forward inner module

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Forward Inner Module

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Forward Inner Module. Bonding. Bonding errors on both sides - swapped bonds Corrected for on link 1 by swapping bonds at chip to fan-in and swapping them back at fan-in to detector - PowerPoint PPT Presentation

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Page 1: Forward Inner Module

Forward Inner Module

Page 2: Forward Inner Module

Bonding

• Bonding errors on both sides - swapped bonds– Corrected for on link 1 by swapping bonds at chip

to fan-in and swapping them back at fan-in to detector

– Noticed too late for link 0 and every other channel swapped. Also both unbonded detector strips at one end on link 0

– HV bonded via fan-in to front side. Bond wire from fan-in glued to detector back side

Page 3: Forward Inner Module

Current characteristics

• IV characteristic measured 20C– Consistent with data in database at 150V– High current above 150V, reason not know

• Note: Module now slightly dirty due to treatment (e.g. opto tests at liverpool/oxford)

Page 4: Forward Inner Module