electrochemical additive manufacturing of metal ...adv. mat. 29 (2017) 1604211 (review) 16 ......
TRANSCRIPT
Tomaso Zambelli, [email protected] of Biosensors and Bioelectronics, www.lbb.ethz.ch
electrochemical additive manufacturing of metal microstructures with the FluidFM
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LBB and surface patterns at the micrometer scale
biomolecular micropatternsto direct cell growth
Vogt et al. Biomaterials 2005 26:2549Martinez et al. Lab Chip 2016 16:1663
microarraysfor sensing applications
Städler et al. Biointerphases 2006 1:142 200 µm 5 µm
AFM (optical beam detection, OBD)
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split‐diode photodetector
laser source
cantilever deflected because of the interaction of the tip with the surfacesurface
Meyer et al., Appl Phys Lett 1988 53:1045, OBD
Albrecht et al, J Vac Sci Technol 1990 8:3386, Si cantilevers
Binnig et al., Phys Rev Lett 1986 56:530, AFM
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FluidFM: a force-controlled nanopipette
AFM cantilevers with a microchannel Simultaneous control of force + liquid flow
microfluidics + AFM FluidFM
Laser to measure deflection
Nano Lett. 9 (2009) 2501
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Microchanneled AFM cantilevers
k ~ 0.2 - 2 N/m
Dr. Edin SarajlicSmartTip BV (NL) Cytosurge AG (CH)
Deladi et al, Appl Phys Lett 2004 85:5361
Berenschotet al, Small 2012 8:3823
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FluidFM for surface patterning: previous workinfluence of p, v, Fon nanoparticle deposition
cell-adhesive polymer patternsfor directed cell growth
PhD R Grüter
Nanoscale 5 (2013) 1097Langmuir 30 (2014) 7037
with PhD H. Dermutz
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local electrodeposition with FluidFM: principle
FluidFM as a local source of reactants for electrodeposition
first trials: Copper electroplating
Local reduction of metal ions
PhD L Hirt
RSC Advances 5 (2015) 84517
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2D ec-patterning: proof of concept with copper
large apertures (2-8 µm) and visual observation to find deposition parameters
(Ag QRE), 20 mV/s
(bottom view)
8 µm tipless probe, 50 mM CuSO4, p = 500 mbar
RSC Advances 5 (2015) 84517
Cu dissolution
Cu plating
Cu platingH2 ev olution
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2D metal ec-deposition with force controlFluidFM is an AFM!ec-deposition and AFM topography with the same probe
In situ AFM(3D representation)
0 s
1 s
2 s
5 s
10 sPost-deposition SEM
20 µm
300 nm pyramidal probe, -0.6 V vs. Ag QRE, 50 mM CuSO4, p = 15 mbar, setpoint = 1 nN
0 s
1 s
2 s
5 s
10 s
Dep
ositi
on ti
me
2.7 µm
RSC Advances 5 (2015) 84517
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ec-deposition: overpotential as ext. parameter
50 mM CuSO4, 15 mbar, 2 s approach time, 10 nN setpoint
RSC Advances 5 (2015) 84517
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local electrografting with FluidFM:aryldiazonium salts
In situ AFM Ex situ SEM
300 nm pyramidal probeE = -0.7 V vs. Ag QRE3 mg/ml NBD · BF4
Substrate: ITOp = 0 mbarvTip = 4 µm/s (lines)
Thinnest lines ~150 nm
with Renaud CornutThomas BerthelotPascal Viel
RSC Advances 5 (2015) 84517
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metal 3D printing yes, but limited resolution
current standard for additive manufacturing of metal: laser / e-beam melting
resolution limited (50-100 µm) by powder size and heat spreading
alternative techniques needed for the micrometer scale
Wikimedia
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additive manufacturing of metals at the micrometer scale: current developments
Adv. Mat. 29 (2017) 1604211 (review)
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Meniscus-confined electroplating
Seol et al. Small 2015 11:3896
meniscus challenging automation difficult
EC-deposition reaction confined in the liquid meniscusbetween a glass micropipette and the substrate
pipette diameter: 15 µm
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ec 3D printing with FluidFM: protocol (1)
copper on gold
~40 nN
Adv. Mater. 28 (2016) 2311
PhD L Hirt
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ec 3D printing with FluidFM: protocol (2)
«touching event»
copper on gold
~40 nN
Adv. Mater. 28 (2016) 2311
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ec 3D printing with FluidFM: protocol (3)
move up 0.5 µm (or away)
copper(!) on gold
~40 nN
not squeezing out, but voxel-by-voxel
Adv. Mater. 28 (2016) 2311
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automation
10 µmdeflection monitored
user-defined shapeto be printed
30 µm
(2x speed)
Cu on ITO
«voxel by voxel» printing
Adv. Mater. 28 (2016) 2311
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copper micro-objects
overhangs / sideway deposition
layer-by-layer deposition
10 µm
10 μm
20 μm
10 μm5 μm
10 µm
5 µm
control over feature sizevia overpressure
4 7 10 13 16 mbar1
0 M
1 M
16 mbar1 mbar 20 min
15 min 80 min
20 min 30 min
Adv. Mater. 28 (2016) 2311
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fully dense, pure metal microstructures
with Alain Reiser, Prof . Spolenak (ETH D-MATL)
EDX of Cu pillars on AuCross section of a pillar500 nm
Adv. Mater. 28 (2016) 2311
W ORLD OF A PPLICA TIONS
3D PRINTING-METAL P RINT ING-
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Edgar HeppWabe KoelmansMiklos Mohos
zoom on two voxels
Signals during printing
= printed normally
= redundant point indesign
Visual feedback on desigSEM image of structure
Printing process monitoring and feedback on design
zoom on 2 voxels
W ORLD OF A PPLICA TIONS
3D PRINTING-METAL P RINT ING-
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5 µm5 µm
pillar wall solid body
2D 3D1D
= voxel
10 µm
Edgar HeppWabe KoelmansMiklos Mohos
CO PPE R MICRO-OBJECTS
W ORLD OF A PPLICA TIONS
3D PRINTING-METAL P RINT ING-
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5 µm
walls with ov erhang 90 degree ov erhang
• overhanging structures printed without support structures• 90 degree overhangs possible
2 µm
Edgar HeppWabe KoelmansMiklos Mohos
CO PPE R MICRO-OBJECTS
W ORLD OF A PPLICA TIONS
3D PRINTING-METAL P RINT ING-
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wall with a window
2 µm
micro coil
10 µm 10 µm
cylinder
Edgar HeppWabe KoelmansMiklos Mohos
CO PPE R MICRO-OBJECTS
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conclusionsFluidFM for surface patterning localized electroplating &
electrografting mask-free patterning in-situ AFM imaging
FluidFM for 3D microfabrication «voxel by voxel» printing force feedback for automation
Outlook optimization other metals
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acknowledgements
Luca Hirt
Stephan IhleZhijian PanJohannes Braun
Raphael GrüterLiv ie Dorwling-Carter
Renaud CornutThomas BerthelotJérôme Polesel-MarisPascal Viel
Pablo Dörig, Pascal Behr, Mike Gabi
Edgar HeppWabe KoelmansMiklos Mohos
Alain ReiserRalph Spolenak Patrick Frederix
f unding
Martin LanzStephen Wheeler
János Vörös (head)
ScopeM, ETH ZürichZMB, Univ ersity of Zürich