k kapoor dgm(qa), nfc, hyderabad - iim | hyderabad … inspection the principles of radiography x or...
TRANSCRIPT
IIM Hyderabad 15th July 2016
Overview of NDT Methods
K Kapoor
DGM(QA), NFC, Hyderabad
Discontinuity
Flaw
Defect
Interruption in Normal Physical Structure
- Keyways, Grooves, Holes present by design
Discontinuity with undesirable
connotation
- Slag, Porosity, Lamination
Flaw which makes component unfit for service
- Cracks, Lack of Fusion in Weld
Types of Flaws:
• Planar Flaws (2D)
– Lack of Fusion , Cracks
• Volumetric Flaws (3D)
– Porosity , Inclusions
Important Flaw Characteristics in materials
Location Surface Flaw
Sub-surface Flaw
• Surface flaw more severe as compared to sub-surface flaw because of
higher stress intensity associated with it
• Code provides guidelines on classification of flaw in to surface or sub-
surface, if it lies just below the surface of the component
Shape
• Flaws with sharp tip like crack more severe than flaws with smooth
surface like porosity
• Small root radius leads to higher stress intensity
Important Flaw Characteristics in materials
Proximity
• If two flaws are very close, they influence the stress intensity
associated with each other
• Two flaws shall be separated by the length of the longest flaws, or
else they shall be considered together as a singe flaw including
the sound region in between
Important Flaw Characteristics in materials
Nature
• Weld Flaw
- Operator: Porosity, lack of fusion, slag inclusion, undercut
- Metallurgical origin: Cold crack, Hot crack, laminar tearing
• Planar or Volumetric Flaw
• Planar flaw more severe than volumetric flaw
Important Flaw Characteristics in materials
Classification of NDT Methods
Non-Destructive Testing
Surface
Examination
Volumetric
Examination
Performance
Test
Visual
Liquid Penetrant
Magnetic
Particle
Eddy Current
Radiography
Ultrasonic
Testing
Acoustic
Emission
Leak Test
NDT Techniques for Welds
• Conventional
X- ray and Gama-ray Radiography
Ultrasonic testing
Eddy Current testing
Magnetic Particle
Dye Penatrant
• Advanced
Infra-red Thermography
Acoustic Emission
Micro-focal radiography
Real time radiography
Time of Flight Diffraction (UT)
Phased array ultrasonic testing
X-ray residual stress measurement
Dye Penetrant Inspection
Surface breaking defects only detected
Penetrant applied to the component and drawn into
the defects by capillary action
Applicable to all non- porous and non absorbing
materials.
Penetrants are available in many different types
Water washable contrast
Solvent removable contrast
Water washable fluorescent
Solvent removable fluorescent
Post-emulsifiable fluorescent
Dye Penetrant Inspection
Dye Penetrant Inspection
Dye Penetrant Inspection
Step 1. Pre-Cleaning
Cleaning preparation is very important on this method.
Usually solvent removal is been used
Dye Penetrant Inspection
Step 2. Apply penetrant
After the application of the penetrant the penetrant is normally
left on the components surface for approximately 15 minutes
(dwell time). The penetrant enters any defects that may be
present by capillary action
Dye Penetrant Inspection
Step 3. Clean off penetrant
After sufficient penetration time (dwell time) has been
given,excess removal penetrant stage take place. A damped
lint free tissue with solvent is used to clean the excess
penetrant.
Dye Penetrant Inspection
Step 3. Apply developer
After the excess penetrant is been removed, a thin layer
of developer is applied.A penetrant drawn out by reversed
capillary action.
Dye Penetrant Inspection
Step 4. Inspection / development time
Inspection should take place immediately after the developer
has been applied .Any defects present will show as a bleed
out during development time.
Dye Penetrant Inspection
Step 5. Post-Cleaning
After the inspection has been performed post cleaning is
required to prevent corrosion.
Dye Penetrant Inspection
Colour contrast Penetrant
Fluorescent Penetrant Bleed out viewed
under a UV-A light
source
Bleed out viewed
under white light
Magnetic Particle Inspection
Magnetic Particle Inspection
Surface and slight sub-surface detection
Relies on magnetization of component being tested
Ferro-magnetic materials only can be tested
A magnetic field is introduced into a specimen being tested
Methods of applying a magnetic field, yolk, permanent magnet, prods and flexible cables.
Fine particles of iron powder are applied to the test area
Any defect which interrupts the magnetic field, will create a leakage field, which attracts the particles
Any defect will show up as either a dark indication or in the case of fluorescent particles under UV-A light a green/yellow indication
Collection of ink
particles due to
leakage field
Magnetic Particle Inspection
Prods
DC or
AC
Electro-
magnet
(yolk) DC or
AC
Crack
like
indicati
on
Crack
like
indicati
on
Magnetic Particle Inspection
A crack like
indication
Magnetic Particle Inspection
Alternatively to contrast
inks, fluorescent inks
may be used for greater
sensitivity. These inks
require a UV-A light
source and a darkened
viewing area to inspect
the component
Magnetic Particle Inspection Typical sequence of operations to inspect
a weld
Clean area to be tested
Apply contrast paint
Apply magnetisism to the component
Apply ferro-magnetic ink to the component
during magnetising
Interpret the test area
Post clean and de-magnatise if required
Magnetic Particle Inspection
Advantages
Simple to use
Inexpensive
Rapid results
Little surface
preparation required
More sensitive than
visual inspection
Disadvantages
Surface or slight sub-
surface detection only
Magnetic materials
only
No indication of
defects depths
Detection is required
in two directions
Radiographic Inspection The principles of radiography
X or Gamma radiation is imposed upon a test
object
Radiation is transmitted to varying degrees
dependant upon the density of the material through
which it is travelling
Thinner areas and materials of a less density show
as darker areas on the radiograph
Thicker areas and materials of a greater density
show as lighter areas on a radiograph
Applicable to metals,non-metals and composites
Industrial Radiography
• X - Rays
Electrically generated
• Gamma Rays
Generated by the decay
of unstable atoms
Industrial Radiography
• X - Rays
Electrically generated
Industrial Radiography
• Gamma Rays
Generated by the decay of
unstable atoms
Source
Radiation beam Image quality indicator
Radiographic Inspection
Test specimen Radiographic film
Source
Radiation beam Image quality indicator
Radiographic film with latent image after exposure
Radiographic Inspection
Test specimen
7FE12
Step / Hole type IQI Wire type IQI
Radiographic Sensitivity
Wire Type IQI
Step/Hole Type IQI
Image Quality Indicators
Radiographic Techniques
• Single Wall Single Image (SWSI) - film inside, source outside
• Single Wall Single Image (SWSI) panoramic
- film outside, source inside (internal exposure)
• Double Wall Single Image (DWSI)
- film outside, source outside (external exposure)
• Double Wall Double Image (DWDI)
- film outside, source outside (elliptical exposure)
Single wall single image SWSI
IQI’s should be placed source side
Film
Film
Single wall single image SWSI panoramic
• IQI’s are placed on the film side
• Source inside film outside (single exposure)
Film
Film
Double wall single image DWSI
• IQI’s are placed on the film side
• Source outside film outside (multiple exposure)
• This technique is intended for pipe diameters over 100mm
Double wall single image DWSI
Radiograph
Identification
ID MR11
• Unique identification EN W10
• IQI placing A B • Pitch marks
indicating readable film length
Film
Double wall double image DWDI elliptical exposure
• IQI’s are placed on the source or film side
• Source outside film outside (multiple exposure)
• A minimum of two exposures
• This technique is intended for pipe diameters less than 100mm
Double wall double image DWDI
Shot A Radiograph
Identification
ID MR12
• Unique identification EN W10
• IQI placing
1 2 • Pitch marks indicating readable film length
4 3
Radiographic Inspection
Advantages
Permanent record
Little surface preparation
Defect identification
No material type
limitation
Disadvantages
Expensive equipment
Bulky equipment ( x-ray )
Harmful radiation
Detection on defect
depending on orientation
Slow results
Required license to operate
Basic Principles of Ultrasonic
Testing
• To understand and
appreciate the
capability and
limitation of UT
Ultrasonic Inspection Sub-surface detection
This detection method uses high frequency sound
waves, typically above 2MHz to pass through a material
A probe is used which contains a piezo electric crystal
to transmit and receive ultrasonic pulses and display the
signals on a cathode ray tube or digital display
The actual display relates to the time taken for the
ultrasonic pulses to travel the distance to the interface
and back
An interface could be the back of a plate material or a
defect
For ultrasound to enter a material a couplant must be
introduced between the probe and specimen
Ultrasonic Inspection
Ultrasonic testing is a good technique for the
detection of plate laminations and thickness surveys
Laminations detected using normal beam probes
Ultrasonic Inspection
defect
0 10 20 30 40 50
defect
echo Back wall
echo
CRT Display Compression Probe
Material Thk
initial pulse
Ultrasonic Inspection UT Set, Digital Pulse echo
signals
A scan Display
Compression probe Thickness checking the material
Ultrasonic Inspection
Ultrasonic testing requires high operator for defect
identification
Most weld defects detected using angle probes
Ultrasonic Inspection
Angle Probe
UT Set A Scan
Display
Ultrasonic Inspection
0 10 20 30 40 50
initial pulse defect echo
CRT Display
sound path
Angle Probe
defect
Surface distance
Ultrasonic Inspection
Advantages
Rapid results
Sub-surface detection
Safe
Can detect planar defect
Capable of measuring the
depth of defects
May be battery powered
Portable
Disadvantages
Trained and skilled
operator required
Requires high operator
skill
Good surface finish
required
Difficulty on detecting
volumetric defect
Couplant may
contaminate
No permanent record
Principles and Application of Eddy Current Testing
Basic Principle
Parameters influencing ECT
Equipment for ECT Probe (types, construction and design)
Supply, display and measuring unit
Reference Standards
General Applications Tube testing (Welded and Seamless)
Thickness measurement (bare surface and coating)
Surface Crack Detection
Conductivity measurement (sorting, heat-treatment etc)
Illustration
material
Basic Applications of ECT
• Crack detection
• Material thickness measurements
• Coating thickness measurements
• Conductivity measurements for:
o Material identification
o Heat damage detection
o Case depth determination
o Heat treatment monitoring
Advantages
• Sensitive to small cracks and other defects
• Detects surface and near surface defects
• Inspection gives immediate results
• Equipment is very portable
• Method can be used for much more than flaw detection
• Minimum part preparation is required
• Test probe does not need to contact the part
• Inspects complex shapes and sizes of conductive materials
Limitations
• Only conductive materials can be inspected
• Surface must be accessible to the probe
• Skill and training required is more extensive than other techniques
• Surface finish and and roughness may interfere
• Reference standards needed for setup
• Depth of penetration is limited
• Flaws such as delaminations that lie parallel to the probe coil winding and probe scan direction are undetectable
Parameters Influencing ECT
• Material Parameters
Conductivity
Permeability
• Magnetic Coupling (sensor and test object)
• Depth of penetration (frequency)
Conductivity ()
• Variables affecting :
Chemical composition
Impurity content
Heat-treatment
Lattice distortion and lattice defects (Cold work)
Hardness
Temperature
Discontinuities
Permeability
Coil’s Mag. Force (H)
Material’s Flux Density (B)
Non-magnetic Material
Coil’s Mag. Force (H)
Material’s Flux Density (B)
Magnetic Material
Example Cu, SS 304 Steels, Ni-base alloys
Low DOP for eddy currents High DOP for eddy currents
Depth of penetration
Depth of penetration
Material Conductivity
(% IACS)
Resistivity
(-cm)
Permeability DOP (in inch) at frequencies
1KC 4KC 16KC 64KC
Cu 100 1.7 1.0 0.082 0.041 0.021 0.010
Al (6061-T6) 42 4.1 1.0 0.126 0.063 0.32 0.016
Mg 37 4.6 1.0 0.134 0.067 0.34 0.017
Pb 7.8 22 1.0 0.292 0.146 0.073 0.037
Zr 3.4 50 1.0 0.446 0.223 0.112 0.056
304 SS 2.5 70 1.02 0.516 0.258 0.129 0.065
Alloy Steel 2.9 60 750 0.019 0.01 0.0048 0.0024
Cast Iron 10.7 16 175 0.018 0.009 0.0044 0.0022
Phase Lag (with depth)
• Phase lag is a parameter of the eddy current signal that
makes it possible to obtain information about the depth of
a defect within a material
In radians
In degrees
Where:
q=Phase Lag (Rad or Degrees)
x=Distance Below Surface (in or mm)
d=Standard Depth of Penetration (in or mm)
Probes Mode of
operation
Configuration Applications
Absolute Bobbin(ID),
Encircling(OD), Surface
Flaw detection, conductivity measurements and
thickness measurements.
Differential Bobbin(ID),
Encircling(OD), Surface
Flaw detection
Reflection
Probes
Bobbin(ID) (remote
field: driver and sensor)
Flaw detection and thickness measurement
Surface
Bobbin (ID) Encircling (OD)
Reference Standards Common eddy current reference standards include:
• Conductivity standards.
• Flat plate discontinuity standards.
• Flat plate metal thinning standards (step or tapered wedges).
• Tube discontinuity standards.
• Tube metal thinning standards.
• Hole (with and without fastener) discontinuity standards
Basic Applications
• Crack detection (tubes, components)
• Material thickness measurements
• Coating thickness measurements
• Conductivity measurements for:
o Material identification
o Heat damage detection
o Case depth determination
o Heat treatment monitoring
Application 1: Tube Testing: Analysis of Signals
Tube Testing: Analysis of Signals
Tube Testing: Examples
Typical flaws which show
up, include:
Pin-holes
Cross cracks lamination
Seam cracks
Porosity
Hook cracks
Lack of fusion Edge
damage
Open seams
Application 2:Thickness measurement-principle
1
4
3
2
Thickness measurement-example
Thickness of thin metal sheet and foil, and of
metallic coatings on metallic and nonmetallic
substrate
Cross-sectional dimensions of cylindrical tubes
and rods
Thickness of nonmetallic coatings on metallic
substrates
Application 3: Coating Thickness
Measurement of Thin Conductive Layers
• It is also possible to measure the thickness of a thin layer of metal on a metallic substrate, provided the two metals have widely differing electrical conductivities.
• A frequency must be selected such that there is complete eddy current penetration of the layer, but not of the substrate itself.
• The method has been used successfully for measuring thickness of very thin protective coatings of ferromagnetic metals (i.e. chromium and nickel) on non-ferromagnetic metal bases.
Thickness Measurements of Non-conducting Coatings on
Conductive Materials
o Principle: The thickness of nonmetallic coatings on
metal substrates can be determined using effect of
liftoff on impedance. The coating serves as a spacer
between the probe and the conductive surface.
o Applications: thickness measurement of paint and
plastic coatings.
o Accuracy: Thickness between 0.5 and 25 µm can be
measured to an accuracy between -10%/+ 4%.
Application 4: Surface Crack Detection
• Excellent method for detecting surface and near surface defects when the probable defect location and orientation is well known
• Defects such as cracks are detected when they disrupt the path of eddy currents and weaken their strength
Important Considerations
A knowledge of probable defect type, position, and orientation.
The probe should fit the geometry of the part and the coil must produce eddy currents that will be disrupted by the flaw.
Selection of a reasonable probe drive frequency. For surface flaws, use high freq. for maximum resolution and high sensitivity. For subsurface flaws, use lower frequencies to get the required depth of penetration and this results in less sensitivity. For ferromagnetic or highly conductive materials use of an even lower frequency to arrive at some level of penetration.
Reference specimens of similar material as component and with features that represent the defect or condition being inspected
Calibration for crack detection