taikan suehara, siecal meeting in tokyo, 10 sep. 2014 page 1 status of daq development for...
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Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 1
Status of DAQ Status of DAQ developmentdevelopment
for ILD-SiECAL in Kyushufor ILD-SiECAL in Kyushu(and more)(and more)
Taikan Suehara(Kyushu University, Japan)
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 2
• Communication with Hamamatsu• Idea of test setup for mass production• DAQ
– Overall plan– Connecting to EUDAQ
TopicsTopics
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 3
• Hamamatsu said:– 8 inch is possible, but not desired for HPK
standard thickness is 700-800 mextra cost for thinner (due to grinding)resistivity is smaller ( more bias voltage)simple patterns only
– 6 inch: sensors of 320 and 500 m thicknesscost almost the same650 m, 10-15% raise on cost< 300 m, 70% raise on cost70,000 chips/year (ILD DBD: ~ 5 years)
• 500 m, 6 inch currently seems the best
thicker & bigger sensorsthicker & bigger sensors
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 4
1. Chips from Hamamatsu– IV/CV tested in Hamamatsu
2. Laser scan on every pixel on bare chips
– Crosstalk (connecting pixels)– Operable gain (not precise)
3. Glued to PCB/SKIROC, making slabs4. Test with RI source (57Co or 90Sr)
– Gain calibration– Noise
Test stand for mass productionTest stand for mass production
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 5
Plan of laser scanPlan of laser scan
XYZ stage
Si sensor
Springs or conductor sheet
PCB with many holes
Electrode
Laser beamPut the IR laserbeam at everygap between thepixels usingXYZ stage
Check gain (roughly) andleakage (connecting) pixelon each pixel before gluing
Should be short time eg.2 sec/gap, 300 pad/day(can be loosen if we havemultiple stations) N substrate
P+
Metal (Al)Insulating layer
SiO2 protective film
e-h pair
Metal (Al)
ions
PixelGapPixelLaser beam
readout(SKIROC?)
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 6
• Calibration of gain and noise with electronics• 90Sr (2.28 MeV (Max) e-)
– MIP-like signals (non-monochromatic)– Dependence on angle to source
• 57Co (122 & 136 keV (10%) ) life: 0.7 yr– quasi-Monochromatic gamma, easy to calibrate– only ~2% stops at 500 m silicon: scattering
background
• < 1 hour of accumulation time required
Slab test with RI sourceSlab test with RI source
slabs
source
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 7
• 57Co will arrive in Oct. 90Sr already available
• XYZ automated stage: order soon• PCB with holes: should design• DAQ: firstly CAMAC with non-full
channel(eg. 16 channels)
• Plan to establish them within this fiscal year (~Mar. 2015)
• DAQ with SKIROC: next fiscal year
Plan to assemble a test stationPlan to assemble a test station
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 8
DAQDAQ
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 9
DAQ in Kyushu nowDAQ in Kyushu now
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 10
Ongoing1.Online monitor (talk by H. Hirai)2.Connection to external framework(EUDAQ or others)Planned after looking at new calicoes1.Flexible logging system2.C++ support module3.Enforce analysis/debugging
DAQ development plans in DAQ development plans in KyushuKyushu
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 11
• Structure• Data format (LCIO)• Schedule/Plan
Topics about EUDAQ Topics about EUDAQ connectionconnection
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 12
EUDAQ structureEUDAQ structure
CaliceProducer
calicoes / others
TCP connection
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 13
1. Store ‘hit’-like objects• We have ‘CalorimeterHit’ class in LCIO• Need threshold – not always suitable for
low-level analysis (cross talk etc.)
2. Store simple array of raw data planned• More flexibility; hit-like data can be
created from the raw array• Need more steps for high-level analysis• No specific LCIO structure, use
LCGenericObject with attachment class
Data format in LCIOData format in LCIO
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 14
LCIO: LCIO: GenericObjectGenericObject
LCIO Event 1 ROC- LCIO collections 1 types of data (SiADC, ScADC, ScTDC etc.)-LCIO objectsLCGenericObject 1 chip of data
LCGenericObject cansave one array(int, float, double)
dataDescriptionin every object can beused for tags, eg.“LDA=1;DIF=2;BX=10;”
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 15
Current statusCurrent statusSucceeded to run EUDAQwith CaliceProducer producingdummy data encoded to LCIO objectand save to LCIO file using DataCollector
Ready to attach to calicoes/others
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 16
EUDAQ part•Writing TCP adapter•Converter from raw to LCIO (if needed)calicoes part•Attachment of calicoes to output data to TCP
•Integration and test•Testbeam at CERN: 26 Nov. – 8 Dec.
Things to doThings to do
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 17
• We started to work on DAQ(Thanks to LLR and DESY for sending us setup)
• Our first target is the testbeam Nov.-Dec.
• Base software is updating: we’d like to adapt to it
• We’ll also work on prototype of test facility
SummarySummary
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 18
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 19
ROC control on TB modeROC control on TB mode
piconf calicoes/pyrame
Sc hardware Si hardware
Sc data Si data
Event builder
CCCnext ROC
Event builderwill control next ROCNeed to modify piconf/CCC
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 20
ImageImage
Run control
piconf calicoes/pyrame
Sc hardware Si hardware
Sc data Si data
Event builder
LCIO file(s)
Event display
start/stop
EUDAQ
start/stop
Taikan Suehara, SiECAL meeting in Tokyo, 10 Sep. 2014 page 21
Aims•Assure all data are correctly arrived•Assure ROC # is consistent on the whole system•Common format for Si/Sc cal data•Assure run IDInputs•idea a: common LCIO objects•idea b: raw + converter First to implementpiconf seems to have no output formatter
Data CollectorData Collector