positive chemically amplified photoresist for etch ... · 6.67um 4.83um 5.55um 4.87um 4.89um. az,...
TRANSCRIPT
The information contained herein is, as far as we are aware, true and accurate. However, no representations or warranties, either express or implied, whether of merchantable quality, fitness for any particular purpose or of any other nature are hereby made in respect of the information contained in this presentation or the product or products which are the subject of it. In providing this material, no license or other rights, whether express or implied, are given with respect to any existing or pending patent, patent application, trademarks, or other intellectual property right.
AZ® EXP 12XT-20PL Series
Positive Chemically Amplified Photoresistfor Etch, Implant, and Plating Applications
Data at 5 to 15µm Film Thickness
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
2
MEMS /Ink Jet
FT: >30 µm
Lift-off TSV / EtchImplant
Copper/UBMPlating
Gold Plating Solder /Metal Plating
FT: 2-10 µm FT: 3-15 µm FT: 5-30 µm FT: 10-30 µm FT: >30 µm
DUVTFRH/ImplantFT: 3 - 8 µm
AZ’s Thick Film Photoresist Roadmap
<<------------------ AZAZ® EXP 100 EXP 100 ---------------->>
Materials under development
AZ® LExp 600
<---AZ® 12XT Series--><------------------------- AZ® 125nXT Series -------------------------->
Materials in sampling(all EXP products)
Commercialized materials
AZ® nLOFSeries
<------------------------- P4620 ----------------------->
AZ® N4000
AZ® TX 1311VS-01HJ<------------ AZ® 9200 ------------> AZ®
PLP30/PLP40
<----------- AZ® 50XT ---------->
<---AZ® 5nXT/15nXT--->
<---------AZ® 40XT-11D-------->
<------------ AZ® 10XT ------------>
AZ® EXP TXVS-02HJ
AZ® 4562
Red=Neg, Blue =Pos; nLOF, N4000,,5nXT, 15nXT, 12XT, 40XT = chemically amplified; 125nXT = photopolymer; 10XT, 9200, P4620, PLP, 50XT = DNQ
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
3
AZ® Electronic Materials Thick Photoresist Product Summary
Platform: DNQ = Novolak, CA = Chemically Amplified, PP = Photopolymer
Wavelength: Red font indicates better performance.
Developer Compatibility: Bold font indicates most compatible developer, resulting in shorter develop times and lower exposure energies.
Thick Film Product Platform λ
FT Range (um)
Maximum Single coat
Aspect Ratio Application Developer
Compatibility
P4000 Series DNQ g-h 2 - 55 25 2:1 Solder, Cu, Au 400K / TMAH4500 Series DNQ g-h 2 - 55 25 2:1 Solder, Cu, Au 400K / TMAH9200 Series DNQ g-h -i 3 - 50 25 3:1 Solder, Cu, Au 400K / TMAH
10XT DNQ g-h -i 4 - 50 25 3:1 Solder, Cu, Au 400K / TMAH50XT DNQ g-h 15 - 65 65 3:1 Solder, Cu, Etch 400K
PLP-30 DNQ g-h 6 - 25 25 2:1 Au, Cu 303NPLP-40 DNQ g-h 20 - 30 30 2:1 Au, Cu 303N
12XT Series CA g-h-i 5 - 20 20 4:1 Si, Cu, Au, TSV TMAH40XT Series CA g-h-i 20 - 100 60 4:1 Etch, Solder, Cu TMAH / 400K
125nXT Series PP g-h-i 20 - 120 120 6:1 Cu, Au, Solder TMAH / 303N5nXT/15nXT CA g-h-i 5 - 20 20 3:1 Cu, TSV Etch TMAH
TX 1311 CA DUV 3 - 5 5 15:1 Cu, NiFe, Si TMAH
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
4
Three versions to cover various film thickness; -05, -10, -15Chemically Amplified PlatformOutstanding Throughput:
Superior PhotospeedShort Develop Times
Can be used on i-line steppers & aligners (with i-line λ)Compatible to many substrates; Si, Cu, AuCompatible to many plating solutions; Cu Ni, AuIdeal for TSV applications, DRIE processesVery good implant resistanceVery good aspect ratios; allows for thicker coatings for moredifficult etch and implant processes, without compromise onthroughput.Strips in standard processes
AZ® EXP 12XT-20PL SeriesFeatures and Summary
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
5
AZ® EXP 12XT-20PL SeriesOptical Parameters
n & k for 12XT-20PL-05
-0.5
0
0.5
1
1.5
2
2.5
0 200 400 600 800 1000 1200 1400
wavelength (nm)
nk
n, k value @ 350~450nm & 633nm
λ n k351.773 1.6495 0.0046102000455.046 1.6057 0.0019772000627.848 1.5762 0.0000000000
A = 736.54a = 1.535b = 0.019251c = -0.001122
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
6
AZ® EXP 12XT-20PL-05Spin Speed Curve
Spin curve for 12XT-20PL- 05, batch 2518-98 B
234567
500 1000 1500 2000 2500 3000 3500
Spin speed, rpm
Film
thic
knes
s, µ
2518-98 B
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
7
AZ® EXP 12XT-20PL-10Spin Speed Curve
Optitrac coat and BakeHand dispense on 150 mm siliconSpin 1000-4000 rpm for 30 secSB: 110°C/ 180 sec Contact
5
6
7
8
9
10
11
12
13
14
15
1000 1500 2000 2500 3000 3500 4000
Spin Speed (rpm)
Film
Thi
ckne
ss (µ
m)
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
8
AZ® EXP 12XT-20PL-15Spin Speed Curve
Optitrac coat and BakeHand dispense on 150 mm siliconSpin 1000-4000 rpm for 30 secSB: 110°C/ 240 sec Contact
8
10
12
14
16
18
20
22
24
26
1000 1500 2000 2500 3000 3500 4000
Spin Speed (rpm)
Film
Thi
ckne
ss (µ
m)
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
9
Substrate: 150mm SiliconFilm Thickness: 5 µm, static dispenseSoftbake: 110°C / 120sec, contactExposure: i-line stepper, NA=0.48 and Σ=0.55Post Exposure Bake: 90°C / 60 sec, contactDevelop: 2 x 30 sec puddle in AZ 300 MIF (.26N) @23°C
AZ® EXP 12XT-20PL-05 Process Conditions
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
10
10µm 5µm
2.6µm2.2µm
4µm
3µm
8µm
Dose To Print = 120mJ/cm2
FT = 5µm, Silicon
AZ® EXP 12XT-20PL-05 Linearity Comparison
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
11
CD = 5µm
-1.0µm
-0.5µm
0.0µm
0.5µm
1.0µm
1.5µm
2.0µm
2.5µm
3.0µm
CD = 2.6µm
-1.0µm
-0.5µm
0.0µm
0.5µm
1.0µm
1.5µm
2.0µm
2.5µm
3.0µm
Dose To Print = 120mJ/cm2
FT = 5µm, Silicon
AZ® EXP 12XT-20PL-05 Depth of Focus
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
12
80mJ/cm2
90mJ/cm2
100mJ/cm2
110mJ/cm2
120mJ/cm2
130mJ/cm2
140mJ/cm2
150mJ/cm2
160mJ/cm2
170mJ/cm2
180mJ/cm2
AZ® EXP 12XT-20PL-05 Exposure Latitude
Focus = =1.0µmFT = 5µm, Silicon
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
13
Sample: Lot 2518-80Substrate: 150mm Silicon, Copper, and GoldFilm Thickness: 10µmSoftbake: 110°C/180sec, contactExposure: i-line stepper, NA=0.48 and Σ=0.55Post Exposure Bake: 90°C/ 60 sec, contactDevelop: 2 x 60 sec puddle in AZ 300 MIF (.26N) @23°C
AZ® EXP 12XT-20PL-10 Process Conditions
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
14
AZ® EXP 12XT-20PL-10 Linearity / Resolution
Dose to Print 110 mJ/cm²Silicon SubstrateFocus = + 5µm
10 µm(9.92 um)
5 µm(4.85 um)
8 µm(7.93 um)
3 µm(3.07 um)
4 µm(3.90 um)
2.2 µm(2.50 um)
2.4 µm(2.60 um)
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
15
AZ® EXP 12XT-20PL-10 Linearity / Resolution
Linearity @ 110mJ/cm2, +5 focus
0
2
4
6
8
10
12
0 2 4 6 8 10 12
Measured Resist lines (um)
Mas
k no
min
al C
D (u
m)
Resist CD
Dose to Print 110 mJ/cm²Silicon SubstrateFocus = + 5µm
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
16
AZ® EXP 12XT-20PL-10 Exposure Latitude
Mask CD = 10µm Mask CD = 5µm
100 mJ/cm² CD = 11.08 um
Dose to Print 110 mJ/cm²Silicon Substrate
Focus = + 5µm
110 mJ/cm² CD = 9.84 um
120 mJ/cm² CD = 9.28 um 120 mJ/cm² CD = 4.40 um
110 mJ/cm² CD = 4.88 um
100 mJ/cm² CD = 5.20 um
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
17
3
4
1
0
-1
6
2
7
5
AZ® EXP 12XT-20PL-10 Depth of FocusMask CD = 10µm Mask CD = 5µmMeasured
CDMeasured
CD
Dose to Print 110 mJ/cm²Silicon Substrate
3
4
1
0
-1
6
2
7
5
10.00um
9.86um
10.73um
10.93um
11.10um
9.86um
10.43um
9.86um
9.86um
5.22um
5.05um
5.87um
6.44um
6.67um
4.83um
5.55um
4.87um
4.89um
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
18
AZ® EXP 12XT-20PL-10 Depth of Focus
CD DOF @ 110 mJ/cm2
0
2
46
8
10
12
-2 -1 0 1 2 3 4 5 6 7 8
Focus (um)
CD
(um
)
10 um5 um
Dose to Print 110 mJ/cm²Silicon Substrate
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
19
AZ® EXP 12XT-20PL-10 Linearity / Resolution
Dose to Print = variousCopper SubstrateFocus = + 2µm
5 µm
10 µ
5 µ
8 µ
2.2 µ
2 µ
200 mJ/cm² 250 mJ/cm² 300 mJ/cm²
10 µ 8 µ
3 µ
10 µ
5 µ
8 µ
3 µ
5 µ
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
20
3um
0
2um
AZ® EXP 12XT-20PL-10 Depth of Focus for Mask CD = 10µm
Focus = variousCopper SubstrateDose to Print = 200mJ/cm2
10µ FT
1um0um-1um
4um5um6um7um
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
21
3um
4um
1um
0um
-1um
6um
2um
7um
5um
250 mJ/cm² 300 mJ/cm²
AZ® EXP 12XT-20PL-10 Depth of Focus for Mask CD = 10µm
Focus = variousCopper SubstrateDose to Print = 250mJ/cm2
300mJ/cm2
10µ FT
Data for 3-6um Focus was Not available.
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
22
150 mJ/cm² 200 mJ/cm²
10 µm
5 µm
8 µm
3 µm
AZ® EXP 12XT-20PL-10 Linearity / Resolution
Dose to Print = variousGold SubstrateFocus = + 2µm
10 µm
5 µm
8 µm
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
23
3
4
1
0
-1
6
2
7
5
200 mJ/cm²150 mJ/cm²AZ® EXP 12XT-20PL-10
Depth of Focus for Mask CD = 10µm
Focus = variousGold SubstrateDose to Print = 150mJ/cm2
200mJ/cm2
10µ FT
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
24
AZ® EXP 12XT-20PL-15Process Conditions (Lot 2518-119S5)
Substrate: 150mm SiliconFilm Thickness: 15 µm; static dispenseSoftbake: 110°C / 240sec, contactExposure: i-line stepper, conventional illumination
NA=0.48 and Σ=0.55Post Exposure Bake: 90°C/ 60 sec, contactDevelop: 2 x 60 sec puddle in AZ 300 MIF (.26N) @23°C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
25
AZ® EXP 12XT-20PL-15Performance Summary on Silicon
Features (1:1)
Film
Thickness(μm)
DTP (mJ/cm²)
Exposure Latitude
(%)
DOF (μm)
Linearity (μm)
10.0 μm Dense Lines
15.0
286
46
7
2.8
7.0 μm Dense Lines
15.0
316
39
8
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
26
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
AZ® EXP 12XT-20PL-15Exposure Latitude on Silicon; FT=15.0 μm; 10.0 μm L/S
Exposure Dose (mj/cm²)
Mea
sure
d Li
new
idth
(µm
)
8
8.5
9
9.5
10
10.5
11
11.5
12
210 225 240 255 270 285 300 315 330 345 360 375 390 405
286 mj/cm²46% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
27
285 mJ/cm²
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
330 mJ/cm²
300 mJ/cm²
AZ® EXP 12XT-20PL-15Exposure Latitude on Silicon; FT=15.0 μm; 10.0 μm L/S
255 mJ/cm² 270 mJ/cm²240 mJ/cm²
315 mJ/cm²345 mJ/cm²360 mJ/cm²375 mJ/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
28
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
AZ® EXP 12XT-20PL-15Exposure Latitude on Silicon; FT=15.0 μm; 7.0 μm L/S
Exposure Dose (mj/cm²)
Mea
sure
d Li
new
idth
(µm
)
5.5
6
6.5
7
7.5
8
210 225 240 255 270 285 300 315 330 345 360 375 390 405
8.5
316 mj/cm²39% Exposure Latitude
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
29
300 mJ/cm²
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
345 mJ/cm²
315 mJ/cm²
AZ® EXP 12XT-20PL-15Exposure Latitude on Silicon; FT=15.0 μm; 7.0 μm L/S
270 mJ/cm² 285 mJ/cm²255 mJ/cm²
330 mJ/cm²360 mJ/cm²375 mJ/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
30
8.40
8.80
9.20
9.60
10.00
10.40
10.80
11.20
11.60
0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10.00
Focus (µm)
Mea
sure
d Li
new
idth
(µm
)AZ® EXP 12XT-20PL-15
Depth of Focus on Silicon; FT=15.0 μm; 10.0 µm L/S
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
DTP = 285 mj/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
31
AZ® EXP 12XT-20PL-15Depth of Focus on Silicon; FT=15.0 μm; 10.0 µm L/S
2.0 µm 3.0µm 4.0 µm
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
8.0 µm 7.0 µm 6.0 µm9.0 µm
5.0 µm
1.0 µm
DTP = 285 mj/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
32
5.80
6.20
6.60
7.00
7.40
7.80
8.20
0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10.00
Focus (µm)
Mea
sure
d Li
new
idth
(µm
)AZ® EXP 12XT-20PL-15
Depth of Focus on Silicon; FT=15.0 μm; 7.0 µm L/S
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
DTP = 315 mj/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
33
AZ® EXP 12XT-20PL-15Depth of Focus on Silicon; FT=15.0 μm; 7.0 µm L/S
2.0 µm 3.0µm 4.0 µm
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
8.0 µm 7.0 µm 6.0 µm9.0 µm
5.0 µm
1.0 µm
DTP = 315 mj/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
34
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
DTP = 285 mj/cm²
AZ® EXP 12XT-20PL-15Linearity on Silicon; FT=15.0 μm, L/S
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
35
AZ® EXP 12XT-20PL-15Linearity on Silicon; FT=15.0 μm, L/S
8.0 µm 7.0 µm 5.0 µm 4.0 µm
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
2.8 µm 3.0 µm 3.2 µm2.6 µm2.4 µm
3.4 µm
10.0 µm
DTP = 285 mj/cm²
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
36
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Nominal Linewidth (µm)
Mea
sure
d Li
new
idth
(µm
)
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
DTP = 315 mj/cm²
AZ® EXP 12XT-20PL-15Linearity on Silicon; FT=15.0 μm, Contact Holes
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow, SWG, and TARP are trademarks of AZ Electronic Materials.
37
AZ® EXP 12XT-20PL-15Linearity on Silicon; FT=15.0 μm, Contact Holes
5.0 µm 4.5 µm 4.0 µm 3.8 µm
Film Thickness: 15.0 µmOptitrac coat and BakeSB: 110°C/ 240 sec ContactASML 0.48 NA 0.55 σ i-LinePEB: 90°C/ 60 sec ContactAZ 300 MIF 2 X 60 sec spray puddle @ 23 °C
2.8 µm 3.0 µm 3.4 µm
3.6 µm
2.6 µm
DTP = 315 mj/cm²