mezza-pede smt connectors application …...1.0mm pitch mezza-pede® smt connectors are designed for...

Application Specification

Mezza-pede® SMT Connector Low Profile 1.0mm Pitch

Rev. 3 – December 7, 2016


Mezza-pede® SMT Connector Application Specification, Rev. 3 ©2009-16, Mezza-pede is a registered trademark of Advanced Interconnections Corp. Data provided as a general guideline only. Specifications subject to change without notice. For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents Dimensions: inch/(mm)

Table of Contents 1.0 Introduction 3

2.0 Scope 3

3.0 Product Overview 3

4.0 Part Number Structure 6

5.0 Shipping 7

6.0 PC Board Design 7

7.0 PC Board Application Procedure 8

8.0 Solder Paste and Disposition 8

9.0 Solder Reflow 9

10.0 Double Sided Reflow 11

11.0 Cleaning 11

12.0 Protective – Pick and Place Cover Removal 11

13.0 Recommended Mating and Unmating Procedure 12

14.0 Storage 13

15.0 Revision History 14



1.0 Introduction 1.0mm pitch Mezza-pede® SMT Connectors are designed for the mating and unmating of a PC board (PCB) to a PCB, PCB to flex cable, or flex cable to flex cable. The female connector (receptacle) may also be used as a surface mount socket for a thru-hole device. 2.0 Scope This product Application Specification covers the 1.0mm pitch low profile SMT receptacle (socket) and the SMT and thru-hole headers. 3.0 Product Overview There are two (2) components that make up this connector system; a header and a socket (receptacle). The receptacle incorporates terminals consisting of a female shell with an internal contact, an insulator, and a terminal lead [see Fig 1A]. The receptacle is typically mounted to the PC board (motherboard). The SMT header incorporates a male terminal, an insulator, and a terminal lead [see Fig 1B]. The thru-hole header incorporates a male terminal and an insulator [see Fig 1C]. The header is attached to a daughter card in board to board applications or to a flex circuit for PCB to cable assemblies. Receptacles and headers are each shipped in tape and reel packaging. The headers are shipped with a protective (pick-and-place) cover that is removed after solder-attach (also available as an option on the SMT receptacle) [see Fig. 5]. This cover can be left in place for storage or for protection of the male terminals during the handling processes. The flexible thru-hole headers are supplied in trays without pick-and-place covers.

Figure 1A



3.1 Dimensions [See Fig. 2]

Model Pin Count Rows A B

DHS/DHAM 8 2 x 4 .171/(4.36) .118/(3.00)

DHS/DHAM/DHAL 14 2 x 7 .290/(7.36) .236/(6.00)

DHS/DHAM 20 2 x 10 .408/(10.36) .354/(9.00)

DHS/DHAM 30 2 x 15 .605/(15.37) .551/(14.00)

DHS/DHAM 36 2 x 18 .722/(18.34) .669/(17.00) 3.2 Pitch:

• Spacing in the “X” axis is 0.039/(1.00) TYP. [Fig. 2] • Spacing in the “Y” axis is 0.039/(1.00) TYP. [Fig. 2]

Figure 1B Figure 1C

SMT Header

Thru-hole Header



3.3 Stack Height (“Z”), which is the resultant distance between two (2) mated and stacked PCBs as measured from the bottom of the upper PC board to the top of the mating PC board, is 0.157/(4.00) approx. for the SMT version [Fig 3A] and 0.122/(3.10) for the through hole version [Fig 3B]. *Note: Mated height will vary depending on reflow profile, paste volume, and PC board pad size.

Z Dimension: DHAM/DHS: 0.157/(4.00), DHAL/DHS: 0.132/(3.35), DHA/DHS 0.122/(3.10)

3.4 The SMT connector system utilizes a screw-machined terminal that is pressed into and

soldered to a terminal lead to assure a robust connection. This proprietary design allows the use of screw-machine technology along with metal forming technology. [Fig. 4]

3.5 The leads are plated with Matte Tin to be RoHS compliant. 3.6 The removable cover (cap) is designed to facilitate automated pick-and-place and to protect

the terminals during transportation, storage, and assembly. Covers are provided as a standard feature on the header [Fig. 5A] and an option on the receptacle [Fig. 5B]. This cover needs to be removed before the product can be put into use, but only after the solder reflow operation has taken place.

Figure 3A (DHAM/DHS) Figure 3B (DHA/DHS)

Figure 4

Figure 5A Figure 5B

Protective/pick-and-place cover

Z Z

Receptacle (Socket)

SMT Header



4.0 Part Number Structure 4.1 Part number structure

Receptacle (Female, Socket)

Header (Male)

Figure 6

Figure 7 DHA

DHS

DHAM

DHAL



5.0 Shipping 5.1 Standard shipping for the SMT models is in tape and reel. [Fig. 8]

5.2 Standard shipping for the Thru-hole model (DHA) is in trays. 6.0 PC Board Design Proper PC board design affects connector reliability and performance. The following recommendations are intended to ensure reliable electrical connections, while maximizing manufacturing yields and aiding in possible rework applications. 6.1 PC board pad size .024/(0.610) x 0.054/(1.37). 6.2 Copper defined solder pads. 6.3 Pad materials: Copper with Immersion Gold, Immersion Silver, OSP or HASL. 6.4 Solder mask clearance must be greater than the PC board pad size and be registered properly

so that .002" (0.05mm) minimum clearance is met all around the pad. 6.5 PC board vias should not be included in the solder pads. [Fig. 9] The connector side of the via

shall be fully covered with solder mask. Solder mask may be truncated along interconnect trace.



7.0 PC Board Application 7.1 The protective cover attached to the SMT header (optional on the receptacle) can be used for

vacuum pickup and placement with automated equipment. Placement by mechanical grippers that grip the outside of the insulator is acceptable but not preferred.

7.2 Receptacle and/or header will be placed so that solder leads are placed on top of or lightly pushed into the solder paste. Receptacle and/or header shall not be dragged into place, since this will track solder paste that may cause bridging and result in an electrical short.

7.3 Receptacle and/or header placement utilizes typical SMT placement procedures. 8.0 Solder Flux/Paste 8.1 To make the product easier to use, a no-clean RMA flux is recommended. If using a solder

paste, a no-clean solder paste is recommended. 8.2 Standard product requires the use of eutectic SnPb solder paste. 8.3 Recommended solder paste for lead-free, RoHS compliant product is 95.5Sn /4.0Ag /0.5Cu. 8.4 Recommended stencil thickness is .003 inches (0.08mm). 8.5 Recommend a rectangle aperture of .019 inches (0.48mm) X .043 inches (1.09mm) for a .003

inches (0.08mm) thick stencil.



9.0 Solder Reflow All recommended temperatures are on top surface of the board, either inside or in close proximity to the Mezza-pede® SMT Connector. 9.1 For standard SnPb product: 9.1.1 To obtain temperature equalization at all the joint locations, soak at 130° C to 160° C

before reflow for 120 seconds max. 9.1.2 Reflow time above 183° C should be between 45 seconds and 75 seconds. 9.1.3 Peak temperature should be between 210° C and 217° C. 9.1.4 The maximum temperature on the board should not exceed 230° C for more than 10

seconds. 9.1.5 A nitrogen environment of equal to or greater than 4,000 ppm O² can improve stability, but

it is not required. 9.1.6 Maximum ramp rate should be 3° C per second. 9.1.7 See Figure 10A for sample profile. 9.2 For lead-free RoHS compliant product: 9.2.1 To obtain temperature equalization at all BGA locations, soak at 150° C to 210° C prior to

reflow for 60-90 seconds. 9.2.2 Reflow time above 219° C should be a maximum of 90 seconds. 9.2.3 Peak temperature should be between 235° C and 250° C. 9.2.4 The maximum temperature on the board should not exceed 260° C for more than 10

seconds. 9.2.5 The maximum total cumulative time to ramp up, soak, and reflow the board shall be limited

to 330 seconds. 9.2.6 Nitrogen environment of equal to or greater than 4,000 ppm O² can improve stability, but it

is not required. 9.2.7 Maximum ramp rate should be <2.5° C per second. [Fig. 10B]



Figure 10A

Figure 10B



10.0 Double Sided Reflow The Mezza-pede® SMT Connector is suitable for double sided reflow. In all cases users should verify connector applicability for inverted reflow through process verification testing. 11.0 Cleaning The connector and board assembly can be washed with an appropriate cleaner to remove any residue or contaminants after reflow. Vacuum pickup caps should be removed before cleaning to reduce the chance of trapping cleaning solutions. 12.0 Protective Cover Removal To manually remove the protective/pick-and-place cover:

12.1 With the cover installed as shown in. [Fig. 11A] grab the cover with your fingers on two

opposing sides. 12.2 Pull the cover up from the header or receptacle (socket) keeping the cover parallel to

the insulator (wafer). [Fig. 11B] 12.3 Save protective cover as a terminal/contact protector during storage.

Figure 11A Figure 11B

Removal Direction

Removal Direction

Removal Direction

Removal Direction

Receptacle (Socket)

SMT Header



13.0 Recommended Mating and Unmating 13.1 Mating the two halves of the receptacle/header system:

13.1.1 Align the male terminals with the opening in the female shell. [Fig. 12A] 13.1.2 Verify that all the male terminals are inside of the female shells. [Fig. 12B] 13.1.3 Push down until the positive stop is contacted. [Fig. 12C] 13.1.4 Verify that the pins are fully seated.


Figure 12C



13.2 Unmating the receptacle/header system:

13.2.1 There is no extraction tool available for this connector system. 13.2.2 To remove the header from the receptacle, grab the PCB as close as possible to the

connector and pull up in a parallel direction to the receptacle. 13.2.3 Continue pulling up till the male terminals have cleared the female shell. 13.2.4 Replace protective cover onto header to protect male terminals from being damaged.

14.0 Storage 14.1 It is recommended to keep the protective covers in place, or re-install them, if parts will not be

used for an extended period of time. 14.2 See section 12.0 for cover removal.


Removal Direction

Removal Direction



15.0 Revision History REV. DESCRIPTION BY DATE 0 New Release G. Goodman 2-24-09 1 Added 30 pos., ®, and receptacle cover option G. Goodman 5-9-13 2 Changed stencil aperture in section 8.5 G. Goodman 10-3-14 3 Added references to 20 position model and Model DHAL throughout. Sections 1.0, 2.0, 3.0: minor text edits for clarity and added reference to Thru-hole header. Section 3.1 Changed dimensional data to table format. Section 3.6 changed patented to proprietary. G. Goodman 12-7-16

mezza-pede smt connectors application …...1.0mm pitch mezza-pede® smt connectors are designed for...

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