rf-ti1352b1 low-power sub-1g + 2.4 g dual-band multi ... · rf-ti1352b1 low-power sub-1g + 2.4 g...

RF-TI1352B1 Low-power Sub-1G + 2.4 G

Dual-band Multi-Protocol Module

Version 1.0

Shenzhen RF-star Technology Co., Ltd.

Apr. 09th, 2020

RF-TI1352B1

www.szrfstar.com V1.0 - Apr., 2020

Shenzhen RF-star Technology Co., Ltd. Page 1 of 20

TI CC131X Sub-1 GHz Module List

Chipset Core FLASH

(KB)

RAM

(KB) Model Antenna

Freq.

(MHz)

Dimension

(mm)

TX

Power

(dBm)

Range

(M) Photo

CC1310

F128RGZ M3 128 8

RF-SM-1077B1 IPEX 868

915 18 26 14 2500

RF-SM-1077B2 IPEX 433

470 18 26 15 2500

CC1310

F128RSM M3 128 8

RF-SM-1044B1 PCB 868

915 14 22 14 2500

RF-SM-1044B2 PCB 868

915 9 12.5 14 2500

RF-SM-1044B4 Half-

hole

868

915 14 22 14 2500

Contact

Me

CC1352R M4F 352 80 RF-TI1352B1 IPEX 868

915 16.8 26.5

5 BLE:

500

5 ZigBee:

300

14 868 MHz:

1500

Note:

1. The communication distance is the longest distance obtained by testing the module's maximum transmission power

in an open and interference-free environment in sunny weather.

2. Click the picture to buy modules.

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RF-TI1352B1



1 Device Overview

1.1 Description

RF-TI1352B1 is an RF module based on TI lower-power SoC CC1352R. It integrates a 48 MHz and a 32.768 kHz crystal,

a 256 KB ROM, a 352 KB Flash, and two IPEXs to guarantee the external antenna connection. Its ARM® Cortex®-M4F

core application processor can operate at extremely low current at flexible power modes. It features small size, robust

connection distance, and rigid reliability. It supports Sub GHz and 2.4 GHz multi-protocol and can be preprogrammed

with a serial interface communication protocol for Thread, ZigBee, BLE5.0 and TI 15.4-Stack (Sub 1GHz). 1.27-mm pitch

stamp stick package for easy assembling and cost-effective PCB design.

1.2 Key Features

• Microcontroller

- Powerful 48 MHz ARM® Cortex®-M4F

processor

- 352 of in-system programmable flash

- 256 KB of ROM for protocols and library

functions

- 8 KB of Cache SRAM

- 80 KB 0f ultra-low leakage SRAM.

- Supports OTA upgrade

• Peripherals

- Digital peripherals can be routed to 28

GPIOs

- 12-Bit ADC, 200 k Samples/s, 8 channels

- 2 × UART

- 2 × SPI

- I2C

- I2S

- 2 × comparators with internal reference DAC

(1 × continuous time, 1 × ultra-low power)

• Radio Section

- Suitable for systems targeting complicance

with worldwide radio frequency regulations：

ISM Sub 1GHz (433 MHz, 868 MHz, 915 MHz)

+ 2.4 GHz

- Multi-protocol supports of Sub 1GHz and 2.4

GHz: Thread, ZigBee, BT5.0 and IEEE

802.15.4 PHY and MAC

• Low Power

- Wide supply voltage range 1.8 V ~ 3.8 V

- Active-mode RX: 5.8 mA (3.6 V, 868 MHz),

6.9 mA (3.0 V, 2.4 GHz)

- Active-Mode TX 0 dBm: 8.0 mA (3.6 V, 868

MHz), 7.1 mA (3.0 V, 2.4 GHz)

- Active-Mode TX at +14 dBm: 24.9 mA (868

MHz)

- Active-Mode MCU 48 MHz (CoreMark): 2.9

mA (60 μA/MHz)

- Sensor Controller, Low Power-Mode, 2 MHz,

running infinite loop: 30.8 μA

- Sensor Controller, Active-Mode, 24 MHz,

running infinite loop: 808 μA

- Standby: 0.85 μA (RTC on, 80KB RAM and

CPU retention)

- Shutdown: 150 nA (wakeup on external

events)

http://www.szrfstar.com/

RF-TI1352B1



1.3 Applications

• Home automation

• Smart plug and metering

• Home appliances

• Sensor nodes

• Security systems

• Industrial control

• Wearables

• Building automation

• Sensor networks

• Medical devices

• Gaming controller

• Remote controls

1.4 Functional Block Diagram

Figure 1. Functional Block Diagram of RF-TI1352B1

CC1352R

GPIO

Power Filter

48.0 MHz 32.768 kHz

Reset

Sub-1 G Matching

2.4 G Matching

IPEX

IPEX

Half Hole

Half Hole


RF-TI1352B1



Table of Contents

TI CC131X Sub-1 GHz Module List ............................................................................................................................ 1

1 Device Overview ............................................................................................................................................................. 2

1.1 Description............................................................................................................................................................ 2

1.2 Key Features ....................................................................................................................................................... 2

1.3 Applications .......................................................................................................................................................... 3

1.4 Functional Block Diagram .............................................................................................................................. 3

Table of Contents ................................................................................................................................................................ 4

Table of Figures ................................................................................................................................................................... 5

Table of Tables ..................................................................................................................................................................... 5

2 Module Configuration and Functions ...................................................................................................................... 6

2.1 Module Parameters ........................................................................................................................................... 6

2.2 Module Pin Diagram ......................................................................................................................................... 7

3.3 Pin Functions ....................................................................................................................................................... 7

3 Specifications ................................................................................................................................................................... 9

3.1 Absolute Maximum Ratings ........................................................................................................................... 9

3.2 Recommended Operating Conditions ....................................................................................................... 9

3.3 Power Consumption ......................................................................................................................................... 9

3.3.1 Power Consumption on Power Modes ......................................................................................... 9

3.3.2 Power Consumption on Radio Modes ........................................................................................ 11

3.4 Antenna ................................................................................................................................................................ 12

4 Application, Implementation, and Layout............................................................................................................. 13

4.1 Module Photos .................................................................................................................................................. 13

4.2 Recommended PCB Footprint .................................................................................................................... 13

4.3 Antenna ................................................................................................................................................................ 14

4.4 Schematic Diagram ......................................................................................................................................... 15

4.5 Basic Operation of Hardware Design ...................................................................................................... 15

4.6 Trouble Shooting .............................................................................................................................................. 16

4.6.1 Unsatisfactory Transmission Distance ........................................................................................ 16

4.6.2 Vulnerable Module .............................................................................................................................. 16


RF-TI1352B1



4.6.3 High Bit Error Rate ............................................................................................................................. 17

4.7 Electrostatics Discharge Warnings ........................................................................................................... 17

4.8 Soldering and Reflow Condition ................................................................................................................. 17

4.9 Optional Packaging ......................................................................................................................................... 18

5 Revision History ............................................................................................................................................................ 19

6 Contact Us ....................................................................................................................................................................... 20

Table of Figures

Figure 1. Functional Block Diagram of RF-TI1352B1 ................................................................................. 3

Figure 2. Pin Diagram of RF-TI1352B1 ............................................................................................................ 7

Figure 3. The Specification of Antenna Seat ................................................................................................ 12

Figure 4. The Specification of IPEX Wire ....................................................................................................... 12

Figure 5. Photos of RF-TI1352B1 ..................................................................................................................... 13

Figure 6. Recommended PCB Footprint of RF-TI1352B1 ...................................................................... 13

Figure 7. Specification of Antenna Seat ......................................................................................................... 14

Figure 8. Specification of IPEX Wire ................................................................................................................ 14

Figure 9. Schematic Diagram of RF-TI1352B1 ........................................................................................... 15

Figure 10. Recommended Reflow for Lead Free Solder ......................................................................... 18

Figure 11. Optional Packaging Mode .............................................................................................................. 18

Table of Tables

Table 1. Parameters of RF-TI1352B1 ................................................................................................................ 6

Table 2. Pin Functions of RF-TI1352B1............................................................................................................ 7

Table 3. Absolute Maximum Ratings .................................................................................................................. 9

Table 4. Recommended Operating Conditions of RF-TI1352B1 ............................................................ 9

Table 5. Table of Power Consumption on Power Modes ........................................................................... 9

Table 6. Table of Power Consumption on Radio Modes .......................................................................... 11


RF-TI1352B1



2 Module Configuration and Functions

2.1 Module Parameters

Table 1. Parameters of RF-TI1352B1

Chipset CC1352R

Supply Power Voltage 1.8 V ~ 3.8 V, 3.3 V is recommended

Frequency 868 MHz, 902 MHz ~ 928 MHz, 2400 MHz ~ 2480 MHz

Maximum Transmit Power +14.0 dBm @ Sub 1GHz

+5.0 dBm @ 2.4 GHz

Receiving Sensitivity

-121 dBm @ Sub GHz (Long-range Mode)

-110 dBm @ Sub GHz (50 kbps)

-105 dBm @ BT 5.0 (LE Coded PHY)

GPIO 28

Power Consumption

RX current: 5.8 mA @3.6 V, 868 MHz

6.9 mA @3.0 V, 2.4 GHz

TX current: 8.0 mA @ 0 dBm, 3.6 V, 868 MHz

7.1 mA @ 0 dBm, 3.0 V, 2.4 GHz

24.9 mA @ +14 dBm, 3.6 V, 868 MHz

Sensor Controller (Low Power-Mode, 2 MHz): 30.8 μA

Sensor Controller (Active-Mode, 24 MHz): 808 μA

Standby mode: 0.85 µA

Sleep Mode: 150 nA

Support Protocol Thread, ZigBee, BT 5.0 and TI 15.4-Stack (Sub 1GHz)

Crystal 48 MHz, 32.768 kHz

Package SMT packaging

Communication Interface UART, SPI, I2C, I2S

Dimension 26.5 mm × 16.8 mm

Type of Antenna IPEX version 1 / Half hole

Operating Temperature -40 ℃ ～ +85 ℃

Storage Temperature -40 ℃ ～ +125 ℃


RF-TI1352B1



2.2 Module Pin Diagram

Figure 2. Pin Diagram of RF-TI1352B1

3.3 Pin Functions

Table 2. Pin Functions of RF-TI1352B1

Pin Name Function Description

1 P03 GPIO GPIO, Sensor Controller

2 P04 GPIO GPIO, Sensor Controller

3 P05 GPIO GPIO, Sensor Controller, high-drive capability



6 P08 GPIO GPIO

7 P09 GPIO GPIO

8 P10 GPIO GPIO

9 P11 GPIO GPIO

10 P12 GPIO GPIO

11 P13 GPIO GPIO


RF-TI1352B1



12 P14 GPIO GPIO

13 P15 GPIO GPIO, JTAG_TDO, high-drive capability

14 VDD VDD Power Supply: 2.0 V ~ 3.6 V, recommend to 3.3 V

15 GND GND Ground

16 TMS TMS JTAG_TMS

17 TCK TCK JTAG_TCK

18 RES RES Reset, active low. No internal pullup resistor.

19 P16 GPIO GPIO, JTAG_TDI, high-drive capability

20 P17 GPIO GPIO

21 P18 GPIO GPIO

22 P19 GPIO GPIO

23 P20 GPIO GPIO

24 P21 GPIO GPIO

25 P22 GPIO GPIO

26 P23 GPIO GPIO, Sensor Controller, analog








34 GND GND Ground

35 2G4-OUT RF Out 2.4 GHz antenna pin out

36 GND Antenna Ground

37 SUB-OUT RF Out Sub 1GHz antenna pin out

38 GND GND Ground


RF-TI1352B1



3 Specifications

3.1 Absolute Maximum Ratings

Table 3. Absolute Maximum Ratings

Identification Condition Min. Typ. Max. Unit

Supply Voltage Battery mode -0.3 3.3 4.1 V

Input Level Sub 1 GHz RF pins 10 dBm

Input Level 2.4 GHz RF Pins 5 dBm

Storage Temperature / -40 25 150 ℃

3.2 Recommended Operating Conditions

Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table

below. Long-term work beyond this limit will affect the reliability of the module more or less.

Table 4. Recommended Operating Conditions of RF-TI1352B1

Items Condition Min. Typ. Max. Unit

Operating Supply Voltage 1.8 3.3 3.8 V

Operating Supply Voltage (Boost

mode)

VDDR = 1.95 V

+14 dBm RF output power 2.1 3.8 V

Operating Temperature -40 +25 +85 ℃

Notes：

(1) The operating temperature is limited to the change of crystal’s frequency;

(2) To ensure the RF performance, the ripple wave on the source must be less than ±300 mV.

3.3 Power Consumption

3.3.1 Power Consumption on Power Modes

Table 5. Table of Power Consumption on Power Modes

When measured on the RF-TI1352B1 reference design with Tc = 25 ℃, VDDS = 3.6 V with DC/DC enabled unless

otherwise noted.

Parameter Test Conditions Typ. Unit

Core Current Consumption

Icore Reset and Shutdown Reset. RESET_N pin asserted or VDDS below power-on-

reset threshold 150 nA


RF-TI1352B1



Shutdown. No clocks running, no retention 150 μA

Standby without cache

retention

RTC running, CPU, 80KB RAM and (partial) register

retention.

RCOSC_LF

0.85 μA


retention.

XOSC_LF

0.99 μA

Standby

with cache retention


retention.

RCOSC_LF

2.78 μA


retention.

XOSC_LF

2.92 μA

Idle Supply Systems and RAM powered

RCOSC_HF 590 μA

Active MCU running CoreMark at 48 MHz

RCOSC_HF 2.89 μA

Peripheral Current Consumption

Iperi

Peripheral power

domain Delta current with domain enabled 82.3

μA

Serial power domain Delta current with domain enabled 5.5 μA

RF Core Delta current with power domain enabled,

clock enabled, RF core idle 178.9 μA

μDMA Delta current with clock enabled, module is idle 53.6 μA

Timer Delta current with clock enabled, module is idle 67.8 μA

I2C Delta current with clock enabled, module is idle 8.2 μA

I2S Delta current with clock enabled, module is idle 21.7 μA

SSI Delta current with clock enabled, module is idle 69.4 μA

UART Delta current with clock enabled, module is idle 140.8 μA


RF-TI1352B1



CRYPTO (AES) Delta current with clock enabled, module is idle 21.1 μA

PKA Delta current with clock enabled, module is idle 71.1 μA

TRNG Delta current with clock enabled, module is idle 29.7 μA

Sensor Controller Engine Consumption

ISCE

Active mode 24 MHz, Infinite loop, VDDS = 3.0 V 808.5 μA

Low-power mode 2 MHz, Infinite loop, VDDS = 3.0 V 30.1 μA

3.3.2 Power Consumption on Radio Modes

Table 6. Table of Power Consumption on Radio Modes

When measured on the RF-TI1352B1 reference design with Tc = 25 °C, VDDS = 3.6 V with DC/DC enabled unless

otherwise noted.

Using boost mode (increasing VDDR up to 1.95 V), will increase system current by 15% (does not apply to TX +14

dBm setting where this current is already included).

Relevant Icore and Iperi currents are included in below numbers.

Parameters Test Conditions Typ. Unit

Radio receive current, 868 MHz 5.8 mA

Radio receive current, 2.4 GHz (BLE) VDDS – 3.0 V 6.9 mA

Radio transmit current

Sub-1 GHz PA

0 dBm output power setting

868 MHz

8.0 mA

+10 dBm output power setting

868 MHz 14.3 mA


Boost mode, Sub-1 GHz PA


868 MHz

24.9 mA


2.4 GHz PA (BLE)

0 dBm output power setting, VDDS = 3.0 V 7.1 mA


2440 MHz, VDDS = 3.0 V 9.6 mA


RF-TI1352B1



3.4 Antenna

RF-TI1352B1 module is integrated the IPEX version 1 antenna seat, the specification of antenna seat is as follow:

Figure 3. The Specification of Antenna Seat

The specification of IPEX wire end is as follow:

Figure 4. The Specification of IPEX Wire


RF-TI1352B1



4 Application, Implementation, and Layout

4.1 Module Photos

Figure 5. Photos of RF-TI1352B1

4.2 Recommended PCB Footprint

Figure 6. Recommended PCB Footprint of RF-TI1352B1


RF-TI1352B1



4.3 Antenna

RF-TI1352B1 module is integrated the IPEX version 1 antenna seat, the specification of antenna seat is as follow:

Figure 7. Specification of Antenna Seat

The specification of IPEX wire end is as follow:

Figure 8. Specification of IPEX Wire


RF-TI1352B1



4.4 Schematic Diagram

Figure 9. Schematic Diagram of RF-TI1352B1

4.5 Basic Operation of Hardware Design

1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and

the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the

power supply. Otherwise, the reverse connection may cause permanent damage to the module;

2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged

if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

voltage.

3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,

which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the

power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.

4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.

If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top

Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital

part of module and routed in the Bottom Layer (all copper is well grounded).

5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer

or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;

6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect


RF-TI1352B1



the module performance. It is recommended to stay away from the module according to the strength of the

interference. If circumstances permit, appropriate isolation and shielding can be done.

7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,

high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended

to stay away from the module according to the strength of the interference. If circumstances permit, appropriate

isolation and shielding can be done.

8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for

example: USB 3.0;

9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the

antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality

antenna extension wire can be used to extend the antenna to the outside of the case.

10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

4.6 Trouble Shooting

4.6.1 Unsatisfactory Transmission Distance

1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.

Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The

performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to

the ground.

2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.

3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the

metal shell.

4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The

higher the data rate, the closer the distance.

5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower

the voltage, the smaller the power is.

6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.

4.6.2 Vulnerable Module

1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged

if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

voltage.

2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.


RF-TI1352B1



3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.

If there is no special demand, it is not recommended to use at too high or too low temperature.

4.6.3 High Bit Error Rate

1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or

modify the frequency and channel to avoid interferences.

2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.

3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.

4.7 Electrostatics Discharge Warnings

The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions

below:

1. According to the anti-static measures, bare hands are not allowed to touch modules.

2. Modules must be placed in anti- static areas.

3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.

Static may result in the degradation in performance of module, even causing the failure.

4.8 Soldering and Reflow Condition

1. Heating method: Conventional Convection or IR/convection.

2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent

methods.

3. Solder paste composition: Sn/3.0 Ag/0.5 Cu

4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.

5. Temperature profile: Reflow soldering shall be done according to the following temperature profile.

6. Peak temperature: 245 ℃.


RF-TI1352B1



Figure 10. Recommended Reflow for Lead Free Solder

4.9 Optional Packaging

Figure 11. Optional Packaging Mode

Note: Default tray packaging.


RF-TI1352B1



5 Revision History

Date Version No. Description Author

2019.06.24 V1.0 The Initial version is released. Aroo Wang

2020.04.09 V1.0 Add TI CC131X Sub-1 GHz module list. Sunny Li


RF-TI1352B1



6 Contact Us

SHENZHEN RF-STAR TECHNOLOGY CO., LTD.

Shenzhen HQ:

Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China

Tel.: 86-755-3695 3756

Chengdu Branch:

Add.: No. B4-12, Building No.1, No. 1480 Tianfu Road North Section (Incubation Park), High-Tech Zone, Chengdu,

China (Sichuan) Free Trade Zone, 610000

Tel.: 86-28-6577 5970

Email: [email protected], [email protected]

Web.: www.szrfstar.com

http://www.szrfstar.com/mailto:[email protected]://www.szrfstar.com/

TI CC131X Sub-1 GHz Module List1 Device Overview1.1 Description1.2 Key Features1.3 Applications1.4 Functional Block Diagram

Table of ContentsTable of FiguresTable of Tables2 Module Configuration and Functions2.1 Module Parameters2.2 Module Pin Diagram3.3 Pin Functions

3 Specifications3.1 Absolute Maximum Ratings3.2 Recommended Operating Conditions3.3 Power Consumption3.3.1 Power Consumption on Power Modes3.3.2 Power Consumption on Radio Modes

3.4 Antenna

4 Application, Implementation, and Layout4.1 Module Photos4.2 Recommended PCB Footprint4.3 Antenna4.4 Schematic Diagram4.5 Basic Operation of Hardware Design4.6 Trouble Shooting4.6.1 Unsatisfactory Transmission Distance4.6.2 Vulnerable Module4.6.3 High Bit Error Rate

4.7 Electrostatics Discharge Warnings4.8 Soldering and Reflow Condition4.9 Optional Packaging

5 Revision History6 Contact Us

rf-ti1352b1 low-power sub-1g + 2.4 g dual-band multi ... · rf-ti1352b1 low-power sub-1g + 2.4 g...

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