: 408-745-6785 Fax: 408-745-6783 Email: [email protected], [email protected] Home page: http://www.mycad.com

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Table of Contents

New Features ................................................................. 4

Slice ......................................................................................................... 4

Backup Project ......................................................................................... 5

Enhanced Select ...................................................................................... 5

Auto Wiring .............................................................................................. 6

Enhanced Features......................................................... 8

Repeat function enhanced........................................................................ 8

Instance creation enhanced ..................................................................... 8

Label creation enhanced .......................................................................... 9

Size enhanced ........................................................................................ 10

Create Bitmap ........................................................................................ 10

Gravity enhanced with Intersection ...................................................... 11

Snap Enable with include Ruler ............................................................. 11

Snap mode for some operations ............................................................ 12

Make Cell from Selected Objects .......................................................... 12

Measure Point ........................................................................................ 13

Measure Objects .................................................................................... 13

Attribute – Object information view like old version added ................. 14

Attribute – Rectangle Shape Change with center fix ............................ 15

New Command ............................................................. 16

Fixed Features ............................................................. 17


April 2014 MyChip Pro 2013 4

New Features Slice User can slice for selected objects.

Example) Selected objects slicing

To slice selected objects, user just draws a slicing line on selected objects.



Backup Project LayEdPro 2013 supports that user can backup for working project.

To backup for working project, user set the folder for backup location and select option for

technology, verification backup.

Enhanced Select LayEdPro 2013 supports enhanced select with dialog interface.



Auto Wiring LayEdPro 2013 supports that user can create wires automatically for horizontal or vertical

Horizontal auto wiring interface

Vertical auto wiring interface



Example) before auto wiring

Example) after auto wiring



Enhanced Features Repeat function enhanced Added various options for Repeat

Instance creation enhanced User can select distance type with spacing or interval.



Label creation enhanced Creation of Label interface enhanced. User easily flatten label to Path or Polygon directly with

seeing the size changing by input value changing.



Size enhanced Size operation interface enhanced. User can know the oversized or undersized area value

before operation is done and size operation provide the calculated percent size value for user’s

wanting area.

Create Bitmap Using “Designated Area” option on Create Bitmap, user can capture with selected area.



Gravity enhanced with Intersection User can select gravity intersection point.

Snap Enable with include Ruler User can snap ruler to adjacent object with this option.



Snap mode for some operations User can run Add / Cutout / Intersect / Subtract Polygon under snap mode..

Make Cell from Selected Objects User interface enhanced. User can create instance for selected objects and further more user

can select whether selected objects to new create cell’s instance.



Measure Point User can set to ruler for Measure point.

Measure Objects User can set to ruler for Measure Objects.



Attribute – Object information view like old version added User can select Object information view style.



Attribute – Rectangle Shape Change with center fix User can change of rectangle with Center Fix option on Attribute Dialog.



New Command ReverseSelect

-. This command change selection status of objects with reversely.

FourPathsToRectangle

-. This command makes Rectangle from the selected 4 Paths.

SelectSameObject

-. This command enables user select the same object like already selected an object.

ObjectToInstance

-. This command enables user change selected

Object(Rectangle/Polygon/Path/Circle/Ellipse/Arc/Donut) to Instance

InstanceList

-. This command makes text file which includes instance information for opened a cell.

SelectInside

-. This command enables selecting objects which included in selected object.

ConvertToCircle

-. This command makes selected polygon to circle.

PathToPolygon

-. This command makes selected path to polygon.

GSize

-. This command enables user oversize or undersize for selected objects.

DeleteByLayer

-. This command enables user delete objects by layer for selected cells.

ReversePatternGeneration:

-. This command enables user can get reverse pattern of selected objects



BatchGDSIIImport:

-. This command enables user can get the converted mychip files from the GDSII

BatchBindLibrary:

-. This command enables batch bind library for user selected folder’s mychip project.

ChoppingAtHole:

-. This command enables user can get chopped objects which don’t has a hole.

Fixed Features The following problems are fixed in LayEd Pro 2013

Menu Command Description Project BindLibrary

/ UnBindLibrary

-. Limit the bind library number under 100 to avoid the

Unbind Library function does not processed with over

bind library number over 100.

Cell NewCell -. Limit the length of cell name under 100 characters to

avoid Open Cell function does not processed with over

100 characters for cell name.

Edit Undo -. During object creation undo with include

selection problem solved.

Edit Attribute -. Fixed the bug which horizontally or vertically selected

Circle/Ellipse/Arc/Donut center point change.

Edit MarkNet -. Mark Net for hierarchical design sometimes does

not work rightly bug fixed

View CrossSectionView -. Fixed the bug which Deposit/Etch process does not

processed rightly after Release process.

Create Label -. Sometimes program crash with Polygon type Label

creating problem fixed.



Operation ConnectPath -. Fixed the bug which Connect Path with closed path

makes the program shut down.

Operation Merge -. Changed to Invalid polygon does not processed with

Merge Operation.

Operation Slice -. Option for keep source polygon does not work

sometimes problem solved.

Operation Size -. Input value problem fixed,

-. Japanese character not correctly display problem

fixed.

-. Disable Undersize Restriction option irregularly

changing problem fixed.

Operation Repeat -. Bug for non selection for previous Interval or

Spacing option for Repeat function solved.

Option Technology Editor -. Crash problem for technology file creation

without a project problem solved.

- - -. Datatype reset to 0 with operation or edit problem

fixed.

- - -.Dummy layer creation for open cell sometimes

problem solved.

- - -. Inappropriate menu for right mouse button click

for various object selection bug fixed.

- - -. Font for Japanese O/S display problem solved.



MyLVS Pro Fixed Features The following lists the problems fixed.

Part Description -.Suddenly crash bug fixed.

CifGDS Pro Enhanced Features The following lists are enhanced features.

Part Description -. Enhanced default gds number, cifg name and dxf name.

- User can convert big size MyChip data.

Before this version of CifGDSPro, total size of MyChip data must not over 900MB.

In this version, the size can be over 900MB.

However, each cell size must not over 900MB.

Fixed Features The following lists the problems fixed.

Part Description -. Fixed the bug on MyChioToDFX for Circle/Arc/Donut with layers unchecked then

convert process does not succeeded.



TechED, StippleED Enhanced Features The following lists are enhanced features.

Part Description -. Enhanced default gds number, cif name and dxf name.

Fixed Features The following lists the problems fixed.

Part Description -. Fixed file path recognition problem

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