IntelliSuite 8 The shortest distance from concept to product

IntelliSuite, IntelliFAB, IntelliMask, MEMaterial, AnisE, RECIPE, SYNPLE, MEMS SoC, Total MEMS solutions, CAD for MEMS and Solutions for the MEMS professional are trademarks of IntelliSense Software Corporation.

All other trademarks are © or ™ of their respective owners.

Errors and Omissions Excepted. This document is subject to frequent changes. IntelliSense Software does not accept liabilities due to errors or omissions in this document.

© IntelliSense Software, 2007

Break open new possibilities in MEMS

A living design environment

Used by MEMS professionals worldwide for design, development and manufacturing of MEMS,

IntelliSuite has firmly established itself as industry’s standard tool.  As such, IntelliSense pro-

vides MEMS companies and individual users with a complete living design environment to manage their MEMS product through its life cycle.

IntelliSuite is a tightly integrated design environment that will link your entire MEMS organization to-gether. Built to scale from a point tool to an organization-wide tool, IntelliSuite unifies various engi-neering and manufacturing tasks into a single living design environment.

Intra Organizational Tools

Packaging Engineer

Device EngineerSystem Architect

Electrical Engineer

Process EngineerProgram Manager

Test Engineer

Manufacturing Engineer

What’s in it for me?

Program Manager

System overview Metrics Yield prediction Cost modeling

360° overview As an engineering manager, IntelliSense provides you all the tools you need to monitor every aspect of the MEMS development. You can explore MEMS development at different granularity — from high-level cost estimates and yield projections to mid-level design analysis studies, low-level process flow or metrology data. Intended for use company-wide, IntelliSuite supplies an effective mechanism to consolidate your broad organizational MEMS knowledge in one repository.

System design — made simpleIntelliSense enables electrical and system engineers to create and simulate complex MEMS models with exceptional ease. Thanks to SYNPLE, MEMS system design is as fundamental as drag-ging and dropping, and wiring the schematic. In addition, EDA Linker™ automatically generates high fidelity models of your devices to fit your favorite Mixed Signal simulator from Cadence, Men-tor, Synopsys or Tanner . How’s that for simple system design?

SystemArchitect

SYNPLEMulti-domain system

simulation and synthesis

EDA LinkerDirect link to

Mixed Signal EDA

System Model ExtractionCreate accurate system models

DeviceDesigner

Parametric Layout Virtual Prototyping Advanced meshing

FEA/BEA analysis BioMEMS/RFMEMS tools System Model Extraction

By design With IntelliSuite, we furnish device designers like you with the comprehensive design exploration tools necessary to follow your unlimited creativity. That’s why IntelliSuite includes SYNPLE and a full suite of FEM/BEM analysis tools that will allow you to design such diverse MEMS as sensors and actuators, RF and optical MEMS, and micro-fluidic devices and biosystems.

Yield a productive cropIf you’re a process/manufacturing engineer, our design for manufacturing (DFM) tools grant you the capability to implement your first-time right designs. The across-the-board selection of IntelliSense process tools include virtual prototyping and 3D traveler visualization, thin film mate-rial characterization and optimization tools and databases, wet and dry-etch simulators, and Monte Carlo tools for yield prediction. So, whatever your process engineering goals maybe, our process-specific tools will help you achieve them.

ProcessEngineer

Traveller 3D visualizationFoundry templates

Material databasesProcess optimization

Wet Etch Simulation

Dry Etch (RIE/Bosch) Simulation

Parmetric teststructures

Six SigmaYield prediction

PackageEngineer

Package creation toolsScripting tools

Package analysis tools

Package modeling High frequency modeling Board level modeling

Wrap it up! As a packaging engineer, IntelliSense offers you tools for thermal, mechanical and high-frequency modeling of your devices. Parametric scripting capabilities allow you to effortlessly cre-ate a range of packages, such as SOICs, DIPs, QFPs etc. What’s more, wafer-level encapsulation and related stress analyses may be performed with ease. As a result, you can wrap up your projects quickly and efficiently!

Ace the testWorking together, IntelliSuite and SYNPLE give test engineers a straightforward, multi-tool device for creating parametric test structures and design of experiments (DoE) during the layout process. What’s more, our analysis and system simulation tools allow you to perform a vast subset of MIL-STD (750/883), JEDEC (JESD22) and Telcordia (Belcore) tests in software before the actual fabrica-tion. For success in your next test, turn to IntelliSuite!

TestEngineer

Parametric test structuresTest library

JEDEC/Telcordia/MIL-STD 750/883Test standard support

Rapid test simulationsSoftware validation

Open standards based exchange

Physical layout GDS, DXF, CIF, GERBER, RS-247, EMK, HOLES

Structural and 3D IGES, SAT, VRML, GEOM, DXF

Analysis and mesh structure UNV, PAT, CDB, SAT (Ansoft, Ansys, ABAQUS, Patran, Nastran, Simulia)

System and circuit level VHDL, PSPICE, HSPICE, SIMETRIX, SIMULINK (MEX), TOUCHSTONE

Result files ASCII, CSV (Excel), Touchstone, PLT (Tecplot)

IntelliSuite provides compatibility with many of the existing tools in your toolbox. At the physical layout level it provides seamless data exchange with L-Edit, Virtuoso, AutoCAD and other popular layout editors; at the solid model level you can exchange data with any SAT or IGES based tool such as SolidWorks, CATIA, ProE. At the analysis level you can exchange data with Abaqus, Ansys, Ansoft, Comsol, Nastran or Patran; at a mixed signal or system level you can export directly to ADS, Ansoft, Cadence, Mentor, Mathworks Simulink, Synopsys or Tanner based workflows. Addi-tionally, all result files can be visualized in any Tecplot compatible tool

Fabrication databases & Process simulation

MEMaterial®Thin film knowledge base and process optimization tool

MEMaterial is the most comprehensive thin film database available today. Featuring over 70+ processes, MEMaterial links the material properties of thin films to the machine parameters.

Use MEMaterial to• Obtain accurate material properties• Optimize your processes• Perform NxN dimensional multi-variate analyses• Create an organization wide process knowledge repository• Data-mining of process data into information

3

4

2

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1. Capture. Create proprietary databases of material information (or use material information from 70+ thin !lm processes).

2. Analyze. MEMaterial auto-matically creates information from data using NxN dimen-sion multi-variate estimation routines.

3. Explore. MEMaterial lets you explore material proper-ties as a function of machine settings.

4. Visualize. Advanced visuali-zation routines allow you to quickly visualize any material property as a function of ma-chine settings.

Thin !lm properties of Si3N4 (PECVD, using Argon as a carrier gas). The material properties (Stress, Density, CTE, Youngs modu-lus, Poisson’s ratio and Refractive Index) are shown as a function of machine parameter (Temperature, pressure, total "ow rate, RF power, partial pressure of gases).

IntelliFAB™Process traveller based virtual prototyping

IntelliFAB™ allows you to create and debug your process flow and your mask set before you enter the clean room. It allows you to make virtual prototypes to save costly fabrication mistakes.

Use IntelliFAB to• Debug your process traveller• Visualize your process flow• Create accurate device models• Automatically mesh your devices• Share process flows across the organization• Capture process knowledge• Create devices based on foundry templates

Process traveller in IntelliFAB is linked to actual machine settings (above). IntelliFAB automatically generates 3D views of the device at any process step allowing you to debug your mask and proc-ess design.

AnisE®AnisE is the industry standard for simulating wet anisotropic silicon etching.

AnisE makes it extremely easy to accurately simulate etch behavior. Import your etch and doping masks, choose your wafer orientation and your process parameters, et voila, watch the etch progress on your screen.

Use AnisE to• Simulate KOH/TMAH/Dry etching of <100> and <110> wafers• Perform corner compensation and process deviation studies• Simulate multi-dope, multi-etch processes• Test your designs before entering the fab

Above: Corner compensation study. Evolution of three different corner compensation shapes in 100 Silicon

Below: Bulk micromachined accelerometer. Double sided etching of silicon with multiple doping steps.

RECIPE™RECIPE is industry’s first tool for RIE/ICP and Bosch process simulation

With RECIPE you can layout your microstructure and automatically simulate isotropic, RIE, ICP (Bosch process) etching or any combination of the three processes.

Use RECIPE to• Predict sidewall scalloping, roughness, periodicity and sidewall angle• Predict final dimensions and shape • Predict DRIE artifacts such as etch lag, etch termination (pinch-off)• Predict plate release• Custom tailor etch features such as bowl and stem etches to improve sidewall coverage• Perform multi-etch simulation such as an isotropic etch followed by DRIE followed by RIE.

Experimental veri!cation. A RECIPE etch pro!le (right) is compared with an SEM. A 5µm trench was sequentially etched using a etch/polymerization con!guration of 7s/7s, 9s/7s and 5s/7s, each for 5 minutes

Progression of an etch featuring three processes: 1. Isotropic RIE to create a wine bowl 2. Bosch etch (DRIE) to create the wine stem and 3 Isotropic RIE to smooth the scalloping and improve sidewall coverage. Inset shows the detail of the sidewall scalloping.

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MEMS Cost ModelThe MEMS Cost Model enables you to understand the impact of process and foundry choices on the final cost of your product.

The MEMS Cost Model is designed to serve the needs of anyone interested in understanding the manufacturing costs of MEMS devices.

Do you:

• Develop MEMS devices and want to know what it will cost to make the device?• Buy MEMS devices and want to understand the manufacturing costs• Invest in MEMS and want to understand start-up and production costs?• Work at a MEMS fabrication facility and want to benchmark what you are doing?

If you have answered yes to any of the questions above, then this product is for you.

Physical modeling

IntelliMaskIntelliMask is a powerful, yet easy to use mask editor developed specifically for the MEMS community.

IntelliMask offers MEMS specific features not found in standard elec-tronics or mechanical layout tools. Take designs from process definition through mask layout to device and system analysis within a single unified design environment.

Use IntelliMask to

• Create complex MEMS curvilinear and non-Manhattan masks with ease• Geometric boolean operations• Create masks with cell based hierarchy• Import/Export GDS/DXF files• Automate mask creation through scripting or use the parametric element library to quickly create typi-cal MEMS structures• Direct link to process modeling

Built in scripting support allows you to automate the creation of complex geometries without breaking a sweat.

Built in support for arcs, ellipses, do-nuts and freeform splines makes it easy to create curvilinear structures common in MEMS.

Layouts courtesy Matthew Last, BSAC

IntelliMask ProIntelliMask Pro is a production ready mask making environment.

IntelliMask Pro is available as a paid upgrade to existing IntelliMask/IntelliSuite users. IntelliMask pro gives you additional production ready capa-bilities such as

• Import and export of additional for-mats (CIF, Gerber, RS 274, Electromask, PostScript)• Ability to perform complex Boolean operations between entire layers or cells• Expanded text support, use any TrueType™ font in your masks. Ex-panded language support, insert Chi-nese, Japanese, Greek or Indic charac-ters into your masks• Full layer transparency support• Workgroup features such as hierar-chical shared libraries

PRO

Fast hierarchical support for deeply nested cells. Handle large masks without any performance penalties!

Combined IC and MEMS layout in one package. Support for layer transparency so that you can see through layers.

3D Builder3D Builder is a powerful tool to create and refine all-hex structured or unstructured grids.

IntelliSuite gives you as much control over the device meshing process as you need. On one hand, automatic meshing tools can generate near-optimal meshes while, on the other, interactive tools allow you to further refine the meshes to your hearts' content. Think of it as the Tiptronic™ of meshing tools — enabling you to switch from automatic to manual gears.

With 3D Builder you can:

• Auto-mesh complex MEMS devices• Import/Export grids in a variety of for-mats (ABAQUS, ANSYS, PATRAN etc)• Automatically go from mask layout (GDS/DXF) to meshed 3D structures in a single click• Work with Polar or rectilinear grids• Use popular refinement techniques such as spider webs, corner frame meshes or zippered meshes

3D Builder allows you to work in polar or rectilinear coordinates to help you quickly generate all-hex 3d meshes. Sidewall angles, conformal depositions, mesh matching between different layers can be handled automatically.

3D Builder allows you to go from a multi-layer mask !le to a meshed all-hex 3D structure in one click. Intelligent mesh re!nement tools allow you to further optimize your meshes.

Scripting and parametric element library

IntelliSuite 8 introduces a powerful scripting based technology to automate layout and to quickly create parametric device models.

In addition, IntelliSuite 8 ships with a wide range of parametric elements ranging from active elements (such as linear and rotary comb drives, actuators), passive elements (shuttle masses, serpentines, crab leg springs etc), test structures (electrical and me-chanical tests), stress test structures (bent beams, vernier frames), and packaging elements (DIP, SOIC, SIP, QFP).

Analysis tools

Fully coupled ThermoElectroMagneto-Mechanical analysisThe Thermo-Electro-Magneto-Mechanical (TEMM) analysis module allows you to perform fully coupled thermal, electrical and electrostatic, magnetostatic and mechanical analysis.

TEMM allows you to perform fully coupled static, dy-namic, harmonic, transient, contact and post-contact analyses on linear or non-linear systems. Use TEMM for analyzing a wide range of devices based on electro-static, thermal, electromagnetic or electrothermal principles.

Based on a custom version of the leading non-linear FEM solver from ABAQUS, TEMM allows you to tackle large highly non-linear problems. TEMM incorporates many custom MEMS algorithms that are unmatched by other tools.

• Full dynamics capability (all other tools are limited to quasi-static approximations)• Simulation of electrostatic, electromagnetic, thermal, electrothermal, piezo based sensors and actuators• Exposed Face Mesh algorithms: No need to mesh the air gaps. Decouple mechanical and electrical meshes to solve large problems• Optimized Squeeze Film Damping module for fluid structure interaction (15X faster than typical Navier-Stokes based solvers).

Rotary ring gyro Rate/Coriolis analysis

Draper vibratory gyroElectrostatic drive

Lockheed inertial deviceSqueeze !lm analysis

Raytheon/TI RF switchNon-linear contact analysis

HitachiRF Tunable Filter

NASAAdaptive optics

Corning3D Optical cross connect

NASARadiation detectors

Package and board level analyses

IntelliSuite simplifies the packaging of MEMS devices, reducing the cost of pack-aging development. The tools you need to perform die level and board level packaging analyses come standard with IntelliSuite.

Packaging related stresses, CTE mis-matches, shock effects, effects of packag-ing pressure on device damping, parasitic effects and high frequency electromagnetic effects can all be mod-eled with ease.

IntelliSuite solves most complex packag-ing problems involving linear and non-linear, static, frequency, and dynamic be-havior. Stress, strain and warpage calcula-tions, thermal-electrical (joule heating), vibrational analysis including shock test-ing, damping analysis can all be per-formed with ease

This allows you to perform JEDEC, MIL STD, or Belcore tests on packaged devices before costly device fabrication.

Client Agilent IncApplication Detector chipAnalysis Package Thermo-mechanical analysis

Temperature distribution Stress contours Final device

Warpage due to packaging

Client Corning IncApplication Fiber optic switchingAnalysis Full board level packaging analysis

Fiber block integration

256x256 micro-mirror array

Board deformation Deflection of the mirrorsFinal Boards with warpage reduction mechanism

Piezoelectric and piezoresistive analysis

IntelliSuite ships with the most sophisti-cated piezoelectric and piezoresistive modeling capabilities in the industry. Our PiezoMEMS™ module represents a complete solution for MEMS designers considering piezo-sensing or piezo-actuation mechanisms.

If you are designing piezo-based sensors and transducers, or investigating piezo-acoustic coupling, you will find our de-sign tools invaluable and unsurpassed. Considering piezo actuation for your MEMS device?

IntelliSuite can handle your needs such as time varying loading, floating con-ductors, full thermo-electromechanical modeling and high frequency analysis.

Our advanced coupling algorithms allow you to go well beyond other FE tools to investigate second order coupling such as temperature dependent piezo prop-erties, hysteresis modeling and piezore-sistive joule heating.

Piezoresistive sensors • Piezoelectric sensors and actuators • Piezo pumps •Piezoresistive trimming • Rejustors • High frequency Piezo devices • Piezoacoustic coupling • Bulk Acoustic

Wave devices • Field Bulk Acoustic Resonators • Energy Scavenging

IntelliSuite allows you to model piezoresistive sensors and heating elements with ease. Our specialized tools go be-yond other FEM tools on the market allowing you to accurately determine second order effects such as tem-perature coef!cients, hysteresis, temperature dependent piezo properties.

Piezoelectric devices such as sensors, resonators and actuators are quickly maturing. IntelliSuite allows you to model a wide range of piezoelectric devices rang-ing from inertial sensors to piezo-acoustic coupled devices such as BAW/FBAR/SMR devices.

Microfluidics and BioMEMS analysis

We created a full 3D Navier-Stokes solver optimized for microfluidic applications from the ground up. Simultaneously, we went way beyond the existing code bases by adding support for electroki-netic phenomena, Red-Ox reactions, ac-ids, bases, ampholytes and fluid struc-ture interaction.

An optimized ElectroWetting on Dielectric (EWOD) engine allows you to quickly simulate droplet transport, merging and splitting

We then added advanced visualization algorithms to look at cross-sectional profiles, velocity vectors, streamlines and transient results.

Our code base is not only faster at solv-ing microfludics problems but is the only MEMS tool for problems from ranging from high frequency dielectrophoresis to isoelectric focusing to electro-osmotically enhanced flow.

Discover why top BioMEMS companies are choosing the IntelliSense solution.

Micro-mixing in a valveConcentration gradient evolution

Flow mixing Y combiner

Fluid Structure InteractionInlet flow - membrane interaction

Inlet

Membrane

Flow separation device

Free surface flowSlide coater

Electrokinetics Multiplex focusing

Electro-osmotic driven flow Electrohydrodynamics for cooling

Electrophoresis/DielectrophoresisHigh Frequency Waste separation

Microfluidics• Electrokinetics • Transport stochiometry • Heat transfer • Electro-Wetting on Dielectric (EWOD) • Digital droplet microfluidics• Free Surface Flow • Fluid Structure Interaction • Electrochemistry • Micro-mixing • Electrophoresis •

Dielectrophoresis • Capillary flow and electro-separation • Electro-osmosis • Electro-hydrodynamics • Flow cyclometry • Micro-pumps and valves

High frequency electromagnetic analysis

The IntelliSuite electromagnetic analysis module is specifically designed to address the needs of reliable RF MEMS and micro-wave MEMS by providing fast, accurate, cost-effective solutions for high frequency electromagnetic phenomena.

The Electromagnetic module is the only fully integrated high frequency solver available for MEMS simulation. Traditional high frequency tools are designed for pla-nar or quasi-planar structures, not for 3D deformable structures common in RFMEMS. In fact, IntelliSuite is the only tool on the market that allows you to perform fully coupled Thermo-Electro-Mechanical & Fullwave ElectroMagnetic analyses. You can easily extract impedance and s-parameters as a function of the structure deformation or contact.

Our FullWave ElectroMagnetic engine over-comes some of the common problems with other engines such as inability to handle high aspect ratios, non-planar structures, and dielectric discontinuities.

Create and model complex geometries such as vias and through feeds with ease.

IntelliSuite is the only tool that allows you to perform coupled Thermo-Electro-Mechanical & Full Wave ElectroMagnetic analyses— this is particularly useful in design-ing deformable RFMEMS such as switches, tunable capacitors and varactors

System simulation and synthesis tools

System model extractor (SME)

IntelliSense introduces SME for dramati-cally reducing the computational time to perform accurate dynamic analysis of MEMS. Based upon sub-space model reduction and energy based algorithms, very large non-linear thermo-electromechanical, electrothermal, pie-zoelectric or piezoresistive FEM models can be reduced into computationally efficient behavioral models.

These behavioral models fully capture the complex non-linear dynamics inher-ent in MEMS due to electrostatic forces, electrothermal and residual stresses, squeeze film damping, and multiple mechanical de-grees of freedom.

IntelliSuite is the only tool that gives you the freedom to create arbitrary degree of freedom compact models. These n-DOF 3D models fully capture all of the har-monic modes of the MEMS enabling you to quickly develop readout or control electronics.

SME allows you to create N-DOF system models that accurately capture the dynamic response of MEMS 100-1000x faster than equivalent FEA simulations. The response of a clamped beam driven at 50 kHz (above) and at 3 MHz (left) accurately captures the beam motion.

SYNPLE — system simulation

Developed by IntelliSense to answer the unique needs of the microsystem and nanosystem community, SYNPLE is a system-level simulator for multi-scale (macro, micro, nano) phenomenon simula-tions. As a MEMS design professional, you always seek new ways to realize your designs and, bring them to market faster and efficiently. With SYNPLE, you can. This revolutionary tool will enable you to work in multiple domains — simply and without limits.

While SYNPLE’s range is wide enough to create complex simulations, its user inter-face is exactly what the name implies — simple!

To further your capabilities, IntelliSense ships SYNPLE with an extensive line of comprehensive element libraries for your use. These include analog, digital, mixed-signal, micromechanics, semi-conductor, MEMS and biological modules. And if these aren’t enough, SYNPLE’s expandable archi-tecture will enable you to expand the li-braries by creating customized elements of your own.

AC analysis of a MEMS tunable bandpass !lter assembled from basic elements such as beams, anchors, plates and comb drives. The phase and magnitude plots are shown.

SYNPLE ships with many real world MEMS compound elements that enable you to quickly test your concepts. One such element is a 6 DOF inertial device, ideal for modeling accelerometers and gyros. Shown here is the classic startup response of a vibratory gyro.

EDA Linker: Multi-format Data Export

EDA Linker allows you to incorporate IntelliSuite directly into your EDA environ-ment. Whether you are using a Cadence, Mentor, Synopsys or Tanner environment, or a mixed tool environment IntelliSuite will fit right in.

EDA Linker allows you to co-simulate your micro-devices along with the electronics in

your favorite mixed signal or system level environment.

With EDA Linker you can:

• Co-simulate electronics and MEMS

• Link IntelliSuite with popular EDA tools from Cadence, Mentor, Mathworks, Synopsys or Tanner

• Create accurate N-DOF mixed-signal models of 3D MEMS devices in PSPICE, HSPICE, VHDL, Simulink (MEX)

• Accurately capture non-linear dynamics of MEMS devices including all relevant high order modes

New in version 8.2

ThermoElectroMagneto-Mechanical (TEMM)

module

ElectroWetting on Dielectric (EWOD) Digital

Microfluidics

VisualEASE™Advanced 3D Visualizer

HelpCenterHelp at your fingertips

Detailed App Notes

Enhanced FullWave EMagNow with SAT, Touchstone and

Ansoft compatibility

NanoScale and Carbon Nanotube module

NEMS & CARBON NANOTUBE (CNT) MODULE

IntelliSuite introduces with the world’s first NEMS simulator allowing you to simulate nanoscale structures in conjunction with micro-scale features. The NEMS module can be used to perform thermo-electro-mechanical simula-tions on a nanoscale. Among other applications, the NEMS module can be used for simulating nanoscale resonators, CNT based sensors and Carbon nanowires (CNWs).

This is particularly useful in simulating the emerging class of carbon nanotube (CNT) based sensors which combine micro-scale structures with nanoscale CNTs. Users can perform piezoresitive and electro-thermal-stress simulations to understand the CNT response to thermoelectromechanical loading.

THERMO-ELECTRO-MAGNETO-MECHANICAL MODULE

In another breakthrough first to market feature, IntelliSuite extends its simu-lation capabilities to perform fully coupled linear and non-linear Thermal-ElectroStatic-ElectroMagnetic-Mechanical simulations. This module can be used to simulate static and frequency responses of magnetic or electro-magnetically actuated MEMS devices. Lorentz force driven actuators such as scanning mirrors, switches and mechanisms can be simulated with ease.

COUPLED ELECTROSTATIC-MECHANICAL AND HIGH FREQUENCY (RF) ELECTROMAGNETICS

IntelliSuite ships with a new full 3D FEM based ElectroMagnetics engine optimized for RF MEMS simulation. The Electromagnetics engine is cou-pled with ThermoElectroMechnaical (TEM) analysis capabilities. FullWave ElectroMagnetic analysis of electro-mechanically deformed structures can be seamlessly simulated for the first time within a single software.

In addition, IntelliSuite ships with several other first to market features that allow you to explore phenomenon such as dynamic closure of switches including simulating switch bounce.

ELECTROWETTING ON DIELECTRIC (EWOD) BASED DIGITAL MICROFLUIDICS

IntelliSuite extends its popular microfluidics module to allow users to investigate droplet manipulation and transport. Digital microfluidic devices based on droplet merging and splitting can be easily simulated. In addition, users can study the effect of applied electric fields on the droplet shape and contact angle. Droplet transport simulations can be performed by defining multi-ple electrodes and applying time varying potentials.

REAL WORLD MEMS READOUT AND CONTROL CIRCUITS

Synple now ships with many real world circuits that are used by MEMS electrical engineers. Detailed design schematics are provided for circuits such as high-order sigma delta modulators, PLLs etc so that you can quickly design MEMS at the system level, allowing you to identify impor-tant system level performance issues early in the game.

IntelliSense around the world

For direct sales in North and South America or to reach our corporate HQ contact:

IntelliSense USA • Tel: +1 781 933 8098 sales@intellisense.com

EUROPE

Austria

UNIDOSTTel: +43 664 3133223Fax: +43 1 9716164E-mail: info@unidost.com

Belgium, The Netherlands, Denmark, Sweden, Norway, Denmark, Italy and Spain

PhoenixBV, EnschedePhone: +31 (0)53 483 64 60E-mail: info@phoenixbv.com

France

MMSolutions, ParisTel: +33 1 42965379Guy Debruyne <guy.debruyne@club-internet.fr>

Germany

MMSolutions, GermanyTel: +49 6340 9191 34Kai Dehrmann <kai@mmsolutions.com>

Israel

WaldyTech Ltd.Tel: + 972 9 9573649Fax: +972 9 9576231E-mail: walter_d@waldytech.com

Turkey

UNIDOST, IstanbulTel: +90 216 4141958Fax: +90 216 3368923E-mail: info@unidost.com

UNIVERSITY & EDUCATIONAL SALES

Europractice Software ServiceRutherford Appleton LabsTel: +44 (0)1235 44 5327 E-mail: enquiries@msc.rl.ac.uk

UK

MMSolutions, UKUnited KingdomTel: +44 1628 488649Email: info@mmsolutions.com

ASIA + AMERICAS

China

IntelliSense ChinaTel: +86 25-83478765Fax: +86 25-8471 9905 Web: www.intellisense.com.cnE-mail:china@intellisense.com

India

BigTec, BangaloreTel: +91 80 4107 0138E-mail: guru@bigtec.org

Japan

ADTECH, TokyoTel: +81-3-5464-2971E-mail: info@ad-tech.co.jp

Korea

UIT Solutions Inc, SeoulTel: + 82-2-587-2303E-mail: uitinc@uitsolutions.com

Malaysia

Trans-Dist Tel: + 60 6(03) 8888-9908Fax: + 60 6(03) 8888-9909E-mail: mandy@transdist..com

Singapore

E•Mation Technologies, SingaporeTel: +65-68586882E-mail:emation@singnet.com.sg

Taiwan

Avant Technology, HsinchuTel: +886-3-5160188E-mail: sales@avant.com.tw

North and South America including the United States

IntelliSense Head Quarters, BostonTel: +1 781 933 8098E-mail: sales@intellisense.com

NOTES

NOTES

Total MEMS Solutions

IntelliSense ignited the MEMS industry in the early 1990s with its IntelliSuite® family of innovative CAD/EDA tools — and is now the leading innovator and supplier of de-sign and development solutions for the MEMS profes-sional. With users in more than 30 countries, IntelliSense offers software tools and custom design, consulting and market research services to universities, blue-chip com-panies and start-ups worldwide.

What's more, IntelliSense has formed strong affiliations with dozens of leading MEMS foundries and research institutes worldwide, which allow us to prototype and transfer MEMS-based components into production at the lowest cost. As a fabless MEMS com-pany, IntelliSense also offers design, IP licensing and consulting services.

IntelliSense

www.intellisense.com

Contact us: sales@intellisense.com or by phone at +1 781 933 8098 or Fax: +1 781 933 8099