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September 25, 2013 Photonic Integrated Circuits for 400 Gigabit and 1 Terabit Coherent Transport

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September 25, 2013

Photonic Integrated Circuits for

400 Gigabit and 1 Terabit

Coherent Transport

2

OUTLINE

• Overview of Optical Transport Market

• Evolution of Coherent Optical Module

• PICs for Line-Side 400G Coherent Optical Modules and Linecards

• Tunable Laser

• Integrated Coherent Transmitter (ICT)

• Integrated Coherent Receiver (ICR)

• Array of TLs, ICTs & ICRs for 400GE/1T

• PIC for Client-Side 400G Optical Modules

• 25G EML

• Summary

3

• Overview of Optical Transport Market

• Evolution of Coherent Optical Module

• PICs for Line-Side 400G Coherent Optical Modules and Linecards

• Tunable Laser

• Integrated Coherent Transmitter (ICT)

• Integrated Coherent Receiver (ICR)

• Array of TLs, ICTs & ICRs for 400GE/1T

• PIC for Client-Side 400G Optical Modules

• 25G EML

• Summary

4

168pin

Optical Transport Market: 10/100/400G

300pin

T-XFP

T-SFP+

Metro

2-deg

LH

4-deg

Metro

2/4-deg

1~3

yearsLH

8~12

deg

NEM

linecard

C-CFP

C-CFP2

C-CFP4

Programmable

2~3 years0~2 years 0~2 years2~3 years

LH Metro ROADM LH

Metro(Enterprise

/cloud/

DC)

CDC

ROADM

LH

10G (ON-OFF Keying) 100G (Coherent, DSP) 400G (Coherent, DSP)

2~3 years 2~3

years

Metro(Enterprise

/cloud/

DC)

Enablers:

• PICs

• HOM/DSP(28/20nm CMOS)

SDN

XFP

SFP+

T-XFP

T-SFP+

WSS WSS, MCS

CD-CFP

CDFP

5

• Overview of Optical Transport Market

• Evolution of Coherent Optical Module

• PICs for Line-Side 400G Coherent Optical Modules and Linecards

• Tunable Laser

• Integrated Coherent Transmitter (ICT)

• Integrated Coherent Receiver (ICR)

• Array of TLs, ICTs & ICRs for 400GE/1T

• PIC for Client-Side 400G Optical Modules

• 25G EML

• Summary

6

Coherent Optical Module Outlook

CFP145x82x13.6 mm

CFP2107.5x41.5x12.4 mm

5”x7”

100G Module Evolution

CFP4

100/150/200G

5”x7”

(200G MSA?)

20

0~

40

0G

Mo

du

le E

vo

lutio

n

CFP

(200G MSA?)

5”x7”

(400G MSA?)

CFP

(400G MSA?)

None of these

existing form

factors

have 20/40 x

10G or 8/16x

25G interfaces

7

Coherent Optical Module Outlook

5”x7”

(200G MSA?)

20

0~

40

0G

Mo

du

le E

vo

lutio

n

CFP

(200G MSA?)

5”x7”

(400G MSA?)

CFP

(400G MSA?)

# ICT # ICR Drivers

1 (metro)/

2 (LH)

1 (metro)/

2 (LH)

4 linear(metro)/

8 limiting (LH)

1 (metro)/

2 (LH)

1 (metro)/

2 (LH)

4 linear(metro)/

8 limiting (LH)

2 (metro)/

4 (LH)

2 (metro)/

4 (LH)

8 linear(metro)/

16 limiting (LH)

2 (metro)/

4 (LH)

2 (metro)/

4 (LH)

8 linear(metro)/

16 limiting (LH)

None of these

existing form

factors

have 20 or 40 x

10G interfaces

8

• Overview of Optical Transport Market

• Evolution of Coherent Optical Module

• PICs for Line-Side 400G Coherent Optical Modules and Linecards

• Tunable Laser

• Integrated Coherent Transmitter (ICT)

• Integrated Coherent Receiver (ICR)

• Array of TLs, ICTs & ICRs for 400GE/1T

• PIC for Client-Side 400G Optical Modules

• 25G EML

• Summary

9

Tunable Lasers for 400G/1T

● Gridless Tuning

– 400G example: 200G/λ with 35GHz spacing

– 1T example: 200G/λ with 40GHz spacing

● Narrow Linewdith

– Negligible OSNR penalty @ ∆f⋅Ts < 10-5 for DP-16QAM,

i.e., laser linewidth ∆f < 300KHz.

● High Optical Power

– To compensate the low drive voltage due to

linearity consideration

- Allow splitting for both TX and LO

- To suppress direction detection

terms more effectively in a multi-channel

ROADM condition

Drive voltage

10

Gridless Tuning

● NeoPhotonics laser technology is the perfect choice for “gridless” tuning:

– Thermally tuned DFB laser is “gridless” by design with no mode-hops over the thermal gradient of each laser stripe.

– SOA provides shutter function for dark-tuning

11

High Tunable Laser Optical Power

● Use high saturation power, low-gain SOA

– SOA output can achieve 17.5~18dBm BOL, 16dBm EOL

– SOA also provides VOA function for adjusting output power level.

– With Neo lossless MEMS combiner, SOA gain can be very small (~5dB), OSNR > 50dB still viable.

● Use distributed current injection inputs

– “multi-Injection” laser shows approx +0.5 dB of power compared to regular laser chips.

0

20

40

60

80

100

120

0 100 200 300 400 500 600

Po

wer

(m

W)

Current (mA)

Regular

Multi-injection

@50C

12

Integrated Coherent Transmitter-Options of Integration and Packaging

90o

Tunable

Laser

MZI

MZI

MZI

MZILO

TX

1. TL+ dual-I/Q modulators

2. Dual I/Q modulators + drivers

3. All included

13

ICT to Support Flexible Transceiver

(Ciena, ECOC 2012)

14

Intradyne Coherent Reciever Product Evolution

OIF 1.1 compliant

Silica PLC based

High performance

iPBS

/L band

/w power monitoring

VICR•OIF compliant

•Silica PLC based

•VOA integrated

•High dynamic range and

low noiseDual port SFF ICR custom

•InP (or PLC) based

•Metro/LH application

•Multi channel

•200G/400G

SFF ICR General

•OIF 1.2 (Type 2 )

•Silica PLC based

•33 x16 x6.5

•Integrated MPD/VOA

Gen 1

Gen 2

Gen 3

15

400G ICR Block Diagram (“Gen 3”)

90 deg

Hybrid

90 deg

HybridBS

PBS

+-

+-

+-

+-

LO#1

90 deg

Hybrid

90 deg

HybridBS

PBS

+-

+-

+-

+-

LO#2

200G

200G

Signal

VOA

VOA

Signal

16

Array of PICs for 400GE and 1T transceivers

● 2, 4, 5 or 10 array TLs

● 2, 4, 5 or 10 array ICTs

● 2, 4, 5 or 10 array ICRs

Challenges• Power consumption management

• Yield loss

• The number of pins for control and RF interfaces

• Skew management in interfacing with ADC/DAC

17

• Overview of Optical Transport Market

• Evolution of Coherent Optical Module

• PICs for Line-Side 400G Coherent Optical Modules and Linecards

• Tunable Laser

• Integrated Coherent Transmitter (ICT)

• Integrated Coherent Receiver (ICR)

• Array of TLs, ICTs & ICRs for 400GE/1T

• PIC for Client-Side 400G Optical Modules

• 25G EML

• Summary

18

400GE Client-Side: 25G EML as the key component

• 16x25G NRZ/OOK

• 8x50Gb/s PAM-4

• 4x100Gb/s DMT

19

Summary

● Need standard or MSA for 400G and 1T optical modules

– Otherwise, a converged 100G industry will diverge again!

● 400G and 1T optical modules will require PICs, array of PICs, and multi-channel driver and TIA ICs

● Technical challenges for optical transceiver modules include:

– Power consumption

– Yield

– Interface with next-gen ADC’s and DAC’s (pitch, skew, amplitude, etc.)

– Numerous pins for control and RF interfaces