sp19455-abb linpak 1700v 2x1000a power module - system ......abb 1700v igbt power modules portfolio...

©2019 by System Plus Consulting | SP19455 - ABB LinPak 1700V 2x1000A Power Module 1

ABB Module 5SNG 1000X170300LinPak Phase-Leg IGBT Module 1700V 2x1000APower Semiconductor report by Amine ALLOUCHE March 2019 – Sample

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



SUMMARY

Overview / Introduction 4

o Executive Summary

o Market

o Reverse Costing Methodology

o Glossary

Company Profile 12

o ABB profile

o ABB Modules Portfolio

o Supply Chain

Physical Analysis 16

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Product Datasheet

o Package Analysis

LinPak Technology by ABB Package View & Dimensions Package Opening Package Cross-Section

o Si IGBT Die

IGBT Die View & Dimensions IGBT Die Process IGBT Die Cross-Section

o Si Diode Die

Diode Die View & Dimensions Diode Die Process Diode Die Cross-Section

Manufacturing Process 95

o Si IGBT Process Flow & Fabrication Unit

o Si Diode Process Flow & Fabrication Unit

o Module BOM and Package Process Flow

o Final Test & Packaging Fabrication Unit

Cost Analysis 109

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses

o IGBT die

IGBT Front-End Cost

IGBT Wafer Cost per Process Step

IGBT Die Probe Test & Dicing

IGBT Die Cost

o Diode die

Diode Front-End Cost

Diode Wafer Cost per Process Step

Diode Die Probe Test & Dicing

Diode Die Cost

o Packaging Cost

PCB Cost Calculation

Module BOM Cost

Package Assembly Cost

o Complete Module

Final Test Cost

Final Module Cost

Price Analysis 126

o Definition of Prices

o Estimation of Selling Price

Comparison 129

o Comparison with Cree 1700V Power Module

Feedbacks 134

Company services 136


Overview / Introductiono Executive Summaryo Marketo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Comparison

Related Reports

About System Plus

Executive Summary

The market for power modules will have a 7.6% compound annual growth rate (CAGR) from 2017 to 2023, reaching $5.5M in 2023. The power module market plays a key role in several industrial applications from electric and hybrid electric vehicles (EV/HEV) and motor drives, to megawatt (MW) solutions like converters for wind turbines, which have a standard power range from 100kW to 8MW.

The power module packaging material business is worth $1.2B, which represents about a third of the existing power module market.Yole predicts that this power module packaging material market will have a CAGR for 2017-2023 of 8.2%, approaching $2B in value by 2023.

Module packaging currently has several critical technical aspects, such as molding, high temperature die attach and connection. It must combine good thermal and electrical efficiency while keeping low mass and volume. Also, to remain competitive, power module makers must deliver high reliability while remaining cost efficient.

In the second quarter of 2017, ABB presented its new LinPak line that offers innovative solutions for all power conversion applications. It enables the design of converters with the lowest overall inductance. Fast, low switching loss chip-sets can therefore be used for the first time in high-current applications. ABB’s LinPak modules’ low inductance leads directly to their lowest switching losses and excellent robustness.

The 5SNG 1000X170300 is a unique LinPak 1700V IGBT module from ABB with ultra-low inductance, configured in a compact design, phase-leg topology. This module uses the latest ABB Soft Punch Through (SPT++) silicon IGBT and diode.

This report presents a deep technology analysis of the 5SNG 1000X170300 module and its cost. Supported by a full teardown of the module’s components and housing, this report reveals the innovative assets that enable ABB to assemble its SPT++ chipsets in the LinPak package.

This report provides insights into the structure, technical choices, design, processes, and supply chain positions. It also estimates manufacturing cost of all the module’s components and analyses its selling price. It also includes a detailed comparison with the CAS300M17BM2 1700V SiC power module from Cree. This comparison highlights differences in the electrical parameters, dies, packaging and production costs.


Overview / Introduction

Company Profile & Supply Chain o ABB Profileo ABB Modules Portfolioo Supply Chain

Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

ABB 1700V IGBT Power Modules Portfolio

• ABB’s IGBT power modules are available from 1700V to 6500V as single IGBT, dual / phase-leg IGBT, chopper and dualdiode modules.

• The 5SNG 1000X170300 module is the only one with LinPak package in the 1700V catalog. It is of a Phase-leg typedelivering 2x1000A.

ABB’s 1700V IGBT Modules CatalogSource: ABB Website



Company Profile & SupplyChain

Physical Analysis o Synthesiso Packageo IGBT Die Designo IGBT Die Cross-Sectiono Diode Die Designo Diode Die Cross-Section


Cost Analysis


Comparison

Related Reports

About System Plus

(xxx x) SPT++ IGBT:

o Dimension:

xxx mm² (xxx mm x xxx mm)

o Electrical Connection: Soldered on DBC + xxx µm wire bonding

(xxx x) SPT++ Si Diodes:

o Dimension:

xxx mm² (xxx mm x xxx mm)

o Electrical Connection:

Soldered on DBC + xxx µm wire bonding

AlN DBC substrate:

o Dimension: xxx cm² (xxx mm x xxx mm)

o Electrical Connection:

Soldered on Baseplate

AlSiC Baseplate:

o Dimensions:

Synthesis of the Physical Analysis

LinPak Package:

o Dimensions: 140mm x 99.8mm x 37.5mm

PCB

LinPak Package

M3 Screw (x4)M3 Screw (x6)

M8 Nuts (x6)

Silicone gel

PCB Plastic rivet






Cost Analysis


Comparison

Related Reports

About System Plus

Phase-Leg Configuration

ABB 5SNG 1000X170300 Datasheet

Module Housing Removed – Top Optical ViewSPT++ Diode

NTC Thermistor

SPT++ IGBT






Cost Analysis


Comparison

Related Reports

About System Plus

Package Opening – Housing Removal Steps

Housing removal Steps – Tilted Optical Views

M3 Screw/Nut (x4)

M3 Screw (x6)

M8 Nuts (x6)

“ The connection to the auxiliary terminals for gate, emitter, collector and thermistor are realized with M3 screws.In addition, four molded M3 nuts are positioned in the corners to mechanically fix the adapter board for harsh environmental applications like traction or CAV. The adapter-board connects the modules’ gates and auxiliary emitters in parallel. Thus, many modules can be connected in parallel with just one gate-unit. “

Source: “LinPak – the new standard phase-leg module with exceptional low inductance”

ABB Article by R. Schnell et al.

Plastic Rivet (x6)

o The PCB is fixed to the Package by Snap-Riveting technique (6 Rivets are used)






Cost Analysis


Comparison

Related Reports

About System Plus

Package Opening – Housing Removal Steps

Housing removal Steps – Optical View

AlSiC base-plate

Housing

PCB

AlN DBC Substrates (x)

M3 Screw (x4)

Terminal (x6)






Cost Analysis


Comparison

Related Reports

About System Plus

Package Cross-Section

Package Cross-section – Optical View

Package Cross-section – Optical View

DBC substrate

xxx

xxx

xxx

DBC substrate thickness: xxx mm

o Top xxx: xxx µm

o xxx : xxx µm

o Bottom xxx : xxx µm

IGBT die

AlSiC Baseplate

IGBT die

xx µm

xxx

xxx

xxx

DBC solder:

o DBC xxx thickness : xxx µm

xxx xx µm






Cost Analysis


Comparison

Related Reports

About System Plus

Package Cross-Section – EDX

o The presence of xxx and xxx confirms the composition of the xxx substrate






Cost Analysis


Comparison

Related Reports

About System Plus

IGBT die dimensions

IGBT Die – Optical View

o Die dimensions:xxx mm² (xxx mm x xxx mm)

o There is no marking on the die.

xxx

mm

xxx mm

xxxx

xxxxx






Cost Analysis


Comparison

Related Reports

About System Plus

Die Cross-Section

Transistor Cross-Section – SEM View

xxx µm

o Die thickness: xxx µm






Cost Analysis


Comparison

Related Reports

About System Plus

Transistor Cross-Section – Optical View

Die Process – Ring

xxx µm

xxx µm

Transistor process – Optical View

xxxxxx






Cost Analysis


Comparison

Related Reports

About System Plus

Die Cross-Section



xxx µm

xxx µm

xxx µm

xxx : xxx µm

xxx µm

xxx

o xxx thickness: xxx µm


o xxx thickness : xxx µm

xxx: xxx µm

xxx

xxx µm

xxx

xxx x µm

xxxxxx µm

xxx

xxx

o xxx layer thickness: xxx µm



o Xxx thickness : xxx µm

xxx

xxx

xxx






Cost Analysis


Comparison

Related Reports

About System Plus


Die Process

Transistor after delayering – SEM View

o Transistor pitch: xxx µm

xxx µm

xxx µmxxx

xxx

xxx xxx

xxx






Cost Analysis


Comparison

Related Reports

About System Plus

Die Cross-Section – Active Area Doping Revelation

Transistor Cross-Section Doping revelation – SEM View

xxx

xxx

xxx

xxx

xxxxxx

xxx






Cost Analysis


Comparison

Related Reports

About System Plus

Die Dimensions

Diode Die – Optical view

xxx mm

xxx

mm

o Die dimensions:xxx mm² (xxx mm x xxx mm)

Diode Die – Optical view

xxx






Cost Analysis


Comparison

Related Reports

About System Plus

Die Cross-Section

Die Cross-Section – SEM View

xxx µm

o Die thickness: xxx µm

xxx






Cost Analysis


Comparison

Related Reports

About System Plus

Die Cross-Section



xxx

xxx

xxx

xxx

xxx

xxx

xxx µm

xxx µm

xxx µm

o xxx layer thickness: xxx µm



xxx : xxx µmxxx

xxx

xxx




Physical Analysis

Manufacturing Process Flowo Dies Process Flowo Dies Fab Unito Packaging Process Flowo Packaging Fab Unit

Cost Analysis


Comparison

Related Reports

About System Plus

IGBT Process Flow (1/3)

Implantation

• SiO2 deposition

•Pattern SiO2

•P-well implantation

Implantation

• SiO2 deposition

•Pattern SiO2

•N+ Emitter implantation

Gate oxide

•Thin Gate Oxide growth and pattern

Drawing not to Scale

0 00 000

0 00 000

0 00 000

Si Substrate N+

P well




Physical Analysis

Manufacturing Process Flowo Dies Process Flowo Dies Fab Unito Packaging Process Flowo Packaging Fab Unit

Cost Analysis


Comparison

Related Reports

About System Plus

Module Process Flow




Physical Analysis


Cost Analysiso Synthesiso IGBT Die Costo Diode Die Costo Packaging Costo Module Cost


Comparison

Related Reports

About System Plus

IGBT Front-End Cost

o The Front-End cost ranges from $xxx to $xxx accordingto yield variations.

o The main part of the wafer cost is due to the xxx (xx%).




Physical Analysis




Comparison

Related Reports

About System Plus

Diode Wafer Cost per process steps




Physical Analysis




Comparison

Related Reports

About System Plus

Diode Die Cost

The diode die cost ranges from $xxx to $xxx according to yield variations.

The Front-End manufacturing represents xxx% of the component cost(medium yield estimation).

Probe test, dicing and scrap account for xxx% of the component cost.




Physical Analysis




Comparison

Related Reports

About System Plus

Packaging Cost




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Estimated Manufacturer Price

The module manufacturing cost ranges from$xxx to $xxx according to yield variations.

By taking into account a gross margin of 31%for ABB (2018 results), the module sellingprice is estimated to range from $xxx to $xxxaccording to yield variations.




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Comparison Between ABB and Cree 1700V Power Modules

Cree All-SiC 1700V Power Module CAS300M17BM2 ABB IGBT 1700V Power Module 5SNG 1000X170300

o Both modules use xxx AlN DBC substrates.




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Comparison Between ABB and Cree 1700V Power Modules

Cree All-SiC 1700V Power Module CAS300M17BM2 ABB Power Module 5SNG 1000X170300

o xxx power modules are xxx than xxx.




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

Comparison Between ABB and Cree 1700V Power Modules’ Transistors

1700V IGBT in ABB Module1700V SiC MOSFET in Cree Module

Transistor in Module Die Area Current Density Die Thickness

MOSFET in Cree xxx mm² xxx A/mm² xxx µm

IGBT in ABB xxx mm² xxx A/mm² xxx µm

o xxx dies are more performant in delivering high current densities.




Physical Analysis


Cost Analysis


Comparison

Related Reports

About System Plus

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

POWER & COMPOUNDS• Mitsubishi J1- Series 650V High-Power Modules for

Automotive• Infineon FF400R07A01E3 Double Side Cooled IGBT Module• Infineon FS820R08A6P2B HybridPACK Drive IGBT Module• Automotive Power Module Packaging Comparison 2018• Cree 1700V SiC Module

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

Power Electronics & Compound Semiconductor• Power Module Packaging 2018: Material Market and Technology

Trends• Status of the Power Electronics Industry 2018• IGBT Market and Technology Trends 2017

https://www.i-micronews.com/produit/igbt-market-and-technology-trends-2017/


https://www.i-micronews.com/category-listing/product/status-of-the-power-electronics-industry-2018.html


https://www.systemplus.fr/reverse-costing-reports/automotive-power-module-packaging-comparison-2018/


https://www.systemplus.fr/reverse-costing-reports/infineon-ff400r07a01e3-double-side-cooled-igbt-module/


https://www.systemplus.fr/reverse-costing-reports/mitsubishi-j1-series-650v-high-power-modules-for-automotive/


https://www.systemplus.fr/reverse-costing-reports/infineon-fs820r08a6p2b-hybridpack-drive-igbt-module/


https://www.systemplus.fr/reverse-costing-reports/cree-1700v-sic-module/



https://www.i-micronews.com/category-listing/product/power-module-packaging-2018-material-market-and-technology-trends.html






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About System Pluso Company Serviceso Contact

Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

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