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SEMI E6-1296 © SEMI 1982, 19961

SEMI E6-1296N/A© SEMI 1982, 1996FACILITIES INTERFACE SPECIFICATIONS GUIDELINE AND FORMAT

1 Purpose

This guideline is intended to assist suppliers with thecommunication of information about the facilitiesneeds of their equipment to those who are responsiblefor the facilities design and the equipment installation.

The successful installation and operation of semicon-ductor equipment is the mutual objective of the ownerof the equipment, the operator, the installer, and thesupplier. Within the semiconductor industry, the diver-sity and complexity of equipment have created signifi-cant problems for those who design the facilities andinstall the equipment. It is very difficult to stay currentwith the ever-changing requirements necessary forindividual pieces of equipment. As a result, it is diffi-cult to guarantee that the facilities will meet the needsof each piece of equipment.

2 Scope

Design and installation requirements vary with eachowner and project. Therefore, this guideline isdesigned to cover all activities that may be includedwith equipment installation.

3 Impact

Any supplier who uses this format is expected toinclude within the document all requirements for thesite facilities, equipment shipping, installation, startup,acceptance test, and training. This is a guiding docu-ment for those who design the facility and install theequipment. The format is to be used for all types ofequipment. Therefore, it will be necessary for eachsupplier to make modifications as required to suit thecomplexity of the equipment. The intent is to have asimple, but complete, format for all equipment.

4 Referenced Documents

None.

5 Related Documents

NOTE: All documents cited shall be the latest pub-lished versions of an adopted standard. All documentsshall cite those specifications in effect at the date ofpurchase.

5.1 SEMI Documents

SEMI C3 — Specifications for Gases

SEMI E1.1 — Standard for 3 inch Plastic and MetalWafer Carriers, General Usage

SEMI E1.2 — Standard for 100 mm Plastic and MetalWafer Carriers, General Usage


SEMI E1.4 — Standard for 125 mm Plastic and MetalWafer Carriers, Auto Transport Usage


SEMI E1.7 — Standard for 200 mm Plastic and MetalWafer Carriers, General Usage (Proposed)

SEMI E4 — SEMI Equipment Communications Stan-dard 1 Message Transfer (SECS-I)

SEMI E5 — SEMI Equipment Communications Stan-dard 2 Message Content (SECS-II)

SEMI E7 — Specification for Electrical Interfaces forthe U.S. Only

SEMI E8 — Specification for Wafer Transport Sys-tems: Interface Coordinates

SEMI E15 — Specification for Tool Load Port

SEMI E19 — Standard Mechanical Interface (SMIF)

SEMI E30 — Generic Model for Communications andControl of SEMI Equipment (GEM)

SEMI E33 — Specification for Semiconductor Manu-facturing Facility Electromagnetic Compatibility

SEMI E37 — High-Speed SECS Message Services(HSMS) Generic Services

SEMI E37.1 — High-Speed SECS Message ServicesSingle-Session Mode (HSMS-SS)

SEMI S2 — Safety Guidelines for SemiconductorManufacturing Equipment

5.2 Other Document1

Federal Standard 209E — Airborne Particulate Clean-liness Classes in Cleanrooms and Clean Zones

2SEMI E6-1296 © SEMI 1982, 1996

6 Terminology

6.1 P&ID — Pipe and instrument drawings.

6.2 interconnect — Connection(s) between tool main-frame and peripheral tool sub-systems equipment.

6.3 facilitization — The provision of facilities or ser-vices.

7 Instructions and Sample

Following is a sample for equipment interface specifi-cations. The sample below includes a table of contentsand sample forms. Address each of the items in thetable of contents with a comment, even if the item doesnot apply. Those responsible for the installation needto be sure every aspect has been considered andaddressed. In the following sections, the instructionsfor each element of the table of contents is followed bya sample.

• Table of contents (sample)

• Introduction

• Administrative interface

• Safety

— Non-physical conditions

— Monitoring communications

— Clearances

• Facilities installation requirements

— Environment

— Schematic (single line) diagram and equipmentdata sheets

— Equipment facilitization drawings

• Shipping and receiving requirements

• Installation requirements

— Transport and positioning equipment tools

— Assembly and hookup tools and equipment

• Startup requirements

— Equipment

— Material

1 General Service Administration, Federal Supply Service Bureau, Specification Section, Suite 8167, 470 East L'Enfant Place, SW, Washington, D.C. 20407

— Personnel

• Acceptance test

• Training

• Addenda (list by topic)

7.1 Introduction

7.1.1 Instructions for Introduction — The introductionshould include general information about the scope ofthe document and any other introductory statements.

7.1.2 Sample for Introduction — This document con-tains the facilities design and equipment installationrequirements for (indicate equipment name). It con-forms to SEMI E6 (Facilities Interface SpecificationsGuideline and Format).

7.2 Administrative Interface

7.2.1 Instructions for Administrative Interface — Theadministrative interface should include the contacts forcommercial questions and technical questions.

The equipment description should include:

• Functionality and intended use

• Wafer or material handling method

• Interface with other equipment (especially clustertools)

• Special process requirements

• Number of pieces included as part of this equip-ment

Suppliers are encouraged to make the specificationsdocument as specific as possible to the deliveredequipment.

Include here information about the availability of facil-ities data in electronic formats. Specify the softwareformat name and revision level, and indicate the namesof data files contained in it.

3 SEMI E6-1296 © SEMI 1982, 1996

7.2.2 Sample for Administrative Interface

7.3 Safety

7.3.1 Instructions for Safety — Any special safety concerns relating to the facilities design or equipment installa-tion, startup, or testing should be addressed here.

7.3.1.1 Non-Physical Conditions — Information should be provided by the supplier on all non-physical equipmentemissions including radio frequencies, temperature, humidity, vibrations, noise, odors, and ionizing and non-ioniz-ing radiation. This information should be formatted to show emissions during normal operation and potential emis-sion or releases in the event of malfunction or abnormal conditions.

Table 1. Administrative Interface

Supplier — Sales Rep. Purchasing Agent

Company Name

Address

Administrative:

Contact & Title

Phone/Fax

Supplier — Mfg. Location User — Installation Location

Company Name

Address

Administrative:

Contact & Title

Phone/Fax

Shipping (FOB):

Contact & Title Supplier: User:

Phone/Fax

Equipment Identification Data:

Model

Serial Number

RFQ Number N/A

Quotation Number N/A

Project Number N/A

Sales Order Number N/A

Purchase Order No. N/A

Equipment Name

Type:

Description:

Options Included:

4SEMI E6-1296 © SEMI 1982, 1996

Information should be provided on any non-physicalconditions that could exist in the user's facility thatwould adversely affect the operation of the equipmentbeing supplied.

7.3.1.2 Monitoring Communications — The suppliershould provide information on the protocol, number,type, and location of the data/communication connec-tors for external monitoring that are provided or desir-able.

Examples of conditions that are typically monitoredare: chemicals that could present a health hazard, flam-mable chemicals and other fire hazard conditions,equipment temperature, exhaust systems, radiationsources, and power supplies.

7.3.1.3 Clearances — Drawings required under Sec-tion 7.4.3, Equipment Facilitization Drawings, shouldinclude clearances required for operator access andequipment maintenance and the operation of doors,drawers, and panels integrated into the equipment.Notations should be given if the clearances shown arein compliance with standards or codes.

7.3.2 Sample for Safety — Safety-related checksshould be performed to supplier specification prior tosystem acceptance. These safety checks at point ofinstallation should be accepted by:

• Supplier(s) safety representative

• Customer safety representative

Installation site acceptance test should be signed off bya supplier and a customer. The following test shouldbe performed prior to acceptance to verify that the sys-tem meets requirements:

• Statement of conformance to SEMI S2 (SafetyGuidelines for Semiconductor ManufacturingEquipment)

• Safety interlocks function and shut-down correcthazards

• Ventilation flow test at specifications and locationwhere this can be verified by measurement

• Preventive maintenance and operating proceduresare clearly documented, and personnel are trained

• Chemical spill containment is adequate for 110% ofthe quantity of fluids in the system

• UPS output(s) are isolated when emergency shut-down occurs

• Manual operation of the tool is documented, andpersonnel are trained

• EMO circuit functions

• Ability to lock out hazardous energy sources priorto maintenance

• Onboard gas detection system is functional

• Onboard fire detection system is functional

• Auxiliary equipment tie-ins function as intendedand do not increase level of risk (scrubbers, purg-ing systems, alarms)

• Site-specific installation does not degrade tool'sergonomic design factors

• Interface to building systems functions as intended

7.4 Facilities Installation Requirements

7.4.1 Environment

7.4.1.1 Instructions for Environment — Theserequirements must address the temperature and humid-ity requirements of equipment when it is facilitized foroperation. Any other requirements, such as vibration,may be addressed in the body of the specifications orin the addenda with backup information provided inthe addenda.

5 SEMI E6-1296 © SEMI 1982, 1996

7.4.1.2 Sample for Temperature

* The temperature range which will prevent possible damage to the tool.

7.4.1.3 Sample for Relative Humidity

7.4.1.4 Sample for Special Lighting — Provide Table for Special Equipment Requirements.

7.4.1.5 Sample for Vibration Requirements

This equipment gives forth vibration that may impact sensitive equipment installed nearby. (If yes,indicate worst-case criterion here: .)

This equipment is sensitive to vibration. (If the facility needs to meet Criteria A or better, indicatehere: .) If the tool requirement is more stringent than Criteria A, provide the information required inthe Addendum Section.

7.4.1.6 Sample for Noise Requirements

This equipment gives forth electromagnetic radiation that may impact sensitive equipment installednearby.

This equipment is sensitive to or produces electromagnetic radiation, electromagnetic interference,radio frequency, acoustical vibrations, or electrostatic discharge. (If yes, provide data.)

7.4.1.7 Sample for Seismic Requirements

This equipment has brackets or other mechanisms to secure for earthquake protection. (If yes, pro-vide data.)

7.4.1.8 Sample for Environment Cleanliness

This equipment requires a clean room to meet operational specifications. (If yes, provide minimumcleanliness data.) Different areas of a tool or subassemblies may need different minimums. If so, the suppliershould state this information.

7.4.2 Schematic (Single Line) Diagram and Equipment Data Sheet

7.4.2.1 Instructions for Schematic (Single Line) Diagrams — The diagram(s) is required. It may be included inthe body of the specification or in an addendum at the option of the supplier. Included in the application notes aresamples of possible formats. These also serve as a checklist of information needed by the facilities design andinstallation people.

Table 2. Temperature

Non-Operating Range, min./max.*

Operating Range,min./max.

Target Temp.

Tolerance ±

Maximum Rate of Change/Hour

Tool Area

Support Equipment Area

Table 3. Relative Humidity

Range (%) Percent per Hour

Tool Area to

Support Equipment Area to

6SEMI E6-1296 © SEMI 1982, 1996

A schematic (single line) diagram and equipment datasheet are to be developed for the various facilitiesrequirements. The diagram should be designed to givethe facilities designer or equipment installer a detailedoverview of the facility requirement being covered.The equipment data sheet should be designed to givethe facilities designer or equipment installer the fol-lowing specific information about the facility itemscovered in the diagram:

• A description

• Whether the customer or supplier provides the item

• The "to" and "from" connection points, with con-nections named

• The length or other applicable physical characteris-tics

• A reference designation to the interface diagram

For equipment with simple facilities requirements, thesupplier may combine requirements to reduce the num-ber of diagrams and diagram data sheets. The facilitiesinterface diagrams will be contained in the body of thedocument.

It is also recommended that equipment data sheets beincluded for all equipment, especially those with mul-tiple stand-alone components. The equipment datasheet should give the facilities designer or equipmentinstaller detailed information on all facilities requiredfor a given assembly. This should include, but is notlimited to:

• A description

• All physical characteristics of the assembly

• Environmental requirements

• Detailed facility requirements for items listed

• A reference designation to the interface diagram

• Applicable notes to guide the designer or installerwhen installing the equipment

As with the facilities interface specifications format, itis recommended that the diagrams and data sheets listitems "not needed" so the facilities provider will knowthat these subjects were considered by the equipmentsupplier.

7 SEMI E6-1296 © SEMI 1982, 1996

7.4.2.2 Sample for Schematic (Single Line) Diagram

Figure 1

Schematic (Single Line) Diagram

8SEMI E6-1296 © SEMI 1982, 1996

7.4.2.3 Notes on Equipment Data Sheet — The equipment data sheet contains bold numbers in parentheses whichrefer to the key located at the end of the data sheet.

If more than one connection of a given utility exists for an equipment item, each should be indicated separately.

Flows, temperatures, etc. are for normal operating conditions. If there is a variation because of startup or emer-gency, those additional conditions should be indicated.

1. If there is a difference between normal operating current and peak current, it is necessary to know the durationof the peak to size the equipment circuit breaker. The equipment supplier may supply the peak duration or thesize of the breaker.

2. Power connection should indicate the type of plug used or, if hard wired, indicate the number of wires with theminimum and maximum wire size that can be connected to the equipment lugs. Also, indicate the conduit con-nection opening size.

Please indicate if a drain trap is needed. If a drain trap is provided with the equipment, please indicate its height.

* Average running load over 24 hour typical manufacturing cycle.

** Absolute maximum load.

Table 4. Sample for Equipment Data Sheet

Equipment Name (1.) Component Description (2.) Sheet of Figure (3.)

Vendor (4.)

Physical Properties Crated Installed Clearance (units)Environmental Requirements Operate Standby

Height: (units) Front: Ambient Temperature N/A

Depth: (units) Back: Ambient Humidity N/A

Width: (units) Left: Heat Release to water (units)

Weight: (units) Right: Heat Release to exhaust (units)

Number of Pieces: Top: Heat to space: (units)

Room Class cleanliness

Ref(5.)

Power Equip-ment

Supply Point Inter-conn.

Voltage Phases FLAAmps

BreakerKVA

PeakKVA**

OperateKVA*

Standby KVA

Wire Ground-ing

Other

(6.)

9 SEMI E6-1296 © SEMI 1982, 1996

Ref Exhaust Req.

Supply Point Inter-

connect

Size (O.D.) (units)

Temp. (outlet)

Pressure (units)

Min. Flow

(units)

Max. Flow

(units)

Average Flow

(units)

Material Fitting Size

(units)

Fitting Type

Other

(7.)

Ref Liquid Req.

Supply Point Inter-

connect

Pressure (units)

Temp. (inlet)

Reg. Req.? (9.)

Min. Flow

(units)

Max. Flow

(units)

Avg. Flow

(units)

Fittings Fitting Size

(units)

Fitting Type

Min.Filtration

Other

Drain Req.

(8.)

(10.) (11.)

Ref Gas Req.

Supply Point Inter-

connect

Pressure (units)

Reg. Req.? (9.)

Clean-liness Req.

Min. Flow

(units)

Max. Flow

(units)

Avg. Flow

(units)

Fitting Material

Fitting Size

(units)

Fitting Type

Material Other

Ref Liquid Req.

Supply Point Inter-

connect

Pressure (units)

P-Trap Disch Temp.

Min. Flow

(units)

Max. Flow

(units)

Avg. Flow

(units)

Fitting Material

Fitting Size

(units)

Fitting Type

Material Other

(12.)

Ref Vacuum Req.

Supply Point Inter-

connect

Size (O.D.)

Pressure (units)

Quantity Min. Flow

(units)

Max. Flow

(units)

Avg. Flow

(units)

Fitting Material

Fitting Size

(units)

Fitting Type

Material Other

(13.)

10SEMI E6-1296 © SEMI 1982, 1996

Key to Matrix:

1. Generic name

2. Make and model number

3. Refer to appropriate figure

4. Original manufacturer of this item

5. Refer to call out on applicable schematic

6. Source of service

7. Exhaust content (i.e., acid, solvent, heat process); refer to effluent data sheet if applicable

8. Process cooling water (PCW), high-purity water (DI)

9. Regulator required at the equipment

10. Material fitting made of (Cu, PVC, etc.)

11. Minimum filtration required. Particle size, nom/absolute, efficiency

12. Required drains (liquid)

13. This section includes both wafer handling vacuum and process vacuum (tool-to-vacuum pumps)

14. Chemical by trade and formula

Ref Chemi-cal

Dis-pense

Type of

Chemi-cal

(acid, solvent, base)

Size (O.D.)

No. of Lines

Flow Fitting Size

(units)

Temp. °C

(units)

Fitting Type

Fitting Material

Material Pressure Supply Point Inter-

connect

Other

(14.)

Notes

Table 5. Equipment Effluent Data Sheet

Equipment Manufacturer/Model Number: Date:

System Component Description Prepared by:

Equipment Process Recipe Description

Wafers/Cycle:

INPUT CHEMICAL (GAS/LIQUID) Chemical 1 Chemical 2 Chemical 3 Chemical 4 Chemical 5

Equipment Point of Connection # (see diagram below)

1 2 3 4 5

Process Step Step Duration

Step 1 (min.) Estimated total flow per step

SCCM SCCM SCCM SCCM SCCM



11 SEMI E6-1296 © SEMI 1982, 1996

1. Indicate chemical by chemical formula and written name.

2. Specify estimated (E) or actual (A) measurements.







Totals per Cycle

(min.) SCCM SCCM SCCM SCCM SCCM

EFFLUENT CHEMICALS (GAS/LIQUID)

Chem. A Chem. B Chem. C Chem. D Chem. E Chem. F

Equipment Point of Connec-tion (see diagram below)

6 7 8 9 (X) (X)

Process Step

Step 1 Estimated total flow per step

SCCM SCCM SCCM SCCM SCCM SCCM









Total Effluent for Cycle (each chemical)


EMISSIONS PER WAFER SCC/Wafer SCC/Wafer SCC/Wafer SCC/Wafer SCC/Wafer SCC/Wafer

Table 5. Equipment Effluent Data Sheet

12SEMI E6-1296 © SEMI 1982, 1996

Table 6. Equipment Data Base Units

Item International Units American Units

Physical Properties

Distance mm in.

Weight kg lb.

Temperature °C °F

Heat Watts Btu/Hr

Exhaust

Size mm in.

Pressure mm in. of H2O

Flow NM3-H SCFM

Fitting Size mm in. (nominal)

Liquid

Pressure KPA psig

Temperature °C °F

Flow LPM GPM

Fitting Size cm (nominal) in. (nominal)

Vacuum

Size cm (nominal) in. (nominal)

Pressure mm of Hg in. Hg

Flow SLPM SCFM


Chemical Dispense

Container Size liters gal.


Gas

Pressure KPA psig

Flow LPM or SCCM SCFM or SCCM


Liquid Source

Pressure KPA psig

Flow LPM or SCCM GPM or SCCM


13 SEMI E6-1296 © SEMI 1982, 1996

7.4.3 Equipment Facilitization Drawings

7.4.3.1 Instructions for Equipment Facilitization Drawings — As a minimum, the overall dimensions and clear-ances of equipment are to be provided. These should include: plan and elevation drawings that show connectionlocations, and minimum, maximum, and typical interconnect distances.

Table-mounted equipment must indicate the minimum table size and structural requirement.

A system interconnect schematic is required for any equipment that consists of more than one item.

A facilities interface matrix should be included, following the format in this guideline. For complex equipment, itis recommended that a summary matrix be included first, followed by an extended matrix for each component. Aswith other sections of this document, it is recommended that the extended matrix list items "not applicable" (N/A)so the facilities provider will know that these subjects were considered by the equipment supplier.

Information should be provided on all minimum/maximum distance limitations of the equipment to other equip-ment, sources of chemicals, and auxiliary equipment. Insert equipment drawings here and provide table of dis-tance parameters.

7.5 Shipping and Receiving Requirements

7.5.1 Instructions for Shipping and Receiving Requirements — Suppliers should include information about thetype and number of containers in which this equipment is shipped and how they are to be handled and stored. Thisshould include clearances for oversize equipment, special staging and uncrating or preparation areas, etc. In addi-tion, any special receiving information should be noted. This is especially important for sensitive equipment or ifsupplier involvement is required. If containers cannot be unloaded by hand, please state the equipment needed.

Table 7. Drawing Checklist

Hard CopySoft Copy and

Format Included Drawings

Legends and symbols

Plan views with maintenance and electrical clearances and operator access

Plan and elevation views, including:Front, side, and top viewsHeight, width, and depth dimensionsCenterline dimensions for all facilities connectionsIsometric view(s)

Captioned photos

Floor-loading diagram showing:Weight load on each contact point to the floorDimensions of support mechanism that contacts floorCenter of gravity location

Receptacle or terminal strip connections (to be included when user is required to make connections)

Through-the-wall mounting drawings:Dimensions for cutout sizeCross-sectional top viewAssembly drawings when applicable

External piping and instrument drawings (P&ID) included? If yes, see Table 4.

Internal P&ID included? If yes, see Table 4.

14SEMI E6-1296 © SEMI 1982, 1996

7.5.2 Sample for Shipping and Receiving Requirements

Number of Containers:

Impact monitors, if included, will have a maximum of G's.

The following equipment will be required to unload:

Equipment can/must be stored as follows:

Outside

In a store room

Out of weather in a dry location

Moved to a cleanroom on arrival

Temperature range to °C ( to °F) Temperature

Humidity range to %

Dimension of largest piece to move:

Weight of largest piece to move into the cleanroom

Special receiving instructions:

7.6 Installation Requirements

7.6.1 Instructions for Installation Requirements — Consider every step from receiving to final hookup. The instal-lation process usually includes the need for tools, transportation equipment, and personnel (quantity, duration, andskills). All requirements should be indicated so their availability will be assured.

During the assembly and installation, the following provisions will be required:

7.6.2 Sample for Transport and Locating Equipment

7.6.3 Sample for Assembly and Hookup Tools and Equipment

Table 8. Shipping and Receiving Requirements

Container #Dimensions

(L x W x H) (units)Weight (units) Impact Monitor Tilt Monitor

15 SEMI E6-1296 © SEMI 1982, 1996

7.7 Start-Up Requirements

7.7.1 Instructions for Start-Up Requirements — Consider every step from initial powerup to release for accep-tance test. The startup process usually includes the need for tools, measurement equipment, and personnel (quan-tity, skills, and expected duration). All requirements should be indicated so their availability will be assured. Inaddition, for some equipment, it may be necessary to use materials (such as wafers) and supplies during startup.The supplier should indicate the type, quantity, and specifications of any materials needed.

It may also be necessary to use special measurement or analytical instruments to test performance of equipment orsample product produced. Requirements for these should also be stated.

If the supplier supplies separate start-up documentation, or if the supplier is responsible for start-up, this should bereferenced.

7.7.2 Sample for Equipment

7.7.3 Sample for Material

7.7.4 Sample for Personnel

7.8 Acceptance Test

7.8.1 Instructions for Acceptance Test — Suppliers should indicate if acceptance testing will be required, whattests will be required and provide an estimate of the duration of the acceptance tests. It is especially important toindicate if any tests or inspection of the facility will be required prior to the installation or start-up of the equip-ment.

7.8.2 Sample for Acceptance Test — Tests will be performed to demonstrate that the facilities meet requirements.

Yes No

The following tests will be required:

Tests will be performed to demonstrate that the equipment meets requirements.

Yes No

The following tests will be required:

16SEMI E6-1296 © SEMI 1982, 1996

7.9 Training

7.9.1 Instructions for Training — Please indicate if any special training is required to install or operate themachine. It is especially important to indicate if any training is required for the installation process. If required,indicate whether this is part of the system deliverables, or is the responsibility of the customer.

If the supplier supplies separate training documentation, or if the supplier is responsible for training, this should bereferenced.

7.9.2 Sample for Training

Special training will be required.

Yes No

User's personnel are required to be trained in the following as a prerequisite to supplier-supplied training and priorto operation, use, or maintenance of the equipment:

Supplier will provide the following training at:

Supplier's site:

User's site:

7.10 Addenda

7.10.1 Instructions for Addenda — The addenda is to contain all additional information requested by customer ordeemed necessary by supplier. It is necessary to convey the facilities interface needs of the equipment. List andcover only the items necessary. It is the responsibility of the equipment supplier to determine the requirements tobe covered. The application notes to this guideline contain an initial checklist of addendum topics and, for selectedtopics, examples of how information may be presented.

8 Addendum Topics

Following is a checklist of topics that should be considered for inclusion in the addenda. The equipment suppliermay add addenda as necessary.

8.1 Topics without Examples Provided in this Document

• Process gas purity (refer to SEMI C3 and related standards)

• Supplier-supplied interconnecting cables and lines

• Special utilities requirements (water, compressed air, other support liquids, waste drains — traps, trap liquidheight)

• Electromagnetic requirements (safety, shielding)

• Ionizing radiation requirements (safety, shielding)

8.2 Topics with Examples — For selected addendum topics, the following samples and information are provided.

8.2.1 Addendum A, Computer Interface — If the equipment has provision and capability for communication witha host computer, provide the information and applicable documentation requested below.

17 SEMI E6-1296 © SEMI 1982, 1996

Communication Interface

Serial interface

This equipment complies with SEMI E4 (SEMI Equipment Communications Standard 1 MessageTransfer (SECS I)). Attach the documentation requested in Section 9 of SEMI E4.

This equipment complies with SEMI E37 and E37.1, High-Speed SECS Message Services, SingleSession (HSMS-SS). Specify the physical network (e.g. Ethernet) and required cabling (e.g. 10-Base-T) in the fol-lowing Network section.

Network. Specify by reference to a published standard. Include physical link and protocol.

Other. Specify by reference to a published standard. Include the physical link and protocol.

Message Content

This equipment complies with SEMI E5 (SEMI Equipment Communications Standard 2 MessageContent (SECS II)).

Message sequences conform to the recommendations of SEMI E30

The following capabilities scenarios are implemented on this equipment:

establish communications

data collection

alarm management

remote control

process program management

material movement

equipment terminal services

error messages

clock

spooling

log file

Additional, or other, messages are implemented. Attach message documentation requested in Section8 of SEMI E5. If process programs are unformatted (per the definition of SEMI E5), attach documentation definingthe format of the program.

8.2.2 Addendum B, Vacuum Requirements — This equipment requires installation of a vacuum pump at some dis-tance from the system. The equipment is designed to achieve its required performance with a pump and vacuumline capable of the following flow(s) and pressure levels at the connection port to the equipment:

These levels can be achieved with the following specified pump and line sizing (specify number of elbows andother restrictions):

Because the vacuum pump and its installation are critical elements in the proper performance of this equipment,any deviation from the above should be designed in consultation with the supplier.

18SEMI E6-1296 © SEMI 1982, 1996

The vacuum pump must be prepared for chemical service as follows:

An interlock or alarm signal indicating pump failure is required at the equipment. Details on contact rating andconnector are provided:

8.2.3 Addendum C, Electrical Requirements

This equipment complies with SEMI E7 (Specification for Electrical Interfaces for the U.S. Only).

This equipment requires special electrical connectors. List the special plug and/or receptacle require-ments.

This equipment requires AC power line conditioning. List the power purity requirements and watt-age.

This equipment requires UPS. List the required capacity (watts and time) and response specifications.List any suggested supplier whose equipment will meet the specifications.

This equipment has other special electrical requirements. List and specify.

8.2.4 Addendum D, Vibration Requirements

Vibration Criterion Checklist

This checklist summarizes the information needed for a sensitive equipment vibration criterion to be properlydefined.

I. Analysis methodology

A. If time domain analysis is to be used, use:

1. Frequency range Hz to Hz

[ ] acceleration, [ ] velocity

[ ] displacement

2. Allowable amplitude

[ ] peak-to-peak, [ ] 0-peak,

[ ] RMS value.

B. If frequency domain analysis is to be used, use:

1. [ ] 1/3 octave analysis, with second filter time constant

2. [ ] constant bandwidth analysis with a frequency resolution of Hz

3. [ ] linear averaging

[ ] exponential averaging

[ ] peak hold averaging

19 SEMI E6-1296 © SEMI 1982, 1996

4. Allowable amplitudes

Provide a plot of allowable amplitude as a function of frequency. Amplitude is given in terms of:

[ ] peak-to-peak

[ ] 0-peak

[ ] RMS value

Equipment manufacturer:

Equipment model number:

Equipment use (e.g., microscope, stepper, etc.):

Person to contact for questions:

Phone number: ( ) -

II. Plot of vibration criteria

The following plot of generic vibration criteria for sensitive equipment in buildings shows velocity vs. frequency,using 1/3 octave analysis.

Figure 2

Floor Vibration Criterion for Equipment Used in the Production of Integrated Circuits(Other Curves Represent Criteria Recommended by International Standards Organization)

20SEMI E6-1296 © SEMI 1982, 1996

8.2.5 Addendum E, Floor Loading

Figure 3

Sample Floor Loading Diagram

8.2.6 Addendum F, Wafer Handling

Wafer Size

This equipment, as delivered, is configured to handle mm wafers. It is capable of processing wafers ofother sizes as follows:

Table 9. Wafer Size

Wafer Size As DeliveredBy Adjusting

Installed PartsBy Replacing

Installed Parts Supplier Must Modify

3 inch

100 mm

125 mm

150 mm

200 mm

mm

21 SEMI E6-1296 © SEMI 1982, 1996

Wafer Interface

Wafers are inserted manually, one at a time, into this equipment.

This equipment is provided with a single-wafer transport mechanism and port in compliancewith SEMI E8 (Specification for Wafer Transport Systems: Interface Coordinates). Show datum point and loca-tions of input and output port centerlines on the equipment facilitization drawings. See Section 7.4.3.

Wafers are inserted into this equipment in wafer carriers (cassettes). Provide the informationrequested in the sections below.

Wafer Carriers Accommodated

This equipment, as delivered, is capable of accepting wafers delivered in SEMI standard carri-ers (cassettes) conforming to the following:

This equipment requires special wafer carriers:

supplied with the equipment

other — provide name of supplier and specification

Wafer Carrier Interface

Carriers are placed on the receiving platform in the following orientation:

wafers horizontal degrees tilt

wafers vertical degrees tilt

Wafer Alignment

Wafer flat/notch alignment is/ is not required.

Inter-Equipment Material Transport

This equipment complies with SEMI E15 (Specification for Inter-Equipment Material Trans-port Interface), with the following parameters and exceptions:

equipment has an enclosed interface (e.g., load lock)

equipment allows use of cassettes only

equipment allows use of a box conforming to:

SEMI E19 (Standard Mechanical Interface (SMIF))

other — attach specification

Table 10. Wafer Carriers

Wafer Size As DeliveredBy Adjusting

Installed PartsBy Replacing

Supplied Parts Supplier Must Modify

3 inch/SEMI E1.1

100 mm/SEMI E1.2

125 mm/SEMI E1.3

125 mm/SEMI E1.4

150 mm/SEMI E1.5

200 mm/SEMI E1.7

mm

22SEMI E6-1296 © SEMI 1982, 1996

vertical clearance, C3, is:

mm ( inches)

unrestricted

other exception — describe in detail

8.2.7 Addendum H, Contractual Language — Since facility performance and equipment performance-to-specifi-cations are inter-related, a contractual section may be used to ensure that proper performance is achieved.

8.2.7.1 Equipment Performance — Performance of the equipment to specifications is based upon its installationin a facility which meets or exceeds the requirements of Exhibit X (the SEMI E6 furnished by the supplier).Accordingly, customer agrees to provide supplier with:

8.2.7.2 A monthly report which details the status of the facility design, construction, and materials in relation toschedule milestones;

8.2.7.3 Certified complete facility drawings, specifications and calculations at least days before thestart of acceptance testing;

8.2.7.4 Facility supplier materials list, test procedures, and certifications at least days before the startof acceptance testing.

8.2.8 Supplier Inspection — Customer shall make its facility available for supplier’s inspection daysbefore the start of acceptance testing. At that time, supplier will verify that the facility meets or exceeds specifica-tions. If the facility fails to meet specifications, supplier may recommend modifications that customer may chooseto accept or reject. If customer chooses to reject supplier’s recommendations, then customer must waive that por-tion of the specifications or acceptance criteria that may be affected by the lack of proper facilities as designated bysupplier.

8.2.8.1 The determination that customer’s facility is deficient will be a joint decision made by supplier and cus-tomer. Any re-audit of customer’s facility by supplier will be at customer’s expense.

8.2.8.2 If customer’s facility is determined to be deficient, then the final system progress payment shall be due atsupplier’s scheduled shipment date for the system. If customer requests installation of the system without re-auditof the facility, customer shall be responsible for supplier’s costs associated with failure of the facility to meet spec-ifications.

NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the responsi-bility of the user of these standards to establish appropriate safety and health practices and determine the applicabilityof regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability of the stan-dards set forth herein for any particular application. The determination of the suitability of the standard is solely theresponsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels, product datasheets, and other relevant literature respecting any materials mentioned herein. These standards are subject to changewithout notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrightedmaterial or of an invention covered by patent rights. By publication of this standard, SEMI takes no positionrespecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in thisstandard. Users of this standard are expressly advised that determination of any such patent rights or copyrights,and the risk of infringement of such rights, are entirely their own responsibility.

Copyright BySEMI® (Semiconductor Equipment and Materials International)805 East Middlefield Road, Mountain View, CA 94043. Reproduction of the contents in whole or in part is forbidden withoutexpress written consent of SEMI.