lecture 8 - cpe 690 introduction to vlsi design
TRANSCRIPT
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CpE 690: Digital System DesignFall 2013
Lecture 8Transient Response and Delay
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Bryan AcklandDepartment of Electrical and Computer Engineering
Stevens Institute of TechnologyHoboken, NJ 07030
Adapted from Lecture Notes, David Mahoney Harris CMOS VLSI Design
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Activity
1) If the width of a transistor increases, the current willincrease decrease not change
2) If the length of a transistor increases, the current willincrease decrease not change
3) If the supply voltage of a chip increases, the maximum
transistor current willincrease decrease not change
4) If the width of a transistor increases, its gate capacitance willincrease decrease not change
5) If the length of a transistor increases, its gate capacitance willincrease decrease not change
6) If the supply voltage of a chip increases, the gate capacitanceof each transistor will
increase decrease not change
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DC analysis tells us V out if Vin is constant
Transient analysis tells us V out (t) in response to a
change in V in
Requires solving differential equations Input is usually considered to be a step or ramp
From GND to V DD or vice versa
Transient Response
GND
VDD
Vin Vout
delay
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tpdr : rising propagation delay maximum time from input
crossing V DD/2 to risingoutput crossing V DD/2
tpdf : falling propagation delay maximum time from input
crossing VDD
/2 to fallingoutput crossing V DD/2
tpd : average propagation delay t pd = (t pdr + t pdf )/2
t r : rise time from output crossing 0.2
VDD to 0.8 V DD
t f : fall time from output crossing 0.8
VDD to 0.2 V DD
Delay Definitions
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tcdf : falling contamination delay minimum time from input
crossing V DD/2 to fallingoutput crossing V DD/2
tcdr : rising contamination delay minimum time from input
crossing V DD/2 to risingoutput crossing V DD/2
tcd : avg. contamination delay
t pd = (t cdr + t cdf )/2
Delay Definitions (cont.)
tcdf
tpdf
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Delay in CMOS Circuits
Switching CMOS gate generates output current inresponse to changing input voltages
All nodes have some finite capacitance (to ground) gate capacitance parasitic source/drain (diode) capacitance parasitic wiring capacitance
Transient waveforms found by solving:
C node (dV node /dt) = I k,nodefor each node in circuit
k
Cnode
Vnode I1,node
I2,node
I3,node
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Inverter Step Response
Find step response of inverter driving C load
V in(t ) = u (t - t 0)V DD
V out (t < t 0) = V DD
d V out (t ) dt = - I dsn (t ) C load
Vin(t) Vout (t)C load
Idsn (t)
I dsn (t )=
0 for t < t 0
( /2 )(V DD V t )2 for V out > V DD V t
(V DD V t V out (t) /2) V out (t) for Vout < V DD - V t
t0
Vin(t)
Vout (t)
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Simulated Inverter Delay
Solving differential equations by hand is too hard
SPICE simulator solves the equations numerically Uses more accurate I-V models too! But simulations take time to write!
(V)
0.0
0.5
1.0
1.5
2.0
t(s)0.0 200p 400p 600p 800p 1n
tpdf = 66ps t pdr = 83psVinVout
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Delay Estimation
We would like to be able to easily estimate delay For exploration of design space, dont need to be as accurate as
simulation Want a technique where its easier to ask What if?
The step response usually looks like a 1 st order RCresponse with a decaying exponential.
Can we model conducting transistor as effective resistance?
1.0
0.5
0.0
(V)
20p 40p 60p 80p0
A
ShockleySPICE
RC model
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Effective Resistance
Shockley models have limited value Not accurate enough for modern transistors Too complicated for much hand analysis
Simplification: treat transistor as resistor Replace I ds (Vds , Vgs ) with effective resistance R Ids = Vds /R or 0 depending on gate voltage
R averaged across switching of digital gate Too inaccurate to predict current at any given time But good enough to predict gate delay
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RC Delay Model
Use equivalent circuits for MOS transistors Ideal switch + capacitance and ON resistance Unit nMOS has resistance R, capacitance C Unit pMOS has resistance 2R, capacitance C
Capacitance (gate & diffusion) proportional to width
Resistance inversely proportional to width
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RC Values
Capacitance C = C g = C s = C d = 2 fF/ m of gate width in 0.6 m Gradually decline to 1 fF/ m in nanometer techs.
Resistance R 5-10 K m in 0.6 m process Improves with shorter channel lengths
Unit transistors May refer to minimum contacted device (4/2 ) Or maybe W=1 m device (doesnt matter as long as you are consistent)
AMI
0.6 m
TSMC
250nm
TSMC
180nm
IBM
130nm
IBM
65nm
R n (k . m) 9.2 4.0 2.7 2.5 1.3
R n (k .4 ) 7.7 8.0 7.5 9.6 10
R p (k . m) 19.9 8.9 6.5 6.4 2.9
R p (k .4 ) 16.6 17.8 18.1 24.7 22.3
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RC Values
Estimate the delay of a fanout-of-1 inverter
6RC
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Example: 3-input NAND
Sketch a 3-input NAND with transistor widths chosen to
achieve effective rise and fall resistances equal to a unitinverter (R).
2 2 2
3
3
3
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3-input NAND Capacitors
Annotate the 3-input NAND gate with gate and diffusion
capacitance.
2 2 2
3
3
3
2 2 2
3
3
33C
3C
3C
3C
2C
2C
2C
2C
2C
2C
3C
3C
3C
2C 2C 2C
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9C
3C
3C3
3
3
222
5C
5C
5C
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3-input NAND Capacitors
Annotate the 3-input NAND gate with gate and diffusion
capacitance.
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9C
3C
3C3
3
3
222
5C
5C
5C
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Rise & Fall Delay
What are worst-case rise and fall delays?
How can we estimate delay of these networks?
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with multiple RC components
Second order response is too complicated defeats whole purpose of simplifying to an RC network
Can approximate to: =
1 +
2= R
1C
1 + (R
1+R
2).C
2
= RC
= 11 + 1 1 + 1 + 2 . 2 + 2 1 1 2 2
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Elmore Delay
ON transistors modeled as resistors
Pullup or pulldown network represented as an RC tree root of tree is voltage source (often V DD or GND) leaves are capacitors at end of branches
Elmore delay to any target (node j) in the branch:
where: i represents all the nodes in the branch
C i is the capacitance at node i Rsij is the resistance of the shared path from the source to and
from the source to the target
Elmore delay is conservative
over-estimates the delay
= .
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Shared Path
delay to node N is:R1C1 + (R 1+R 2).C 2 + + (R 1+R 2++R n).C N
delay to node 2 is:R1C1 + (R 1+R 2).C 2 + (R 1+R 2).(C 3+C 4++C N)
R1 R 2 R 3 R N
C1 C 2 C 3 C N
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Example: Elmore Delay
Calculate delay from source to all nodes in circuit:
A B C D
E
F
G
H 2R
2R
3R
3R
3R R R
R
C C
C
2CC
2C C
3C
source
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3-input NAND: pull-down delay
Estimate worst-case rising and falling delay of 3-input NAND
driving h identical gates.
h copies
= 3 + 3C + + 9 + 5 ( + + ) = 12 + 5
Worst case pull-down delay occurs when ABC goes from (110) to (111)
A
B
C
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3-input NAND: pull-up delay
Estimate worst-case rising and falling delay of 3-input NAND
driving h identical gates.
h copies
= 9 + 5 C (R) + 3C R + 3C R = 15 + 5
Worst case pull-up delay occurs when ABC goes from (111) to (110)
A
B
C
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Delay Components
Delay has two parts
Parasitic delay 15 or 12 RC Independent of load
Effort delay 5h RC Proportional to load capacitance
= 15 + 5 = 12 + 5
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Contamination Delay
Best-case (contamination) delay can be substantially less
than propagation delay:
if top nMOS is last to turn on:
= 9 + 5
if all pMOS turn on simultaneously:
= 3 +
= 12 + 5 = 15 + 5 compare to:
i.e. ABC goes from (011) to (111) i.e. ABC goes from (111) to (000)
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Diffusion Capacitance
We assumed contacted diffusion on every s / d.
but shared on series nMOS chain Good layout minimizes diffusion area Good NAND3 layout shares one diffusion contact
Reduces output capacitance by 2C
Merged un-contacted diffusion also helps
1.5C 1.5C
1.5C
1.5C
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Layout Comparison
Which layout is better?
AVDD
GND
B
Y
AVDD
GND
B
Y
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Example: Gate delays
For the gate =
+ .
a) Draw the schematic
b) Size the transistors to give pullup and pulldown strength equal to unitsize inverter
c) Annotate with effective R of each transistor and C of each node
d) Calculate worst case rising & falling propagation delay while driving h similar gates (via input B)
e) Calculate best case rising & falling contamination delay while driving hsimilar gates (via input B)