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25th RD50 Workshop (Bucharest) June 13th, 2014 1 Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona IMB-CNM, Barcelona (Spain) M. Baselga, P. Fernández-Martínez, D. Flores, S. Hidalgo, V. Greco, A. Merlos, D. Quirion RD50 project: Fabrication of 200um thick p and n- type pad detectors with enhanced multi-plication effect Giulio Pellegrini

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RD50 project: Fabrication of 200um thick p and n- type pad detectors with enhanced multi-plication effect. Giulio Pellegrini. M. Baselga , P. Fernández-Martínez , D. Flores, S. Hidalgo, V. Greco, A. Merlos , D. Quirion. IMB-CNM , Barcelona (Spain ). - PowerPoint PPT Presentation

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Page 1: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 1

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

IMB-CNM, Barcelona (Spain)

M. Baselga, P. Fernández-Martínez, D. Flores, S. Hidalgo, V. Greco, A. Merlos, D. Quirion

RD50 project:Fabrication of 200um thick p and n- type

pad detectors with enhanced multi-plication effect

Giulio Pellegrini

Page 2: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 2

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

RD50 Institutes participating:

1. CNM-Barcelona, G. Pellegrini, 2. Liverpool University, Gianluigi Casse, 3. UC Santa Cruz, Hartmut Sadrozinki 4. IFCA Santander, Ivan Vila5. University of Glasgow, Richard Bates, 6. INFN Florence, Mara Bruzzi7. CERN, M. Moll8. Jozef Stefan Institute , G. Kramberger,

Page 3: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 3

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

What is new? New mask designed at CNM with many suggestions

from all the groups. Thickness of the substrates: 200um. Only electron collection. Improve surface isolation (p-stop). Different terminations. Pads with different sizes + Strips and pixel detectors. Diodes for timing applications, TOTEM, AFP and PPS Different test structures to measure the multiplication

layer. Try heavy dopants: Ga.

Page 4: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 4

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

RD50 LGAD New Run. Mask Design

o Pad Detectors with Multiplication Multiplication Area

8 x 8 mm 3 x 3 mm

Termination:* P-Stop + N-Guard Ring* P-Stop + N-Guard Ring with JTE* JTE + P-Stop + N-Guard Ring with JTE

o Pixel Detectors 1 x 1 mm (6x6 Matrix)

o PIN Diodes (for reference) 8 x 8 mm 3 x 3 mm 1 x 1 mm (6x6 Matrix) Top & Bottom circular windows in the metal layer.

Page 5: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 5

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

Segmenteddetectors

Best configurationfor diodes

Simplest process

Page 6: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 6

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

Pin

LGAD

Page 7: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 7

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

RD50 LGAD New Run. Mask Designo Strip Detectors with Multiplication

80 µm pitch 160 µm pitch

DC Strips (standard width) Spaghetti DC Strips XL DC Strips (extended implantation) PIN Strips

80 µm pitch, 50 % Standard, 50 % Spaghetti 160 µm pitch, 50 % Standard, 50 %

Spaghettio Test Structures

SIMS LAL Group Structures INFN Group Structures Electrical and Technological CNM Structures

o FEI4 Matrix (?) 8 x 8 mm Active Area

Page 8: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 8

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

20 µm

32 µm

32 µm

44 µm

80um pitch strips

XL

Page 9: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 9

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

100 µm

112 µm

112 µm

124 µm

160um pitch strips

XL

Page 10: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 10

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

Ultra Fast Silicon Detectors Experiments interested CMS-

TOTEM-ATLAS. Time resolution required 10ps. Designed proposed by Nicoló

Cartiglia. In this mask, the UFSD detectors

will be 1cm2. This is just to prove their functionality.

Final detectors will be larger and may be thinner.

See Nicolo´s Talk.

Slim edgeClose to beam side

Page 11: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 11

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

Active Gallium

Substrate Doping

Active Boron

Active Gallium

Substrate Doping

Active Boron

• Similar Diffusion coefficients• Different Solid Solubility (one order of

magnitude lower in the case of Gallium)

After diffusion

After implantation

Heavy Dopants: Ga

Why multiplication decrease with irradiation? Try to use heavy dopants for the multiplication layer to reduce the initial acceptor removal effect.See Gregor´s talk.

Page 12: IMB-CNM , Barcelona (Spain )

25th RD50 Workshop (Bucharest) June 13th, 2014 12

Centro Nacional de Microelectrónica Instituto de Microelectrónica de Barcelona

Conclusion and future work New mask design ready, we will buy it

next week. Fabrication should start in July. Run due by end of October. Preliminary IV and CV will be done at CNM.

Then the detectors will be diced and distributed between the participating institutes.