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9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 | 301-474-0607 | www.dfrsolutions.com

SHERLOCKState of the Union

March 25, 2019 | Dr. Natalie Hernandez


Copyright of DfR Solutions 2019

Agenda

Sher·locknoun

1. the software solution for

quantitative insight into the

thermal, mechanical,

thermo-mechanical and

manufacturing behaviors

and reliability of electronic

hardware .

02 SHERLOCK (Then…)

What’s are the industry challenges?01

06Speaker Bio

03 SHERLOCK 2019

04 SHERLOCK 2020

05 Conclusions

2



Industry Challenges – What Are They?

3

• Concept of DV0 (need to use SHERLOCK to evaluate new components, pre-layout, post-layout, and manufacturing)

• Optimization (quickly identify best paths)

Faster time to market with newer technologies

(OEM/Tier 1)

• ISO 26262, System level prediction toolBetter system level predictions (automotive and

military)



What is the Common Workflow?

4

Component Selection

Pre-Layout Post-Layout Manufacturing

Component Board Module System

Requirements

Part Library

Circuit Analysis

Thermal Analysis

Mechanical Analysis

Reliability Analysis

Where does SHERLOCK fit?



Accelerating Product Development

5

Hardware

Specs

Functional

Block

Housing

Initial Part

Selection

SchematicFull

BOM

Board

Outline

Connectors

Layout DfM

Initial Part

Placement

Change

Management



First release: June 16, 2010

SHERLOCK (Then…)

6



SHERLOCK – The Baseline (4.X and before)

– Shock and Vibration Analysis

– Printed Through Hole Fatigue

– Solder Joint Fatigue

– Conductive Anodic Filament (CAF)

– Component Derating

– DFMEA

– Hi-Fidelity PCB Modeling

– In Circuit Test (ICT) Fixture Analysis

– Force Deflection Analysis

– Failure Rate Analysis

– Lead Modeling

– Cutout Editor for Mechanical Parts

– Trace Modeling


SHERLOCK v. 5.0 and 5.1

EASIER MODELING

With new features and refinements, SHERLOCK 5.0 makes it easier to bring the “real world” to electronics builds for expert users and novices alike

– Modeling regions

– Decreasing simulation time by focusing on areas of interest

– Heat sinks

– Siemens NX Nastran Integration

– Plated Through Hole Analysis




SHERLOCK v. 5.2: SEMICONDUCTOR WEAROUT

SHERLOCK is the first and only tool to predict

the four basic failure mechanisms:– Hot Carrier Injection (HCI)

– Time Dependent Dielectric Breakdown (TDDB)

– Negative Bias Temperature Instability (NBTI)

– Electromigration (EM)



SHERLOCK v. 5.3

THERMAL MECHANICAL ANALYSIS

Thermal Mech highlights potentialsystem-level effects on solder joint reliability during temperature cycling

− Over-constrained boards

− Underfill modeling

− Potting/Staking

− Mirroring



TEMPERATURE-BASED FEA

SHERLOCK v. 5.4

– Temperature-based FEA

– Materials Library Update

– Component failure models

– Component Cracking

– Composite Part Materials

– SQLite Part Library

– New Interface



SHERLOCK 6.1

Key highlights:

• Thermal Mech BGA Predictions

• Locked IP Model



Thermal Mech – BGA Predictability

• Electric vehicles are practically computers on wheels.

• BGAs are increasingly used in the automotive and aerospace industry. However, high density boards lead to a host of reliability issues.

• How does this new version of Thermal Mech solve customer problems?− Engineers can run thermal mechanical

analysis on multiple types of BGAs in multiple locations on the board with multiple types of underfills. Running such analyses early in the design process allows engineers to determine the optimal design before building a physical model and testing it in the field environment.

13



Locked IP Model

• Locked IP Model: Retains IP and design advantages while communicating design efficacy throughout the supply chain

• Proposed work flow:

14



Insulated Metal Substrate (IMS)

SHERLOCK 2019

15



Insulated Metal Substrate (IMS)

• Sherlock now includes an Insulated metal substrate (IMS) model for bottom terminated components (BTC) package types that model light emitting diodes.

• Along with the new BTC package type, the Sherlock Stackup editor has been updated to allow for the definition of an IMS stackup

16



Microvia Reliability and Manufacturability Analyses

SHERLOCK 2019

17



The Big Picture

• Analyze a PCB with tens of thousands of microvias, vias and PTHs

• Identify the configurations susceptible to failure

• Run FEM on them for reliability as well as manufacturability analysis

18



Microvia/PTH Model Development

19

Design Files

• ODB++

• Drill files

• Gerber files

• …

SHERLOCK

• Preprocessing

• Parse and bin holes in the pcb

• Classify holes into three categories; PTH, stacked, and staggered

• Identify configuration susceptible to failure

• Gather geometrical and material parameters of marked configs and send them to FEA

FEM

• Processing using automated scripting

• Build and run FE models simulating thermal excursion in reflow process and field usage

• Send the results back to SHERLOCK for postprocessing

SHERLOCK

• Postprocessing

• Perform reliability analysis for PTHs(low-cycle fatigue prediction)

• Perform manufacturability analysis for stacked μvias (interfacial separation in reflow process)



Performing a Reliability Analysis

20

𝚫𝜺(Model prediction)

𝑵𝒇

(Model prediction)

𝑵𝒇

(Experimental results2)

𝑵𝒇

(Experimental results1)

Case 1 (10 mil) 2.1931E-3 5765 5839 4307

Case 2 (12 mil) 2.0269E-3 6574 6805 4808

Case 3 (16 mil) 1.7839e-3 8133 8347 5037

1 Characteristic life cycle reported based on cycle to first failure on each daisy chain

2 Characteristic life cycle estimated considering suspended data points



Completing a Manufacturability Analysis

• Manufacturability analysis on stacked microvias

− Tensile overstress

− Interfacial separation between microvia body and target/capture pads

21



GUI Redesign

SHERLOCK 2019

22



SHERLOCK 7.0

• GUI Redesign

23



SHERLOCK 7.0

24



IMEC Manufacturing Yield Prediction

SHERLOCK 2019

25



IMEC Manufacturing Yield Tool

First Pass Yield Quality and Test

• Basic Design-for-Assembly Quality.

• Design improvement: BOM, component

placement, process selection.

• Yield prediction of incoming designs.

– Yield analysis of running production:

identifying anomalies.

• Basic Design-for-Test support.

• Early test need identification on

preliminary BOM.

• Quality improvement by DfT. Yield, quality

and test efficacity analysis: identifying

anomalies.

• Defining test requirements, capacity and

cost for incoming designs based on basic

BOM info.

26



Non-standard components

SHERLOCK 2019

27



Non-Standard Components

• Component designs are moving away from traditional scenarios to support changing application needs

− Non-standard BGAs

› Non-standard ball grid layouts

› Multiple die geometries explicitly

− Non-standard QFNs

› Asymmetric copper layouts

28



ANSYS IcePak Integration

SHERLOCK 2020

29



SHERLOCK + ANSYS WORKBENCH

30

Life Cycle

Conditions

Electronic

Design Files

Geometry,

Properties, Boundry

Conditions, Loads

Pre-Processing

SHERLOCKDesignAnalysis

FEA

Tool

ANSYS

Thermal, Vibrational,

Mechanical Shock

Analyses

Mechanical

CAD

SHERLOCK

Library

Parts

Packages

Materials

Measurement Data

Test Data

Displacement,

Strain, Temperature

Post-Processing

SHERLOCKReliability

Physics

Reliability

Predictions

Solid

Model,

ACT

Interface

Script



SHERLOCK + ANSYS ICEPAK

31

Life Cycle

Conditions

Electronic

Design Files

Geometry,

Properties, Thermal

Properties

Pre-Processing

SHERLOCKDesignAnalysis

ICEPAKANSYS

SHERLOCK

Library

Parts

Packages

Materials

Measurement Data

Test Data

Thermal Maps,

Thermal Images

Post-Processing

SHERLOCKReliability

Physics

Reliability

Predictions



Scripting

SHERLOCK 2020

32



SHERLOCK and Scripting

• Quicker time to meaningful project results

• Opportunity to vary analysis parameters

− Less time waiting in between tasks

• Batch jobs/Job queuing

− Running multiple analyses at once

− Setting a list of simulations to run

• Monte Carlo availability

Usability Technical Functionality

33



Additional Analyses

SHERLOCK 2020

34



Additional Analyses

• Predicting conformal coating cracking

• Failure of the Isotropic Conductive Adhesives (ICAs)

− Occurs after thermal loading due to CTE mismatch between silicon and substrate

− Causes delamination

35



Conclusions

SHERLOCK started as a board level reliability tool.

SHERLOCK now highlights potential risks due to:

System-level effects

Extreme conditions

More complicated assemblies and environments

SHERLOCK in the future will assess more failure mechanisms, provide improved integrations with other key

software in the electronics industry, and continue to be an integral component of the electronics reliability

workflow.

Thanks for listening!

SHERLOCK persists to make users heroes within their companies.

SHERLOCK is the software solution for quantitative insight into the thermal, mechanical, thermo-mechanical and

manufacturing behaviors and reliability of electronic hardware

36



Dr. Natalie Hernandez, Product Manager

Dr. Hernandez is the Product Manager of the award-winning design reliability software, SHERLOCK

Automated Design Analysis™. Natalie assures that Sherlock’s road map solves customer problems

and aligns well with the industries’ evolving needs. She is passionate about creating innovative,

results-driven solutions.

Contact

(301) 474 -0607 [email protected] linkedin.com/in/hernandeznl

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