jean-philippe tock (te-msc) on behalf of the smacc project

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Page 1: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project
Page 2: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

SMACC Seventeenth report[20 min]

24/01/2014

Jean-Philippe Tock (TE-MSC)

On behalf of the SMACC project

Page 3: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

Activities since last LSC (10/01/2014) Arc splices installation

• By Activities• By sectors

SIT DFBA (See next presentation)

Dashboards

Specials Quadrupole diodes Dipole diodes

Activities for the next 2 weeks

Conclusions

Page 4: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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Sector 56 : Final leak test and surface work on DFBAK SHM Investigation on dipole diodes

Sector 67 : Pressure test planned for 15.01.2014 Leak tests, ElQA

Sector 78 Progress on M leak tests and closure of interconnections Disconnect DFBAO SHM (Priority to be defined)

Sector 81 Complete the M lines rewelding M leak tests

Sector 12 Complete electrical insulation Progress on quad diodes consolidation

Sector 23 Cu machining Installation of shunts Start electrical insulation

Sector 34 Cu machining Installation of shunts

Sector 45 M lines opening & ElQC in the zone of He spill test, temporary reclosure of ICs

SMACC Main activities for the last 2 weeks

OK, 8 remain due to NCs

> Half done but on hold

OK, 3 remains due to NCs

OK, 6 remain due to NCs

>25% done

On-going, Splices condemned by spill test were measured, reclosure completed this week

Pressure tested successfully, See later

SHM disconnecred and at the surface

> 90% leak tested, > 80% reclosed

> 75 % tested

On-going, almost half done

From last LSC (10.01.2014)

All is reclosed but the IC with DFBAK, Good progress, see next presentationInsulation vacuum leak tested on >80% of S56

OK, 14 remain due to NCs

>50% done

Page 5: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SEQUENCE AND STATUS

OK to open

8 sectors

Open ICs

8 sectors

Install DN200

100 %

Open M sleeves

> 7.4 sectors

ElQC(old splices)

> 7 sectors

Undo / Redo splices

≈ 6.5 sectors

ElQC(new splices)

Machine Cu

> 6.5 sectors

ElQCafter Cu mach.

≈ 6.5 sectors

Install shunts

> 6.3 sectors

ElQCafter shunt

> 6 sectors

Insulate splices

≈ 5.2 sectors

Weld M

> 4.2 sectors

Leak test M

> 3.2 sectors

Close IC

≈ 3 sectors

Final LT

≈ 1.9 sector

Consolidate Q diodes

≈ 4.6 sectors

Stopped,Will slightly impact in 2 weeks

Cancelled

Completed

Completed

Completed

Page 6: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Progress report by activity

Courtesy H Prin

Desoldering / Resoldering: Completed in about 6.5 sectors equivalent

Desoldering in 23 is completed and well advanced in 34

54 ICs had not almost no splices to be redone (1 of) For geometrical reason

Still enough ICs available for Cu machining

9777

Page 7: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Progress report by activity

Shunts are installed in ≈ 6.4 sectors-eq (1354 ICs ≈ 80%)

• Almost completed in 23• Work in sectors 23-34 (No

infrastructure at P3)• Slightly > 1 week ahead of schedule• Mind the last X% effect

Shunt weekly installation rate (4 weeks sliding average)

Page 8: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Progress report by activity

Insulation box: Installed in 5.2 sectors equivalent

Courtesy H Prin / G Maury

• > 80 injected in W3 and in W4 • > 50 ICs are ready for injection• Under recovery

(< 1 week behind baseline)• Only 7 IC left in 5 first sectors

(<1 %)• Buffer of >3 weeks wrt welding

92

Page 9: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Progress report by activity

M Welding : ≈ 872 ICs welded, > 4 sec-eq:

Routinely 12 ICs/day Work concentrated in 1 sector 4 leaks were found end of 2013 (2 in

S78 and 2 in S81)Investigations are still on-going (2), To be followed

As presented LSC 4.10.2013

11 weeks @ 34

18 weeks @ 51

37 ICS behind forecast(Eq to 3 days ;Recovered in a month)

Page 10: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Progress report by activity

M sleeves leak testing : (780 ICs) are leak tested (> 3.5 sec-eq)

Following the M lines About 1 month behind schedule Should recover as for the M welding

Courtesy P Cruikshank / L Mourier

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SMACC Progress report by activity

Reclosure of interconnections : Almost 3 sec equivalent are reclosed

Started closing 81 about a week ahead of baseline Reclosing temporarily IC in 45 for He Spill test Only 15 IC (About 1 day) behind schedule globally

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SMACC Progress report by activity

Final leak test: ≈ 1.7 sec equivalent completely validated

3 weeks to have results after repumping 4 subsectors under test in 78, 5th one next week (> 1/3) First sector to be released soon in 81 (Today or beginning of next week) About 5 weeks behind schedule; limited by release rate

Page 13: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

SMACC Sector 67

Leak test at 10 bar (half design pressure) QRL, LSS cryostats, Arc beam vacuum : OK Magnet cryostat and DFBAs:

New leak on C’K circuit (A19R6) at 10 bar, recloses at 1 barLongitudinal localisation and repair with the other NCs

Demonstrates the interest of the “0.5 * design pressure leak test” Dixit P Cruikshank

Purge is on-goingTo come:

ElQA Flushing ElQA

Campaign to fix NCs (leaks, thermometer, possible short circuits in diodes, ?) beginning of March 14

Courtesy P Cruikshank

Page 14: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Progress report by sector

Main activities are : Work on NCs (Not priority: DFBAO)

1 NC blocks the W leak test of usually 16 ICs Leak test of M lines Closure of interconnections Leak test on insulation vacuum

Courtesy M Pojer

Page 15: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Progress report by sector

Main activities are : Leak test of M lines Reclosure of IC

Main activity is : The welding of M lines

Page 16: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Progress report by sector

Main activities are : Installation of electrical insulation Work on overheated splices

(More info later) Preparation for Q diodes

consolidation

Main activities are : Almost all old present splices have

been measured Splices redoing Cu machining Shunt installation

Page 17: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Sector 45 He Spill test

W4 (end) : Temporary relosure of W-bellows on 26 Ics (On-going)Preparation of test (TE-CRG)

W5 : Half of sector (L5) not accessible for AUG testsW6 : He spill test during the nights (Access restrictions)

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SMACC Dashboards

Opening is completed Shunting is slightly ahead on schedule The installation of insulation boxes is recovering Welding rate is more than required to recover baseline schedule Reclosure: to increase, next week will be a good benchmark in 81 Insulation vacuum leak test : Limited by release rate

Page 19: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

SMACC summary status Updated 24-Jan-14

19-Apr-13 212 13-May-13 17-Jun-13 211 19-Jul-13 05-Jul-13 211 08-Aug-13 19-Jul-13 211 15-Aug-13 30-Aug-13 211 27-Sep-13 17-Sep-13 179 25-Oct-13-11 212 -6 -54 212 -41474 -58 212 -41494 4 212 -41501 -10 212 8 212

08-Apr-13 100% 07-May-13 24-Apr-13 100% 08-May-13 100% 23-Jul-13 100% 20-Aug-13 100% 25-Sep-13 84%

16-May-13 211 06-Jun-13 22-Jul-13 211 23-Aug-13 13-Aug-13 211 17-Sep-13 27-Aug-13 211 24-Sep-13 30-Sep-13 211 27-Oct-13 15-Oct-13 211 22-Nov-13-20 211 10 -31 211 60 8 211 48 5 211 51 -27 211 22 7 211 11

26-Apr-13 100% 16-Jun-13 21-Jun-13 100% 22-Oct-13 21-Aug-13 100% 04-Nov-13 01-Sep-13 100% 14-Nov-13 03-Sep-13 100% 18-Nov-13 22-Oct-13 100% 03-Dec-13

07-Jun-13 212 27-Jun-13 26-Aug-13 211 30-Sep-13 18-Sep-13 211 22-Oct-13 02-Oct-13 194 29-Oct-13 28-Oct-13 181 22-Nov-13 12-Nov-13 0 20-Dec-13-24 212 12 -3 212 -41547 33 212 -41569 44 212 -41576 29 212 -41600 -41590 212 -41628

14-May-13 100% 09-Jul-13 23-Aug-13 100% 21-Oct-13 100% 15-Nov-13 92% 26-Nov-13 85% 0%

28-Jun-13 212 18-Jul-13 01-Oct-13 211 04-Nov-13 23-Oct-13 206 26-Nov-13 06-Nov-13 163 03-Dec-13 27-Jan-14 21 21-Feb-14 11-Feb-14 0 21-Mar-14-38 212 8 -11 212 -41582 34 212 -41604 29 212 -41611 -7 212 -41691 -41681 212 -41719

21-May-13 100% 26-Jul-13 20-Sep-13 100% 26-Nov-13 97% 05-Dec-13 77% 20-Jan-14 10% 0%

19-Jul-13 212 08-Aug-13 05-Nov-13 211 09-Dec-13 27-Nov-13 48 14-Jan-14 11-Dec-13 0 21-Jan-14 24-Feb-14 0 21-Mar-14 11-Mar-14 0 22-Apr-14-53 212 21 -11 212 -41617 55 212 -41653 -41619 212 -41660 -41694 212 -41719 -41709 212 -41751

27-May-13 100% 29-Aug-13 25-Oct-13 100% 21-Jan-14 23% 0% 0% 0%

09-Aug-13 212 29-Aug-13 10-Dec-13 198 27-Jan-14 20-Jan-14 0 21-Feb-14 31-Jan-14 0 27-Feb-14 24-Mar-14 0 22-Apr-14 08-Apr-14 0 21-May-14-67 212 19 -25 212 -41666 -41659 212 -41691 -41670 212 -41697 -41722 212 -41751 -41737 212 -41780

03-Jun-13 100% 17-Sep-13 15-Nov-13 93% 0% 0% 0% 0%30-Jul-0025-Nov-13 212 13-Dec-13 29-Jan-14 101 04-Mar-14 24-Feb-14 0 28-Mar-14 07-Mar-14 0 03-Apr-14 24-Apr-14 0 22-May-14 07-May-14 0 20-Jun-14

-188 212 -49 -48 212 -41702 -41694 212 -41726 -41705 212 -41732 -41753 212 -41781 -41766 212 -4181021-May-13 100% 25-Oct-13 12-Dec-13 48% 0% 0% 0% 0%

06-Jan-14 212 24-Jan-14 05-Mar-14 0 08-Apr-14 31-Mar-14 0 07-May-14 11-Apr-14 0 13-May-14 22-May-14 0 20-Jun-14 06-Jun-14 0 18-Jul-14-255 212 -53 -41703 212 -41737 -41729 212 -41766 -41740 212 -41772 -41781 212 -41810 -41796 212 -41838

26-Apr-13 100% 02-Dec-13 0% 0% 0% 0% 0%

19-Apr-13 1695 24-Jan-14 17-Jun-13 1354 08-Apr-14 05-Jul-13 887 07-May-14 19-Jul-13 779 13-May-14 30-Aug-13 624 20-Jun-14 17-Sep-13 390 18-Jul-14-11 1695 -53 -54 1695 -41737 -58 1695 -41766 4 1695 -41772 -10 1695 -41810 8 1695 -41838

08-Apr-13 100% 02-Dec-13 24-Apr-13 80% 08-May-13 52% 23-Jul-13 46% 20-Aug-13 37% 25-Sep-13 23%

S34

S45

LHC

S67

S78

S81

S12

S23

ICs Opening

S56

Sleeves Welding M lines Leak Test ICs closure Ins Vac Leak testShunts Installation

Completed

Completed

New

New

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SMACC Progress report SIT

SIT All cryomagnets are reconnected Team members are partially reinforcing the train and the DFBA activities Activities linked to NC and overheated splices Intervention on triplet braids to start end of January (See next slide). Discussions with RP (should be OK).

Courtesy N Bourcey, S Le Naour

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SMACC Progress report SIT : Interventions on triplets braid

Consolidation of triplet braids

To be confirmed by CRG

By order of priority:1. Q1R1/Q1L5: Install braids2. Q1L1/Q1R5: Remove braids3. Q1L2/Q1L8: Remove braids

Q1R2/Q1R8: Install braids4. D1L2/D1L8: Remove braids on DFBX side

D1R2/D1R8: Remove braids on arc side

Present status : 1 was done in 2009 2 and 3 are planned within SMACC during LS1

Similar to previous interventions but without thermometers 4 will only be done if resources available and no impact on schedule

(consider not done during LS1)

Page 22: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Dashboards

Baseline: 66.5 % (62.4 %)Completed: 64.4 % (58.8 %)Delay 7 (9) days

Baseline: 67.8 % (66.8 %)Completed: 63.9 % (60.3 %)Delay 24 (27) days

Decreasing delay

Delay stable

Arc splices: Rates are stableAll activities are still on-goingTrend should remain in the next 1-2 monthsMain delay is in S12

DFBA: See next presentation

Preliminary

Page 23: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Dashboards

Progress:Baseline: 67.8% (64.4 %)Completed: 63.7% (58.4 %)

Delay 15 (16) days

Stable ; Δbaseline >≈ Δcompleted

Page 24: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Quadrupole diodes (1/5)

Quadrupole diodes : ON HOLD

4.66 sectors are consolidated (56,67,78, 81 and 2/3 of 12- Up to Q28L2) Components: 4 types :

1. Stainless steel plates (#4000) : All received with spares2. Inconel nuts (#8000) : OK for the whole LHC3. Inconel threaded plates (#4000): For 32 diodes at CERN (2/3 sec-eq). 4. Inconel studs (#8000) : 2 at CERN so < 1 diode-eq

Delivery expected from supplier 3 W6 No reliable news from supplier 1

Do not count on its deliveries (Conservative or realistic?)

Courtesy L Grand-Clement, R Moron –Ballester, F Savary

Page 25: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Quadrupole diodes (2/5)

Quadrupole diodes : ON HOLD

Action plan: (1 to 5 on-going in parallel)1. Splitting the work in 2 to prepare consolidation as much as possible :

5 weeks originally foreseen per sector All containers are open Measurements before consolidation and removal of helicoil is on-going in S23

2 weeks per sector when components are available (with the present resources)

2. Launching orders to cover the complete LHC(+margin) without counting supplier 13. Visit supplier 3 next Tuesday (28.01.2014)4. Investigate means to reduce delays (overtime)5. Procure tooling to allow doubling the team6. Identify resources with the right profile and who will become free (W5)7. Train these resources as soon as components are available (W7 onwards)

(Goal is to double the rate so 1 week per sector)8. Assessing the impact on the schedule and interference with other activities

(see next slide) and optimising the sequence (Priority by sectors, subsectors with other large NCs,…)

Courtesy L Grand-Clement, R Moron –Ballester, F Savary

Page 26: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Quadrupole diodes (3/5)

Quadrupole diodes : ON HOLD

Impact on other activities:1. Welding:

Can weld 3 ICs/4 and 6 welds/7 2. Welding visual inspection:

Have to come back to inspect welds of the diodes containers3. M lines leak test :

Can limit impact on schedule with extra tooling (plugs)Increase the workload, likely in a critical period

4. Closure of interconnections : If Pt3 is OK, 3 ICs/4 can be closed Increase the workload, but likely acceptable

5. Leak test of insulation vacuumCannot be doneAccording to baseline, should start W14 where we are blocked presently

Courtesy L Grand-Clement, R Moron –Ballester, F Savary

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SMACC Quadrupole diodes (4/5)

Courtesy L Grand-Clement, F Savary

Quadrupole diodes : Bare busbars

Contact resistanceQBQI.14L1

Beforedisconnection (µΩ)

Afterconsolidation (µΩ)

Busbar/heatsink(µΩ)

BB_d_A (less Ni) 2.0 0.2 0.1

BB_d_B (bare) 1.6 0.4 0.1

BB_d_C (less Ni) 1.3 0.4 0

BB_d_D (bare) 0.5 0.4 0.6

BB_m_A (Ag) 1.5 0.3

BB_m_B (Ag) 1.1 0.3

BB_m_C (Ag) 1.4 0.6

BB_m_D (Ag) 2.3 0.4

Page 28: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Quadrupole diodes (4/5)

Courtesy L Grand-Clement, F Savary

Quadrupole diodes : Bare busbars

Contact resistanceQBQI.16R8

BeforeDisconnection(µΩ)

AfterConsolidation(µΩ)

BB_d_A 0.5 0.1

BB_d_B (bare) 1.3 0.4

BB_d_C (less Ni) 2 0.5

BB_d_D (bare) 1.0 0.2

BB_m_A (Ag) 0.8 0.5

BB_m_B (less Ag) 0.5 0.1

BB_m_C (Ag) 0.9 0.3

BB_m_D (less Ag) 2.1 0.2

Page 29: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

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SMACC Quadrupole diodes (4/5)

Courtesy L Grand-Clement, F Savary

Quadrupole diodes : Bare busbars

Bare busbar QBQI.32R7• Magnet busbar/connection plate

Contact resistanceQBQI.32R7

Beforedisconnection (µΩ)

Afterconsolidation (µΩ)

BB_d_A (Ni) 2.1 0.5

BB_d_B (Ni) 2.3 0.6

BB_d_C (Ni) 1.9 1.1

BB_d_D (Ni) 2.5 0.3

BB_m_A (Bare) 1.3 0.2

BB_m_B (Bare) 1.5 0.5

BB_m_C (Bare) 0.6 0.5

BB_m_D (Bare) 1.3 0.2

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SMACC Quadrupole diodes (4/5)

Courtesy L Grand-Clement, F Savary

Quadrupole diodes : Bare busbars

3 cases so far in sectors 78 & 81 (SSS from start of production) Contacts resistance of bare busbars are lower than Ni/Ag coated ones [“almost”

acceptable] and are less degraded so far than Ni/Ag coated ones Actions have to be defined (Diodes WG):

Ranging from use as is to … …. Magnet busbars exchange requires to change the SSS !

Busbars / heatsink contacts are electrically measured but not visually inspected systematically

Inventory of diodes stacks ready for installation is limited

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SMACC Dipole diodes No outlier in 67 and 81 In 56, 3 dipole diodes (MDB) have been extracted and

will be replaced in the coming days In 78: 4 outlier leads (3 diodes)

Too early too conclude; it has to be analysed within the diodes WG (MPE-MSC)

Courtesy M Bednarek & ElQA team

Location

MTF_ID Diode lead Contact resistance [Ohm]

A15L8 HCLBARB000-IN003058 Anode 208 µA15L8 HCLBARB000-IN003058 Cathode 89.8 µA18L8 HCLBBRD000-IN003012 Anode 18.9 μA21R7 HCLBBRA000-IN003014 Cathode 16.6 µ

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SMACC Summary on progress

Main 13 kA Splices: Delay reduces Unavailabilty of components for QDiodes consolidation

Special Interventions: Delay stable

DFBA: See next presentation

SMACC: Slightly more than 2 weeks of delay

Delays are sligthly reducingVery slightly more than nominal rate achieved

these last 17 weeks !

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Sector 56 : Final leak test and surface work on DFBAK SHM Investigation on dipole diodes

Sector 67 : Pressure test successfull Purge, ElQA, Flushing (CRG/MPE): Not formally SMACC project

Sector 78 (Not priority) Work on NC Work on DFBAO at the surface

Sector 81 (Priority) Complete the M leak tests of non problematic Ics Progress on IC closure

Sector 12 Progress on M lines rewelding Start M leak test

Sector 23 Progress on the installation of electrical insulation Work on overheated splices Complete preparation for Q diodes consolidation

Sector 34 Complete splices unsoldering Installation of shunts

Sector 45 Start desoldering and resoldering of splices

SMACC Main activities for the next 2 weeks

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ConclusionsDelays are starting to reduceMind the last X % (S78 is at 91%) effect…

DFBA consolidation (see next presentation)

?: Source of leaks in 78/81 ? : Actions to undertake for bare busbar in Q diodes (Diodes WG)

Issues:Components for consolidation of quadrupole diodesOther diodes issues (Diodes WG-MPE/MSC)Repair of NCs in parallel with production work (March in 67)

Page 35: Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project