presentation 020210

McKinney, Texas

Just like an old friend, we can do it all

Microelectronics

Medical

Glass Bonders

Conductive silvers

Optically clear

Encapsulants

Conformal coatings

Electronics

MicroCoat Technologies, LLC

Military

Environmental Environmental

Responsibility Responsibility

&&

Demonstrable Cost Demonstrable Cost SavingsSavings

MicroCoat TechnologiesMicroCoat TechnologiesMicroCoat TechnologiesMicroCoat Technologies


µ

THE 3 MAJOR FACTORS THE 3 MAJOR FACTORS EFFECTING COSTS ARE EFFECTING COSTS ARE …….…….

THE 3 MAJOR FACTORS THE 3 MAJOR FACTORS EFFECTING COSTS ARE EFFECTING COSTS ARE …….…….

APPLICATION SPECIFIC COSTSAPPLICATION SPECIFIC COSTS

TANGIBLE COSTSTANGIBLE COSTS

INTANGIBLE COSTSINTANGIBLE COSTS


µ

Likely to Increase Product Performance, Likely to Increase Product Performance, Durability, & User SafetyDurability, & User Safety

Higher Productivity, as in WIP (Cycle Higher Productivity, as in WIP (Cycle Time)Time)

Regulatory Compliant Materials per Regulatory Compliant Materials per OSHA, EPA, FDAOSHA, EPA, FDA

Lower Energy CostsLower Energy Costs

APPLICATION SPECIFIC COSTS


No Solvents and VOC (Volatile Organic No Solvents and VOC (Volatile Organic Compounds) TreatmentCompounds) Treatment

Less Downtime and MaintenanceLess Downtime and Maintenance Lower Energy CostsLower Energy Costs Less ScrapLess Scrap Less Waste & Waste DisposalLess Waste & Waste Disposal Lower Tooling & Fixturing CostsLower Tooling & Fixturing Costs Lower Labor RatesLower Labor Rates Lower OverheadLower Overhead May Lower Insurance RateMay Lower Insurance Rate Lower Operating CostsLower Operating Costs

Tangible CostsTangible Costs


Intangible Costs Can Be More Compelling Than Intangible Costs Can Be More Compelling Than Tangible CostsTangible Costs

Regulatory CompliantRegulatory Compliant

• -OSHA (Health)-OSHA (Health)

• -FDA (Safety)-FDA (Safety)

• -EPA (Waste Disposal)-EPA (Waste Disposal)

• -No Solvent Handling-No Solvent Handling

• -May Improve Quality-May Improve Quality

• -Higher Capacity Utilization-Higher Capacity Utilization

• -A Process Not Achieved by Another -A Process Not Achieved by Another MethodMethod

Intangible CostsIntangible Costs


Maximizing a Maximizing a Plant'sPlant's

Real Estate Real Estate

• Plant managers (our customers), restructure and Plant managers (our customers), restructure and reconfigure every square inch of the "real estate" reconfigure every square inch of the "real estate" under their care to increase throughput, output under their care to increase throughput, output and quality, reducing labor and waste as much as and quality, reducing labor and waste as much as possible in the process. Capital improvements possible in the process. Capital improvements focus not so much on expanding plant size as on focus not so much on expanding plant size as on wringing as much production as is mechanically wringing as much production as is mechanically and humanly possible from existing capacity. and humanly possible from existing capacity.

• One 6-10 foot UV conveyor will replace ~100-500 One 6-10 foot UV conveyor will replace ~100-500 sq. ft. of conventional ovens and save an sq. ft. of conventional ovens and save an enormous amount of energy dollars and real enormous amount of energy dollars and real estateestate


SHORTENING CYCLE SHORTENING CYCLE TIMETIME SHORTENING CYCLE SHORTENING CYCLE TIMETIME

WIP (Work in Process)WIP (Work in Process)

Labor per PartLabor per Part

Overhead per PartOverhead per Part

REDUCESREDUCES

THE RESULT! THE RESULT!

PRODUCTIVITY INCREASESPRODUCTIVITY INCREASES


The Complete UV/Visible Light The Complete UV/Visible Light

Adhesive Adhesive Assembly PackageAssembly Package

The Complete UV/Visible Light The Complete UV/Visible Light

Adhesive Adhesive Assembly PackageAssembly Package Glob Tops and Underfills for COB & Flip Glob Tops and Underfills for COB & Flip

Chips (Clear & Opaque)Chips (Clear & Opaque) Wire Tacking Wire Tacking Peelable & Water Soluble Masks Peelable & Water Soluble Masks Potting & EncapsulatingPotting & Encapsulating Conformal CoatingsConformal Coatings Conductive & Resistive MaterialsConductive & Resistive Materials


Conformal CoatingsConformal Coatings

UV, Dark Cure & UV, Dark Cure & Heat CureHeat Cure

Conformal CoatingsConformal Coatings

UV, Dark Cure & UV, Dark Cure & Heat CureHeat Cure


UV Cured UV Cured Peelable & Peelable & Water Soluble Water Soluble

Solder MasksSolder Masks Fluorescing,Fluorescing, & Non- & Non-FluorescingFluorescing

UV Cured UV Cured Peelable & Peelable & Water Soluble Water Soluble

Solder MasksSolder Masks Fluorescing,Fluorescing, & Non- & Non-FluorescingFluorescing


Wire TackersWire Tackers Wire TackersWire Tackers


The Application of The Application of Conformal CoatingsConformal Coatings

The Application of The Application of Conformal CoatingsConformal Coatings


Non-Outgassing UV/Multi-Cure EpoxyNon-Outgassing UV/Multi-Cure Epoxy Adhesives for the Disc Drive IndustryAdhesives for the Disc Drive Industry


Inductor Encapsulants For Vacuum Pick & Place Inductor Encapsulants For Vacuum Pick & Place

Air Coil Molded Surface “Flat” Over WiresAir Coil Molded Surface “Flat” Over Wires


Spray or Dip Coatings

UV Cure SMD LED Encapsulants UV Cure SMD LED Encapsulants


Fully Automated, PC Controlled, Fully Automated, PC Controlled, Inductor Molding ProcessInductor Molding Process

DISPENSE BOWL FEED/PLACEMENT KNOCKOUT

UPPER SHIELD

GLASS PLATE 8mm TRACK

1 FOCUSED UV SYSTEM COMPONENT CATCH

MicroCoat Technologies MicroCoat Technologies

McKinney, TXMcKinney, TX


CLASS VI* MEDICAL CLASS VI* MEDICAL ADHESIVESADHESIVES

CLASS VI* MEDICAL CLASS VI* MEDICAL ADHESIVESADHESIVES

FACE MASK BONDINGFACE MASK BONDING STYLUS & CANNULA BONDINGSTYLUS & CANNULA BONDING RESERVOIR BONDINGRESERVOIR BONDING MOLDED SHELL BONDINGMOLDED SHELL BONDING CATHETER BONDINGCATHETER BONDING TUBE SET BONDINGTUBE SET BONDING * PASSES MOLD SPORE INITIATION* PASSES MOLD SPORE INITIATION

FOR:


UV Cured Hearing AidUV Cured Hearing Aid Shells & Forms Shells & Forms UV Cured Hearing AidUV Cured Hearing Aid Shells & Forms Shells & Forms

Hard or Flexible ShellsHard or Flexible Shells Opaque Glob Top Over ICOpaque Glob Top Over IC

ITC & CIC Hearing Aid ITC & CIC Hearing Aid Shells , Fill, & IC Glob TopShells , Fill, & IC Glob Top


MicroCoat TechnologiesMicroCoat Technologies

Moisture Protection for Moisture Protection for SwitchesSwitches

Electrical/Electronic Equipment Automotive Machine Tools Medical Equipment and DevicesTrucks and Busses Heavy Equipment Lawn and Garden Restaurant Equipment


Restriction on Hazardous Substances Restriction on Hazardous Substances (RoHS) (RoHS)

Waste Electrical and Electronic Equipment Waste Electrical and Electronic Equipment (WEEE) (WEEE)

• On July 1, 2006, the European Union will begin restricting the material content On July 1, 2006, the European Union will begin restricting the material content of electronics products being shipped within and into the EU. Several elements of electronics products being shipped within and into the EU. Several elements and compounds are involved, but the most common is lead (Pb). “Lead-Free” and compounds are involved, but the most common is lead (Pb). “Lead-Free” isn’t just about manufacturing, it is about doing business in Europe, and isn’t just about manufacturing, it is about doing business in Europe, and electronics companies cannot wait until 2006 to get started. electronics companies cannot wait until 2006 to get started.

• MicroCoat Technologies has developed both epoxy and acrylic conformal MicroCoat Technologies has developed both epoxy and acrylic conformal coatings to help alleviate fears of tin whisker contamination floating around coatings to help alleviate fears of tin whisker contamination floating around your circuitry. MCT also manufactures special harder Dual Cure (UV/Thermal) your circuitry. MCT also manufactures special harder Dual Cure (UV/Thermal) coatings for coating tight lead space IC’s for protection against tin whisker coatings for coating tight lead space IC’s for protection against tin whisker migration across very small pitch leadsmigration across very small pitch leads

• Call or E-mail us today for more information about these materialsCall or E-mail us today for more information about these materials• Tel: +1-972-678-4950 Fax: +1-214-257-8890 or E-Mail to Tel: +1-972-678-4950 Fax: +1-214-257-8890 or E-Mail to

[email protected] LinksRoHS Links

• Government SitesGovernment Sites http://www.dti.gov.uk/sustainability/pdfs/finalrohs.pdf http://www.dti.gov.uk/sustainability/weee/http://www.dti.gov.uk/sustainability/weee/

• Industry Sites: Industry Sites: http://www.leadfree.org/ http://www.nemi.org/• Independent Sites: Independent Sites: http://www.pb-free.info/ http://www.pb-free.com/

mailto:[email protected]

http://www.dti.gov.uk/sustainability/pdfs/finalrohs.pdf

http://www.leadfree.org/

http://www.nemi.org/

http://www.pb-free.info/

http://www.pb-free.com/


Lead Coating To Reduce The Lead Coating To Reduce The Possibility Of Tin Whisker Possibility Of Tin Whisker Migration On Fine Pitch IC’sMigration On Fine Pitch IC’s

MICROELECTRONICSMICROELECTRONICS MICROELECTRONICSMICROELECTRONICS


Optically Clear Glob Tops Optically Clear Glob Tops forfor IC’s, LED’s, EPROMS, Etc. IC’s, LED’s, EPROMS, Etc.

Without SiliconeWithout Silicone

Optically Clear Glob Tops Optically Clear Glob Tops forfor IC’s, LED’s, EPROMS, Etc. IC’s, LED’s, EPROMS, Etc.

Without SiliconeWithout Silicone Refractive Index 1.49 - 1.91!!!!!Refractive Index 1.49 - 1.91!!!!! Transmissivity @ 990nm 99%Transmissivity @ 990nm 99% R-I 1.9 @ 850 nmR-I 1.9 @ 850 nm Operating Temperature Range Operating Temperature Range

of -55C to +150C of -55C to +150C

UV Curable in < 20 seconds !UV Curable in < 20 seconds !MicroCoat Technologies, LLC

Optically Clear UV Cured Optically Clear UV Cured

Photo Cell Coatings Photo Cell Coatings



Optically Clear Coatings Optically Clear Coatings and Adhesives for;and Adhesives for;

•WADM Modules •Modulators•Attenuators•Pump Lasers•Switches•Amplifiers

Picture of Sinclair Manuf. Packages

Smart Card IC Smart Card IC CoatingsCoatings Smart Card IC Smart Card IC CoatingsCoatings



Epoxy Sealing of Hybrids Epoxy Sealing of Hybrids and Power Devicesand Power Devices

Epoxy Sealing of Hybrids Epoxy Sealing of Hybrids and Power Devicesand Power Devices

Non-conductive adhesives for lid sealing, die attach, etc.Non-conductive adhesives for lid sealing, die attach, etc.

Passes gross leak, temp cycle, temp shock.Passes gross leak, temp cycle, temp shock.

Withstands die attach to >340CWithstands die attach to >340C

JOE’S HYBRIDCOMPANY

MCT 3417Hi Temp Sealing

Passes 340C Die Attach 5 minutesPasses 350 Cycles -65C- +150C

Passes 85/85Passes Gross Leak


MicroCoat Technologies

1316 Somerset Drive McKinney, TX 75070 www.m-coat.com +1-972-678-4950 Fax +1-214-257-8890

Unparalleled in Polymer Coatings and Adhesives Technology TM

Product Data Sheet

MicroCoat 3417-2

A Single Component, Toughened, Microelectronic Grade Package Sealant with a Service Temperature of <-100oC to Over >340°C and Meets NASA Low Outgassing Specifications

MicroCoat 3417-2 features a unique blend of performance properties including both high shear and peel strengths along with convenient handling and high/low temp properties. This is a one component system formulated to cure at elevated temperatures. 3417-2 has a number of outstanding processing advantages;

No mixing is necessary prior to use. The viscosity remains constant with time (i.e. it will not thicken over time) Working life is unlimited at room temperature, and the material is room temperature storable No cleanup required in-between shifts

MicroCoat 3417-2 forms high strength bonds for service over the remarkably wide temperature range of <-100oC to over 300°C and is used for Microelectronic Package Sealing for Kovar/Ceramic, Ceramic/Ceramic, Ceramic/Thick Film Gold, Pd/Au, Pt/Pd/Au, etc sealing. As a toughened system, 3417-2 offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking. It is 100% reactive and does not contain any diluents or solvents. 3417-2 is remarkably resistant to severe thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. Adhesion to metals, glass, and ceramics is excellent. The cured epoxy is a superior electrical insulator and is colored is gray. MicroCoat Polymer System 3417-2’s high performance coupled with its convenient handling make it widely used in a variety of applications in the aerospace, electronic, microelectronics, electrical, automotive and chemical industries. MicroCoat 3417-2 will meet NASA low outgassing specifications. Product Advantages

A single component system; no mixing required prior to use, no viscosity changes over time. Room temperature storable; not premixed and frozen! Versatile cure schedules. High shear and peel strength to similar and dissimilar substrates over the remarkably wide

temperature range of -100oC – 340oC. (Note: Color changes to slightly amber >300oC) Passes Gross Leak – Seal Integrity - Mil-Std-883 Method 5005 Sub Group 3 Mil-Std-883 1014 2)

Gross Leak Test Good electrical insulating properties and chemical resistance. Superior thermal shock, impact and stress cracking fatigue resistance, Will meet NASA low outgassing per ASTM E-595, NASA MSFC 1443, Mil-Std-883 5011.4 (3.8.6) RoHS Compliant

The information contained herein, is, to the best of our knowledge accurate. However, MicroCoat Technologies, LLC does not assume any liability whatsoever for the accuracy or completeness of the information contained herein. Final determination of the suitability of any material is the sole responsibility of the user. The information contained herein is considered typical properties and is not intended to be used as specifications for our products. This information is offered solely to assist purchasers in selecting the appropriate products for purchaser’s own testing. All products may present unknown hazards and should be used with the proper precautions. Although certain hazards are described herein and in the Material Safety Data Sheets, we cannot guarantee that these are the only hazards that exist. Repeated and prolonged exposure to epoxy resins can cause sensitization or other allergic responses.

Conductive, Non-Conductive, Non-Conductive, Conductive, and and Thermally Conductive Die Attach Thermally Conductive Die Attach

Adhesives Adhesives

Conductive, Non-Conductive, Non-Conductive, Conductive, and and Thermally Conductive Die Attach Thermally Conductive Die Attach

Adhesives Adhesives

Al2O3

AlN

BoN

Diamond

Ag


In electronics, thermal management is crucial in both the design of circuit-board assemblies and in the production of semiconductor materials. For PC boards a crucial aspect can be the heating or cooling power required to keep a circuit within its specified operating temperature range.In the manufacturing of silicon wafers it is important to maintain a very uniform temperature distribution across the wafer in order to achieve quality production processes and high yields.

Conductive AdhesivesConductive Adhesives

• SMD Attach To PCB and SMD Attach To PCB and CeramicCeramic

• Screen Printing TracesScreen Printing Traces• Die AttachDie Attach• Solder ReplacementSolder Replacement• Flex Silver TracesFlex Silver Traces• Flex Carbon TracesFlex Carbon Traces• Anti-StaticAnti-Static• Chip Component TerminationChip Component Termination• Tantalum Capacitor Tantalum Capacitor

TerminationTermination• Static DischargeStatic Discharge• Platable For SMD ComponentsPlatable For SMD Components• Quick-Set PCB RepairQuick-Set PCB Repair• Bio-SensorsBio-Sensors• Silver Spray-OnSilver Spray-On

Low Outgassing Die AttachLow Outgassing Die AttachAdhesivesAdhesives

UV/Heat Cure for HighUV/Heat Cure for HighAccuracy Placement of Accuracy Placement of Opto DevicesOpto Devices


Advantages of Advantages of Conductive Conductive Adhesives Adhesives Over SolderOver Solder• Low Thermal Processing StressLow Thermal Processing Stress• Thermomechanical Fatigue ResistanceThermomechanical Fatigue Resistance• Low VOC’sLow VOC’s• Eliminates Solder MaskEliminates Solder Mask• Excellent Fine PitchExcellent Fine Pitch• Wide Process WindowWide Process Window• NO Residues, high SIRNO Residues, high SIR• No CleanNo Clean• NO LEAD!!NO LEAD!!



• 85% Ag – NO ORGANICS85% Ag – NO ORGANICS• NO Outgassing – NONE!, NO Outgassing – NONE!,

NADA!, ZIPPO!, LING!, NULL!, NADA!, ZIPPO!, LING!, NULL!, REI!REI!

DOWN THE HOLE

LAUNCH

PAD

APPROVED FOR A HARD LANDING ON VENUS!!!!!!!APPROVED FOR A HARD LANDING ON VENUS!!!!!!!

SUPER HIGH SUPER HIGH TEMPERATURETEMPERATURE CONDUCTIVE CONDUCTIVE

DIE ATTACH ADHESIVE TO DIE ATTACH ADHESIVE TO >650>650ooCC

Wirebonded Die394-95Ni/Moly TabEutectic Bond (Sn/Ge)Au PadSubstrate

UV/Thermal Cure UV/Thermal Cure Conductive Conductive Adhesive for Adhesive for Die AlignmentDie Alignment

AdhesiveAdhesive Die Attach Die Attach Align &Align & Thermal Thermal Perfectly Aligned DevicesPerfectly Aligned Devices DispenseDispense UV CureUV Cure Cure Cure

UV Light Wand



Flip Chip Bumping Using Flip Chip Bumping Using Conductive Conductive

SilverSilver• Adhesive bumpingAdhesive bumping is a flip-chip bumping is a flip-chip bumping

process that stencils electrically conductive process that stencils electrically conductive adhesive over an under-bump metallization adhesive over an under-bump metallization placed over the bond pad. The stenciled placed over the bond pad. The stenciled adhesive serves as the bump after it has adhesive serves as the bump after it has been cured. Mounting of adhesive-bumped been cured. Mounting of adhesive-bumped flip-chips also uses conductive adhesives. flip-chips also uses conductive adhesives.

Stenciled Conductive Ag

UV Cure Low Temperature UV Cure Low Temperature Glass Glass Replacement for Hybrid Replacement for Hybrid CircuitsCircuits

UV Cure Low Temperature UV Cure Low Temperature Glass Glass Replacement for Hybrid Replacement for Hybrid CircuitsCircuits

100% Solids100% Solids<25 Second Cure Time<25 Second Cure TimeWithstands 230Withstands 230ooC Solder ReflowC Solder ReflowPrint and Cure Before or After TrimmingPrint and Cure Before or After TrimmingNo Post Cure Resistor Drift - No Post Cure Resistor Drift - NoneNone!!


Optoelectronic“Light Pipe” System

OptoelectronicOptoelectronicOptoelectronic“Light Pipe” System“Light Pipe” System“Light Pipe” System

• Customer Problem Solving

LED DETECTORLED DETECTOR


?


An optoelectronic “Light Pipe” System An optoelectronic “Light Pipe” System for Optical Switchesfor Optical Switches





Optically clear Coating




White Reflective Coating




Optional Black Coating


Optical SwitchOptical Switch



Thermoelectric Thermoelectric ComponentsComponents Thermoelectric Thermoelectric ComponentsComponents

HOT’N-COLD CO.HOT’N-COLD CO.

Moderately Flexible, Moderately Flexible, High Temperature, UV CureHigh Temperature, UV CureCoatingCoating

Peltier DevicePeltier Device


UV and UV/Visible UV and UV/Visible Light Light Curing Curing EquipmentEquipment

UV and UV/Visible UV and UV/Visible Light Light Curing Curing EquipmentEquipment


The Energy Rule The Energy Rule The Waste Disposal RuleThe Waste Disposal RuleThe Labor RuleThe Labor Rule The WIP RuleThe WIP Rule The Overhead RuleThe Overhead Rule The Capacity RuleThe Capacity Rule The Real Estate RuleThe Real Estate Rule

The UV Rules ofThe UV Rules of ResponsibilityResponsibility


SHORTENING CYCLE SHORTENING CYCLE TIMETIME SHORTENING CYCLE SHORTENING CYCLE TIMETIME

WIP (Work in Process)WIP (Work in Process)

Labor per PartLabor per Part

Overhead per PartOverhead per Part

REDUCESREDUCES

THE RESULT THE RESULT

Higher ProfitsHigher ProfitsMicroCoat Technologies, LLC

presentation 020210

Documents

wires microcoat technologies

tx microcoat technologies

llc spray

llc military

maintenance lower energy

conformal coatings uv

acrylic conformal coatings

dip coatings