sprinkler buddy presentation #8: “testing/finalization of all modules and global placement”...

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Buddy Presentation #8: “Testing/Finalization of all Modules and Global Placement” 3/26/2007 Team M3 Kartik Murthy Panchalam Ramanujan Sasidhar Uppuluri Devesh Nema Kalyan Kommineni Design Manager: Bowei Gai “Low Cost Irrigation Management For Everyone ! ”

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Sprinkler Buddy

Presentation #8:

“Testing/Finalization of all

Modules and Global Placement”

3/26/2007

Team M3Kartik Murthy

Panchalam RamanujanSasidhar Uppuluri

Devesh Nema Kalyan Kommineni

Design Manager: Bowei Gai

“Low Cost Irrigation Management For Everyone ! ”

Current Status Determine Project Develop Project Specifications Plan Architectural Design

Determination of all components in design Detailed logical flowchart

Design a Floor Plan Create Structural Verilog Make Transistor Level Schematic Layout

(~85% done..all modules LVS with only global left) Testing (Extraction, LVS, and Analog Sim.)

(main modules verified)

Finalized Floor Plan

Transistor Count …

Block (# used) Old TC New TC

40:20 Muxes (6) 362 362

60:20 Muxes (2) 644 644

Counter (2) 220 220

KC ROM (1) 1256 1256

P ROM (1) 122 122

Metric Storage SRAMS (2)

2430 2430

Constant Storage ROM (1)

428 428

Floating Point Adder (4)

3210 3501Floating Point Multiplier (2)

1026 1026

10 Bit Registers (9)

210 210

Datapath Logic / Misc.

2305 2305

Total:

30,817

Updated Design SizeBlock (# used) Size (um)

40:20 Muxes (4) 20 x 80

60:20 Muxes (2) 20 x 120

Counter (2) 12 x 17

KC ROM (4 parts) 181 x 8

P ROM (1) 70 x 8

Metric Storage SRAMS (2)

181 x 60

Constant Storage ROM (1)

181 x 8

Floating Point Adder (4)

96x151

Floating Point Multiplier (2)

89 x 40

10 Bit Registers (8) 50 x 10

• 330um x 335 um• ~ 1 : 1.01 aspect ratio• .11 mm^2 area• .28 Density

Layout: Progress

All Big Modules LVS Global Wiring still has to be finished Control Logic locations estimated and

placed Needs wiring

Extracted Simulations Run on Major Blocks

Layout : 60-20 MUX

Density: .35 transistors/um2

Layout : ROMs

The decoder

and ROM didn’t

match at all…

Decoder

ROM

Layout : ROMs

Changed Busses from M 1/2 to

3/4

Moved ROM under Bus

Layout : Shifter

Density: .35 transistors/um2

Layout : FP Add SIG Unit

Inputs

Density: .36 transistors/um2

Outputs

Layout : FP Add Exponent Unit

Density: .34 transistors/um2Outputs

Inputs

Layout : FP Adder FSM

Shaped to “Fill Gaps”

Layout : FP Adder

Density: .28 transistors/um2

Inputs

Outputs

Layout : Floating Point Multiply

Density: .34 transistors/um2

Inputs Outputs

Layout : Entire Chip

Density: .28 transistors/um2

Simulations : Extracted RC Mult

Clean Input

Input Through Min Sized Inv

1.175ns propagation delay

Multiplier Output

Simulations : Extracted RC Shifter

Output from Shifter

Output from Shifter

Clean Shift Signal

340ps propagation delay

Input Through Min Size Inv

Design Challenges and Implementation

DecisionsFor The Past Week

Design Challenge

Translation to HW

Avoiding “Black Space” in Layout

• Completed Global Level Layouts then shaped FSMs to fill gaps• Placed Entire Blocks under higher metal busses

Problems/QuestionsMetal Directionality is lost when we

rotate blocks Possible to ignore this in blocks we don’t

route over ? Especially bad in large blocks (FP Adder)

Even worse to correct

For Next TimeMore Layout

Global Routing Entire Chip Extracted RC Verification