taikan suehara, siecal meeting in tokyo, 10 sep. 2014 page 1 status of daq development for...

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Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ Status of DAQ development development for ILD-SiECAL in for ILD-SiECAL in Kyushu Kyushu (and more) (and more) Taikan Suehara (Kyushu University, Japan)

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Page 1: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1

Status of DAQ Status of DAQ developmentdevelopment

for ILD-SiECAL in Kyushufor ILD-SiECAL in Kyushu(and more)(and more)

Taikan Suehara(Kyushu University, Japan)

Page 2: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 2

• Communication with Hamamatsu• Idea of test setup for mass production• DAQ

– Overall plan– Connecting to EUDAQ

TopicsTopics

Page 3: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 3

• Hamamatsu said:– 8 inch is possible, but not desired for HPK

standard thickness is 700-800 mextra cost for thinner (due to grinding)resistivity is smaller ( more bias voltage)simple patterns only

– 6 inch: sensors of 320 and 500 m thicknesscost almost the same650 m, 10-15% raise on cost< 300 m, 70% raise on cost70,000 chips/year (ILD DBD: ~ 5 years)

• 500 m, 6 inch currently seems the best

thicker & bigger sensorsthicker & bigger sensors

Page 4: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 4

1. Chips from Hamamatsu– IV/CV tested in Hamamatsu

2. Laser scan on every pixel on bare chips

– Crosstalk (connecting pixels)– Operable gain (not precise)

3. Glued to PCB/SKIROC, making slabs4. Test with RI source (57Co or 90Sr)

– Gain calibration– Noise

Test stand for mass productionTest stand for mass production

Page 5: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 5

Plan of laser scanPlan of laser scan

XYZ stage

Si sensor

Springs or conductor sheet

PCB with many holes

Electrode

Laser beamPut the IR laserbeam at everygap between thepixels usingXYZ stage

Check gain (roughly) andleakage (connecting) pixelon each pixel before gluing

Should be short time eg.2 sec/gap, 300 pad/day(can be loosen if we havemultiple stations) N substrate

P+

Metal (Al)Insulating layer

SiO2 protective film

e-h pair

Metal (Al)

ions

PixelGapPixelLaser beam

readout(SKIROC?)

Page 6: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 6

• Calibration of gain and noise with electronics• 90Sr (2.28 MeV (Max) e-)

– MIP-like signals (non-monochromatic)– Dependence on angle to source

• 57Co (122 & 136 keV (10%) ) life: 0.7 yr– quasi-Monochromatic gamma, easy to calibrate– only ~2% stops at 500 m silicon: scattering

background

• < 1 hour of accumulation time required

Slab test with RI sourceSlab test with RI source

slabs

source

Page 7: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 7

• 57Co will arrive in Oct. 90Sr already available

• XYZ automated stage: order soon• PCB with holes: should design• DAQ: firstly CAMAC with non-full

channel(eg. 16 channels)

• Plan to establish them within this fiscal year (~Mar. 2015)

• DAQ with SKIROC: next fiscal year

Plan to assemble a test stationPlan to assemble a test station

Page 8: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 8

DAQDAQ

Page 9: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 9

DAQ in Kyushu nowDAQ in Kyushu now

Page 10: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 10

Ongoing1.Online monitor (talk by H. Hirai)2.Connection to external framework(EUDAQ or others)Planned after looking at new calicoes1.Flexible logging system2.C++ support module3.Enforce analysis/debugging

DAQ development plans in DAQ development plans in KyushuKyushu

Page 11: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 11

• Structure• Data format (LCIO)• Schedule/Plan

Topics about EUDAQ Topics about EUDAQ connectionconnection

Page 12: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 12

EUDAQ structureEUDAQ structure

CaliceProducer

calicoes / others

TCP connection

Page 13: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 13

1. Store ‘hit’-like objects• We have ‘CalorimeterHit’ class in LCIO• Need threshold – not always suitable for

low-level analysis (cross talk etc.)

2. Store simple array of raw data planned• More flexibility; hit-like data can be

created from the raw array• Need more steps for high-level analysis• No specific LCIO structure, use

LCGenericObject with attachment class

Data format in LCIOData format in LCIO

Page 14: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 14

LCIO: LCIO: GenericObjectGenericObject

LCIO Event 1 ROC- LCIO collections 1 types of data (SiADC, ScADC, ScTDC etc.)-LCIO objectsLCGenericObject 1 chip of data

LCGenericObject cansave one array(int, float, double)

dataDescriptionin every object can beused for tags, eg.“LDA=1;DIF=2;BX=10;”

Page 15: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 15

Current statusCurrent statusSucceeded to run EUDAQwith CaliceProducer producingdummy data encoded to LCIO objectand save to LCIO file using DataCollector

Ready to attach to calicoes/others

Page 16: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 16

EUDAQ part•Writing TCP adapter•Converter from raw to LCIO (if needed)calicoes part•Attachment of calicoes to output data to TCP

•Integration and test•Testbeam at CERN: 26 Nov. – 8 Dec.

Things to doThings to do

Page 17: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 17

• We started to work on DAQ(Thanks to LLR and DESY for sending us setup)

• Our first target is the testbeam Nov.-Dec.

• Base software is updating: we’d like to adapt to it

• We’ll also work on prototype of test facility

SummarySummary

Page 18: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 18

Page 19: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 19

ROC control on TB modeROC control on TB mode

piconf calicoes/pyrame

Sc hardware Si hardware

Sc data Si data

Event builder

CCCnext ROC

Event builderwill control next ROCNeed to modify piconf/CCC

Page 20: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 20

ImageImage

Run control

piconf calicoes/pyrame

Sc hardware Si hardware

Sc data Si data

Event builder

LCIO file(s)

Event display

start/stop

EUDAQ

start/stop

Page 21: Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1 Status of DAQ development for ILD-SiECAL in Kyushu (and more) Taikan Suehara (Kyushu University,

Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 21

Aims•Assure all data are correctly arrived•Assure ROC # is consistent on the whole system•Common format for Si/Sc cal data•Assure run IDInputs•idea a: common LCIO objects•idea b: raw + converter First to implementpiconf seems to have no output formatter

Data CollectorData Collector