semiconductor technology -cmos-wada/system07/sysarc2007-5(cmos).pdf · 2007/11/16 system arch 2007...

2007/11/16 System Arch 2007 (Fire Tom Wada) 1

SEMICONDUCTOR TECHNOLOGY-CMOS-

Fire Tom Wada


What is semiconductor and LSIs

Huge number of transistors can be integrated in a small Si chip.The size of the chip is roughly the size of nails.Currently, 10M transistors can be integrated.1000 times integration comparing to 20 yrs ago.The cost of the chip is roughly same.All electronic equipments are powered by LSIs.PCs, Cellular phones, 3D graphics, Internet.


PC mother board

Large Scale Integration


SONY PLAYSTATION 2 MAINBOARD

Rendering LSI

High Speed Memory

Graphics LSI

Direct RDRAM


Mobile Phone Mobile Phone MainboardMainboardMemory, Logic, Analog


Key device is LSI

INTEL Pentium III module


This is a packaged LSI-Pentium III 300MHz Cache LSI-

20 mm

15 mm


Si chip is molded in the package.

2 million transistor Chip is connected to the pins thru

wires.


6 inches Si wafer


8 inches Si wafer

Hundreds of Chips

on a Si Wafer


Several hundreds of chips are fabricated on a wafer simultaneously.


Chip photo- Motion Estimation Chip for HDTV camera -

9.1 mm

Your small finger’s nail size.

200M transistors.

8.6 mm


Scanning Electron Microscope photo- Cross-section of the LSI -

0.5 micron


Structure Of CMOS LSI

IsolationPN-Isolation, Local oxidation

Si SubstrateBulk, epitaxial , SOI

Well StructureN-type well in P-type Substrate

Latch UpPNP Bipolar Transistor and NPN Bipolar Transistor

Fabrication Process Technology


Cross-section of the LSIMetal wiring

N-type well

N+ N+ P+ P+

Poly-silicon Poly-silicon

P-type MOS transistorN-type MOS transistor

P-type Si substrate

Si wafer


Advanced Process Development

Transistor module （FEP)

65nm

Lithography(VUV, EPL)Mask

CMPplanarization

Low Resistance Contact withHigh Aspect ratio

High κGate insulator

Fine Cu interconnect

Low κinterdielectric

SiGe/Metal gate

Multi-level MetalizationModule（BEP)

Low Resistance Ultra shallow junction

Low stress Shallow Trench Isolation


LSI integration trend- Moore’s law -

WideWide--TV, PHS phoneTV, PHS phone

DVD player

DVD-ROM

DVD-RAM

DVD recorder

Source: SEMATEC

81

10B

1B

100M

10M

1M

100K

10K

1K

83 85 87 89 91 93 95 97 99 01 03 05 07 09

0.8 0.5 0.3 0.18CHANNEL LENGTH (MICRON)

0.13

Digital HDTV receiver

Nu

mbe

r of

tra

nsi

stor

s on

a c

hip

The number of transistors are increasing

by 58% per year.

- Moore’s Law -


Communications and Consumer Products Drive Semiconductor

35%

30%

25%

20%

15%

10%

5%

0%0% 5% 10% 15% 20% 25% 30% 35%

CAGR % (1997-2002)

SemiconductorIndustry

Ap

pli

cati

on

Mark

et

Gro

wth

3rd Generation

2nd Generation

1st Generation

ColorTV

ColorTV

CarRadioCar

Radio

VideoCameraVideo

Camera

PortableComputingPortable

ComputingSwitching& LAN

Switching& LAN

HDTVHDTV

MultimediaPC

MultimediaPC

Advanced DesktopPC and WorkstationAdvanced Desktop

PC and Workstation

AutomotiveApplications/GPS

AutomotiveApplications/GPS

DVDPlayerDVD

Player

Set-TopBox

Set-TopBox

Internet Game Consoles

Internet Game ConsolesSmart

Cards/KiosksSmart

Cards/KiosksSmart

Appliance-PhoneSmart

Appliance-Phone

Digital CameraDigital Camera

40% 45% 50% 55%

40%

45%Cellular PhonesCellular Phones

SC Content (As % of Equipment Cost)Sources: Applied Materials Corporate Marketing estimates, Dataquest


Fabrication Process Issues


Ultra Clean Room


Layer Deposition

lithography

etching

cleaning

Basic LSI process

SEM photo of Logic LSIs

M1

M2

M3

M4

M5

M6

M7


Light Source

Lens

MaskAA A A A A A A A A A A A A A

A A A A A A A A A A A A A AA A A A A A A A A A A

Si Wafer

Y

Stage

Lens

X

Projection


Packaging & Test

Final Test I

Burn-In

Ex.)Vcc:7V，Temp.:125℃, 24～42hrs

Shipping TestFinal Test II

Functional Test，DC/AC Test

Functional Test(at Speed)，DC/AC Test

Pre Test

Wafer Test

scribing

Chips

Mounting

Bonding

Enclosing

marking

Ass

embl

y Fl

owWafer

Remove Process defect Chips

TestingFunctional Test，DC Test

Sample


Large Scale Integration

NMOS , PMOS and WiringAll Logic Function can be madeMemory Element Can be made

Billions of Transistors and wiring make LSI!


CMOS NOT (Inverter)


CMOS NAND と NOR

011

101

110

100

fBA

011

001

010

100

fBA


Classification Of LSI1. Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA2. Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory)3. Analog LSI: ADC, DAC, Filter, Amplifier

Micro Processor (PC’s central processing Unit)Perform Digital computation according to the program in MemoryIntegration in 7000 times in 25 years, (Moor’s Law) Clock Speed : 700 times in 25 years

Memory LSI:Dynamic Random Access Memory: Main memory for Computer, 4-times density in 4 yearsStatic Random Access Memory : work memory for mobile equipmentsFlash Memory : Nonvolatile memory , Digital Camera Storage

Analog LSI: Used for interface, high speed RF interface, Analog to Digital Conversion, Digital to Analog Conversion


Analog to Digital Conversion

ADC LSI

Analog to Digital

Sample the analog wave

Convert to Digital format in Binary

Same as f(t) to AnContinuous time

Discrete time


Chip photoSoC Flash Memory

semiconductor technology -cmos-wada/system07/sysarc2007-5(cmos).pdf · 2007/11/16 system arch 2007...

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