photonic integrated circuits (pics)

8/12/2019 Photonic Integrated Circuits (PICs)

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Photonic Integrated

Circuits (PICs)Nitin K. Lohar

2012JOP2495


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Overview

Introduction

Types of Integration

Materials used for PIC fabrication

Fabrication of Waveguides in PICs

PICs vs. Electronic ICs

References


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Photonic Integrated Circuits (PIC

Integrated circuit which incorporates at least two optical devoptical waveguide junction in between to form a single phot

Optical device such as lasers, modulators, detectors, attenuaDEMUXs, optical amplifiers, filters, couplers, photonic switches

Aim is to achieve greater processing power, lower cost per dimproved reliability, reduced space and power requirements

Primary application in fiber optic communication, others inclubiomedical sensing and photonic computing


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Example Devices

Image co


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Types of Integration

Hybrid

Many single function optical devices are assembled into a single

sometimes with associated electronic ICs

These devices are interconnected to each other by electronic a

couplings internal to the package

Highly complex and challenging

Monolithic Integration

Can consolidate many devices and functions into a single photo

Fabrication involves same steps as of electronic ICs: building dev

common substrate so that all photonic couplings occur within th

all functions are consolidated into a single, physically unique dev


6/12Image courtesy: Ref. 6


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Material used for PIC Fabrication

Many material can be used such as: Indium Phosphide (InP), Arsenide (GaAs), Lithium Niobate (LiNbO3), Silicon (Si), and Si(Silicon on Insulator SOI).

LiNbO3: can be used for modulation and SHG, but cannot beactive Opto-electronic components such as lasers and detec

GaAs can be used for both lasing and detection but only in 8

telecom window. Si: mature CMOS technology available, can be used as mate

for passive optical components, but difficulties in active com

Indium Phosphide can be used for integration of both activeoptical devices operating in the 1310nm or 1550nm telecom


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Fabrication of Waveguides in PIC

Two types: Conventional index guided waveguides and Photon

Figure: of photstructurUV litho

etching


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PICs vs. Electronic ICs

Main difference: type of material used for fabrication

For Electronic ICs, it is mainly silicon

For the case of PICs, materials vary as per the functioning of dev

LiNbO3, GaAs, InP, SOI etc.

In an electronic IC, the main device is the transistor. In PIC, thparticular main device that dominates in the fabrication

Because of the mature technology available for Silicon, cost ICs is much less than of PICs, also, the number of componentICs is much larger than in PICs.


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Conclusion

Photonic integrated circuits make the whole system more cohelps in providing high performance.

These chips can be integrated with basic electronic circuits wapplicable for more functions.

The development of PIC technology has not yet reached its hThrough constant research, people are trying to make this te

common, low cost, and highly efficient one In future most of electronic ICs will be replaced by PICs.


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References

1. Application specic photonic integrated circuits through generic novel paradigm in photonics, P. Munoz, J.D. Domenech et al, Wa

2. Large-scale photonic integrated circuits, Nagarajan, R.; Joyner, Selected Topics in Quantum Electronics, IEEE Journal of , vol.11, nJan.-Feb. 2005 doi: 10.1109/JSTQE.2004.841721

3. Photonic Integrated Circuits: A Technology and Application Primwhite paper, Document Number: DS-008-001/0605, 2005.

4. Basic structures for photonic integrated circuits in Silicon-on-insulaBogaerts, D. Taillaert, B. Luyssaert, P. Dumon, J. Van Campenhou

D. Van Thourhout, R. Baets, V. Wiaux, and S. Beckx, Opt. Express 2004.

5. Diode Lasers and Photonic Integrated Circuits, L. A. Coldren, S. WWiley & Sons, Inc., 1995.

6. Image Courtesy: http://www.kaiamcorp.com/tech_detail1.htm

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