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The new environmental regulations to reduce average CO2 emissions and other automotive trends play in favor of greater vehicle electrification and faster deployment of Electric Vehicles/Hybrid Electric Vehicles (EV/HEVs). Yole Développement expects that there will be 24 million EV/HEVs sold annually by 2024. Although China is the biggest market for electric and hybrid electric vehicles, foreign suppliers still provide a big proportion of power modules integrated into systems in China. However, the share of Chinese power module and die makers is increasing and the quality and performance of these devices is continuously improving. One of the major power module manufacturers in China is StarPower. In this context, System Plus Consulting provides a full reverse costing study of the StarPower module GD820HTX75P6H. This Tri-Pack power module, in a P6 package from StarPower, drives 820 A with a voltage rating of 750 V. It uses copper pin- fin dissipation structure for direct liquid cooling. Supported by a full teardown of the module’s components and housing, this report reveals StarPower’s packaging technological choices as well as the designs of the IGBT and diode dies used. This report provides insights about technology data, manufacturing cost and the selling price of the module. It includes an estimated manufacturing cost of all the module’s components. Also included an exhaustive comparison between the Tri-Pack P6 module GD820HTX75P6H from StarPower and its counterpart from Infineon, the HybridPACK™ Drive FS820R08A6P2B. These comparisons highlight differences in the packaging design, die technology, and cost. COMPLETE TEARDOWN WITH Detailed optical and SEM photos Precise measurements Material EDX analysis Manufacturing process flow Supply chain evaluation Manufacturing cost analysis Estimated selling price Technology and cost comparisons with Infineon’s HybridPACK™ Drive FS820R08A6P2B Tri-Pack power module from StarPower with direct liquid cooling pin-fin structure. REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT Title: StarPower GD820HTX75P6H Tri-Pack IGBT Module Pages: 100 Date: March 2020 Format: PDF & Excel file Price: EUR 3,990 StarPower GD820HTX75P6H Tri-Pack IGBT Module IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM POWER - DISPLAY

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Page 1: StarPower GD820HTX75P6H Tri-Pack IGBT Module · HybridPACK Drive IGBT Module The newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology. June 2017 - EUR 3,490*

The new environmental regulations toreduce average CO2 emissions and otherautomotive trends play in favor of greatervehicle electrification and fasterdeployment of Electric Vehicles/HybridElectric Vehicles (EV/HEVs). YoleDéveloppement expects that there will be24 million EV/HEVs sold annually by 2024.

Although China is the biggest market forelectric and hybrid electric vehicles,foreign suppliers still provide a bigproportion of power modules integratedinto systems in China. However, the shareof Chinese power module and die makersis increasing and the quality andperformance of these devices iscontinuously improving. One of the majorpower module manufacturers in China isStarPower.

In this context, System Plus Consultingprovides a full reverse costing study of theStarPower module GD820HTX75P6H. ThisTri-Pack power module, in a P6 packagefrom StarPower, drives 820 A with avoltage rating of 750 V. It uses copper pin-fin dissipation structure for direct liquidcooling.

Supported by a full teardown of themodule’s components and housing, thisreport reveals StarPower’s packagingtechnological choices as well as thedesigns of the IGBT and diode dies used.

This report provides insights abouttechnology data, manufacturing cost andthe selling price of the module. It includesan estimated manufacturing cost of all themodule’s components.

Also included an exhaustive comparisonbetween the Tri-Pack P6 moduleGD820HTX75P6H from StarPower and itscounterpart from Infineon, theHybridPACK™ Drive FS820R08A6P2B.

These comparisons highlight differences inthe packaging design, die technology, andcost.

COMPLETE TEARDOWN WITH

• Detailed optical and SEM photos

• Precise measurements

• Material EDX analysis

• Manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated selling price

• Technology and cost comparisons with

Infineon’s HybridPACK™ Drive

FS820R08A6P2B

Tri-Pack power module from StarPower with direct liquid cooling pin-finstructure.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Title: StarPowerGD820HTX75P6H Tri-Pack IGBT Module

Pages: 100

Date: March 2020

Format: PDF & Excel file

Price: EUR 3,990

StarPower GD820HTX75P6H Tri-Pack IGBT Module

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY

Page 2: StarPower GD820HTX75P6H Tri-Pack IGBT Module · HybridPACK Drive IGBT Module The newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology. June 2017 - EUR 3,490*

TABLE OF CONTENTS

Introduction

• Executive Summary

• Market Overview

• Reverse Costing Methodology and Glossary

Company Profiles

• StarPower

Physical Analysis

• Overview of the Physical Analysis

• Package Analysis

Package opening

Package cross-section

• Si IGBT Die

IGBT die view and dimensions

IGBT die process

IGBT die cross-section

• Si Diode Die

Diode die view and dimensions

Diode die process

Diode die cross-section

Manufacturing Process

• Si IGBT Fabrication Unit & Process Flow

• Si Diode Fabrication Unit & Process Flow

• Final Test and Packaging Fabrication Unit

• Packaging Process Flow

AUTHORS

Cost Analysis

• Synthesis of the Cost Analysis

• Yield Explanations and Hypotheses

• Si IGBT

IGBT front-end cost

IGBT wafer cost per process step

IGBT die probe test, dicing and cost

• Si Diode

Diode front-end cost

Diode wafer cost per process step

Diode die probe test, dicing and cost

• DBC Cost

DBC BOM cost

DBC assembly cost

• Module Cost

Module BOM cost

Packaging assembly cost

Final module cost

Selling Price Analysis

• Definition of Prices

• Estimation of Selling Price

Comparison

• StarPower vs Infineon Power Modules

STARPOWER GD820HTX75P6H TRI-PACK IGBT MODULE

RELATED REPORTS

Hitachi Double-Side Cooling Power Module from Audi e-tron’s InverterDiscover Hitachi’s power module and its innovative assembling technology of integrated double-side cooling structure.January 2020 - EUR 3,990*

Infineon FS820R08A6P2B HybridPACK Drive IGBT ModuleThe newest HybridPACK Drive power module from Infineonwith EDT2 IGBT technology.June 2017 - EUR 3,490*

Mitsubishi J1- Series 650V High-Power Modules for AutomotiveThe first power module with 7th-gen CSTBT IGBT and an innovative integrated substrate.October 2018 - EUR 4,990*

Amine Allouche is part of SystemPlus Consulting’s Power Electronicsand Compound Semiconductorsteam. Amine holds a Master’sdegree focused on Micro andNanotechnologies for integratedSystems.

Guillaume Chevalier has joinedSystem Plus Consulting in early2018 to perform physical analyses.He holds a two-year universitydegree in technology of physicalmeasurements and instrument-ation technics.

Page 3: StarPower GD820HTX75P6H Tri-Pack IGBT Module · HybridPACK Drive IGBT Module The newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology. June 2017 - EUR 3,490*

COSTING TOOLS

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Process-BasedCosting Tools

ParametricCosting Tools

WHAT IS A REVERSE COSTING®?

Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.

IC Price+

MEMS CoSim+

Power CoSim+

LED CoSim+

3D PackageCoSim+

DisplayPrice+

PCBPrice+

SYSCost+

CONTACTS

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting is specialized

in the cost analysis of electronics

from semiconductor devices to

electronic systems.

A complete range of services and

costing tools to provide in-depth

production cost studies and to

estimate the objective selling price of

a product is available.

Our services:

• STRUCTURE & PROCESS

ANALYSES

• TEARDOWNS

• CUSTOM ANALYSES

• COSTING SERVICES

• COSTING TOOLS

• TRAININGS

www.systemplus.fr

[email protected]

Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGermany+49 151 23 54 41 [email protected]

America Sales OfficeSteven LAFERRIEREWestern USA & Canada+1 [email protected]

Chris YOUMANEastern USA & Canada+1 919-607-9839 [email protected]

Asia Sales OfficeTakashi ONOZAWAJapan & Rest of Asia+81 80 4371 [email protected]

Mavis WANGGreater ChinaTW +886 979 336 809CN [email protected]

Peter OKKorea+82 10 4089 [email protected]

Our analysis is performed with our costing tool Power CoSim+.

System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from

single chip to complex structures.

Power CoSim+Cost simulation tool to evaluate the cost of any Power Electronics process or device: from single chip tocomplex structures.

Page 4: StarPower GD820HTX75P6H Tri-Pack IGBT Module · HybridPACK Drive IGBT Module The newest HybridPACK Drive power module from Infineon with EDT2 IGBT technology. June 2017 - EUR 3,490*

1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System PlusConsulting except in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.

2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros andworked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will becharged on these initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the companycommits itself in invoicing at the prices in force on the date the order is placed.

3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted accordingto the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of earlypayment.

4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in thecase of a particular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting apenalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is thecurrent one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoicedeadline. This penalty is sent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the

total invoice amount when placing his order.

5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.

6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.

7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).

8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?

9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.

10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.

11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.

TERMS AND CONDITIONS OF SALES