forward inner module
DESCRIPTION
Forward Inner Module. Bonding. Bonding errors on both sides - swapped bonds Corrected for on link 1 by swapping bonds at chip to fan-in and swapping them back at fan-in to detector - PowerPoint PPT PresentationTRANSCRIPT
Forward Inner Module
Bonding
• Bonding errors on both sides - swapped bonds– Corrected for on link 1 by swapping bonds at chip
to fan-in and swapping them back at fan-in to detector
– Noticed too late for link 0 and every other channel swapped. Also both unbonded detector strips at one end on link 0
– HV bonded via fan-in to front side. Bond wire from fan-in glued to detector back side
Current characteristics
• IV characteristic measured 20C– Consistent with data in database at 150V– High current above 150V, reason not know
• Note: Module now slightly dirty due to treatment (e.g. opto tests at liverpool/oxford)