flex chassis ig
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IBM Flex Chassis IGTRANSCRIPT
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IBM Flex System Enterprise ChassisTypes 7893, 8721, and 8724Installation and Service Guide
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IBM Flex System Enterprise ChassisTypes 7893, 8721, and 8724Installation and Service Guide
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NoteNote: Before using this information and the product it supports, read the general information inNotices on page 593; and read the IBM Safety Information and the IBM Systems EnvironmentalNotices and User Guide on the IBM Documentation CD.
Third Edition (August 2013)
Copyright IBM Corporation 2013.US Government Users Restricted Rights Use, duplication or disclosure restricted by GSA ADP Schedule Contractwith IBM Corp.
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ContentsSafety . . . . . . . . . . . . . . . vGuidelines for trained service technicians . . . . vi
Inspecting for unsafe conditions . . . . . . viGuidelines for servicing electrical equipment . . vii
Safety statements . . . . . . . . . . . . viii
Chapter 1. Introduction . . . . . . . . 1Related documentation . . . . . . . . . . . 5The IBM Documentation CD . . . . . . . . . 5Notices and statements in this document . . . . . 6Features and specifications. . . . . . . . . . 7Major chassis components . . . . . . . . . . 9
Front view of the IBM Flex System EnterpriseChassis . . . . . . . . . . . . . . . 10Rear view of the chassis . . . . . . . . . 13
Chapter 2. Installing the IBM FlexSystem Enterprise Chassis . . . . . . 23Setting up your IBM Flex System Enterprise Chassis 23
Removing components . . . . . . . . . 23Installing the chassis in a rack . . . . . . . 28Installing components . . . . . . . . . . 36Network integration . . . . . . . . . . 48Cabling the chassis . . . . . . . . . . . 50Connecting the chassis to power . . . . . . 51
User labels . . . . . . . . . . . . . . 52Obtaining firmware updates . . . . . . . . . 53Disconnecting the chassis from power . . . . . 54
Chapter 3. Configuring the IBM FlexSystem Enterprise Chassis . . . . . . 57Configuring the chassis by using the CMM. . . . 57
CMM network access tag . . . . . . . . . 58IPv6 addressing for initial connection. . . . . 59Ethernet connection . . . . . . . . . . 60
Configuring the chassis by using the IBM FlexSystem Manager management node . . . . . . 62
Connecting to the management node remotely byusing the host name . . . . . . . . . . 62Connecting to the management node remotely byusing the static IP address . . . . . . . . 63Connecting to the management node locally byusing the console breakout cable . . . . . . 64Configuring the management node . . . . . 65
Configuring I/O modules . . . . . . . . . 65Configuring compute nodes . . . . . . . . . 68
Chapter 4. Troubleshooting the chassis 69Service bulletins . . . . . . . . . . . . . 70Diagnostic tools . . . . . . . . . . . . . 70
IBM Flex System Manager event log . . . . . 70CMM event log . . . . . . . . . . . . 70Front information panel LEDs . . . . . . . 515Chassis module LEDs . . . . . . . . . 517
Troubleshooting by symptom . . . . . . . . 518Cannot communicate with the IBM Flex SystemManager management node . . . . . . . 518Cannot communicate with the CMM . . . . 519Cannot communicate with the I/O module . . 519Cannot log in . . . . . . . . . . . . 519Cannot ping the CMM on the managementnetwork . . . . . . . . . . . . . . 520Cannot ping the I/O module . . . . . . . 523Cannot ping the IBM Flex System Managermanagement node on the data network . . . 524Cannot ping the IBM Flex System Managermanagement node on the management network. 528Compute node connectivity problems . . . . 532Intermittent connectivity problems . . . . . 532Multiple nodes cannot connect . . . . . . 533Node power problems . . . . . . . . . 534Overheating . . . . . . . . . . . . . 535Poor network performance . . . . . . . . 536Power supply problems . . . . . . . . . 536Cannot ping the IBM Flex System Managermanagement node on the management network. 537Single node cannot ping the I/O module . . . 538Unusual noises coming from a power supply orfan module . . . . . . . . . . . . . 538Unusual odors . . . . . . . . . . . . 539Visible physical damage . . . . . . . . . 539
Chapter 5. Parts listing, Types 7893,8721, and 8724 . . . . . . . . . . . 541Power cords . . . . . . . . . . . . . . 543
Chapter 6. Removing and replacingcomponents . . . . . . . . . . . . 545Installation guidelines . . . . . . . . . . 545
System reliability guidelines . . . . . . . 546Handling static-sensitive devices . . . . . . 546Returning a device or component . . . . . 546
Removing and replacing consumable parts . . . 546Replacing the filter media . . . . . . . . 547Removing the shelf supports . . . . . . . 548Replacing the shelf supports . . . . . . . 549
Removing and replacing Tier 1 CRUs . . . . . 550Removing a Chassis Management Module. . . 551Replacing a Chassis Management Module . . . 552Removing an IBM Flex System Managermanagement node. . . . . . . . . . . 553Replacing an IBM Flex System Managermanagement node. . . . . . . . . . . 554Removing compute nodes . . . . . . . . 556Replacing compute nodes . . . . . . . . 557Removing fan modules . . . . . . . . . 560Replacing fan modules . . . . . . . . . 561Removing an I/O module . . . . . . . . 563Replacing an I/O module . . . . . . . . 564
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Removing a power supply . . . . . . . . 565Replacing a power supply . . . . . . . . 566Removing a fan logic module . . . . . . . 568Replacing a fan logic module . . . . . . . 569Removing a chassis shelf . . . . . . . . 570Replacing a chassis shelf . . . . . . . . 570
Removing and replacing FRUs . . . . . . . 571Removing a 4-bay storage enclosure . . . . . 571Replacing a 4-bay storage enclosure . . . . . 572Removing the shuttle . . . . . . . . . . 573Replacing the shuttle . . . . . . . . . . 574Removing a fan distribution card. . . . . . 576Replacing a fan distribution card . . . . . . 577Removing the front LED card . . . . . . . 579Replacing the front LED card . . . . . . . 580Removing the midplane . . . . . . . . . 581Replacing the midplane . . . . . . . . . 583Removing the rear LED card . . . . . . . 585Replacing the rear LED card . . . . . . . 586
Appendix. Getting help and technicalassistance. . . . . . . . . . . . . 589Before you call . . . . . . . . . . . . . 589Using the documentation . . . . . . . . . 590Getting help and information from the World WideWeb . . . . . . . . . . . . . . . . 590How to send DSA data to IBM . . . . . . . 590Software service and support . . . . . . . . 591Hardware service and support . . . . . . . 591IBM Taiwan product service . . . . . . . . 591
Notices . . . . . . . . . . . . . . 593Trademarks . . . . . . . . . . . . . . 593Important notes . . . . . . . . . . . . 594Particulate contamination . . . . . . . . . 595Documentation format . . . . . . . . . . 596Telecommunication regulatory statement . . . . 596Electronic emission notices . . . . . . . . . 596
Federal Communications Commission (FCC)statement. . . . . . . . . . . . . . 596Industry Canada Class A emission compliancestatement. . . . . . . . . . . . . . 597Avis de conformit la rglementationd'Industrie Canada . . . . . . . . . . 597Australia and New Zealand Class A statement 597European Union EMC Directive conformancestatement. . . . . . . . . . . . . . 597Germany Class A statement . . . . . . . 598Japan VCCI Class A statement. . . . . . . 599Japan Electronics and Information TechnologyIndustries Association (JEITA) statement . . . 599Korea Communications Commission (KCC)statement. . . . . . . . . . . . . . 599Russia Electromagnetic Interference (EMI) ClassA statement . . . . . . . . . . . . . 599People's Republic of China Class A electronicemission statement . . . . . . . . . . 599Taiwan Class A compliance statement . . . . 600
Index . . . . . . . . . . . . . . . 601
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SafetyBefore installing this product, read the Safety Information.
Antes de instalar este produto, leia as Informaes de Segurana.
Ls sikkerhedsforskrifterne, fr du installerer dette produkt.
Lees voordat u dit product installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tmn tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce produit, lisez les consignes de scurit.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo prodotto, leggere le Informazioni sulla Sicurezza.
Copyright IBM Corp. 2013 v
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Les sikkerhetsinformasjonen (Safety Information) fr du installerer dette produktet.
Antes de instalar este produto, leia as Informaes sobre Segurana.
Antes de instalar este producto, lea la informacin de seguridad.
Ls skerhetsinformationen innan du installerar den hr produkten.
Bu rn kurmadan nce gvenlik bilgilerini okuyun.
Guidelines for trained service techniciansThis section contains information for trained service technicians.
Inspecting for unsafe conditionsUse this information to help you identify potential unsafe conditions in an IBM
product that you are working on.
Each IBM product, as it was designed and manufactured, has required safety itemsto protect users and service technicians from injury. The information in this sectionaddresses only those items. Use good judgment to identify potential unsafeconditions that might be caused by non-IBM alterations or attachment of non-IBMfeatures or optional devices that are not addressed in this section. If you identify
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an unsafe condition, you must determine how serious the hazard is and whetheryou must correct the problem before you work on the product.
Consider the following conditions and the safety hazards that they present:v Electrical hazards, especially primary power. Primary voltage on the frame cancause serious or fatal electrical shock.
v Explosive hazards, such as a damaged CRT face or a bulging capacitor.v Mechanical hazards, such as loose or missing hardware.
To inspect the product for potential unsafe conditions, complete the followingsteps:1. Make sure that the power is off and the power cords are disconnected.2. Make sure that the exterior cover is not damaged, loose, or broken, and observe
any sharp edges.3. Check the power cords:
v Make sure that the third-wire ground connector is in good condition. Use ameter to measure third-wire ground continuity for 0.1 ohm or less betweenthe external ground pin and the frame ground.
v Make sure that the power cords are the correct type.v Make sure that the insulation is not frayed or worn.
4. Remove the cover.5. Check for any obvious non-IBM alterations. Use good judgment as to the safety
of any non-IBM alterations.6. Check inside the system for any obvious unsafe conditions, such as metal
filings, contamination, water or other liquid, or signs of fire or smoke damage.7. Check for worn, frayed, or pinched cables.8. Make sure that the power-supply cover fasteners (screws or rivets) have not
been removed or tampered with.
Guidelines for servicing electrical equipmentObserve these guidelines when you service electrical equipment.v Check the area for electrical hazards such as moist floors, nongrounded powerextension cords, and missing safety grounds.
v Use only approved tools and test equipment. Some hand tools have handles thatare covered with a soft material that does not provide insulation from liveelectrical current.
v Regularly inspect and maintain your electrical hand tools for safe operationalcondition. Do not use worn or broken tools or testers.
v Do not touch the reflective surface of a dental mirror to a live electrical circuit.The surface is conductive and can cause personal injury or equipment damage ifit touches a live electrical circuit.
v Some rubber floor mats contain small conductive fibers to decrease electrostaticdischarge. Do not use this type of mat to protect yourself from electrical shock.
v Do not work alone under hazardous conditions or near equipment that hashazardous voltages.
v Locate the emergency power-off (EPO) switch, disconnecting switch, or electricaloutlet so that you can turn off the power quickly in the event of an electricalaccident.
v Disconnect all power before you perform a mechanical inspection, work nearpower supplies, or remove or install main units.
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v Before you work on the equipment, disconnect the power cord. If you cannotdisconnect the power cord, have the customer power-off the wall box thatsupplies power to the equipment and lock the wall box in the off position.
v Never assume that power has been disconnected from a circuit. Check it tomake sure that it has been disconnected.
v If you have to work on equipment that has exposed electrical circuits, observethe following precautions: Make sure that another person who is familiar with the power-off controls is
near you and is available to turn off the power if necessary. When you work with powered-on electrical equipment, use only one hand.
Keep the other hand in your pocket or behind your back to avoid creating acomplete circuit that could cause an electrical shock.
When you use a tester, set the controls correctly and use the approved probeleads and accessories for that tester.
Stand on a suitable rubber mat to insulate you from grounds such as metalfloor strips and equipment frames.
v Use extreme care when you measure high voltages.v To ensure proper grounding of components such as power supplies, pumps,blowers, fans, and motor generators, do not service these components outside oftheir normal operating locations.
v If an electrical accident occurs, use caution, turn off the power, and send anotherperson to get medical aid.
Safety statementsThese statements provide the caution and danger information that is used in thisdocumentation.
Important:
Each caution and danger statement in this documentation is labeled with anumber. This number is used to cross reference an English-language caution ordanger statement with translated versions of the caution or danger statement inthe Safety Information document.
For example, if a caution statement is labeled Statement 1, translations for thatcaution statement are in the Safety Information document under Statement 1.
Be sure to read all caution and danger statements in this documentation before youperform the procedures. Read any additional safety information that comes withyour system or optional device before you install the device.
Statement 1
viii IBM Flex System Enterprise Chassis: Installation and Service Guide
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DANGER
Electrical current from power, telephone, and communication cables ishazardous.
To avoid a shock hazard:
v Do not connect or disconnect any cables or perform installation,maintenance, or reconfiguration of this product during an electrical storm.
v Connect all power cords to a properly wired and grounded electrical outlet.v Connect to properly wired outlets any equipment that will be attached tothis product.
v When possible, use one hand only to connect or disconnect signal cables.v Never turn on any equipment when there is evidence of fire, water, orstructural damage.
v Disconnect the attached power cords, telecommunications systems,networks, and modems before you open the device covers, unlessinstructed otherwise in the installation and configuration procedures.
v Connect and disconnect cables as described in the following table wheninstalling, moving, or opening covers on this product or attached devices.
To Connect: To Disconnect:
1. Turn everything OFF.2. First, attach all cables to devices.3. Attach signal cables to connectors.4. Attach power cords to outlet.5. Turn device ON.
1. Turn everything OFF.2. First, remove power cords from outlet.3. Remove signal cables from connectors.4. Remove all cables from devices.
Statement 2
CAUTION:When replacing the lithium battery, use only IBM Part Number 33F8354 or anequivalent type battery recommended by the manufacturer. If your system has amodule containing a lithium battery, replace it only with the same module typemade by the same manufacturer. The battery contains lithium and can explode ifnot properly used, handled, or disposed of.
Do not:
v Throw or immerse into waterv Heat to more than 100C (212F)v Repair or disassemble
Dispose of the battery as required by local ordinances or regulations.
Safety ix
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Statement 3
CAUTION:When laser products (such as CD-ROMs, DVD drives, fiber optic devices, ortransmitters) are installed, note the following:
v Do not remove the covers. Removing the covers of the laser product couldresult in exposure to hazardous laser radiation. There are no serviceable partsinside the device.
v Use of controls or adjustments or performance of procedures other than thosespecified herein might result in hazardous radiation exposure.
DANGER
Some laser products contain an embedded Class 3A or Class 3B laser diode.Note the following.
Laser radiation when open. Do not stare into the beam, do not view directlywith optical instruments, and avoid direct exposure to the beam.
Class 1 Laser ProductLaser Klasse 1Laser Klass 1Luokan 1 LaserlaiteAppareil A Laser de Classe 1`
Statement 4
18 kg (39.7 lb) 32 kg (70.5 lb) 55 kg (121.2 lb)
CAUTION:Use safe practices when lifting.
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Statement 8
CAUTION:Never remove the cover on a power supply or any part that has the followinglabel attached.
Hazardous voltage, current, and energy levels are present inside any componentthat has this label attached. There are no serviceable parts inside thesecomponents. If you suspect a problem with one of these parts, contact a servicetechnician.
Statement 13
DANGER
Overloading a branch circuit is potentially a fire hazard and a shock hazardunder certain conditions. To avoid these hazards, ensure that your systemelectrical requirements do not exceed branch circuit protection requirements.Refer to the information that is provided with your device for electricalspecifications.
Statement 21
CAUTION:Hazardous energy is present when the blade is connected to the power source.Always replace the blade cover before installing the blade.
Statement 26
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CAUTION:Do not place any object on top of rack-mounted devices.
Statement 32
CAUTION:To avoid personal injury, before lifting the unit, remove all the blades, powersupplies, and removable modules to reduce the weight.
Statement 33
CAUTION:This device does not provide a power control button. Removing power supplymodules or turning off the server blades does not turn off the electrical currentsupplied to the device. The device also might have more than one power cord.To remove all electrical current from the device, ensure that all power cords aredisconnected from the power source.
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Rack Safety Information, Statement 2
DANGER
v Always lower the leveling pads on the rack cabinet.v Always install stabilizer brackets on the rack cabinet.v Always install servers and optional devices starting from the bottom of therack cabinet.
v Always install the heaviest devices in the bottom of the rack cabinet.
Regulatory information
The IBM Flex System Enterprise Chassis is intended for connection to the load sideof a power distribution unit (PDU) or uninterruptible power source (UPS)supplying a maximum 20A branch circuit protection.
Maschinenlrminformations-Verordnung - 3. GPSGV, der hchste Schalldruckpegelbetrgt 70 dB(A) oder wenige.
17 Schalldruckpegel
Sound pressure level62 db (A)
18 Deklarierter schalleistungspegel
Declared sound power level7.5 bels
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Chapter 1. IntroductionThe IBM Flex System Enterprise Chassis Types 7893, 8721, and 8724 is a 10Unext-generation server platform with integrated chassis management. It is acompact, high-density, high-performance, rack-mounted, scalable server platformsystem.
The IBM Flex System Enterprise Chassis has fourteen node bays that support up tofourteen 1-bay compute nodes or up to seven 2-bay compute nodes when theshelves are removed from the chassis. You can use both 1-bay and 2-bay computenodes to meet your specific hardware needs. The chassis platform is optimized forboth x86 and POWER resources.
The IBM Flex System Enterprise Chassis also supports 4-bay storage nodes, whenthe shelves and shelf supports are removed from the chassis. The IBM Flex SystemEnterprise Chassis can support up to three 4-bay storage nodes or storageexpansion enclosures.
The compute nodes and storage nodesshare common resources, such as power,cooling, management, and I/O resources in the chassis.
Note:
v A 1-bay compute node occupies one node bay in the chassis.v A 1-bay compute node with captive-mode expansion node occupies two adjacentnode bays (horizontally) in the chassis and requires the chassis shelf to beremoved prior to installation.
v A 2-bay compute node occupies two adjacent node bays (horizontally) in thechassis and requires the chassis shelf to be removed prior to installation.
v A 4-bay storage node or storage expansion enclosure occupies four adjacentnode bays (two vertically and horizontally) in the chassis and requires thechassis shelves and shelf supports to be removed prior to installation.
The IBM Flex System Enterprise Chassis can support the following components:v Up to fourteen 1-bay compute nodes or up to seven 2-bay compute nodes withthe shelves removed.
v Up to seven 1-bay compute nodes with captive-mode expansion node (eachassembly occupies two node bays).
v Up three 4-bay storage nodes or storage expansion enclosures with the shelvesand shelf supports removed.
v Up to six power supplies.v Up to ten fan modules (two 40 mm fan modules and eight 80 mm fan modules).v Four I/O modules (two redundant pairs), with the following features in eachmodule: A four-lane physical interconnect that supports speeds up to 16 Gbps,
four-lanes to each single node bay or eight-lanes to each full-width node bay(two adjacent bays), 16 Gbps per lane. The four lanes support 4x10 Gbps (40Gbps) or Fourteen Data Rate InfiniBand at 56 Gbps.
Four x1 ports or a single x4 port on each compute node Up to 16 logical I/O modules (four per physical I/O module)
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v One IBM Flex System Manager management node, which providesmultiple-chassis management support.
v Two IBM Flex System Chassis Management Modules (CMMs) for redundancy. ACMM provides single-chassis management support.
v Two fan logic modules, which detect fan module presence and provide acommunication path to the fan modules.
v Two fan distribution cards, which pass the power and signals from the midplaneto the fan modules and the fan logic modules.
v One rear LED card, which stores the vital product data (VPD) of the chassiscomponents.
The chassis system provides the following features:v IBM X-Architecture
The IBM Flex System Enterprise Chassis is an IBM X-Architecture system thatuses proven innovative IBM technologies to build powerful, scalable, andreliable compute node platforms. It provides features such as IBM PredictiveFailure Analysis (PFA) and real-time diagnostics.
v Compute node expansion capabilitiesYou can install up to fourteen 1-bay compute nodes or seven 2-bay computenodes in the chassis. Some compute nodes have connectors for additionaloptional devices that you can use to add capabilities to the compute nodes. Forexample, you can install optional I/O expansion adapters to add networkinterfaces or storage through the I/O modules.
v Hot-swap capabilitiesAll component bays in the chassis are hot-swappable. For example, you can add,remove, or replace a compute node, I/O module, IBM Flex System Managermanagement node, Chassis Management Module, fan logic module, fan module,or power supply without disconnecting the power from the chassis.
v High-availability designThe following components in the chassis enable continued operation if one ofthe components fails: Power supplies
The power supplies support a single power domain that provides dc powerto all of the chassis components. If a power supply fails, the other powersupplies can continue to provide power. For power redundancy, additionalpower supplies can be installed.
Note: The power management policy that you have implemented for thechassis determines the result of a power-supply failure.
I/O modulesThe I/O module bays provide a four-lane physical interface to each 1-baycompute node that supports speeds up to 56 Gbps. The I/O modules must beinstalled in pairs if you want them to be redundant.
Fan modulesThe fan modules provide cooling to all of the chassis components.
Fan logic modulesThe fan logic modules enable the Chassis Management Module to monitorthe fans and control fan speed.
v Chassis midplaneThe chassis midplane provides the following features:
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Redundant high-speed serialize/deserialize (SERDES) interconnects betweencompute nodes and I/O modules
I2C communication paths between the CMM and all devices in the chassis 1 Gb Ethernet communication paths between the CMM and all compute
nodes and I/O modules Power distribution to all nodes and modulesThe midplane provides hot-swap connectors for the following components: Fourteen 1-bay compute nodes or seven 2-bay compute nodes Four I/O modules Two CMMs Six power supplies Ten fan modules Two fan logic modules
v Systems managementIf an IBM Flex System Manager management node is installed, it providesconfiguration and management support for multiple chassis, their devices, andthe compute nodes locally or remotely. For more information about the IBM FlexSystem Manager, see http://publib.boulder.ibm.com/infocenter/flexsys/information/topic/com.ibm.acc.8731.doc/product_page.html.The IBM Flex System Chassis Management Module (Chassis ManagementModule or CMM) provides single-chassis management. The ChassisManagement Module is used to communicate with the system-managementprocessor in each compute node to provide system monitoring, event recording,and alerts and to manage the chassis, its devices, and the compute nodes. Thechassis supports up to two CMMs. If one CMM fails, the second CMM candetect its inactivity, activate itself, and take control of the system without anydisruption. For more information about the CMM, see http://publib.boulder.ibm.com/infocenter/flexsys/information/topic/com.ibm.acc.cmm.doc/cmm_product_page.html.
The following table shows the minimum configuration that is required for the IBMFlex System Enterprise Chassis to operate.
Table 1. Minimum chassis configurationComponent Bay
Two power supplies Power-supply bays 1 and 4
Two 40 mm fan modules Fan bays 5 and 10
Four 80 mm fan modules Fan bays 1, 2, 6, and 7
Two fan logic modules Fan logic bays 1 and 2
IBM Flex System Manager (optional, one perchassis)
Node bay 1
One Chassis Management Module CMM bay 1
One I/O module I/O bay 1
One compute node Node bays 2 - 14
Record information about the IBM Flex System Enterprise Chassis in the followingtable. You will need this information for future reference.
Chapter 1. Introduction 3
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Product name IBM Flex System Enterprise ChassisMachine type 7893, 8721, or 8724Model number _____________________________________________Serial number _____________________________________________
The serial number and model number are on the top, front, and rear of the chassis.The following illustration shows the location of the label on the front of thechassis.
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If the chassis comes with an RFID tag, it is attached to the lower-right corner of thebezel. The following illustration shows the location of the RFID tag on the front ofthe chassis.
Chassis RFID tag
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