spi2016 yitp call a4s.!nakhla! carleton)university)(can))) josé!e.!schutteainé!...
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Workshop Chair Stefano Grivet-‐Talocia Politecnico di Torino (ITA) [email protected]
Program Co-‐Chairs Igor S. Stievano Politecnico di Torino (ITA) Paolo Manfredi Ghent University (BEL)
Standing Committee Uwe Arz PTB Braunschweig (GER) Flavio G. Canavero Politecnico di Torino (ITA) Hartmut Grabinski Leibniz Univ. Hannover (GER) Antonio Maffucci University of Cassino (ITA) Michel S. Nakhla Carleton University (CAN) José E. Schutt-‐Ainé University of Illinois (USA) Madhavan Swaminathan Georgia Tech (USA)
Important Dates January 31, 2016 Paper submission (2-‐4 pp.) February 28, 2016 Notification of acceptance
Conference Program May 8, 2016 (afternoon) Tutorials & welcome reception May 9 -‐ May 11, 2016 Technical sessions, exhibition Social event & gala dinner May 11, 2016 (afternoon) European IBIS summit
+ Info and instructions @ www.spi2016.org
www.spi2016.org
Information for Authors
Over the past nineteen years, the IEEE Workshop on Signal and Power Integrity has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation. In view of last year’s success, the Committee is looking forward to the 20th Edition which will convene in Turin, Italy.
The SPI2016 technical program will include both oral and poster sessions. The conference proceedings will be published on IEEE Xplore. Student authors will be eligible for the Best Student Paper Award. Authors of best-‐ranked papers (based on peer review and presentation at the workshop) will be invited to submit an extended manuscript for a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology (subject to regular review process). A number of prominent experts will be giving keynotes, tutorials, and short courses on areas of emerging interest. An Industry Forum will additionally host both invited and contributed talks from the industry, with the aim of fostering the discussion and cooperation with academia and tool vendors on challenging problems that have no satisfactory solution yet. Details on submission of contributions (both as regular papers and for the Industry Forum) are available on the SPI web site. The 19th European IBIS Summit will also be hosted at the conference venue.
As a consolidated tradition, the technical program will be complemented by fascinating social events, allowing the attendees to enjoy the architectural and cultural heritage as well as the vibrant atmosphere of the former capital of Italy.
Topics of Interest
SPI 2016 FINAL CALL FOR PAPERS
20th IEEE Workshop on Signal and Power Integrity 8-‐11 May 2016, Turin, Italy
• Modeling and simulation for SI/PI • Coupled Signal and Power Integrity analysis • Noise reduction and equalization techniques • High-‐speed link design and modeling • Power distribution networks • RF/microwave/mixed signal systems • 3D IC and packages (TSV/SiP/SoC) • Nano-‐interconnects and nano-‐structures • Electromagnetic theory and modeling • Transmission line theory and modeling
• Macromodeling, reduced order models • Electromagnetic compatibility • Design methodology/flow • Measurements • Jitter and noise modeling • Stochastic/sensitivity analysis • Electro-‐thermal modeling • Chip-‐package co-‐design • Novel CAD concepts • Optical interconnects
Workshop Chair Stefano Grivet-‐Talocia Politecnico di Torino (ITA) [email protected]
Program Co-‐Chairs Igor S. Stievano Politecnico di Torino (ITA) Paolo Manfredi Ghent University (BEL)
Standing Committee Uwe Arz PTB Braunschweig (GER) Flavio G. Canavero Politecnico di Torino (ITA) Hartmut Grabinski Leibniz Univ. Hannover (GER) Antonio Maffucci University of Cassino (ITA) Michel S. Nakhla Carleton University (CAN) José E. Schutt-‐Ainé University of Illinois (USA) Madhavan Swaminathan Georgia Tech (USA)
Important Dates January 31, 2016 Paper submission (2-‐4 pp.)
February 28, 2016 YITP application deadline
Conference Program May 8, 2016 (afternoon) Tutorials & welcome reception May 9 -‐ May 11, 2016 Technical sessions, exhibition Social event & gala dinner May 11, 2016 (afternoon) European IBIS summit
+ Info and instructions @ www.spi2016.org
www.spi2016.org
SPI2016 YOUNG INVESTIGATOR TRAINING PROGRAM (YITP)
Thanks to a financial contribution received from ACRI (ACRI represents Italian joint-‐stock Savings Banks and Foundations of Banking Origin) for SPI2016, full funding is available for young researchers, for participating to the SPI2016 conference and spending a one-‐month period (attached to the SPI event) as a visiting scientist in one of the leading Italian universities that agreed to participate to this program (see map below).
Eligible candidates must qualify as young researchers (age limit: 40), and must be affiliated to non-‐Italian institutions. A cumulative contribution up to 3000€ (researchers from European institutions) or 4000€ (researchers from non-‐European institutions) will be granted based on a rigorous selection process as a research award. This funding will cover participation to the conference, as well as travel costs, lodging, and meals for the entire one-‐month visiting period. Details on eligibility, application and selection process, as well as on available research topics and scientific representatives at the various host universities, can be found at www.spi2016.org/acri_yitp.asp
SPI 2016 YOUNG INVESTIGATOR TRAINING PROGRAM
20th IEEE Workshop on Signal and Power Integrity 8-‐11 May 2016, Turin, Italy
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