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Application of Thin Films in Contemporary Industry

Henrik Obst

VON ARDENNEDresden, Germany

15.10.2013

provides

industrial vacuum coaters &

approved layer stacks e.g. for

• Architecture Glazing

• Photovoltaic

• Solar Absorbers and Reflectors on Metal Strip

• Web Coating

15.10.2013 Seminar University of Salento4

Application of Thin Films in Contemporary Industry

Outline

• Introduction

• Methods of Deposition

• EB-evaporation

• Sputtering

• Applications & Equipment for Production

• Architectural Glass Coating

• (Thin Film) Photovoltaic

• Sputter Roll Coater for Polymer Films

• Metal Strip Coater

• Developments for OELD Applications

• Summary

IntroductionExamples of Thin Film Application

15.10.2013 Seminar University of Salento

Solar Park near Leipzig 40 MWp CdTe Solar Farm

(former Russian Military Airport)World Jewellery Center Milano

www.juwi.de

5

IntroductionExamples of Thin Film Application


IntroductionWhat means “THIN”


• 0.01 .. 10 nm semiconductor, barrier,

passivation, EUV-optics

• 20 nm transparent metallic layers

• 10 .. > 100 nm optical (refractive) layers

e.g. thickness for interference with λ/4 in SiO2:550 nm /4 /1,5 = 91,6 nm

• 200 µm thermal barrier

coatings (TBC) YSZ

Methods of Deposition


Plating

Spin Coating

Pyrolytic Coating

and many others …

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Physical Vapor Deposition (PVD)

• Evaporation (e.g. by electron beam)

• Sputtering

• Molecular Beam Epitaxy (MBE)

• Cathodic Arc Deposition

Methods of DepositionPVD-Process Conditions: Vacuum


• Mean free path of particles

l ∼ 1/p

air, room temperature, p = 10-2 mbar l = 10 mm

p = 10-3 mbar l = 100 mm

• Scattered particles due to collisions

• Processes with inherent ion-bombardment, e.g. Ar+

• Parasitic incorporation vs. reactive processes

• Common pressure for evaporation < 1*10-4 mbar

• Common pressure for sputtering 5*10-3 mbar

Methods of Deposition: Electron Beam TechnologyEB-Gun

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EB Generation and EB Guidance

Seminar University of Salento

Methods of Deposition: EB-TechnologyEB-Gun

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EH150V EH300V EH800V

- Max. Process Chamber Pressure 5 Pa

- Beam Power 30 ... 800 kW

- Acceleration Voltage 30 ... 60 kV

- Cathode System Quick and Easy Exchange

- Space Charge Limited ModeOption: Temperature Limited Mode

- Power control

patented

Variocathode


Methods of Deposition: SputteringBasic Mechanisms of a DC Plasma Discharg


Methods of Deposition: Sputtering


Vacuum + Argon inlet + electricaldischarge generate the plasma, i. e. negative electrons and Argon ions.

High-energetic Argon ions hit the target surface provokingenergy cascades.

A layer is built up on the substrate by sputtering the target material.

Substrate

Target

hv

e-

Methods of Deposition: SputteringBasic Principles of Magnetron Sputtering

• Magnetron-Principle:

Closed magnetic tunnel in front of the sputter target (cathode)

-500 V



Methods of Deposition: SputteringPlanar Magnetron Technology

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Plasma Target

Utilization max 45%

Re-deposition zonesand oxide deposition:

clamping ledges

powder formation

flaking

film quality disturbed

Reactive Sputtering of SiO2

Methods of Deposition: SputteringPlanar Target with Re-Depositions


Methods of Deposition: SputteringDual Rotatable Magnetron RDM 3800


Target Utilization 85%

ZnO-Al Ceramic Target

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Methods of Deposition: SputteringWhy rotatable targets?


• Much higher target utilization (factor 2)

• No re-deposition zones at the target surface

• 1.5 to 2 times higher dynamic deposition rates

• Better uniformity < ± 1.5%

• Less arcing, less flaking

• Enhanced magnetic field strength, tunable magnetbars

• Total: lower cost of ownership, CoO

Methods of Deposition: SputteringCoating Technology- RDM Process in DC Mode

DC, DC-DC or DC-Pulseconductive Targets (ρ ≤ 1 Ωcm), long-term stable TCO processes (e.g. ITO or ZnO:Al2O3)

Anode AnodeDC DC

Seminar University of Salento19 15.10.2013

Methods of Deposition: SputteringCoating Technology – RDM Process in AC Mode


AC/MF+ +- -

AC/MF++ --

Electron drift

Film condensation with densification by ion impact

Moving substrate

Methods of Deposition: SputteringWorking Ranges for High Rate Reactive Sputtering

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P = constant!metallic mode

reactive mode

transition modestabilization

by fast control of reactive gas flow,

only


FilmMaterial

TargetMaterial

Type of sputter process

Max. Dyn. Dep. Rate [nm*m/min]Rotatable Planar

SiOx Si/Si:Al AC reactive 120 (RDM) 73 (SDM)

Nb2O5 NbxO AC ceramic 80 (RDM) 39 (SDM)

SiO2 Si/Si:Al AC reactive 80 (RDM) 39 (SDM)

ITO ITO DC/DC ceramic 180 (RSM/RSM) 67 (SSM/SSM)

Mo Mo DC/DC metallic 200 (RSM/RSM) 130 (WSM)

ZnO:AlZn:Al/AZO

DC reactive 120 (RSM) N/A

Methods of Deposition: SputteringTypical Maximal Dynamic Deposition Rates

RotatableRDM – Rotatable Dual MagnetronRSM – Rotatable Single Magnetron

PlanarSDM – Standard Dual MagnetronSSM – Standard Single MagnetronWSM – Wide Single Magnetron


Application: Architectural Glass Coating


2008 – New TV-Tower (CCTV) in Peking

Application: Architectural Glas CoatingGC330H

LowE- und Solar Control-Coatings Substrate sizes up 3.3 x 6.0 m²

Cycle time 40 sec


Application: Architectural Glas CoatingEquipment: GC330H


Application: Architectural Glas CoatingBenefits of Architectural Low-E Glass Coating


65 % Transmittance

Outdoors Indoors

Reflectance 23 %

Absorption 12 %

U= 1.2 W/m2K

15 liter fuel oil

per m2 and year

U= 5.8 W/m2K

68 liter fuel oil

per m2 and year

Reflectance 8 %

Absorption 4 %

Energy savings

heating and cooling costs saving

environmental protection

Fuel consumption 100% 21%

88 % Transmittance


Improved Silver Layer: Lower Resistance = Higher NIR Reflectance

Bottom Layer: TiO2

Increased transmittance and neutral color

Split Top Layer: SnO2/Si3N4

Improved mechanical and chemical robustness oflayer stack

Si3N4

SnO2

NiCrOx

Ag

ZnO

TiO2(TxO)

Glass

Application: Architectural Glass CoatingHeat protection coating with U = 1.1 W/m2K (Single Low-E)

Application: Thin Film PVSolar Cell Structures


Cd Te > 3 µm

ITO or SnO2:F

CdS0.3 µm

Glass pane 4 mm

CIGS > 2 µm

Cu In (Ga) Se, S

Mo 0.5 µm

i-ZnO and ZnO:Al 1µm

Glass pane 4 mm

Thin Film

a-Si:H CdTe CIGS

Metal 0.5 µm

η = 7% η = 10% η = 13%

ZnO:Al or SnO2:F

Metal Reflector 0.3 µm

ZnO:Al

p a-Si : H

i a-Si : H

n a-Si : H

CdS 50 nm

Glass pane 4 mm

Applications for Web Coating

• Invisible ITO-films for touch panels or EMI shielding

• Window films i.e. Low-E, electrochromic, IR blocker

• Antireflection, dry AR coatings

• Flexible PV, contact and absorber layers

• Enhanced mirrors, optical filters

• Barrier and adhesion layers


FOSA1600 Web Coating System


• Modular design of multi-chamber platform for R2R vacuum coatings

• Deposition of high-quality layers using advanced sputtering technology

• Flexible substrates, polymer films with multiple coil handling

• Industrial mass production

Systems and Features FOSA1600 D8 Dual Drum Web Coater


Modularity ofMulti-Chamber System

System

• 1x unwinding, 1x rewinding, 1 to 3x process chambers

• 1 drum per process chamber

• Concept allows up to 24 magnetrons

FOSA1600S4FOSA1600D8FOSA1600T12


Pre-Treatment Setup Compartment Mode Type

Plasma Treatment for

all SubstratesDC

LIONPlasma and Ion Impact

AC Glow Discharge ACElectronImpact

Free Span HeatersHeat and

DesorptionInfra Red

IR

Cryo – TrapsEffective H2O

Pumping within the Sputter Compartment

Trapping @ T < -125°C

Pumpingof Water

Vapor

Techniques for Applied Web Coatings Processes for Pre-treatment of Polymer Films


Substrate

≈AC

Substrat

Drum @ 80°C

15.10.201333

Film Materials Setup Compartment Mode Type

Ag, Al, Cu, Ti, Metals

NiV, NiCr, Alloys

ITO, NbOx, Ceramics

DC(pulsed)

WSMplanar


NiV, NiCr, Alloys

ITO, NbOx, Ceramics

DC(pulsed)

RSMrotatable


NiV, NiCr, Alloys

ITO, AZO, Ceramics

DC/DCseparated (pulsed)

RSM/RSMrotatable


ITO, AZO, TCO’s

TiOx, NbOx, Ceramics

DC/DCDAS (pulsed)

RSM/RSMrotatable

Techniques for Applied Web CoatingsDC Magnetron Sputtering


Substrat

Substrat

Substrat

Substrat

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Film Materials Setup Compartment Mode Type

Al-reactive Oxides

Si-reactive Oxides

TiO2, Nb2O5, Oxides

AC-MFdense

Plasma

SDMplanar

Al-reactive Oxides

Si-reactive Oxides

TiO2, Nb2O5, Oxides

AC-MFdense

Plasma

RDMrotatable

Al-reactive Nitrides

Si-reactive Nitrides

mixed Oxide-Nitrides

AC-MFdense

Plasma

RDMrotatable

Techniques for Applied Web CoatingsAC-MF Magnetron Sputtering


Substrat

Substrat

Substrat

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Metrology

In-Situ Measurement

• Multi-track optical measurement (Transmit., Reflectance)

• Non contact sheet resistance measurement

• Other parameters on request

• Marker cathode

Process Control

• Impedance control for SiOxNY deposition



Applications & Equipment for ProductionAir-to-Air Metal Strip Coating

Applications & Equipment for ProductionAir-to-Air Metal Strip Coater MCS1250


• Substrate 1.25 m (W)

• R2R for Metal Strip Coating 24h/5d onto Al, Cu, Steel

• EB-PVD and Rotatable Magnetron Sputtering

• Film materials: Al, CrN, SiO2, TiO2,

Metallbandbeschichter MSC 1200


Applications & Equipment for Production Air-to-Air Metal Strip Coater

Coatings and Applications onto Al, Cu and SST metal strip:Reflectors

Absorbers

Technologies:

• Glow Discharge

• Sputter Etching

• Metallic and Reactive Sputtering

• Electron Beam Evaporation

Length 106 m, Strip width 1,2 m

Plasma Pre-TreatmentGlow Discharge Sputter etching


Electron impact Ar+ Ion impact

Applications & Equipment for ProductionReflectors with Metal Strips


Light Reflectors made from AluminiumReflectatance:

Electro plated < 85%Vacuum coating > 96%

20% less energy consumption with constant illumination strength

Applications & Equipment for ProductionEnhanced Reflectance vs. Mirror Material

• Enhanced Al Mirror • Enhanced Ag Mirror


Seminar University of Salento43

Applications & Equipment for ProductionEB-PVD: Layer Properties

Parameter SiO2 TiO2

Index of refraction n = 1.44 n = 2.2...2.3(λ = 670 nm)

λ/(4n)-thickness 85 nm 45 nm

O2 partial pressure 1 x 10-4 mbar 1 x 10-4 mbar

density 0.8 ... 0.9 ρbulk 0.8 .... 0.9 ρbulk

Maximum dynamic rate(absorption free) 30 nm/s 5...6 nm/s

Evaporated material per cycle (120 h) 80 kg 75 kg

Techn. Challenges Sublimation residual absorption (re-oxidation ofsuboxides)

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Solar Absorber with Metal Strip


Solar Absorber – Top Roof Modul Copper Metal Strip – PVD coated

Solar water heating


• Goals

Best usage of solar energy High solar absorbance Ae

Reduced losses low Emissivity ε

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Process Monitoring Using EllipsometryIn-Situ / Ex-Situ


• in situ: Ellipsometry, XRF

• ex situ: Reflectometry

• reverse thickness

calculation

• position matching

15.10.2013

Air-to-AirMetal Strip Coater MSC1250


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