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ELIN-W1 series Multiradio Linux system-on-module with Wi-Fi and Bluetooth Data Sheet

Abstract

This technical data sheet describes ELIN-W1 series multiradio

wireless gateway. ELIN-W1 series is a highly-integrated multiradio

system-on-module with Wi-Fi IEEE 802.11a/b/g/n, Classic Bluetooth v2.1 + EDR, Bluetooth Low Energy v4.0, dual RMII, UART, CAN, USB

and SPI interfaces. The module is designed for a long life cycle, has

an extended operating temperature range and is suitable for industrial, vehicle, medical, security, and other demanding

applications.

www.u-blox.com

UBX-15011161 - R03

http://www.u-blox.com/

ELIN-W1 series - Data Sheet

UBX-15011161 - R03 Early Production Information Contents

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Document Information

Title ELIN-W1 series

Subtitle Multiradio Linux system-on-module with Wi-Fi and Bluetooth

Document type Data Sheet

Document number UBX-15011161

Revision and date R03 17-Jun-2016

Document status Early Production Information

Document status explanation

Objective Specification Document contains target values. Revised and supplementary data will be published later.

Advance Information Document contains data based on early testing. Revised and supplementary data will be published later.

Early Production Information Document contains data from product verification. Revised and supplementary data may be published later.

Production Information Document contains the final product specification.

This document applies to the following products:

Product name Type number Firmware version PCN / IN reference

ELIN-W160 ELIN-W160-00B-00 2.0.0.0 -

u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited.

The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.

Copyright © 2016, u-blox AG.

u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in the EU and other countries.



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Contents

Contents .............................................................................................................................. 3

1 Functional description .................................................................................................. 5

1.1 Overview .............................................................................................................................................. 5

1.2 Product features ................................................................................................................................... 5

1.3 Block diagram ....................................................................................................................................... 6

1.4 Product description ............................................................................................................................... 6

1.5 Supported features ............................................................................................................................... 6

2 Interfaces ...................................................................................................................... 7

2.1 Power management ............................................................................................................................. 7

2.1.1 Power sequence ............................................................................................................................ 7

2.2 Digital I/O interfaces supply output ....................................................................................................... 7

2.3 Antenna interfaces ............................................................................................................................... 7

2.3.1 Antenna connectors ...................................................................................................................... 7

3 System functions .......................................................................................................... 8

3.1 Module power modes .......................................................................................................................... 8

3.2 Module control signals ......................................................................................................................... 8

3.3 Bootstrapping ....................................................................................................................................... 8

3.4 System interfaces .................................................................................................................................. 8

3.4.1 Ethernet ........................................................................................................................................ 8

3.4.2 GPIO ............................................................................................................................................. 8

3.4.3 UART ............................................................................................................................................. 9

3.4.4 ADC .............................................................................................................................................. 9

3.4.5 JTAG ............................................................................................................................................. 9

3.4.6 USB ............................................................................................................................................... 9

3.4.7 SDIO .............................................................................................................................................. 9

3.4.8 SPI ................................................................................................................................................. 9

3.4.9 I2C ................................................................................................................................................. 9

4 Pin definition .............................................................................................................. 10

4.1 Primary connector ............................................................................................................................... 10

4.1.1 Default primary connector pin functions ...................................................................................... 10

4.2 Secondary connector .......................................................................................................................... 13

4.2.1 Default secondary connector pin functions .................................................................................. 13

5 Electrical specification ................................................................................................ 16

5.1 Absolute maximum ratings ................................................................................................................. 16

5.1.1 Supply voltage ............................................................................................................................. 16

5.1.2 Output voltage regulator ............................................................................................................. 16

5.1.3 Maximum ESD ............................................................................................................................. 16



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5.2 Operating conditions .......................................................................................................................... 16

5.2.1 Temperature range ...................................................................................................................... 17

5.2.2 Power supply ............................................................................................................................... 17

5.2.3 I/O DC characteristics .................................................................................................................. 17

5.2.4 Reset characteristics .................................................................................................................... 17

5.2.5 Control signals characteristics ...................................................................................................... 18

6 Mechanical specification ............................................................................................ 19

6.1 Module weight ................................................................................................................................... 19

6.2 Mounting information ........................................................................................................................ 19

7 Regulatory compliance .............................................................................................. 20

7.1 Wireless Regulatory compliance .......................................................................................................... 20

8 Product handling ........................................................................................................ 21

8.1 Packaging ........................................................................................................................................... 21

8.2 Moisture sensitivity levels .................................................................................................................... 22

8.3 ESD handling precautions ................................................................................................................... 22

9 Labeling and ordering information ........................................................................... 23

9.1 Product labeling .................................................................................................................................. 23

9.2 Explanation of codes........................................................................................................................... 23

9.3 Ordering information .......................................................................................................................... 24

10 Guidelines for efficient and safe use ........................................................................ 25

10.1 General ........................................................................................................................................... 25

10.1.1 Product care ................................................................................................................................ 25

10.1.2 Radio frequency exposure ........................................................................................................... 25

10.1.3 Electronic equipment ................................................................................................................... 25

10.2 Potentially explosive atmospheres ................................................................................................... 25

10.2.1 Safety compliance ....................................................................................................................... 26

Appendix .......................................................................................................................... 27

A Glossary ...................................................................................................................... 27

Related documents........................................................................................................... 28

Revision history ................................................................................................................ 28

Contact .............................................................................................................................. 29


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1 Functional description

1.1 Overview

The ELIN-W1 series is a highly integrated multiradio Linux platform module from u-blox targeted for integration

in devices for demanding applications such as industrial and medical applications. The module is built around a

Cortex-A8 CPU with an ODIN-W160 multiradio chip, which includes Wi-Fi, Classic Bluetooth and Bluetooth low energy (dual-mode / Bluetooth Smart Ready). The Wi-Fi support conforms to IEEE 802.11a/b/g/n and has support

for dual-band 2.4 GHz and 5 GHz operation.

The module is developed for reliable, high demanding industrial devices and applications and delivers high performance. The module provides modular radio type approvals for Europe, US and Canada (R&TTE, FCC, and

IC), EMC certification and Bluetooth qualification, which simplifies and shortens the integration work.

1.2 Product features

Table 1: ELIN-W1 series main features summary


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1.3 Block diagram

The block diagram of the ELIN-W1 series is provided in this section.

Figure 1: ELIN-W1 series block diagram

1.4 Product description

Model Description

ELIN-W160 OEM system-on-module with U.FL and board-to-board connector. AM3352 600MHz processor. MMU, Watch Dog Timer, RTC, 256 MB DDR3L RAM, 512 MB NAND Flash. It supports Bluetooth low energy, Classic Bluetooth and

Wi-Fi.

1.5 Supported features

Table 3 lists the main features supported by the ELIN-W1 series modules:

Interface Amount Configuration Comment

GPIO 16 General purpose IO:s 3.3V

Ethernet 2 100 Mbit RMII

MDIO 1

UART 3 UART up to 3.6 MBaud 3.3V

SDIO 1

SPI 1

I2C 1 400 kHz

Onboard EEPROM 1 64 kB EEPROM For MAC addresses, factory settings and custom data

USB 2 USB 2.0 OTG

ADC 4 200 kS/s Max 1.8V

JTAG 1

Regulated 3.3 V 1 500 mA Always on

Table 2: Main supported features


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2 Interfaces This section describes the signals available on the interface connectors of the module:

Host interface and control signals through primary and secondary board-to-board connector

Antenna connector through U.FL connector. See Antenna interfaces section for detailed information.

2.1 Power management

2.1.1 Power sequence

The ELIN-W1 is a single supply voltage module with configurable power management modes to reduce current

consumption. The power management ensures correct power sequencing of the internal power rails are within operational bounds. When all the rails are regulated within bounds, VINT_GOOD is asserted and the CPU is

started. If the PMIC is unable to regulate the power rails, the module is shut off.

If you use external voltage supplies for host peripherals, ensure that:

No voltage is applied to the IO pins before the VINT_GOOD is signaled

The external voltage rails are powered off before shut down of the ELIN-W1 module.

2.2 Digital I/O interfaces supply output

The ELIN-W1 provides the following output voltage rails that can be used to power the host peripherals:

Rail Specification Comment

VOUT_3V3 3.3V, max 500mA Always on

VINT_1V8 1.8V, max 50mA Available after power on

VINT_RTC 1.8V, max TBD Available after power on and during sleep

Table 3: IO power rails in ELIN-W1 series

2.3 Antenna interfaces

The unit cannot be mounted arbitrary due to the radio communication. See the ODIN-W16 series System

Integration Manual [3] for the antennas that can be used and for additional information about other RF and

antenna issues.

2.3.1 Antenna connectors

The ELIN-W160 has an U.FL connector for external antenna on the ODIN-W160. The U.FL connector has a characteristic impedance of 50 Ω, which supports both Bluetooth and dual-band Wi-Fi.


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3 System functions

3.1 Module power modes

The ELIN-W1 provides hardware support for low power modes for both radio and CPU to minimize power

consumption. See the ELIN-W1 series System Integration Manual [1] for information on how to setup and use

the different power modes.

3.2 Module control signals

The following signals are used to control the on board peripherals on the ELIN-W1 and to reflect the current

status:

Signal Location Type Description

LED Green Power LED, ON when the system is powered.

LED Yellow MCU.T13 Output CPU heartbeat, blink frequency reflects system load

RESETn Input 3.3 V, Active Low, Internal 10k pull-up

Power Toggle Input 5.5 V tolerant, Active Low, Internal 100k pull-up

VINT_GOOD Output 1.8 V, Active High

Table 4: ELIN-W1 series control signals

3.3 Bootstrapping

The ELIN-W1 latches the boot sequence during power up and maintains the configuration until the next power cycle. The board supports the following the boot mode:

Boot mode Interface order

Default NAND, NAND, I2C, MMC0, UART0

Table 5: ELIN-W1 Boot interface sequence

The U-Boot boot loader is located in NAND, which after initialization can boot either from the SD card, network,

USB or other peripherals.

Do not oppose the SYSBOOT pins during power on as it can prevent the device from booting properly.

3.4 System interfaces

The default configuration of the ELIN-W1 is a subset of the possible combinations for the AM3352 processor.

Other pinmux configurations are possible but not supported.

3.4.1 Ethernet

The ELIN-W1 supports two 100 Mbit Ethernet MAC through RMII with an integrated switch. The RMII interface operates at 3.3 V and requires the 50 MHz clock signal to be sourced from the PHY. Both the PHYs are

controlled through a single MDIO bus.

3.4.2 GPIO

16 GPIOs

Certain GPIO pins can be used as interrupt inputs depending on the pinmux configuration


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3.4.3 UART

The ELIN-W1 includes four UART interfaces. The UART0 is used as Linux console. The UART 1, 3 and 4 can be

used for general purpose.

All UARTs support IrDA and CIR modes

All UARTs support RTS and CTS flow control

UART1 supports full modem control

3.4.4 ADC

12-bit Successive Approximation Register (SAR) ADC

200 K Samples per second

Input can be selected from any of the eight analog inputs multiplexed through an 8:1 Analog Switch

Can be configured to operate as a 4-wire resistive Touch Screen Controller (TSC) interface

3.4.5 JTAG

This debug interface supports the following:

JTAG and cJTAG for ARM (Cortex-A8 and PRCM), PRU-ICSS Debug

Supports device boundary scan

Supports IEEE 1500

3.4.6 USB

Up to two USB 2.0 high-speed OTG ports with integrated PHY

3.4.7 SDIO

1-, 4- and 8-bit MMC, SD, and SDIO modes

3.3 V operation

Up to 48 MHz data transfer rate (Supports standard and high-speed mode)

Supports card detect and write protect through GPIO

Complies with MMC4.3, SD, and SDIO 2.0 specifications

3.4.8 SPI

The ELIN-W1 supports SPI master and slave interfaces on 48 MHz with one chip select.

3.4.9 I2C

Up to three I2C master and slave interfaces

Standard mode (up to 100 kHz)

Fast mode (up to 400 kHz)


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4 Pin definition Figure 2 illustrates an overview of the interface location on the connector.

4.1 Primary connector

Figure 2: Primary connector interface layout

4.1.1 Default primary connector pin functions

Description Type/

Characteristics

CPU

Pin

Interface

signal

Pin

No.

Pin

No.

Interface

signal

CPU

Pin

Characteristics Description

Ground GND GND 1 2 GND GND Ground

Ethernet RMII Continuous 50 MHz Reference Clock

I, 3.3 V H18 RMII1.REFCLK 3 4 GND Ground

Ground GND 5 6 RMII2.REFCLK

H16 I, 3.3 V

Ethernet RMII Continuous 50 MHz Reference Clock

Ethernet RMII Carrier Sense (CRS)/ RX_Data Valid

I, 3.3 V H17 RMII1.CRSDV 7 8 GND GND Ground

Ethernet RMII Transmit Data Available. Active high.

O, 3.3 V J16 RMII1.TXEN 9 10 RMII2.CRSDV

U16 I, 3.3 V

Ethernet RMII Carrier Sense (CRS) / RX_Data Valid

J15 RMII1.RXERR 11 12 RMII2.TX_EN

R13 O, 3.3 V

Ethernet RMII Transmit Data Available. Active high.

Ground GND GND 13 14 Reserved Do not connect

Ethernet RMII Transmit data bit 0

O, 3.3 V K17 RMII1.TXD0 15 16 GND GND Ground



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Description Type/

Characteristics

CPU

Pin

Interface

signal

Pin

No.

Pin

No.

Interface

signal

CPU

Pin


Ethernet RMII Transmit data bit 1

O, 3.3 V K16 RMII1.TXD1 17 18 RMII2.TXD0

V15 O, 3.3 V Ethernet RMII Transmit data bit 0

Ground GND GND 19 20 RMII2.TXD1

R14 O, 3.3 V Ethernet RMII Transmit data bit 1

Ethernet RMII Receive data bit 0

I, 3.3 V M16 RMII1.RXD0 21 22 GND GND Ground

Ethernet RMII Receive data bit 1

I, 3.3 V L15 RMII1.RXD1 23 24 RMII2.RXD0

V17 I, 3.3 V Ethernet RMII Receive data bit 0

Ground GND GND 25 26 RMII2.RXD1

T16 I, 3.3 V Ethernet RMII Receive data bit 1

MDIO (RMII PHY Management Data Input/Output) interface Data signal

IO, 3.3 V M17 MDIO.DATA 27 28 GND GND Ground

MDIO (RMII PHY Management Data Input/Output) interface Clock signal

O, 3.3 V M18 MDIO.CLK 29 30 RMII2.RESETN

L18 IO, 3.3 V Ethernet RMII PHY 2 Control Signal

Ground GND GND 31 32 RMII1.RESETN

L17 IO, 3.3 V Ethernet RMII PHY 1 Control Signal

Digital IO IO, 3.3 V, 10k PD, SYSBOOT pin

T2 GPIO.IO7 33 34 Reserved Do not connect


R3 GPIO.IO6 35 36 PWR_ON 5.5 V tolerant, Act. Low

Module Power up/down signal


R4 GPIO.IO5 37 38 VINT_GOOD

1.8 V, Act.High

Power Good Signal for VINT rails

Digital IO IO, 3.3 V, 100k PU, SYSBOOT pin

T1 GPIO.IO4 39 40 RESETN A10 10 k PU, Act. Low

System Reset Signal


V2 GPIO.IO3 41 42 ADC.AIN3 A7 AI, 1.8 V Analog to Digital Converter


V3 GPIO.IO2 43 44 ADC.AIN2 B7 AI, 1.8 V Analog to Digital Converter


R2 GPIO.IO1 45 46 ADC.AIN1 C7 AI, 1.8 V Analog to Digital Converter


R1 GPIO.IO0 47 48 ADC.AIN0 B6 AI, 1.8 V Analog to Digital Converter



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Description Type/

Characteristics

CPU

Pin

Interface

signal

Pin

No.

Pin

No.

Interface

signal

CPU

Pin



UART Transmit "0" : Low, "1" : High

O, 3.3 V D15 UART1.TXD 51 52 VREF_ADC B9 PWR, Max 1.8 V, no load

ADC Reference Voltage

UART Receive "0" : Low, "1" : High

I, 3.3 V D16 UART1.RXD 53 54 GND GND Ground

UART Clear To Send, hardware flow control. Active low.

I, 3.3 V, Act. Low

D18 UART1.CTS 55 56 VINT_RTC

PWR, Regulated output 1.8 V, max 1 mA. Available after VINT_GOOD is asserted

Regulated output voltage for suspend circuitry

UART Request To Send, hardware flow control. Active low.

O, 3.3 V, Act. Low

D17 UART1.RTS 57 58 VINT_1V8

PWR, Regulated output 1.8 V, max 50 mA. Available after VINT_GOOD is asserted

Regulated output voltage for 1.8V

USB0 VBUS supply control

O, 3.3 V F16 USB0.DRVVBUS

59 60 VOUT_3V3

PWR, Regulated output 3.3 V, max 500 mA, Always ON

Regulated output voltage for 3.3V

USB0 OTG identification

A P16 USB0.ID 61 62 GND GND Ground

USB0 VBUS (input only for voltage sensing)

A P15 USB0.VBUS 63 64 GND GND Ground


USB0 data differential pair

A N18 USB0.DM 67 68 GND GND Ground


A N17 USB0.DP 69 70 VCC PWR, DC power input

Module power supply

Ground GND GND 71 72 VCC PWR, DC power input

Module power supply


O, 3.3 V E16 UART0.TXD 73 74 VCC PWR, DC power input

Module power supply


I, 3.3 V E15 UART0.RXD 75 76 VCC PWR, DC power input

Module power supply

UART Clear To Send, hardware flow control. Active low.

I, 3.3 V E18 UART0.CTS 77 78 VCC PWR, DC power input

Module power supply

UART Request To Send,

O, 3.3 V E17 UART0.RTS 79 80 VCC PWR, DC power input

Module power supply



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Description Type/

Characteristics

CPU

Pin

Interface

signal

Pin

No.

Pin

No.

Interface

signal

CPU

Pin


hardware flow control. Active low.

Table 6: ELIN-W1 primary connector description

Software support is not implemented currently.

4.2 Secondary connector

Figure 3 illustrates an overview of the interface location on the connector. The secondary connector is optional.

Figure 3: Secondary connector interface layout

4.2.1 Default secondary connector pin functions

Description Type/

Characteristics

CPU

Pin

Interface

signal

Pin

No.

Pin

No.

Interface

signal

CPU

Pin

Characteristi

cs

Description

Do not connect Reserved 1 2 Reserved Do not connect







Do not connect Reserved 15 16 GND GND Ground




O, 3.3 V C18 UART3.TXD 21 22 GPIO.IO15 U18 IO, 3.3 V Digital IO


I, 3.3 V C15 UART3.RXD 23 24 GPIO.IO14 B12 IO, 3.3 V Digital IO

UART Clear To I, 3.3 V, 10k U3 UART3.CTS 25 26 GPIO.IO13 D13 IO, 3.3 V Digital IO



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Description Type/

Characteristics

CPU

Pin

Interface

signal

Pin

No.

Pin

No.

Interface

signal

CPU

Pin

Characteristi

cs

Description

Send, hardware flow control. Active low.

PD SYSBOOT pin

UART Request To Send, hardware flow control. Active low.

O, 3.3 V, 10 k PD, SYSBOOT pin

U4 UART3.RTS 27 28 GPIO.IO12 C13 IO, 3.3 V Digital IO

Ground GND GND 29 30 GPIO.IO11 K18 IO, 3.3 V Digital IO

SPI Master Clock output. The SPI direction depends on master/slave role.

O, 3.3 V A13 SPI1.CLK 31 32 GPIO.IO10 J17 IO, 3.3 V Digital IO

Ground GND GND 33 34 GPIO.IO9 K15 IO, 3.3 V Digital IO

SPI Master Input Slave Output. The SPI direction depends on master/slave role.

I, 3.3 V B13 SPI1.MISO 35 36 GPIO.IO8 J18 IO, 3.3 V Digital IO

SPI Master Output Slave Input. The SPI direction depends on master/slave role.

O, 3.3 V D12 SPI1.MOSI 37 38 GND GND Ground

SPI Slave Select, active low

O, 3.3 V C12 SPI1.CS0 39 40 I2C2.SDA A17 IO/D, 3.3 V I²C data

The Test Data Out pin receives serial data from the target during debugging.

O, 3.3 V A11 JTAG.TDO 41 42 GND GND Ground

Ground GND GND 43 44 I2C2.SCL B17 IO/D, 3.3 V I²C clock

The Test Clock pin is used to clock data into the TDI and TMS inputs of the target.

I, 3.3 V A12 JTAG.TCK 45 46 I2C1.SDA B16 IO/D, 3.3 V I²C data

Ground GND GND 47 48 I2C1.SCL A16 IO/D, 3.3 V I²C clock

The Test Reset pin can be used to reset the TAP controller of the processor to allow debugging to take place.

I, 3.3 V, 10k PD Act. Low

B10 JTAG.NTRST 49 50 GND GND Ground

The Test Data In pin provides serial data to the target during debugging

I, 3.3 V B11 JTAG.TDI 51 52 I2C0.SCL C16 O, 3.3 V, 1.5k PU

I²C clock

JTAG MISC IO, 3.3 V B14 JTAG.EMU1 53 54 I2C0.SDA C17 IO, 3.3 V, I²C data



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Description Type/

Characteristics

CPU

Pin

Interface

signal

Pin

No.

Pin

No.

Interface

signal

CPU

Pin

Characteristi

cs

Description

EMULATION PIN 1

1.5k PU

The Test Mode Select pin is used to set the state of the Test Access Port (TAP) controller on the target.

I, 3.3 V C11 JTAG.TMS 55 56 GND GND Ground

JTAG MISC EMULATION PIN 0

IO, 3.3 V C14 JTAG.EMU0 57 58 SDIO1.DATA2

T11 IO, 3.3 V SDIO data bit 2

Do not connect Reserved 59 60 SDIO1.DATA3

U12 IO, 3.3 V SDIO data bit 3

Do not connect Reserved 61 62 SDIO1.CMD

V9 IO, 3.3 V SDIO Command signal

Do not connect Reserved 63 64 GND GND Ground

Ground GND GND 65 66 SDIO1.CLK

U9 O, 3.3 V SDIO Clock signal

USB1 VBUS supply control

O, 3.3 V F15 USB1.DRVVBUS

67 68 GND GND Ground

USB1 OTG identification

A P17 USB1.ID 69 70 SDIO1.DATA0


USB1 VBUS (input only for voltage sensing)

A T18 USB1.VBUS 71 72 SDIO1.DATA1


Ground GND GND 73 74 SDIO1.DATA4



A R17 USB1.DP 75 76 SDIO1.DATA5

R12 IO, 3.3 V SDIO data bit 5


A R18 USB1.DM 77 78 SDIO1.DATA6

V13 IO, 3.3 V SDIO data bit 6

Ground GND GND 79 80 SDIO1.DATA7


Table 7: ELIN-W1 secondary connector description

TYPE: Signal direction

I = Input

O = Output

IO = Input and Output

D = Open drain

DS = Differential

A = Analog

PWR = Power

GND = Ground


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5 Electrical specification Stressing the device above one or more of the ratings listed in the Absolute Maximum Rating

section may cause permanent damage. These are stress ratings only. Operating the module at these or at any conditions other than those specified in the Operating conditions section of this

document should be avoided. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

The ELIN-W1 module uses a single regulated supply voltage and single voltage IO levels. The module also has

the capability to provide regulated voltage supply for host logic decreasing the overall BOM and cost.

5.1 Absolute maximum ratings

The ELIN-W1 module uses a single regulated supply voltage and single voltage IO levels. The module also has the

capability to provide regulated voltage supply for host logic decreasing the overall BOM and cost.

5.1.1 Supply voltage

Symbol Parameter Vmin

Vtyp

Vmax

Imin

Ityp

(idle CPU, idle radio) Imax

Iq

VCC Supply voltage 3.6 V 5.0 V 5.5 V 150 mA 48 mA

VREF_ADC, AINx ADC Voltage Reference -0.5 V 1.8 V

IO pin 1.8 V 1.8V IO voltage -0.5 V 1.8 V 2.1 V

IO pin 3.3 V 3.3V IO voltage -0.5 V 3.3 V 3.6 V

Table 8: ELIN-W1 supply voltage properties

5.1.2 Output voltage regulator

Symbol Parameter Vmin

Vtyp

Vmax

Imax

Comment

VINT_RTC Regulated Deep Sleep Voltage 1.8 V TBD

VINT_1V8 Regulated Output voltage 1.8 V 1.8 V 50 mA

VOUT_3V3 Regulated Output voltage 3.3 V 3.3 V 500 mA

Table 9: ELIN-W1 output voltage properties

Do not apply voltage to any interfaces before VINT_GOOD is asserted as this can harm the module.

Output voltages are subject to power sequencing and are shared with on-board peripherals.

Exceeding the Imax

limit may harm the device and cause undefined behavior!

5.1.3 Maximum ESD

Parameter Maximum Unit Remarks

ESD immunity ±6000 V Air Discharge according to IEC 61000-4-2

Table 10: ELIN-W1 series maximum ESD ratings

5.2 Operating conditions

Operating condition ranges define those limits within which the functionality of the device is guaranteed.



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5.2.1 Temperature range

Parameter Minimum Maximum Unit

Storage temperature -40 +85 °C

Operating temperature -40 +75 °C

Table 11: Temperature range

5.2.2 Power supply

Read the safety notes in Guidelines for efficient and safe use section before using the module.

5.2.2.1 Supply voltage

Symbol Parameter Minimum Type Maximum Unit

VCC Supply voltage 3.6 5.0 5.5 V

Table 12: Power supply voltage

5.2.2.2 Current consumption

The current consumption for ELIN-W1 is provided in the following table. These measurements are performed at

room temperature with 5.0 V regulated supply voltage.

Symbol Power mode State lmin

ltyp

Imax

Unit Power consumption

Unit

Power down 48 μA mW

RTC Only Mode 195 μA mW

Wireless Receive 226 mA mW

Wireless Transmit 312 mA mW

Idle 151 mA mW

Table 13: ELIN-W1 current consumption

5.2.3 I/O DC characteristics

Symbol Parameter Minimum Type Maximum Unit

VIO 1.8 V 1.8 V IO domain 1.710 1.80 1.89 V

VIO 3.3 V 3.3 V IO domain 3.135 3.300 3.465 V

VIL LOW level input voltage 0 0.35 x VIO V

VIH HIGH level input voltage 0.65 x VIO VIO V

VOL

LOW level output voltage 0.0 0.45 V

VOH

HIGH level output voltage VIO - 0.45 VIO V

IGPIO

Sink and source current Pin dependent. See Datasheet for AM335x

mA

Table 14: ELIN-W1 I/O characteristics

5.2.4 Reset characteristics

Symbol Parameter Condition Minimum Type Maximum Unit

VIL(RESET_N)

RESET_N Input low level voltage 0.5 V

VIH(RESET_N)

RESET_N Input high level voltage 1.35 V

Vhys(RESET_N)

RESET_N Schmitt trigger voltage hysteresis

70 mV

RPU(RESET_N)

Internal RESET_N pull-up resistance 10 kΩ

CRESET_N

Internal RESET_N capacitance 100 nF

Table 15: ELIN-W1 current consumption



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5.2.5 Control signals characteristics

Symbol Parameter Condition Minimum Type Maximum Unit

VIL(VINT_GOOD)

VINT_GOOD Input low level voltage 0.3 V

VIH(VINT_GOOD)

VINT_GOOD Input high level voltage VIO - 0.3 V

VIL(PWR_ON)

Power ON Input low level voltage 0 0.4 V

VIH(PWR_ON)

Power ON Input high level voltage 1.2 VCC V

Table 16: ELIN-W1 control signal characteristics


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6 Mechanical specification

Figure 4: ELIN-W1 mechanical drawing

6.1 Module weight

Parameter Product variant Measure Unit

Weight ELIN-W160 14 g

Outline dimension ELIN-W160 50.0 x 44.0 x 9.6 mm

Table 17: ELIN-W160 mechanical properties

6.2 Mounting information

The ELIN-W1 has three mounting holes, which enables the module to be used in environments with vibration.


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7 Regulatory compliance

Products marked with this lead-free symbol on the product label comply with the

"Directive 2011/65/EU of the European Parliament and the Council on the Restriction of Use of certain Hazardous Substances in Electrical and Electronic Equipment" (RoHS).

The ELIN-W1 series modules are RoHS compliant. No natural rubbers, hygroscopic

materials, or materials containing asbestos are employed.

The ELIN-W1 module is for OEM integration only.

ELIN-W1has been tested and complies with the regulatory demands of the CE-mark, Industry Canada (IC) and the limits for a Class B digital device pursuant to Part 15 of the FCC Rules.

ELIN-W1 has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection

against harmful interference in a residential installation. This equipment generates and can

radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation. If this equipment does

cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or

more of the following measures:

o Reorient or relocate the receiving antenna

o Increase the separation between the equipment and receiver

o Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected

Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications NOT explicitly APPROVED by u-blox AG could cause the module to

cease to comply with FCC rules part 15, and thus void the user's authority to operate the

equipment.

To fulfill the safety standard EN 60950 ELIN-W1must be supplied with a Class-2 Limited Power

Source.

7.1 Wireless Regulatory compliance

The regulatory compliance of the wireless part of ELIN-W1 relies on the regulatory certification of the onboard

radio module ODIN-W160.

ODIN-W160 is tested and complies with the regulatory demands in Canada (IC), US (FCC), Japan (Giteki) and Europe (CE). It has a FCC, IC and Giteki Modular Transmitter certification.

To secure that the wireless part of ELIN-W1 is operated in an authorized mode read carefully the regulatory instructions found in the documents ELIN-W1 System Integration Manual [1] and

ODIN-W1 System Integration Manual [3].


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8 Product handling

8.1 Packaging

The ELIN-W1 series modules are delivered on trays, with 24 pieces of modules on each tray. Table 18 describes

the module quantity in a standard shipment package of ELIN-W1. The dimensions of the trays and tray packages

in a carton are specified in Figure 5 and Figure 6. For more information about packaging, see the u-blox Package Information Guide [5].

Quantity

ELIN-W1 module in one shipment package 96 pieces

Trays in one shipment package 4 trays

ELIN-W1 modules on Trays 24 pieces/tray

Table 18: Package information of ELIN-W1 module

Figure 5: ELIN-W1 tray dimensions (unit: mm)


UBX-15011161 - R03 Early Production Information Product handling

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Figure 6: Tray arrangement in a carton (unit: mm)

8.2 Moisture sensitivity levels

The ELIN-W1 modules are Moisture Sensitive Devices (MSD) in accordance to the IPC/JEDEC

specification.

The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required. The ELIN-W1

modules are rated at MSL level 4. For more information regarding moisture sensitivity levels, labeling, storage

and drying see the u-blox Package Information Guide [5].

For MSL standard, see IPC/JEDEC J-STD-020, which can be downloaded from www.jedec.org.

8.3 ESD handling precautions

The ELIN-W1 modules contain highly sensitive electronic circuitry and are Electrostatic Sensitive

Devices (ESD). Handling ELIN-W1 modules without proper ESD protection may destroy or damage them permanently.

The ELIN-W1 modules are Electrostatic Sensitive Devices (ESD) and require special ESD precautions typically

applied to ESD sensitive components. The Maximum ESD section reports the maximum ESD ratings of the ELIN-W1 modules.

Proper ESD handling and packaging procedures must be applied throughout the processing, handling, and

operation of any application that incorporates ELIN-W1 module.

The ESD precautions should be implemented on the application board where the module is mounted, as

described in the ELIN-W1 series System Integration Manual [1].

Failure to observe these recommendations can result in severe damage to the device!

http://www.jedec.org/


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9 Labeling and ordering information

9.1 Product labeling

The labels of ELIN-W1 series modules include important product information as described in this section. Figure 7

illustrates the label of ELIN-W1 series modules and includes: u-blox logo, product name, product revision, date of

production, dataMatrix (with unit serial number, hardware and firmware revision) and pin 1 marker.

Figure 7: ELIN-W1 series sample label

9.2 Explanation of codes

Three different product code formats are used. The Product Name is used in documentation such as this data

sheet and identifies all u-blox products, independent of packaging and quality grade. The Ordering Code

includes options and quality, while the Type Number includes the hardware and firmware versions. Table 19 provides information regarding these three different formats:

Format Structure

Product Name PPPP-TGVV

Ordering Code PPPP-TGVV-TTQ

Type Number PPPP-TGVV-TTQ-XX

Table 19: Product code formats

Table 20 explains the parts of the product code.

Code Meaning Example

PPPP Form factor ELIN

TG Platform

T – Dominant technology, For example, W: Wi-Fi, B: Bluetooth

G - Generation

W1

VV Variant based on the same platform; range [00…99] 60

TT Major Product Version 00

Q Quality grade

A: Automotive

B: Professional

C: Standard

B

XX Minor product version (not relevant for certification) Default value is 00

Table 20: Part identification code


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9.3 Ordering information

Ordering Number Product

ELIN-W160-00B 600 MHz, 512 MB Flash, 256 MB RAM with ODIN-W160. U.FL connector.

Table 21: Product ordering codes


UBX-15011161 - R03 Early Production Information Guidelines for efficient and safe use

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10 Guidelines for efficient and safe use

10.1 General

Read this information before using your ELIN-W1 module. For any exceptions due to national requirements or

limitations while using your Wi-Fi module, please contact u-blox AG.

Changes or modifications to the product not expressly approved by u-blox will void the user's

authority to operate the equipment.

10.1.1 Product care

• Do not expose your product to liquid or moisture.

• Do not expose your product to extreme hot or cold temperature. • Do not expose your product to lit candles, cigarettes, cigars, open flames and so on.

• Do not drop, throw or try to bend your product since rough treatment could damage your product.

• Do not attempt to disassemble your product. Doing so will void warranty. The product does not contain consumer serviceable or replaceable components. Service should only be performed by

u-blox AG.

• Do not paint your product as the paint could prevent normal use. • If you will not use your product for a while, store it in a place that is dry, free from damp, dust and

extreme heat and cold.

• The clearance and creepage distances required by the end product must be withheld when the module is installed.

• The cooling of the end product shall not negatively be influenced by the installation of the module

when the module is installed.

10.1.2 Radio frequency exposure

The ODIN-W160 Wi-Fi module contains a small radio transmitter and receiver.

During communication with other Wi-Fi products, the ODIN-W160 module transmits and receives radio

frequency (RF) electromagnetic fields (microwaves) in the frequency range 2412 - 2462 MHz, 5180 - 5240 MHz,

5260 - 5320 MHz, and 5500 - 5700 MHz. The output power of the radio transmitter is very low. While using the module, you will be exposed to some of the transmitted RF energy. This exposure is well below the prescribed

limits in all national and international RF safety standards and regulations.

10.1.3 Electronic equipment

Most modern electronic equipment in hospitals and cars is shielded from RF energy. However, certain electronic

equipments are not.

This equipment emits RF energy in the ISM (Industrial, Scientific, Medical) band. Please ensure

that all medical devices used in proximity to this device meet appropriate susceptibility specifications for this type of RF energy.

10.2 Potentially explosive atmospheres

Turn off your electronic device before entering an area with potentially explosive atmosphere. It is rare, but your

electronic device could generate sparks. Sparks in such areas could cause an explosion or fire resulting in bodily

injury or even death.

Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include fueling

areas, such as petrol stations, below deck on boats, fuel or chemical transfer or storage facilities, and areas

where the air contains chemicals or particles, such as grain, dust or metal powders.


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10.2.1 Safety compliance

To fulfill the safety standard EN 60950, the ELIN-W160 Wi-Fi module must be supplied by a Class-2 Limited

Power Source.


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Appendix

A Glossary Name Definition

ADC Analog to Digital Converter

BPF Band Pass Filter

BT Bluetooth

CAN Controller Area Network

CTS Clear To Send

DC Direct Current

DSR Data Set Ready

DTR Data Terminal Ready

FW Firmware

GND Ground

GPIO General Purpose Input Output

H High

I Input (means that this is an input port of the module)

IEEE Institute of Electrical and Electronics Engineers

I2C Inter-Integrated Circuit

L Low

LPO low Power Oscillator

MSL Moisture Sensitivity Level

N/A Not Applicable

O Output (means that this is an output port of the module)

PCN / IN Product Change Notification / Information Note

PD Pull-Down

PU Pull-Up

RMII Reduced Media Independent Interface

RTS Request To Send

RXD Receive Data

SAR Successive Approximation Register

SDIO Secure Digital Input Output

SPI Serial Peripheral Interface

TBD To Be Defined

TSC Touch Screen Controller

TXD Transmit Data

UART Universal Asynchronous Receiver-Transmitter serial interface

USB Universal Serial Bus

Table 22: Explanation of abbreviations and terms used


UBX-15011161 - R03 Early Production Information Related documents

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Related documents [1] ELIN-W1 System Integration Manual, document number UBX-15011162

[2] EVK-W16 User Guide, document number UBX-15017061

[3] ODIN-W1 series System Integration Manual, document number UBX-15011025

[4] ODIN-W1 series Data Sheet, document number UBX-15011034

[5] u-blox Package Information Guide, document number UBX-14001652

For regular updates to u-blox documentation and to receive product change notifications please register on our homepage.

Revision history

Revision Date Name Status / Comments

R01 24-Feb-2015 mjer Initial release

R02 26-Jan-2016 lalb, mjer, fbro, jhel, kgom

Updated the document status to Advance Information. Added sample image of the module label. Changed the maximum operating temperature range from +85 °C to +75 °C. Updated the Firmware revision to 2.0. Included chapter 8 - Product handling and included packaging information for ELIN-W1 in section 8.1.

R03 17-Jun-2016 fbro, ovik Updated the document status to Early Production Information. Added information about type approvals in section 7.


UBX-15011161 - R03 Early Production Information Contact

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Contact For complete contact information visit us at www.u-blox.com.

u-blox Offices

North, Central and South America

u-blox America, Inc.

Phone: +1 703 483 3180

E-mail: [email protected]

Regional Office West Coast:

Phone: +1 408 573 3640


Technical Support:

Phone: +1 703 483 3185


Headquarters Europe, Middle East, Africa

u-blox AG

Phone: +41 44 722 74 44 E-mail: [email protected]

Support: [email protected]

Asia, Australia, Pacific

u-blox Singapore Pte. Ltd.

Phone: +65 6734 3811

E-mail: [email protected] Support: [email protected]

Regional Office Australia:

Phone: +61 2 8448 2016 E-mail: [email protected]


Regional Office China (Beijing):

Phone: +86 10 68 133 545


Regional Office China (Chongqing):



Regional Office China (Shanghai):



Regional Office China (Shenzhen):

Phone: +86 755 8627 1083



Regional Office India:

Phone: +91 80 4050 9200


Regional Office Japan (Osaka):



Regional Office Japan (Tokyo):



Regional Office Korea:



Regional Office Taiwan:



http://www.u-blox.com/

mailto:[email protected]




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