technical specification industrial compact flash card

140
_______________________________________________________________________________________________ Technical Specification Industrial Compact Flash Card Release Date: June 2005 Version: 1.4 _______________________________________________________________________________________ SCM PC-Card GmbH Sperl-Ring 4 D-85276 Pfaffenhofen Tel: +49 8441 788 810 Fax: +49 8441 788 900 www.scm-pc-card.de

Upload: others

Post on 03-May-2022

8 views

Category:

Documents


0 download

TRANSCRIPT

Page 1: Technical Specification Industrial Compact Flash Card

_______________________________________________________________________________________________

Technical Specification Industrial Compact Flash Card

Release Date: June 2005

Version: 1.4 _______________________________________________________________________________________

SCM PC-Card GmbH Sperl-Ring 4 D-85276 Pfaffenhofen Tel: +49 8441 788 810 Fax: +49 8441 788 900 www.scm-pc-card.de

Page 2: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 1/139 0605V4

Preliminary

S-CN CompactFlash Card

Industrial Application

Product Specification

June 2005

S-CN : Single-Level-Cell-NAND

Page 3: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 2/139 0605V4

Document History

Version Description Date Approved by 1 New issue Apr. 2004 Debby Chang

2

1. Supported flash kind for block size. 2.Capacity appearance modify 3.Checking Product UDMA function (announce not supported multi word DMA)

August. 2004 Xeras Xiang

3 1.Update AC Characteristics December 2004 Ethan Cheng

4

1. Power Consumptions 2. Environment conditions 3. MTBF 4. R/W Test 5. Temp Flow Chart 6. PCB No

June 2005 Verlaine Lin

Page 4: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 3/139 0605V4

Contents INDUSTRIAL APPLICATION.............................................................................................................................................................................1

1. INTRODUCTION.........................................................................................................................................................................................7

1.1 GENERAL DESCRIPTION ........................................................................................................................................................................7 1.2 FEATURES...............................................................................................................................................................................................8

2. PRODUCT SPECIFICATION...................................................................................................................................................................9

2.1 OPERATION AND ENVIRONMENT DESCRIPTION....................................................................................................................................9 2.2 PHYSICAL DESCRIPTION ......................................................................................................................................................................10

3. PRODUCT MODEL ..................................................................................................................................................................................11

3.1 PART NUMBER DEFINITION.................................................................................................................................................................11

4. SUPPORT FLASH MEDIA......................................................................................................................................................................12

4.1 SUPPORTED NAND FLASH TYPE.......................................................................................................................................................12 4.2 LOGICAL FORMAT PARAMETERS (CHS) ............................................................................................................................................12

5. BLOCK DIAGRAM...................................................................................................................................................................................14

5.1 CONTROLLER ARCHIVE.......................................................................................................................................................................14 5.2 FLASH CARD ARCHIVE........................................................................................................................................................................14

6. SPECIFICATION AND FEATURES.....................................................................................................................................................15

6.1 ELECTRICAL SPECIFICATION...............................................................................................................................................................15 6.1.1 Absolute Maximum Ratings..........................................................................................................................................................15 6.1.2 General DC Characteristic...........................................................................................................................................................15 6.1.3 DC Electrical Characteristics for 5 Volts Operation..................................................................................................................15 6.1.4 DC Electrical Characteristics for 3.3 Volts Operation...............................................................................................................16 6.1.5 Attribute Memory Read Timing Specification .............................................................................................................................16 6.1.6 Configuration Register(Attribute Memory)Write Timing Specification ....................................................................................17 6.1.7 Common Memory Read Timing Specification.............................................................................................................................17 6.1.8 Common Memory Write Timing Specification ............................................................................................................................18 6.1.9 I/O Input (Read) Timing Specification .........................................................................................................................................19 6.1.10 I/O Input (Write) Timing Specification ...................................................................................................................................20 6.1.11 True IDE Mode I/O (Read/Write) Timing Specification........................................................................................................21 6.1.12 True IDE Ultra DMA Mode I/O (Read/Write) Timing Specification ...................................................................................23

6.1.12.1 Ultra DMA Data-In Burst Initiation Timing............................................................................................................................................ 24 6.1.12.2 Sustained Ultra DMA Data-In Burst Timing........................................................................................................................................... 25 6.1.12.3 Ultra DMA Data-In Burst Host Pause Timing ........................................................................................................................................ 25 6.1.12.4 Ultra DMA Data-In Burst Device Termination Timing.......................................................................................................................... 26

Page 5: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 4/139 0605V4

6.1.12.5 Ultra DMA Data-In Burst Host Termination Timing.............................................................................................................................. 26 6.1.12.6 Ultra DMA Data-In Burst Host Termination Timing.............................................................................................................................. 27 6.1.12.7 Sustained Ultra DMA Data-Out Burst Timing........................................................................................................................................ 27 6.1.12.8 Ultra DMA Data-Out Burst Device Pause Timing ................................................................................................................................. 28 6.1.12.9 Ultra DMA Data-Out Burst Device Termination Timing....................................................................................................................... 28 6.1.12.10 Ultra DMA Data-Out Burst Host Termination Timing........................................................................................................................... 29

6.2 POWER MANAGEMENT .......................................................................................................................................................................29 6.2.1 Normal Mode.................................................................................................................................................................................29 6.2.2 Power down Mode ........................................................................................................................................................................29

6.3 PHYSICAL SPECIFICATION ...................................................................................................................................................................30 6.3.1 CompactFlash CF Type I..............................................................................................................................................................30 6.3.2 CompactFlash CF Type II.............................................................................................................................................................30

7. PIN ASSIGNMENT....................................................................................................................................................................................31

7.1 COMPACTFLASH PIN TYPE..................................................................................................................................................................31 7.2 SIGNAL DESCRIPTION..........................................................................................................................................................................33

8. CIS AND FUNCTIONS CONFIGURATION REGISTERS.............................................................................................................38

8.1 CONFIGURATION OPTION REGISTER (200H) .....................................................................................................................................38 8.2 CARD CONFIGURATION AND STATUS REGISTER (ADDRESS 202H) .................................................................................................39 8.3 PIN REPLACEMENT REGISTER (ADDRESS 204H) ..............................................................................................................................40 8.4 SOCKET AND COPY REGISTER (ADDRESS 206H) ..............................................................................................................................40 8.5 CARD INFORMATION STRUCTURE (CIS) ............................................................................................................................................41

9. ATA SPECIFIC REGISTER DEFINITIONS.......................................................................................................................................55

9.1 MEMORY MAPPED ADDRESSING........................................................................................................................................................55 9.2 CONTIGUOUS I/O MAPPING ADDRESSING .........................................................................................................................................56 9.3 OVERLAPPING I/O MAPPING ADDRESSING........................................................................................................................................57 9.4 TRUE IDE MODE.................................................................................................................................................................................57 9.5 ATA REGISTERS...................................................................................................................................................................................58

9.5.1 Data Register .................................................................................................................................................................................58 9.5.2 Error Register ................................................................................................................................................................................58 9.5.3 Feature Register.............................................................................................................................................................................59 9.5.4 Sector Count Register....................................................................................................................................................................59 9.5.5 Sector Number Register ................................................................................................................................................................59 9.5.6 Cylinder Low Register...................................................................................................................................................................60 9.5.7 Cylinder High Register..................................................................................................................................................................60 9.5.8 Drive Head Register......................................................................................................................................................................61 9.5.9 Status Register................................................................................................................................................................................62 9.5.10 Alternate Status Register..........................................................................................................................................................62 9.5.11 Device Control Register...........................................................................................................................................................63

Page 6: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 5/139 0605V4

9.5.12 Drive Address Register ............................................................................................................................................................63

10. ATA COMMANDS................................................................................................................................................................................64

10.1 CHECK POWER MODE - 98H OR E5H ................................................................................................................................................64 10.2 EXECUTE DRIVE DIAGNOSTIC - 90H..................................................................................................................................................65 10.3 ERASE SECTOR(S) - C0H.....................................................................................................................................................................66 10.4 FORMAT TRACK - 50H.........................................................................................................................................................................67 10.5 IDENTIFY DRIVE – ECH ......................................................................................................................................................................68 10.6 IDLE - 97H OR E3H..............................................................................................................................................................................69 10.7 IDLE IMMEDIATE - 95H OR E1H..........................................................................................................................................................70 10.8 INITIALIZE DRIVE PARAMETERS - 91H...............................................................................................................................................71 10.9 READ BUFFER - E4H...........................................................................................................................................................................72 10.10 READ LONG SECTOR(S) - 22H OR 23H...............................................................................................................................................73 10.11 READ MULTIPLE - C4H.......................................................................................................................................................................74 10.12 READ SECTORS(S) – 20H OR 21H.......................................................................................................................................................75 10.13 READ VERIFY SECTOR(S) – 40H OR 41H...........................................................................................................................................76 10.14 RECALIBRATE - 1XH...........................................................................................................................................................................77 10.15 REQUEST SENSE - 03H ........................................................................................................................................................................78 10.16 SEEK - 7XH..........................................................................................................................................................................................79 10.17 SET FEATURE - EFH.............................................................................................................................................................................80 10.18 SET MULTIPLE MODE - C6H...............................................................................................................................................................81 10.19 SET SLEEP MODE - 99H OR E6H ........................................................................................................................................................82 10.20 STANDBY - 96H OR E2H......................................................................................................................................................................83 10.21 STANDBY IMMEDIATE 94H OR E0H ...................................................................................................................................................84 10.22 TRANSLATE SECTOR - 87H..................................................................................................................................................................85 10.23 WEAR LEVEL - F5H.............................................................................................................................................................................86 10.24 WRITE BUFFER - E8H..........................................................................................................................................................................87 10.25 WRITE LONG SECTOR(S) 32H OR 33H...............................................................................................................................................88 10.26 WRITE MULTIPLE - C5H .....................................................................................................................................................................92 10.27 WRITE MULTIPLE WITHOUT ERASE – CDH.......................................................................................................................................93 10.28 WRITE SECTOR(S) - 30H OR 31H........................................................................................................................................................94 10.29 WRITE SECTOR(S) WITHOUT ERASE - 38H.........................................................................................................................................95 10.30 WRITE VERITY - 3CH..........................................................................................................................................................................96

11. ERROR POSTING.....................................................................................................................................................................................97

12. IDENTIFY DRIVE INFORMATION...............................................................................................................................................99

13. ATA PROTOCOL OVERVIEW ..................................................................................................................................................... 103

13.1 PIO DATA IN COMMANDS................................................................................................................................................................ 103 13.2 PIO DATA OUT COMMANDS............................................................................................................................................................ 103 13.3 NON DATA COMMANDS ................................................................................................................................................................... 103

Page 7: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 6/139 0605V4

14. ULTRA DMA DATA-IN COMMANDS................................................................................................................................................... 104

14.1. INITIATING AN ULTRA DMA DATA-IN BURST.......................................................................................................................................... 104 14.2. THE DATA-IN TRANSFER........................................................................................................................................................................... 104 14.3. PAUSING AN ULTRA DMA DATA-IN BURST............................................................................................................................................. 105

14.3.1. Device pausing an Ultra DMA data-in burst ............................................................................................................................... 105 14.3.2. Host pausing an Ultra DMA data-in burst ................................................................................................................................... 105 14.3.3. Terminating an Ultra DMA data-in burst ..................................................................................................................................... 105

14.3.3.1. Device terminating an Ultra DMA data-in burst............................................................................................................................................. 105 14.3.3.2. Host terminating an Ultra DMA data-in burst................................................................................................................................................. 106

14.4. ULTRA DMA DATA-OUT COMMANDS ..................................................................................................................................................... 108 14.4.1. Initiating an Ultra DMA data-out burst........................................................................................................................................ 108 14.4.2. The data-out transfer ...................................................................................................................................................................... 108 14.4.3. Pausing an Ultra DMA data-out burst.......................................................................................................................................... 109

14.4.3.1 Host pausing an Ultra DMA data-out burst...................................................................................................................................................... 109 14.4.4. Terminating an Ultra DMA data-out burst................................................................................................................................... 109

14.4.4.1 Host terminating an Ultra DMA data-out burst................................................................................................................................................ 109 14.4.4.2 Device terminating an Ultra DMA data-out burst............................................................................................................................................ 110

14.5. ULTRA DMA CRC RULES.........................................................................................................................................................................111

15. SECURITY CF...............................................................................................................................................................................................113

16.SYSTEM ENVIRONMENTAL SPECIFICATIONS............................................................................................................................. 138

16.1 TEMPERATURE TEST FLOW ...................................................................................................................................................................... 138 16.2ALTITUDE TEST.......................................................................................................................................................................................... 139

Page 8: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 7/139 0605V4

1. Introduction

1.1 General Description The S-CN CompactFlash Card uses NAND-Type flash memory devices, which leads to its

remarkable high performance and comes with capacities from 256 MB to 6GB unformatted.

Compliant with ISA (Industrial Standard Architecture) bus interface standard, the S-CN CompactFlash Card performs sequential read/write for each sector (512 bytes) count. It also conforms to CompactFlash Specification and is designed with precision mechanics to enable host devices to read/write from the CompactFlash interface into Flash Media. It can operate with a 3.3V or 5V single power from the host side.

The card provides extraordinary memory medium for PC or any other electric equipment and digital still camera, and, in particular, the S-CN CompactFlash Card has been approved through various compatibility tests to be used in numerous portable desktop, notebook computers and personal handheld devices such as handheld audio recorders, PDAs, Palm sized PCs, Handheld PCs and Auto PCs under industrial environment.

Page 9: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 8/139 0605V4

1.2 Features PC Card compliant

Conforms to CompactFlash standard

Compatible with PCMCIA ATA specification

Support CIS implemented with attribute memory

Compatible with all PC Card Services and Socket Services

PCMCIA ATA / IDE interface

ATA command set compatible

Support for 8-bit or 16-bit host data transfer

Program and auto-wait-state initiation for compatibility with any IORDY supporting host

Compatibility with host ATA disk I/O BIOS, DOS/Windows file system, utilities, and application software

Extremely rugged and reliable

Advanced defect block management

Support background erased operation

3.3/5 Volt power supply, very low power consumption

● Zero-power data retention, no batteries required

● Internal self-diagnostic program operates at VCC power on

● Auto sleep mode

High reliability based on internal ECC (Error Correcting Code) function Zero-power data retention, no batteries required

3 variations of mode access ● Memory card mode

● I/O card mode

● True IDE mode

- PIO Mode 4

- UDMA mode 2

Not supported Multi word DMA formatted.

Page 10: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 9/139 0605V4

2. Product Specification 2.1 Operation and environment description

5V ± 10% Operating Voltage DC Input Power 3.3V ± 5% Read Mode: 40mA (Max) Write Mode: 60mA (Max) Standby Mode:6.5mA(Approach alues)

5V

Read/ Write Peak: 100mA Read Mode: 20mA (Max) Write Mode: 35 mA (Max) Standby Mode: 1mA (Approach values)

Typical Power Consumptions:

3.3V

Read/ Write Peak: 100mA Extended Temp. -20°C to +85°C

Operating Temperature Industrial Temp. -40°C to +85°C Extended Temp. -40°C to +90°C

Storage Temperature Industrial Temp. -50°C to +90°C

Humidity Operation 5% to 95% (Non-condensing ) Humidity Non-operation 5% to 95% (Non-condensing ) Shock Operation 3000-G (Max.) Shock Non-operation 3000-G (Max.) Vibration Operation 30-G (Peak to peak to maximum)

Environment conditions

Vibration Non-operation 30-G (Peak to peak to maximum) DOS

Windows 98 Windows ME Operation System supported Compatibility (Microsoft Product) Windows NT Windows 2000 Windows XP

Page 11: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 10/139 0605V4

2.2 Physical description Weight: 15 g Type I Pin-Pitch: 1.27 mm

L x W x H 36.4 x 42.8 x 3.3 (mm)

Weight: 23 g 1.Weight and Measures (unit: m)

Type II Pin-Pitch: 1.27 mm

L x W x H 36.4 x 42.8 x 5.0 (mm)

2. Storage Capacities Capacity 256MB – 6GB To/from Flash memory (burst mode):

up to 20 Mbytes/sec Data Transfer Rates To/from host (burst mode):

up to 8 Mbytes/sec

3. Performance

Data Access Time 1.2 ms MTBF 3,000,000 hours

Error Correction More than 3 bit error correction per second read

ECC High reliability based on internal ECC function

4. Reliability

R/W Test Testdisk: 1,000,000 Read/Write cycles

Page 12: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 11/139 0605V4

3. Product Model & Ordering Information

CFA = Compact Flash Card

CFA-XXXX-13T-00-CP

XXXX: 032M 32Mbyte Type I064M 64Mbyte Type I128M 128Mbyte Type I256M 256Mbyte Type I512M 512Mbyte Type I001G 1GByte Type I002G 2GByte Type I003G 3GByte Type I004G 4GByte Type I006G 6GByte Type II008G 8GByte Type II

T: C Commercial Temp. Range 0 / +70° CelI Industrial Temp. Range -40 / +85° Cel

CP: Full Metal Housing

Page 13: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 12/139 0605V4

4. Support Flash Media 4.1 Supported NAND Flash Type 4-1-1. Small block size of 16KB Unit: bits

Flash Capacity 128 Mega 256 Mega 512 Mega

Operation Voltage 2.7V to 3.6V

4-1-2. Large block size of 128KB Unit: bits

Flash Capacity 1 Giga 2 Giga 4 Giga 8 Giga

Operation Voltage 2.7V to 3.6V

4.2 Logical Format Parameters (CHS) CF Type I (3.3mm) Card Capacity*1

Unit: Bytes Card Density*4 256M 512M Cylinder 992 1007 Heads 16 16 Sectors/Track*2 32 63 Total Sectors/Card*3 507904 1,015,056

Capacity*5 260,046,848 519,708,672Unit: Bytes

Card Density*4 1GB 2GB 3GB 4GB Cylinder 2015 4030 6046 8061 Heads 16 16 16 16 Sectors/Track*2 63 63 63 63 Total Sectors/Card*3 2,031,120 4,062,240 6,094,368 8,125,488

Capacity*5 1,039,933,440 2,079,866,880 3,120,316,416 4,160,249,856

Page 14: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 13/139 0605V4

CF Type II (5.0mm)

Card Density*4 6GB Cylinder 12092 Heads 16 Sectors/Track*2 63 Total Sectors/Card*3 12,188,736

Capacity*5 6,240,632,832 Notes:

1. These data are written in Identify table. 2. Total tracks =number of head x number of cylinder. 3. Total sector/Card = sector/track x number of head x number of cylinder 4. Those are general unformatted capacity of all cards. 5. It’s the logical address capacity including the area which is used for file system.

Page 15: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 14/139 0605V4

5. Block Diagram 5.1 Controller Archive

5.2 Flash Card Archive

CompactFlash Interface

NAND Type Flash Memory

Reset Frequency Provider

Power on

Color Control

x51 Turbo base Micro processor

Host Interface CIS CCR Task

Data transfer

Control

Data buffer ECC Logic

Flash Memory Interface Control/ Status

CIS: Card Information Structure CCR: Card Configuration Register ECC: Error Correcting Code

Host Interface Flash Memory

Controller

Reset IC According Card Capacity From Range 25MHz ~ 38MHz Power IC

Page 16: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 15/139 0605V4

6. Specification and Features

6.1 Electrical Specification

6.1.1 Absolute Maximum Ratings

SYMBOL PARAMETER RATING UNITS

VCC Power supply -0.3 to 6 V

VIN Input voltage -0.3 to VCC + 0.3 V

VOUT Output voltage -0.3 to VCC+ 0.3 V

TSTG Storage temperature -50 to 90 ℃

Topr Operating temperature -40 to 85 ℃

6.1.2 General DC Characteristic

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

CIN Input capacitance 15 pF

COUT Output capacitance 15 pF

6.1.3 DC Electrical Characteristics for 5 Volts Operation

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

VIN Input voltage 0 VCC V

VCC Power supply 4.5 5.0 5.5 V

TSTG Storage temperature -50 90 ℃

TOPR Operating temperature -40 85 ℃

VIL Input low voltage CMOS 0.8 V

VIH Input high voltage CMOS 2.4 V

VOL Output low voltage IOL=8mA 0.4 V

VOH Output high voltage IOH=-8mA VCC – 0.8 V

Page 17: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 16/139 0605V4

6.1.4 DC Electrical Characteristics for 3.3 Volts Operation

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

VIN Input voltage 0 VCC V

VDD Power supply 3.0 3.3 3.6 V

TSTG Storage temperature -50 90 ℃

TOPR Operating temperature -40 85 ℃

VIL Input low voltage CMOS 0.6 V

VIH Input high voltage CMOS 2.4 V

VOL Output low voltage IOL=8mA 0.4 V

VOH Output high voltage IOH=-8mA VDD – 0.8 V

6.1.5 Attribute Memory Read Timing Specification

Attribute Memory Read Timing 300 ns

Item Symbol IEEE Symbol

Read Cycle Time tc(R) tAVAV 300

Address Cycle Time ta(A) tAVQV 300

Card Enable Access Time ta(CE) tELQV 300

Output Enable Access Time ta(OE) tGLQV 150

Output Disable Time from CE tdis(CE) tEHQZ 100

Output Disable Time from OE tdis(OE) tGHQZ 100

Address Setup Time tsu (A) tAVGL 30

Output Enable Time from CE ten(CE) tELQNZ 5

Output Enable Time from OE ten(OE) tGLQNZ 5

Data Valid from Address Change tv(A) tAXQX 0

Page 18: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 17/139 0605V4

6.1.6 Configuration Register(Attribute Memory)Write Timing Specification

Configuration Register(Attribute Memory)Write Timing

250 ns

Item Symbol IEEE Symbol Min ns Max ns

Write Cycle Time tc(W) tAVAV 250

Write Pulse Width tw(WE) tWLWH 150

Address Setup Time tsu(A) tAVWL 30

Write Recovery Time trec(WE) tWMAX 30

Data Setup Time for WE tsu(D-WEH) tDVWH 80

Data Hold Time th(D) tWMDX 30

6.1.7 Common Memory Read Timing Specification

Item Symbol IEEE Symbol Min ns Max ns

Output Enable Access Time ta(OE) tGLQV 125

Output Disable Time from OE tdis(OE) tGHQZ 100

Address Setup Time tsu(A) tAVGL 30

Address Hold Time th(A) tGHAX 20

CE Setup before OE tsu(CE) tELGL 0

CE Hold following OE th(CE) tGHEH 20

Wait Delay Falling from OE tv(WT-OE) tGLWTV 35

Data Setup for Wait Release tv(WT) tQVWTH 0

Wait Width Time tw(WT) tWTLWTH 350 (3000 for

CF+)

Page 19: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 18/139 0605V4

6.1.8 Common Memory Write Timing Specification

Item Symbol IEEE Symbol Min ns Max ns

Data Setup before WE tsu(D-WEH) tDVWH 80

Data Hold following WE th(D) tWMDX 30

WE Pulse Width tw(WE) tWLWH 150

Address Setup Time tsu(A) tAVWL 30

CE Setup before WE tsu(CE) tELWL 0

Write Recovery Time trec(WE) tWMAX 30

Address Hold Time th(A) tGHAX 20

CE Hold following WE th(CE) tGHEH 20

Wait Delay Falling from WE tv(WT-WE) tWLWTV 35

WE High from Wait Release tv(WT) tWTHWH 0

Wait Width Time tw (WT) tWTLWTH 350 (3000 for

CF+)

Page 20: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 19/139 0605V4

6.1.9 I/O Input (Read) Timing Specification

Item Symbol IEEE Symbol Min ns Max ns

Data Delay after IORD td(IORD) tlGLQV 100

Data Hold following IORD th(IORD) tlGHQX 0

IORD Width Time tw(IORD) tlGLIGH 165

Address Setup before IORD tsuA(IORD) tAVIGL 70

Address Hold following IORD thA(IORD) tlGHAX 20

CE Setup before IORD tsuCE(IORD) tELIGL 5

CE Hold following IORD thCE(IORD) tlGHEH 20

REG Setup before IORD tsuREG(IORD) tRGLIGL 5

REG Hold following IORD thREG(IORD) tlGHRGH 0

INPACK Delay Falling from IORD tdfINPACK(IORD) tlGLIAL 0 45

INPACK Delay Rising from IORD tdrINPACK(IORD) tlGHIAH 45

IOIS16 Delay Falling from Address tdfIOIS16(ADR) tAVISL 35

IOIS16 Delay Rising from Address tdrIOIS16(ADR) tAVISH 35

Wait Delay Falling from IORD tdWT(IORD) tlGLWTL 35

Data Delay from Wait Rising td(WT) tWTHQV 0

Wait Width Time

tw(WT) tWTLWTH

350 (3000 for

CF+)

Page 21: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 20/139 0605V4

6.1.10 I/O Input (Write) Timing Specification

Item Symbol IEEE Symbol Min ns Max ns

Data Setup before IOWR tsu(IOWR) tDVIWH 60

Data Hold following IOWR th(IOWR) tlWHDX 30

IOWR Width Time tw(IOWR) tlWLIWH 165

Address Setup before IOWR tsuA(IOWR) tAVIWL 70

Address Hold following IOWR thA(IOWR) tlWHAX 20

CE Setup before IOWR tsuCE(IOWR) tELIWL 5

CE Hold following IOWR thCE(IOWR) tlWHEH 20

REG Setup before IOWR tsuREG(IOWR) tRGLIWL 5

REG Hold following IOWR thREG(IOWR) tlWHRGH 0

IOIS16 Delay Falling from Address tdfIOIS16(ADR) tAVISL 35

IOIS16 Delay Rising from Address tdrIOIS16(ADR) tAVISH 35

Wait Delay Falling from IOWR tdWT(IOWR) tlWLWTL 35

IOWR high from Wait high tdrIOWR(WT) tWTJIWH 0

Wait Width Time

tw(WT) tWTLWTH 350

Page 22: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 21/139 0605V4

6.1.11 True IDE Mode I/O (Read/Write) Timing Specification

True IDE Mode I/O (Read/Write Timing Specification)

item Mode 0

(ns)

Mode 1

(ns)

Mode 2

(ns)

Mode 3

(ns)

Mode 4

(ns)

t 0 Cycle time (min) 600 383 240 180 120

t1 Address Valid to -IORD/-IOWR

setup (min) 70 50 30 30 25

t2 -IORD/-IOWR (min) 165 125 100 80 70

t 2 -IORD/-IOWR (min) Register (8 bit) 290 290 290 80 70

t 2i -IORD/-IOWR recovery time (min) - - - 70 25

t3 -IOWR data setup (min) 60 45 30 30 20

t4 -IOWR data hold (min) 30 20 15 10 10

t5 -IORD data setup (min) 50 35 20 20 20

t6 -IORD data hold (min) 5 5 5 5 5

t6Z -IORD data tristate (max)

30 30 30 30 30

t7 Address valid to -IOCS16 assertion

(max) 90 50 40 n/a n/a

t8 Address valid to -IOCS16 released

(max) 60 45 30 n/a n/a

t9 -IORD/-IOWR to address valid hold 20 15 10 10 10

tRD Read Data Valid to IORDY active

(min), if IORDY initially low after tA

0

0 0 0 0

tA tA IORDY Setup time 35 35 35 35 35

tB IORDY Pulse Width (max) 1250 1250 1250 1250 250

Page 23: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 22/139 0605V4

Page 24: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 23/139 0605V4

6.1.12 True IDE Ultra DMA Mode I/O (Read/Write) Timing Specification

Name UDMA

Mode 0 (ns)

UDMA

Mode 1 (ns)

UDMA

Mode 2 (ns)

UDMA

Mode 3 (ns)

UDMA

Mode 4 (ns)

Min Max Min Max Min Max Min Max Min Max

t2CYCTYP 240 160 120 90 60 CYC 112 73 54 39 25 t2CYC 230 153 115 86 57 tDS 15.0 10.0 7.0 7.0 5.0 tDH 5.0 5.0 5.0 5.0 5.0 tDVS 70.0 48.0 31.0 20.0 6.7 tDVH 6.2 6.2 6.2 6.2 6.2 tCS 15.0 10.0 7.0 7.0 5.0 tCH 5.0 5.0 5.0 5.0 5.0 tCVS 70.0 48.0 31.0 20.0 6.7 tCVH 6.2 6.2 6.2 6.2 6.2 tZFS 0 0 0 0 0 tDZFS 70.0 48.0 31.0 20.0 6.7 tFS 230 200 170 130 120 tLI 0 150 0 150 0 150 0 100 0 100 tMLI 20 20 20 20 20 tUI 0 0 0 0 0 tAZ 10 10 10 10 10 tZAH 20 20 20 20 20 tZAD 0 0 0 0 0 tENV 20 70 20 70 20 70 20 55 20 55 tRFS 75 70 60 60 60 tRP 160 125 100 100 100 tIORDYZ 20 20 20 20 20 tZIORDY 0 0 0 0 0 tACK 20 20 20 20 20 tSS 50 50 50 50 50

Page 25: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 24/139 0605V4

6.1.12.1 Ultra DMA Data-In Burst Initiation Timing

Page 26: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 25/139 0605V4

6.1.12.2 Sustained Ultra DMA Data-In Burst Timing

6.1.12.3 Ultra DMA Data-In Burst Host Pause Timing

Page 27: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 26/139 0605V4

6.1.12.4 Ultra DMA Data-In Burst Device Termination Timing

6.1.12.5 Ultra DMA Data-In Burst Host Termination Timing

Page 28: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 27/139 0605V4

6.1.12.6 Ultra DMA Data-In Burst Host Termination Timing

6.1.12.7 Sustained Ultra DMA Data-Out Burst Timing

Page 29: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 28/139 0605V4

6.1.12.8 Ultra DMA Data-Out Burst Device Pause Timing

6.1.12.9 Ultra DMA Data-Out Burst Device Termination Timing

Page 30: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 29/139 0605V4

6.1.12.10 Ultra DMA Data-Out Burst Host Termination Timing

6.2 Power Management

6.2.1 Normal Mode The host can reduce the power consumption of the card by changing its status with the following Power Command.

Sleep mode consumes the lowest power. Response time for the card to change from sleep mode to the active state is about 30 ms or less.

Standby mode, the response time is about 5ms or less. This is due to the interface of the card that accepts the command although can't access the media immediately

Idle mode, the card can respond and access the media immediately. The card needs longer time in this mode than in its active mode in order to active several circuits that were not used in the active mode.

Active mode, the card can respond and access the media immediately, and the commands are processed with no delay.

6.2.2 Power down Mode This card can set itself into Power Down mode. To enable this mode, it is needed to use the Information Change command, which is a vender unique command. The advantage of using this mode is the ability to move automatically into Sleep mode after command completion.

Page 31: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 30/139 0605V4

6.3 Physical Specification

6.3.1 CompactFlash CF Type I

6.3.2 CompactFlash CF Type II

Page 32: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 31/139 0605V4

7. Pin Assignment 7.1 CompactFlash Pin Type

PC Card Memory Mode PC Card I/O Mode True IDE Mode No. Pin Name I/O No. Pin Name I/O No. Pin Name I/O 1 GND 1 GND 1 GND 2 D03 I/O 2 D03 I/O 2 D03 I/O 3 D04 I/O 3 D04 I/O 3 D04 I/O 4 D05 I/O 4 D05 I/O 4 D05 I/O 5 D06 I/O 5 D06 I/O 5 D06 I/O 6 D07 I/O 6 D07 I/O 6 D07 I/O 7 CE1# I 7 CE1# I 7 CS0# I 8 A10 I 8 A10 I 8 A10 I 9 OE# I 9 OE# I 9 ATASEL# I 10 A09 I 10 A09 I 10 A09 I 11 A08 I 11 A08 I 11 A08 I 12 A07 I 12 A07 I 12 A07 I 13 VCC 13 VCC 13 VCC 14 A06 I 14 A06 I 14 A06 I 15 A05 I 15 A05 I 15 A05 I 16 A04 I 16 A04 I 16 A04 I 17 A03 I 17 A03 I 17 A03 I 18 A02 I 18 A02 I 18 A02 I 19 A01 I 19 A01 I 19 A01 I 20 A00 I 20 A00 I 20 A00 I 21 D00 I/O 21 D00 I/O 21 D00 I/O 22 D01 I/O 22 D01 I/O 22 D01 I/O 23 D02 I/O 23 D02 I/O 23 D02 I/O 24 WP O 24 IOIS16# O 24 IOCS16# O 25 CD2# O 25 CD2# O 25 CD2# O 26 CD1# O 26 CD1# O 26 CD1# O 27 D11 I/O 27 D11 I/O 27 D11 I/O 28 D12 I/O 28 D12 I/O 28 D12 I/O 29 D13 I/O 29 D13 I/O 29 D13 I/O 30 D14 I/O 30 D14 I/O 30 D14 I/O

Page 33: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 32/139 0605V4

PC Card Memory Mode PC Card I/O Mode True IDE Mode 31 D15 I/O 31 D15 I/O 31 D15 I/O 32 CE2# I 32 CE2# I 32 CS1# I 33 VS1# O 33 VS1# O 33 VS1# O 34 IORD# I 34 IORD# I 34 IORD# I 35 IOWR# I 35 IOWR# I 35 IOWR# I 36 WE# I 36 WE# I 36 WE# I 37 RDY/BSY# O 37 IREQ O 37 INTRQ O 38 VCC 38 VCC 38 VCC 39 CSEL# I 39 CSEL# I 39 CSEL# I 40 VS2# O 40 VS2# O 40 VS2# O 41 RESET I 41 RESET I 41 RESET# I 42 WAIT# O 42 WAIT# O 42 IORDY O 43 INPACK# O 43 INPACK# O 43 RFU*1 O 44 REG# I 44 REG# I 44 RFU*1 I 45 BVD2 I/O 45 SPKR# I/O 45 DASP# I/O 46 BVD1 I/O 46 STSCH#G I/O 46 PDIAG# I/O 47 D08 I/O 47 D08 I/O 47 D08 I/O 48 D09 I/O 48 D09 I/O 48 D09 I/O 49 D10 I/O 49 D10 I/O 49 D10 I/O 50 GND 50 GND 50 GND

Note: 1. RFU is Reserved for Feature Use

Page 34: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 33/139 0605V4

7.2 Signal Description Signal Name Description I/O Pin VCC (PC Card Memory Mode) (PC Card I/O Mode) (True IDE Mode)

5V , 3.3V 13,38

GND (PC Card Memory Mode) (PC Card I/O Mode) (True IDE Mode)

Ground. 1,50

A0-A10 (PC Card Memory Mode)

These address lines along with the #REG signal are used to select the I/O port address registers within the card, the memory mapped port address registers within the Card, a byte in the card's information structure and its configuration control and status registers.

I 8,10,11,12,14,15,16,17,18,19,20

A0-A10 (PC Card I/O Mode)

This signal is the same as the PC Card Memory Mode signal.

A0-A10 (True IDE Mode)

In True IDE Mode only A0-A2 are used to select the one of eight registers in the ATA Task File, the other address lines should be grounded.

D0-D15 (PC Card Memory Mode) (PC Card I/O Mode)

These lines carry the Data, Commands and Status between the host and controller. D00 is the LSB of the even byte of the word. D08 is the LSB of the odd byte of the word.

I/O 2,3,4,5,6, 21,22,23,27,28,29,30,31,47,48,49

D0-D15 (True IDE Mode)

In True IDE Mode, all Task File operations occur in the byte mode on the low order D00-D07 while all data transfers are 16 bits using D00-D15.

CD1#, CD2# (PC Card Memory Mode) (PC Card I/O Mode) (True IDE Mode)

These Card Detect pins are connected to ground on this card and used by the host to determine that the card is fully inserted into the socket.

O 25,26

VS1#,VS2# (PC Card Memory Mode) (PC Card I/O Mode) (True IDE Mode)

Voltage Sense Signals. O 33,40

Page 35: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 34/139 0605V4

Signal Name Description I/O Pin

CSEL# (PC Card Memory Mode)

This signal is not used for this mode. I 39

CSEL# (PC Card I/O Mode)

This signal is not used of this mode.

CSEL# (True IDE Mode)

This internally pulled up signal is used to configure this card as a Master or a Slave. When this pin is grounded, this card is Master. When this pin is open, this card is Slave.

CE1#,CE2# (PC Card Memory Mode) (PC Card I/O Mode)

These signals are used both to select the card and to indicate to the card whether a byte or a word operation is being performed. #CE2 always accesses the odd byte of the word. #CE1 accesses the even byte or the odd byte of the word depending on A0 and #CE2.

I 7,32

CS0#, CS1# (True IDE Mode)

In the True IDE Mode, #CS0 is the chip select for the Task File Registers while #CS1 is used to select the Alternate Status and the Device Control Register.

BVD1 (PC Card Memory Mode)

This signal is asserted high as the BVD1 signal since a battery is not used with this card.

I/O 46

STSCHG# (PC Card I/O Mode)

This signal is asserted low to alert the host to changes in the RDY/#BSY and Write Protect states, while the I/O interface is configured. The Card Configure and Status Register will control it.

PDIAG# (True IDE Mode)

In the True IDE Mode, this I/O is the Pass Diagnostic signal in the Master/Slave handshake protocol.

BVD2 (PC Card Memory Mode)

This signal is always driven to a high state in Memory Mode since a battery is not required for this card.

I/O 45

SPKR# (PC Card I/O Mode)

This signal is always driven to a high state in I/O Mode since this card does not support the audio function.

DASP# (True IDE Mode)

In the True IDE Mode, this I/O is the Disk Active/Slave Present signal in the Master/Slave handshake protocol.

Page 36: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 35/139 0605V4

Signal Name Description I/O Pin OE# (PC Card Memory Mode)

This is an Output Enable Strobe generated by the host interface. It is used to read data from the card in Memory Mode and to read CIS and configuration registers.

I 9

OE# (PC Card I/O Mode)

In I/O Mode, this signal is used to read the CIS and configuration registers.

|ATASEL# (True IDE Mode)

To enable True IDE Mode, this signal should be grounded.

RESET (PC Card Memory Mode)

When the signal is high, the signal Resets the card.

I 41

RESET (PC Card I/O Mode)

When the signal is high, the signal Resets the card.

RESET# (True IDE Mode)

In the True IDE Mode, the signal is the active low hardware reset from the host.

REG# (PC Card Memory Mode)

This signal is used during Memory Cycle to distinguish between Common Memory and Attribute Memory accesses. High for Common Memory and Low for Attribute Memory.

I 44

REG# (PC Card I/O Mode)

This signal must be low during I/O Cycles when the I/O address is on the Bus.

RFU (True IDE Mode)

In the True IDE Mode, this signal is not used and should be connected to VCC by the host.

WE# (PC Card Memory Mode)

This signal is driven by the host and used for generating memory write cycle to the registers of the card when the card is configured in the Memory mode.

I 36

WE# (PC Card I/O Mode)

In I/O mode, this signal is used for writing the configuration registers.

WE# (True IDE Mode)

In the True IDE Mode, this signal is not used and should be connected to VCC by the host.

Page 37: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 36/139 0605V4

WAIT# (PC Card Memory Mode) (PC Card I/O Mode)

This signal is driven low by the card to notify the host to delay completion of the memory of I/O cycle that is in progress.

O 42

IORDY (True IDE Mode)

In the True IDE Mode, this signal may be used as IORDY.

Page 38: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 37/139 0605V4

Signal Name I/O Pin Description INPACK# (PC Card Memory Mode)

This signal is not used in this mode.

INPACK# (PC Card I/O Mode)

The Input Acknowledge signal is asserted when the card is selected and responds to an I/O read cycle at the address on the address bus.

RFU (True IDE Mode)

O 43

In the True IDE mode, this signal is not used.

IORD# (PC Card Memory Mode)

This signal is not used in this mode.

IORD# (PC Card I/O Mode)

This is an I/O Read strobe generated by the host. This signal gates I/O data onto the bus from the card when the card is configured to use the I/O interface.

IORD# (True IDE Mode)

I 34

In the True IDE mode, the signal is the same as the I/O Mode.

IOWR# (PC Card Memory Mode)

This signal is not used in this mode

IOWR# (PC Card I/O Mode)

The I/O Write strobe is used to clock I/O data on the Data bus into the card controller registers when the card is configured to use the I/O interface.

IOWR# (True IDE Mode)

I 35

In the True IDE Mode, this signal is the same as the I/O mode.

RDY/BSY# (PC Card Memory Mode)

In the Memory Mode, this signal is set high when card is ready to accept a new data transfer operation and held low when the card is busy.

IREQ# (PC Card I/O Mode)

I/O Operation. After the card has been configured for I/O Mode, this signal is used as Interrupt Request.

INTRQ (True IDE Mode)

O 37

In the True IDE Mode, this signal is the active high Interrupt Request to the host.

WP (PC Card Memory Mode)

Memory Mode, the card doesn't have a write protect switch. This signal is held low.

IOIS16# (PC Card I/O Mode)

I/O Mode, A low signal indicates that a 16 bits or odd byte only operation can be performed by the addressed port.

IOCS16# (True IDE Mode)

O 24

In the True IDE Mode, this signal is asserted low when this device is expecting a word data transfer cycle.

Page 39: Technical Specification Industrial Compact Flash Card

Card Industrial Application

TCADO-SCF-000018.4 38/139 0605V4

8. CIS and Functions Configuration Registers

Configuration register specifications This card supports four Configuration registers for the purpose of the configuration and observation of this card. These registers can be used in memory and I/O card mode. In True IDE mode, these register can not be used.

8.1 Configuration Option Register (200H) This register is used for the configuration of the card and allows issuing software reset through this register. <Reset value = 00H>

D7 D6 D5 D4 D3 D2 D1 D0

SRESET LevlREQ INDEX

R/W R/W R/W

Index Those bits are used for selecting an operation mode of the card as follows.

When Power on, Card Hard Reset and Soft Rest, this data is “000000” for the Memory mode card interface recognition.

LevlREQ This bit sets to “0” when pulse mode interrupt is selected, and sets to “1” when level mode interrupt is selected.

SRESET Setting this bit to “1”, places the card in the reset state (Card Hard Reset).This operation is equal to Hard Reset, except this bit is not cleared. Card configuration status is reset and the card internal initialized operation starts when Card Hard Reset is executed, so next access to the card should be the same sequence as the power on sequence.

Index Bits Assignment

INDEX bits

5 4 3 2 1 0 Task File register address Mapping mode

0 0 0 0 0 0 OH to FH, 400h to 7FFH Memory mode

0 0 0 0 0 1 xx0H to xxFH Independent I/O mode

0 0 0 0 1 0 1F0H to 1F7H, 3F6H to 3F7H

Primary I/O mapped

0 0 0 0 1 1 170H to 177H, 376H to 377H

Secondary I/O mapped

Page 40: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 39/139 0605V4

8.2 Card Configuration And Status Register (Address 202H) This register is used for observing the card state. <Reset value = 00H>

D7 D6 D5 D4 D3 D2 D1 D0

CHGED SIGCHG IOIS8 0 0 PWD INTR 0

R R/W R/W --- --- R/W R ---

INTR INTERRUPT: When set, indicates that the #IREQ pin is low. When clear, indicates that the

#IREQ pin is high. This bit state is available whether I/O card interface has been configured or not. If interrupts are disabled by the #IEN bit in the Device Control Register, this bit is zero.

PWD POWER DOWN: When set, the card enters sleep state (Power Down mode). When clear, the card transfers to idle state (active mode).

IOIS8 I/O IS 8 bit: When set, indicates that the data bus width of the host is 8 bits (D0-D7). When clear, indicates that the data bus width of the host is 16 bits (D0-D15).

SIGCHG SIGNAL CHGED: This bit is set and reset by the host to enable and disable a state-change signal from the Status Register, the CHANGED bit control pin 46 and the CHANGED Status signal. If no state change signal is desired, this bit should be set to zero (0) and pin 46 (#STSCHG) signal will be held high while thie card is configured for I/O.

CHGED Indicated that one or both of the pin Replacement Register (204H) Crdy, or CWProt bits are set to one (1). When changed bit is set, #STSCHG pin 46 is held low if the SIGCHG bit is a one (1) and the card is configured for I/O interface.

Page 41: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 40/139 0605V4

8.3 Pin Replacement Register (Address 204H) This register is used for providing the signal state of #IREQ signal when the card configured I/O card interface.

<Reset value = 0CH>

D7 D6 D5 D4 D3 D2 D1 D0

0 0 CRDY 0 1 1 RRDY RWProt

--- R/W --- R/W 0

RWProt READ WRITE PROTECT: this bit indicates the write protect status. When set, indicates

write protect. When cleared indicates write is enable. PRDY This bit is used to determine the internal state of the RDY/BSY signal. This bit may be used

to determine the state of the Ready/Busy as this pin has been reallocated for use as interrupt Request on an I/O card.

CEProt This bit is set to one (1) when RWProt changes state. This bit may be written by the host. CRDY CARD READY: This bit is set to one (1) when the READY bit changes state. This bit may

be written by the host.

8.4 Socket and Copy Register (Address 206H) This register is used for identification of the card from other cards. The host can read and write this register. The host shall set this register before the card’s Configuration Option Register is set. <Read, Reset value = 00H>

D7 D6 D5 D4 D3 D2 D1 D0

0 0 0 DRV# 0 0 0 0

--- --- --- R/W --- --- --- ---

DRV# DRIVE NUMBER: This bit is set by the host and compared to the DRV bit (D4), in the ATA Drive/Head Register. In this way, host can perform the card’s master/slave organization.

Page 42: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 41/139 0605V4

8.5 Card Information Structure (CIS) The CIS is attribute information of the card and its characteristics, which includes information about the type of card and the manufacturer. The CIS is allocated in the beginning of the attribute memory, between addresses 0 and 255. The data is allocated in the even addresses only. The Host uses these registers to initialize and configure the card.

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

000H 01H CISTPL_JEDEC Device info tuple Tuple code

002H 04H TPL_LINK Link length is 4 byte Link to next tuple

004H 02H Device type W Device speed

P

S

Device type= DH: I/O device

WPS=1:No WP

Device Speed=7: ext speed

Device type, WPS, speed

006H 79H EXT Speed Speed

Mantissa exponent

400 ns if not wait Extended speed

008H 01H 1x 2k units 2k byte of address space Device size

00AH FFH List end marker End of device End marker

00CH 1CH CISTP_DEVICE_OC Other conditions device info tuple Tuple code

00EH 04H TPL_LINK Link length 4 bytes Link to next tuple

010H 02H EXT Reserved Vcc MWAIT 3V, wait is not used Other conditions info field

012H DBH Device type W Device speed

P

S

Device type= DH: I/O device

WPS=1:No WP

Device Speed=1:250 ns

Device type, WPS, speed

014H 01H 1x 2k units 2k byte of address space Device size

016H FFH List end marker End of device END marker

018H 18H CISTPL_JEDEC_C JEDEC ID common memory Tuple code

01AH 02H TPL_LINK Link length is 2 bytes Link to next tuple

01CH DFH PCMCIA’s manufacturer’s

JEDEC ID Code Manufacturer’s ID code JEDEC ID of PC Card ATA

01EH 01H PCMCIA JEDEC device code 2nd byte of JEDEC ID

020H 20H CISTPL_MANFID Manufacturer’s ID code Tuple code

022H 04H TPL_LINK Link length is 4 bytes Link to next tuple

024H 45H Low byte of PCMCIA

manufacturer’s code manufacturer’s ID

Low byte of manufacturer’s ID

code

026H 00H High byte of PCMCIA

manufacturer’s code

Code of 0 because other byte is

JEDEC 1 byte manufacturer’s ID

High byte of manufacturer’s ID

code

028H 01H Low byte of product code Low byte of product code

02AH 04H High byte of product code For PC CARD ATA

High byte of product code

02CH 15H CISTPL_VERS_1 Level 1 version/product info Tuple code

Page 43: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 42/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

02EH 1AH T P L _ L I N K Link length is 26 bytes Link to next tuple

030H 04H T P P L V 1 _ M A J O R PCMCIA2.0/JEIDA4.1 Major version

032H 01H T P P L V 1 _ M I N O R PCMCIA2.0/JEIDA4.1 Minor version

034H 43H ‘C’ Info string 1

036H 46H ‘F’

038H 20H ‘ ’

03AH 43H ‘C’

03CH 61H ‘a’

03EH 72H ‘r’

040H 64H ‘d’

042H 00H Null terminator

044H 43H ‘C’ Info string 2

046H 46H ‘F’

048H 41H ‘A’

04AH 20H ‘ ’

04CH XXH ‘X’ According for card capacity.

04EH XXH ‘X’

050H XXH ‘X’

052H XXH ‘X’

054H 4DH ‘M’

056H 42H ‘B’

058H 20H ‘ ‘

05AH 43H ‘C’

05CH 4BH ‘K’

05EH 52H ‘S’

060H 00H Null terminator

062H FFH L i s t e n d m a r k e r End of device END marker

064H 21H C I S T P L _ F U N C I D Function ID tuple Tuple code

066H 02H T P L _ L I N K Link length is 2 bytes Link to next tuple

068H 04H TPLFID_FUNCTION=04H Disk function, may be silicon, may be

removable

PC card function code

06AH 01H R e s e r v e d R P R=0: No BIOS ROM

P=1: Configure card at power on

System initialization byte

Page 44: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 43/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

06CH 22H C I S T P L _ F U N C E Function extension tuple Tuple code

06EH 02H T P L _ L I N K Link length 2 bytes Link to next tuple

070H 01H Disk function extension tuple type Disk interface type Extension tuple type for disk

072H 01H D i s k i n t e r f a c e t y p e PC card ATA interface Interface type

074H 22H C I S T P L _ F U N C E Function extension tuple Tuple code

076H 03H T P L _ L I N K Link length is 3 bytes Link to next tuple

078H 02H Disk function extension tuple type Single drive Extension tuple type for disk

07AH 0CH R e s e r v e D U S V No Vpp< Silicon, single drive

V=0: No Vpp required

S=1: Silicon

U=1: Unique serial#

D=0: Single drive on card

Basic ATA option

Parameter byte 2

07CH 0FH R I E N P 3 P 2 P 1 P 0 P0: Sleep mode supported

P1: Standby mode supported

P2: Idle mode supported

P3: Drive auto power control

N: Some config excludes 3X7

E: Index bit is emulated

I: Twin IOIS 16# datd reg only

R: Reserved

Basic ATA option parameter

byte 2

07EH 1AH C I S T P L _ C O N F I G Configuration tuple Tuple code

080H 05H T P L _ L I N K Link length is 5 bytes Link to next tuple

082H 01H R F S R M S R A S RFS: Reserved

RMS: TPCC_RMSK size-1=0

RAS:TPCC_RADR size-1=1

1 byte register mask

2 b2 byte config base address

Size of fields byte TPCC_SZ

084H 03H T P C C _ L A S T Entry with config index of 03H is

final entry in table

Last entry of config registers

086H 00H T P C C _ R A D R ( L S B ) Configuration registers are located at

200H in REG space

Location of config registers

088H 02H T P C C _ R A D A R ( M S B )

Page 45: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 44/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

08AH 0FH R e s e r v e d S P C I I: Configuration index

C: configuration and status

P: Pin replacement

S: Socket and copy

Configuration registers present

mask TPCC_RMSK

08CH 1BH CISTPL_CFTABLE_ENTRY Configuration table entry tuple Tuple code

08EH 08H T P L _ L I N K Link length is 8 bytes Link to next tuple

090H C0H I D Configuration Index Memory mapped I/O configuration

I=1: Interface byte follows

D=1: Default entry

Configuration index=0

Configuration table index byte

TPCE_INDX

092H 40H W R P B Interface type W=0: Wait not used

R=1: Ready active

P=0: WP not used

B=0: BVD1and BVD2 not used

IF type=0: Memory interface

Interface description field

TPCE_IF

094H A1H M M S I R I O T P M=1: Misc info present

MS=01: Memory space info single

2-byte length

IR=0: No interrupt info present

IO=0: No I/O port info present

T=0: No toming info present

P=1: Vcc only info

Feature selection

TPCE_FS

096H 01H R DI PI AI SI HV LV NV Nominal voltage only follows

R: Reserved

DI: Power down current info

PI: Peak current info

AI: Average current info

SI: Static current info

HV: Max voltage info

LV: Min voltage info

NV: Nominal voltage info

Power parameters for Vcc

098H 55H X Mant i s sa Exponen t Nominal voltage=5V Vcc nominal value

Page 46: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 45/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

09AH 08H Length in 256 bytes pages (LSB) Length of memory space is 2 KB Memory space description

structures (TPCE_MS)

09CH 00H Length in 256 bytes pages (MSB)

09EH 20H X R P R O A T X=0: No more misc fields

R: Reserved

P=1: Power down supported

RO=0: Not read only mode

A=0: Audio not supported

T=0: Single drive

Miscellaneous features field

TPCE_MI

0A0H 1BH CISTPL_CFTABLE_ENTRY Configuration table entry tuple Tuple code

0A2H 06H T P L _ L I N K Link length is 6 bytes Link to next tuple

0A4H 00H I D Configuration Index Memory mapped I/O configuration

I=0: No interface byte

D=0: No Default entry

Configuration index=0

Configuration table index

TPCE_INDX

0A6H 01H M M S I R I O T P M=0: No misc info

MS=00: No memory space inflo

IO=0: No I/O port info present

T=0:No timing info present

P=0: Vcc only info

Feature selection byte

TPCE_FS

0A8H 21H R DI PI AI SI HV LV NV Nominal voltage only follows

R: Reserved

DI: Power down current info

PI: Peak current info

AI: Average current info

SI: Static current info

HV: Max voltage info

LV: Min voltage info

NV: Nominal voltage info

Power parameters for Vcc

0AAH B5H X Mant i s sa Exponen t Nominal Voltage=3.0V Vcc nominal value

0ACH 1EH X E x t e n s i o n +0.3 V Extension byte

Page 47: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 46/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

0AEH 4DH X Mantissa Exponent Max average current over 10 msec is

45 mA

Max. average current

0B0H 1BH CISTPL_CFTABLE_ENTRY Configuration table entry tuple Tuple code

0B2H 0AH TPL_LINK Link length is 10 bytes Link to next tuple

0B4H C1H I D Configuration INDEX Contiguous I/O mapped ATA registers

configuration

I=1: Interface byte follows

D=1: Default entry

Configuration index=1

Configuration table index byte

TPCE_INDX

0B6H 41H W R P B Interface type W=0: Wait not used

R=1: Ready active

P=0: WP not used

B=0: BVS1 and BVS2 not used

IF type=1: I/O interface

Interface description field

TPCE_IF

0B8H 99H M MS IR IO T P M=1: Misc info present

MS=00: No memory space info

IR=1: Interrupt info present

IO=1: I/O port info present

T=0: No timing info present

P=1:Vcc only info

Feature selection byte

TPCE_FS

0BAH 01H R DI PI AI SI HV LV NV Nominal voltage only follows

R: Reserved

DI: Power down current info

PI: Peak current info

AI: Average current info

SI: Static current info

HV: Max voltage info

LV: Min voltage info

NV: Nominal voltage info

Power parameters for Vcc

0BCH 55H X Mantissa Exponent Nominal Voltage=5V Vcc nominal value

0BEH 64H R S E IO AddrLine S=1: 16-bit hosts supported

E=1: 8-bit hosts supported

IO AddrLine:4 lines decoded

I/O space description field

TPCE_IO

Page 48: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 47/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

0C0H F0H S P L M V B I N S=1: Share logic active

P=1: Pulse mode IRQ supported

L=1: Level mode IRQ supported

M=1: Bit mask of IRQ present

V=0: No vender unique IRQ

B=0: No bus error IRQ

I=0: No IO check IRQ

N=0: No NMI

Interrupt request description

structure TPCE_IR

0C2H FFH IRQ IR IR IR IR IR OR IRQ0

7 Q Q Q Q Q Q

6 5 4 3 2 1

IRQ level to be routed 0 to 15

recommended

Mask extension byte 1

TPCE_IR

0C4H FFH IRQ IR IR IR IR IR OR IRQ8

1 5 Q Q Q Q Q Q

1 4 1 3 1 2 1 1 1 0 9

Recommended routing to any

“normal, maskable” IRQ

Mask extension byte 2

TPCE_IR

0C6H 20H X R P R O A T X=0: Nomore misc fields

R: reserved

P=1: Power down supported

RO=0: Not read only mode

A=0: Audi not supported

T=0: Single drive

Miscellaneous features field

TPCE_MI

Page 49: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 48/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

0C8H 1BH CISTPL_CFTABLE_ENTRY Configuration table entry tuple Tuple code

0CAH 06H T P L _ L I N K Link length is 6 bytes Link to next tuple

0CCH 01H I D Configuration index Contiguous I/O mapped ATA registers

configuration

I=0: No Interface byte

D=0: No Default entry

Configuration index=1

Configuration table index byte

TPCE_INDX

0CEH 01H M M S I R I O T P M=0: No Misc info present

MS=00: No memory space info

IR=0: No Interrupt info present

IO=0: No I/O port info present

T=0: No timing info present

P=1:Vcc only info

Feature selection byte

TPCE_FS

0D0H 21H R DI PI AI SI HV LV NV Nominal voltage only follows

R: Reserved

DI: Power down current info

PI: Peak current info

AI: Average current info

SI: Static current info

HV: Max voltage info

LV: Min voltage info

NV: Nominal voltage info

Power parameters for Vcc

0D2H B5H X M a n t i s s a E x p o n e n t Nominal voltage =3.0V Vcc nominal value

0D4H 1EH X E x t e n s i o n +0.3V Extension byte

0D6H 4DH X M a n t i s s a E x p o n e n t Max average current over 10 msec is

45mA

Max. average current

Page 50: Technical Specification Industrial Compact Flash Card

Card Industrial Application

TCADO-SCF-000018.4 49/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

0D8H 1BH CISTPL_CFTABLE_ENTRY Configuration table entry tuple Tuple code

0DAH 0FH T P L _ L I N K Link length is 15 bytes Link to next tuple

0DCH C2H I D Configuration index Contiguous I/O mapped ATA registers

configuration

I=1: Interface byte follows

D=1: Default entry follows

Configuration index=2

Configuration table index byte

TPCE_INDX

0E0H 41H W R P B Interface type W=0: Wait not used

R=1: Ready active

P=0: WP not used

B=0: BVS1 and BVS2 not used

IF type=1: I/O interface

Interface description field

TPCE_IF

0E2H 99H M M S I R I O T P M=1: Misc info present

MS=00: No memory space info

IR=1: Interrupt info present

IO=1: I/O port info present

T=0: No timing info present

P=1:Vcc only info

Feature selection byte

TPCE_FS

0E4H 01H R DI PI AI SI HV LV NV Nominal voltage only follows

R: Reserved

DI: Power down current info

PI: Peak current info

AI: Average current info

SI: Static current info

HV: Max voltage info

LV: Min voltage info

NV: Nominal voltage info

Power parameters for Vcc

0E6H 55H X Mant i s sa Exponen t Nominal Voltage=5V Vcc nominal value

Page 51: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 50/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

0E8H EAH R S E I O A d d r L i n e R=1: Range follows

S=1:16-bit hosts supported E=1: 8-bit

hosts supported

IO AddrLines: 10 lines decoded

I/O space description field

TPCE_IO

0EAH 61H

0ECH FOH 1st I/O base address(LSB) 1st I/O range address

0EEH 01H 1st I/O base address(MSB)

0F0H 07H 1st I/O length-1 1st I/O range length

0F2H F6H 2nd I/O base address(LSB) 2nd I/O range address

0F4H 03H 2nd I/O base address(MSB)

0F6H 01H 2nd I/O length-1 2nd I/O range length

0F8H EEH S P L M I R Q l e v e l S=1: Share logic active

P=1: Pulse mode IRQ supported

L=1: Level mode IRQ supported

M=0: Bit mask of IRQ present

IRQ level is ORQ 14

Interrupt request description

structure TPCE_IR

0FAH 20H X R P R O A T X=0: Nomore misc fields

R: reserved

P=1: Power down supported

RO=0: Not read only mode

A=0: Audi not supported

T=0: Single drive

Miscellaneous features field

TPCE_MI

Page 52: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 51/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

0FEH 1BH CISTPL_CFTABLE_ENTRY Configuration table entry tuple Tuple code

0FCH 06H T P L _ L I N K Link length is 15 bytes Link to next tuple

100H 02H I D Configuration index ATA primary I/O mapped

configuration

I=0: No Interface byte

D=0: No Default entry

Configuration index=2

Configuration table index byte

TPCE_INDX

102H 01H M M S I R I O T P M=0: No Misc info

MS=00: No memory space info

IR=0: No Interrupt info present

IO=0: No I/O port info present

T=0: No timing info present

P=1: Vcc only info

Feature selection byte

TPCE_FS

104H 21H R DI PI AI SI HV LV NV Nominal voltage only follows

R: Reserved

DI: Power down current info

PI: Peak current info

AI: Average current info

SI: Static current info

HV: Max voltage info

LV: Min voltage info

NV: Nominal voltage info

Power parameters for Vcc

106H B5H X M a n t i s s a E x p o n e n t Nominal voltage =3.0V Vcc nominal value

108H 1EH X E x t e n s i o n +0.3V Extension byte

10AH 4DH X M a n t i s s a E x p o n e n t Max average current over 10 msec is

45mA

Max. average current

10CH 1BH CISTPL_CFTABLE_ENTRY Configuration table entry tuple Tuple code

10EH 0FH T P L _ L I N K Link length is 15 bytes Link to next tuple

110H C3H I D Configuration index ATA secondary I/O mapped

configuration

I=1: Interface byte follow

D=1: Default entry

Configuration index=3

Configuration table index byte

TPCE_INDX

Page 53: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 52/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

114H 41H W R P B Interface type W=0: Wait not used

R=1: Ready active

P=0: WP not used

B=0: BVS1 and BVS2 not used

IF type=1: I/O interface

Interface description field

TPCE_IF

112H 99H M M S I R I O T P M=1: Misc info present

MS=00: No memory space info

IR=1: Interrupt info present

IO=1: I/O port info present

T=0: No timing info present

P=1:Vcc only info

Feature selection byte

TPCE_FS

116H 01H R DI PI AI SI HV LV NV Nominal voltage only follows

R: Reserved

DI: Power down current info

PI: Peak current info

AI: Average current info

SI: Static current info

HV: Max voltage info

LV: Min voltage info

NV: Nominal voltage info

Power parameters for Vcc

118H 55H X Mant i s sa Exponen t Nominal Voltage=5V Vcc nominal value

11AH EAH R S E I O A d d r L i n e R=1: Range follows

S=1:16-bit hosts supported E=1: 8-bit

hosts supported

IO AddrLines: 10 lines decoded

I/O space description field

TPCE_IO

11CH 61H L S A S N r a n g e LS=1: Size of lengths is 1 byte

AS=2: Size of address is 2 bytes

N Range=1: Address range-1

I/O range format description

11EH 70H 1st I/O base address(LSB) 1st I/O range address

120H 01H 1st I/O base address(MSB)

122H 07H 1st I/O length-1 1st I/O range length

124H 76H 2nd I/O base address(LSB) 2nd I/O range address

126H 03H 2nd I/O base address(MSB)

128H 01H 2nd I/O length-1 2nd I/O range length

Page 54: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 53/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

12CH EEH S P L M I R Q l e v e l S=1: Share logic active

P=1: Pulse mode IRQ supported

L=1: Level mode IRQ supported

M=0: Bit mask of IRQ present

IRQ level is ORQ 14

Interrupt request description

structure TPCE_IR

12AH 20H X R P R O A T X=0: Nomore misc fields

R: reserved

P=1: Power down supported

RO=0: Not read only mode

A=0: Audi not supported

T=0: Single drive

Miscellaneous features field

TPCE_MI

12EH 1BH CISTPL_CFTABLE_ENTRY Configuration table entry tuple Tuple code

130H 06H T P L _ L I N K Link length is 6 bytes Link to next tuple

132H 03H I D Configuration index ATA secondary I/O mapped

configuration

I=0: No Interface byte

D=0: No Default entry

Configuration index=3

Configuration table index byte

TPCE_INDX

134H 01H M M S I R I O T P M=0: No Misc info

MS=00: No memory space info

IR=0: No Interrupt info present

IO=0: No I/O port info present

T=0: No timing info present

P=1: Vcc only info

Feature selection byte

TPCE_FS

136H 21H R DI PI AI SI HV LV NV Nominal voltage only follows

R: Reserved

DI: Power down current info

PI: Peak current info

AI: Average current info

SI: Static current info

HV: Max voltage info

LV: Min voltage info

NV: Nominal voltage info

Power parameters for Vcc

Page 55: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 54/139 0605V4

Address Data 7 6 5 4 3 2 1 0 Description of contents CIS function

140H B5H X M a n t i s s a E x p o n e n t Nominal voltage =3.0V Vcc nominal value

138H 1EH X Extension +0.3V Extension byte

142H 4DH X M a n t i s s a E x p o n e n t Max average current over 10 msec is

45mA

Max. average current

144H 14H CISTPL_NO_LINK No link control tuple Tuple code

146H 00H Link is 0 bytes Link to next tuple

148H FFH CISTPL_END End of tuple Tuple code

Page 56: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 55/139 0605V4

9. ATA Specific Register Definitions As we described the adapter provides several kinds of addressing modes, Memory mode, I/O mode, and True IDE. Below are described the procedures access for accessing each mode the Task File registers.

9.1 Memory Mapped Addressing Memory Mapped Addressing

#REG Offset A10 A4 – A9 A3 A2 A1 A0 #OE = “0” #WE = “0” 1 0H 0 X 0 0 0 0 Even read data Even write data 1 1H 0 X 0 0 0 1 Error Feature 1 2H 0 X 0 0 1 0 Sector Count Sector Count 1 3H 0 X 0 0 1 1 Sector Number Sector Number 1 4H 0 X 0 1 0 0 Cylinder Low Cylinder Low 1 5H 0 X 0 1 0 1 Cylinder High Cylinder High 1 6H 0 X 0 1 1 0 Drive/Head Drive/Head 1 7H 0 X 0 1 1 1 Status Command 1 8H 0 X 1 0 0 0 Duplicate Even

Read Data Duplicate Even Write Data

1 9H 0 X 1 0 0 1 Duplicate Odd Read Data

Duplicate Odd Write Data

1 DH 0 X 1 1 0 1 Duplicate Error Duplicate Feature

1 EH 0 X 1 1 1 0 Alternate Status Device Control 1 FH 0 X 1 1 1 1 Drive Address Reserved 1 8H 1 X X X X 0 Even Read Data Even Write Data1 9H 1 X X X X 1 Odd Read Data Odd Write Data

Page 57: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 56/139 0605V4

9.2 Contiguous I/O Mapping Addressing Contiguous I/O Mapping Addressing #REG Offset A10 A4 – A9 A3 A2 A1 A0 #IORD = “0” #IOWR = “0”

0 0H 0 X 0 0 0 0 Even read data Even write data 0 1H 0 X 0 0 0 1 Error Feature 0 2H 0 X 0 0 1 0 Sector Count Sector Count 0 3H 0 X 0 0 1 1 Sector

Number Sector Number

0 4H 0 X 0 1 0 0 Cylinder Low Cylinder Low 0 5H 0 X 0 1 0 1 Cylinder High Cylinder High 0 6H 0 X 0 1 1 0 Drive/Head Drive/Head 0 7H 0 X 0 1 1 1 Status Command 0 8H 0 X 1 0 0 0 Duplicate

Even Read Data

Duplicate Even Write Data

0 9H 0 X 1 0 0 1 Duplicate Odd Read Data

Duplicate Odd Write Data

0 DH 0 X 1 1 0 1 Duplicate Error

Duplicate Feature

0 EH 0 X 1 1 1 0 Alternate Status

Device Control

0 FH 0 X 1 1 1 1 Drive Address Reserved

Page 58: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 57/139 0605V4

9.3 Overlapping I/O Mapping Addressing Overlapping I/O Mapping (Primary, Secondary) Addressing

A4 – A9 #REG A10

Primary Secondary A3 A2 A1 A0 #IORD= “0” #IOWR =“0”

0 X 1FH 17H 0 0 0 0 Even read data Even write

data 0 X 1FH 17H 0 0 0 1 Error Feature 0 X 1FH 17H 0 0 1 0 Sector Count Sector Count

0 X 1FH 17H 0 0 1 1 Sector Number

Sector Number

0 X 1FH 17H 0 1 0 0 Cylinder Low Cylinder Low0 X 1FH 17H 0 1 0 1 Cylinder High Cylinder High0 X 1FH 17H 0 1 1 0 Drive/Head Drive/Head 0 X 1FH 17H 0 1 1 1 Status Command

0 X 3FH 37H 1 1 1 0 Alternate Status

Device Control

0 X 3FH 37H 1 1 1 1 Drive Address Reserved

9.4 True IDE Mode True IDE Mode

#CS0 #CS1 DA2 DA1 DA0 #IORD = “0” #IOWR = “0”

1 1 X X X Hi-Z Not Used 1 0 0 X X Hi-Z Not Used 1 0 1 0 X Hi-Z Not Used 0 0 X X X Invalid Invalid 1 0 1 1 0 Alternate Status Device Control1 0 1 1 1 Device Address Not Used 0 1 0 0 0 Data Data 0 1 0 0 1 Error Feature 0 1 0 1 0 Sector Count Sector Count 0 1 0 1 1 Sector Number Sector Number0 1 1 0 0 Cylinder Low Cylinder Low 0 1 1 0 1 Cylinder High Cylinder High 0 1 1 1 0 Drive/Head Drive/Head 0 1 1 1 1 Status Command

Page 59: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 58/139 0605V4

9.5 ATA Registers

9.5.1 Data Register The Data register is a 16-bit register used to transfer data blocks between the ATA data buffer and the host. In addition, the Format Track command uses this register to transfer the sector-information. Setting this mode requires calling the Set Features command.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 D7 D6 D5 D4 D3 D2 D1 D0

bit-15 bit-14 bit-13 bit-12 bit-11 bit-10 bit-9 bit-8 D15 D14 D13 D12 D11 D10 D9 D8

9.5.2 Error Register The Error Register contains additional information about the source of an error. The information in the register is only valid when an error is indicated in ERR-bit (bit-0 = 1) of the Status Register. This register is valid when the BSY bit in Status register and Alternate status register are set to “0”(Ready).

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 BBK UNC MC[0] IDNF MCR[0] ABRT T0NF[0] AMNF BBK Bad Block mark detected in the requested sector ID field - Not

supported UNC Non-Correctable data error encountered MC[0] Removable media access ability has changed - not supported (is 0)IDNF Requested sector ID-field Not Found MCR[0] Media Change Request indicates that the removable-media drive's

latch has changed, indicating that the user wishes to remove the media - not supported (is 0)

ABRT Drive status error or Aborted invalid command T0NF[0] Track 0 Not Found during a Recalibrate command - Not

supported AMNF Address Mark Not Found after finding the correct ID field - Not

supported

Page 60: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 59/139 0605V4

9.5.3 Feature Register This register enables drive-specific features. See the Set Features or Get/Set Features command descriptions.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 Feature byte

9.5.4 Sector Count Register The Sector Count Register contains the number of data sectors requested to be transferred during a read or write operation between the host and the adapter. A zero register value specifies 256 sectors. The command was successful if this register is zero at command completion. If the request is not completed, the register contains the number of sectors left to be transferred.

This register’s initial values is “01H” Some commands (e.g. Initialize Drive Parameters or Format Track) may redefine the register’s contents.)

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 Sector count byte

9.5.5 Sector Number Register In the CHS (Cylinder, Head, Sector) mode, the Sector Number register contains the subsequent command's starting sector number, which can be from 1 to the maximum number of sectors per track. In LBA (logical block address) mode, this register contains LBA bits 0-7, which are updated at command completion. See the command descriptions for register contents at command completion (whether successful or unsuccessful).

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 SN7 SN6 SN5 SN4 SN3 SN2 SN1 SN0 LBA7 LBA6 LBA5 LBA4 LBA3 LBA2 LBA1 LBA0 SN0 – SN7 Sector number byte (8-bits) LBA0 – LBA7 LBA bits 0 to 7

Page 61: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 60/139 0605V4

9.5.6 Cylinder Low Register In the CHS mode, the Cylinder Low Register contains the cylinder number low-8 bits and reflects their status at command completion. In LBA mode, this register contains LBA bits 8-15 and reflects their status at command completion.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 CL7 CL6 CL5 CL4 CL3 CL2 CL1 CL0 LBA15 LBA14 LBA13 LBA12 LBA11 LBA10 LBA9 LBA8 CL0 – CL7 Cylinder Low byte (8-bits) LBA8 – LBA15 LBA bits 8 to 15

9.5.7 Cylinder High Register In the CHS mode, the Cylinder High Register contains the cylinder numbers high-8 bits and reflects their status at command completion. In LBA mode, this register contains LBA bits 16-23 and reflects their status at command completion.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0 LBA23 LBA22 LBA21 LBA20 LBA19 LBA18 LBA17 LBA16 CH0 – CH7 Cylinder High byte (8-bits) LBA16 – LBA23 LBA bits 16 to 23

Page 62: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 61/139 0605V4

9.5.8 Drive Head Register The Drive/Head Register is used to select the drive and head (heads minus 1, when executing Initialize Drive Parameters command). It is also used to select the LBA addressing instead of the CHS addressing.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 1 LBA 1 DRV HS3 HS2 HS1 HS0 HS0-HS3/ DRV LBA24-LBA27

Head number. Drive select number. When DRV=0, the master drive is selected. When DRV=1, the Slave drive is selected. MSB of the LBA addressing.

LBA Address mode select. 0 = CHS (Cylinder, Head, Sector) mode. 1 = LBA (Logical Block Address) mode. Logical Block address interrupted as follows: LBA07-LBA00 :Sector Number Register D7-D0 LBA15-LBA08:Cylinder Low Register D7-D0 LBA23-LBA16:Cylinder High Register D7-D0 LBA27-LBA24:Drive/Head Register HS3-HS0

Page 63: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 62/139 0605V4

9.5.9 Status Register This register contains the adapter status. The contents of this register are updated to reflect the current state of the adapter and the progress of any command being executed by the adapter. When the BSY bit is equal to zero, the other bits in this register are valid. When the BSY bit is equal to one, the other bits in this register are not valid. When the register is read, the interrupt (#IREQ pin) is cleared.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 BSY DRDY DWF DSC DRQ CORR 0 ERR ERR When set, indicates that an error has occurred during the previous

command execution. The bits in the Error Register indicate the cause.

IDX Index is not used – always set to Zero. CORR Indicates that a data error was corrected; transfer is not

terminated. DRQ Data Request. When set, indicates that the adapter is ready to

transfer a word or byte of data between the host and the adapter. DSC Drive Seek Complete. When set, indicates that the requested

sector was found. DWF Drive Write Fault status. When set, indicates that an error has

occurred during write. DRDY Indicates whether the adapter is capable of performing drive

operations (commands). This bit is cleared at power up and remains cleared until the drive is ready to accept a command. On error, DRDY changes only after the host reads the Status register.

BSY This signal is set during the time the adapter accesses the command buffer or the registers. During this time the host is locked out from accessing the command register and buffer. As long as this bit is set no bits in the register are valid.

9.5.10 Alternate Status Register The Alternate Status Register contains command block status information (see Status register). Unlike the Status register, reading this register does not acknowledge or clear an interrupt.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 BSY DRDY DWF DSC DRQ CORR 0 ERR

Page 64: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 63/139 0605V4

9.5.11 Device Control Register The Device Control Register is used to control the drive interrupt request and issue an ATA soft reset to the drive.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 --- --- --- --- 1 SRST #IEN 0 #IEN INTERRUPT ENABLE: When set (0), it enables interrupts to

the host (using the #IREQ tri-state pin). When inactive (1) or drive is not selected, it disables all pending interrupts (#IREQ in high-Z). This bit is ignored in Memory mode.

SRST SOFT RESET: When set, forces the ATA to perform an AT disk control soft reset operation.

9.5.12 Drive Address Register This register reflects the drive and its heads. This register is provides for compatibility with the AT disk interface. It’s recommended that this register is not mapped into this host’s I/O space because of potential conflicts on bit7.

bit-7 bit-6 bit-5 bit-4 bit-3 bit-2 bit-1 bit-0 High-Z #WTG #HS3 #HS2 #HS1 #HS0 #DS1 #DS0 #DS0 When set (0), it indicates that drive 0 is active and selected. #DS1 When set (0), it indicates that drive 1 is active and selected. #HS0 - #HS3 Negation of the head number in the Drive/Head Register. #WTG When set (0), it indicates that a write operation is in progress,

otherwise it is inactive (1) - not supported.

Note: Addressing Mode Descriptions - The adapter, on a command by command basis, can operate in either CHS or LBA addressing modes. Identify Drive Information tells the host whether the drive supports LBA mode. The host selects LBA mode via the Drive/Head Register. Sector number, Cylinder Low, Cylinder High, and Drive/Head Register bits HS3=0 contain the zero-based LBA. The drive's sectors are linearly mapped with: LBA = 0 => Cylinder 0, head 0, sector 1. Regardless of the translation mode, a sector LBA address does not change. LBA = (Cylinder * no of heads + heads) * (sectors/track) + (Sector - 1).

Page 65: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 64/139 0605V4

10. ATA Commands

10.1 Check Power Mode - 98H or E5H This command checks the current power mode of the adapter. When this command is issued and the adapter is in standby mode, or is being set to standby mode, or during a recovery from standby mode is attempted, adapter sets the BSY bit in the Status register and sets the Sector Count Register to “00H”. Then the BSY bit in the Status register is cleared. When the adapter is in the Idle mode, it sets the BSY bit in the Status register and sets “FFH” in the Sector Count Register. Then the BSY bit in the Status register is cleared. An interrupt is issued after the BSY bit is cleared.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Command 98H or E5H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V

Sector Count Power Mode Code.(00H or 80H or FFH) BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 66: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 65/139 0605V4

10.2 Execute Drive Diagnostic - 90H This command performs self-diagnostics on various internal components of the adapter. Results of the test are reported in the Error Register. Note that the bit definitions for the Error Register do not apply with this command. Instead, the value in the Error Register is a diagnostic code, defined in the table below.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command 90H

OUTPUTS: The diagnostic code written into the Error Register is an 8-bit code as shown in the table below.

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V

Error Diagnostic code, see table below

Code Description 01H No error detected 02H Format Media error 03H Sector buffer error 04H ECC logic error 05H Controlling microprocessor error

Page 67: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 66/139 0605V4

10.3 Erase Sector(s) - C0H This command is processed as a NOP command.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count [LBA mode only] The number of sectors to be formatted on the track, must be

set to FFH Sector Number [LBA mode only] LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the starting

sector/LBA Command C0H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V V V V

Page 68: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 67/139 0605V4

10.4 Format Track - 50H This command is processed as a NOP command.

INPUTS

Register 7 6 5 4 3 2 1 0 Features Sector Count [LBA mode only] The number of sectors to be formatted on the track. Must be

set to FFH Sector Number [LBA mode only] LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the starting

sector/LBA Command 50H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V V V

Page 69: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 68/139 0605V4

10.5 Identify Drive – ECH The Identify Drive command enables the host to receive parameter information from the adapter. When the command is issued, the adapter sets the BSY bit, prepares to transfer the 256 words of adapter identification data to the host, sets the DRQ bit, clears the BSY bit, and generates an interrupt. The host can then transfer the data by reading the Data register. All reserved bits or words are all zero. See following table for the identify drive information for this adapter

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command ECH

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF Error V

Page 70: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 69/139 0605V4

10.6 Idle - 97H or E3H Although this command is supported for backward compatibility, it has no actual function. The adapter will always return a ‘good’ status at the completion of this command.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Time-out Parameter. This parameter is ignored by the adapter Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command 97H or E3H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 71: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 70/139 0605V4

10.7 Idle Immediate - 95H or E1H Although this command is supported for backward compatibility, it has no actual function. The adapter will always return a ‘good’ status at the completion of this command.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command 95H or E1H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 72: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 71/139 0605V4

10.8 Initialize Drive Parameters - 91H Initialize Drive Parameters allows the host to alter the number of sectors per track and the number of heads per cylinder. This command does not check the validity of counts of sectors and heads. If an invalid value is set, an error will be reported when another command attempts an invalid access.

The Sector Count Register specifies the number of logical sectors per logical track, and the Device/Head register specifies the maximum head number.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Number of sectors Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Max Head (no. of head = 1) Command 91H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error

Page 73: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 72/139 0605V4

10.9 Read Buffer - E4H The Read Buffer command enables the host to read the current contents of the adapter’s sector buffer. This command has the same protocol as the Read Sector(s) command.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head LBA DEV Command E4H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 74: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 73/139 0605V4

10.10 Read Long Sector(s) - 22H or 23H Read Long (w/ and w/o retry) is similar to the Read Sectors command, except that the content of the Sector Count Register is ignored and only one sector is read. The 512 data bytes and 4 ECC bytes are read into the buffer (with no ECC correction) and then transferred to the host.

The Cylinder Low, Cylinder High, Device/Head and Sector Number specify the starting sector address to be read. The Sector Count Register shouldn’t specify a value other than 1.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count The number of sectors/logical blocks to transfer. This should be set to 01 for

compatibility Sector Number Sector[7:0] or LBA[7:0] of the sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the

sector/LBA to transfer Command 22H (retries enabled) or 23H (retries disabled)

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V

Sector Count 00 if the command proceed without error, else the number of untransfered sectors.

Sector Number Sector[7:0] or LBA[7:0] of the last sector read Cylinder Low Cylinder[7:0] or LBA[15:8] of the last sector read Cylinder High Cylinder[15:8] or LBA[23:16] of the last sector read

BBK UNC MC IDNF MCR ABRT TK0NF AMNFError

V V V V

Page 75: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 74/139 0605V4

10.11 Read Multiple - C4H This command functions like the Read Sector(s) command, but instead of issuing interrupts for each sector, interrupts are issued when a block containing the counts of sectors, defined by the Set Multiple command is, transferred. Also, the DRQ required for the transfer only has to be set at the start of the data block and does not affect other sectors. When the Read Multiple command is issued, the requested sectors (not the block counts or the sector counts in a block) are written into the Sector Count Register. Errors occurring during command execution are reported at the start of a block transfer or at the start of transfer of part of a block. However, the transfer continues even if DRQ is set and the data is corrupted. After the data transfer, the content of the task file with the block data containing the sectors where the error occurred is not defined. To obtain valid error information the host has to request a re-transmission. The next block or part of a block is transferred only if the error is correctable. For all other errors the command is aborted after transferring a block containing an error. The Read Multiple command is supported for backward compatibility. If R/W Multiple commands have been enabled by a previous valid Set Multiple command, the Read Multiple command is identical to the Read Sectors operation except that several sectors are transferred as a block to the Host without the intervening Host handshaking. The block count stands for the number of sectors to be transferred as a block. It is established using the Set Multiple command. Although the Set Multiple, and R/W Multiple commands are supported, the only valid block count is one.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count The number of sectors/logical blocks to transfer Sector Number Sector[7:0] or LBA[7:0] of the sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the sector/LBA to transfer Device/Head LBA DEV Head number or LBA Command C4H OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V V

Sector Count The first sector where the first unrecoverable error occurred Sector Number Sector[7:0] or LBA[7:0] of the last good sector transferred Cylinder Low Cylinder[7:0] or LBA[15:8] of the last good sector transferred Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred Device/Head LBA DEV H[3:0] or LBA[27:24] last good sector transferred

BBK UNC MC IDNF MCR ABRT TK0NF AMNF Error

V V V V V V V V

Page 76: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 75/139 0605V4

10.12 Read Sectors(s) – 20H or 21H The Cylinder Low, Cylinder High, Device/Head and Sector Number or LBA registers specify the starting sector address to be read. The Sector Count Register specifies the number of sectors to be transferred.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count The number of sectors/logical blocks to transfer Sector Number Sector[7:0] or LBA[7:0] of the sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the

sector/LBA to transfer Command 20H (retry enabled) or 21H (retries disabled)

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V V

Sector Count The first sector where the first unrecoverable error occurred Sector Number Sector[7:0] or LBA[7:0] of the last good sector transferred Cylinder Low Cylinder[7:0] or LBA[15:8] of the last good sector transferred Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred Device/Head LBA DEV H[3:0] or LBA[27:24] last good sector

transferred BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V V V V V V V

Page 77: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 76/139 0605V4

10.13 Read Verify Sector(s) – 40H or 41H The Read Verify Sectors command verifies one or more sectors on the card by transferring data from the Flash media to the data buffer in the card and verifying that the ECC is correct. It is performed identically to the Read Sectors command, except that DRQ is not asserted, and no data is transferred to the host. If an uncorrectable error occurs, the Read Verify command will be terminated at the failing sector. The task file registers contain the CHS, or LBA of the sector in which the error occurred.

The Cylinder Low, Cylinder High, Device/Head and Sector Number specify the starting sector address to be verified. The Sector Count Register specifies the number of sectors to be verified.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count The number of sectors/logical blocks to verify Sector Number Sector[7:0] or LBA[7:0] of the first sector/LBA to verify Cylinder Low Cylinder[7:0] or LBA[15:8] of the sector/LBA to verify Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to verify Device/Head LBA DEV H[3:0] or LBA[27:24] of the

sector/LBA to verify Command 40H (retries enabled) or 41H (retries disabled)

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V V

Sector Count The first sector where the first unrecoverable error occurred Sector Number Sector[7:0] or LBA[7:0] of the sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred Device/Head LBA DEV H[3:0] or LBA[27:24] of the

sector/LBA to transfer BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V V V V V V V

Page 78: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 77/139 0605V4

10.14 Recalibrate - 1XH The adapter performs only the interface timing and register operations. When this command is issued, the adapter sets BSY and waits for an appropriate length of time after which it clears BSY and issues an interrupt. When this command ends normally, the adapter is initialized.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command 1XH

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 79: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 78/139 0605V4

10.15 Request Sense - 03H This command requests extended error information for the previous command. The table below defines the valid extended error codes. Those codes are placed in the Error Register.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command 03H

OUTPUTS

The diagnostic code written into the Error Register is an 8-bit code as shown in the table below.

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V

Error Sense code, see table below

Code Description 00H No error detected 01H Self test OK (No error) 03H Write/Erase failed 09H Miscellaneous Error - N/A 20H Invalid Command 21H Invalid Address (requested Head or Sector invalid) 2FH Address Overflow (address too large) 35H, 36H Supply or generate Voltage Out of Tolerance 11H Uncorrectable ECC Error 18H Corrected ECC Error - N/A 05H, 30H-34H, 37H, 3EH Self Test Diagnostic Failed 10H, 14H ID Not Found - N/A 3AH Spare Sectors Exhausted 1FH Data Transfer Error / Aborted Command 0CH, 38H, 3BH, 3CH, 3FH Corrupted Media Format - N/A

Page 80: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 79/139 0605V4

10.16 Seek - 7XH This command seeks and picks up the head to track specified in the Task File registers. Actually the adapter performs only an interface timing and register information.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number (Valid in LBA mode only) LBA[7:0] of the track Cylinder Low Cylinder[7:0] or LBA[15:8] of the track Cylinder High Cylinder[15:8] or LBA[23:16] of the track Device/Head LBA DEV H[3:0] or LBA[27:24] of the track Command 7XH

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V V V V

Page 81: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 80/139 0605V4

10.17 Set Feature - EFH This command is used by the host to establish or select from the specific features listed below.(after a power up or a hardware reset) An ATA software reset does not set the features to default. The feature code is set to 81H, this mode is the default mode.

INPUTS

Register 7 6 5 4 3 2 1 0 Features Feature number according to the table below Sector Count Configuration required Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command EFH

Feature Codes

Code Description 01H Enable 8-bit data transfers 55H Disable Read Look Ahead 66H Disable reverting to power on defaults 81H Disable 8-bit data transfers BBH 4 bytes of ECC apply on read long/write long commands CCH Enable reverting to power on defaults

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 82: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 81/139 0605V4

10.18 Set Multiple Mode - C6H The Set Multiple command allows the adapter to perform Read Multiple and Write Multiple operations. It also sets the block count (counts of sectors making up a block) for these commands. The sector count per block is placed is the Sector Count Register. The adapter supports only blocks with one sector.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Sector Count per Block( = 1) Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command C6H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 83: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 82/139 0605V4

10.19 Set Sleep Mode - 99H or E6H This is the only command that allows the host to set the adapter into Sleep mode. When the adapter is set to sleep mode, the adapter clears the BSY line and issues an interrupt. The adapter enters sleep mode and the only method to make the adapter active again (back to normal operation) is by performing a hardware reset or software reset.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command 99H/E6H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 84: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 83/139 0605V4

10.20 Standby - 96H or E2H This command is sets the adapter in Standby mode. If the Sector Count Register is a value other than 0H, an Auto Power Down is enabled and when the adapter returns to the idle mode, the timer starts a countdown. The time is set in the Sector Count Register.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Time period value Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command 96H or E2H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 85: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 84/139 0605V4

10.21 Standby Immediate 94H or E0H This command sets the adapter into standby mode.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command 94H or E0H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 86: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 85/139 0605V4

10.22 Translate Sector - 87H This command allows the host a method of determining the exact number of times a sector was used (erased). The controller responds with the 512-byte buffer of information that includes the Hot Count, if available, for the sector. This command is not supported in this adapter and will always return the Hot Count as “00”.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Sector Count Sector Number Sector[7:0] or LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the starting

sector/LBA Command 87H

OUTPUTS The diagnostic code written into the Error Register is an 8-bit code as shown in the table below. Register 7 6 5 4 3 2 1 0

BSY DRDY DWF DSC DRQ CORR IDX ERR Status

V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V V V

Address Information 00H - 01H Cylinder MSB (00H), Cylinder LSB (01H) 02H Head 03H Sector 04H - 06H LBA MSB (04H) - LSB (06H) 07H - 12H Reserved 13H Erased Flag (FFH) = Erased; (00H) = Not Erased 14H - 17H Reserved 18H - 1AH Hot Count MSB (18H) - LSB (1AH) 1BH - 1FFH Reserved

Page 87: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 86/139 0605V4

10.23 Wear Level - F5H This command is effectively a NOP command and only implemented for backward compatibility. The Sector Count Register will always return the value “00H”, indicating that wear leveling is not needed.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command F5H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V

Sector Count Always “00H” BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V V V V V V V

Page 88: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 87/139 0605V4

10.24 Write Buffer - E8H This command enables the host to rewrite the contents of the adapter data buffer in the adapter with the desired data sting. This data buffer can be accessed by and read by the Read Buffer Command.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count N/A Sector Number N/A Cylinder Low N/A Cylinder High N/A Device/Head DEV Command E8H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V BBK UNC MC IDNF MCR ABRT TK0NF AMNF

Error V

Page 89: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 88/139 0605V4

10.25 Write Long Sector(s) 32H or 33H This command operates in the same way as the Write Sector command except that it writes data and ECC bytes for long commands directly from the sector buffer. ECC bytes for long commands are byte writes that consist of a 4-byte fixed length data. This command can write only one sector at a time.

INPUT

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count “01h” Sector Number Sector[7:0] or LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the starting

sector/LBA Command 32H or 33H

OUTPUTS

Page 90: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 89/139 0605V4

Page 91: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 90/139 0605V4

Page 92: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 91/139 0605V4

BSY DRDY DWF DSC DRQ CORR IDX ERR Status V V V V V V

Sector Count Bit-0 if the command proceeded successfully, other – untransferred sectors count

Sector Number Sector[7:0] or LBA[7:0] of the last good sector transferred Cylinder Low Cylinder[7:0] or LBA[15:8] of the last good sector transferred Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred

BBK UNC MC IDNF MCR ABRT TK0NF AMNF Error

V V V

Page 93: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 92/139 0605V4

10.26 Write Multiple - C5H This command functions in the same way as the Write Sector command. When this command is issued, the adapter sets the BSY within 400nsec. Interrupts are not issued for every sector but after one block consisting of the counts of sectors defined by the Set Multiple command is transferred. The DRQ required for the transfer only has to be set at the beginning of the block and does not affect other sectors.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Sector Count Sector Number Sector[7:0] or LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LB[27:24] of the starting

sector/LBA Command C5H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V

Sector Count Bit-0 if the command proceeded successfully, other – untransferred sectors countSector Number Sector[7:0] or LBA[7:0] of the last good sector transferred Cylinder Low Cylinder[7:0] or LBA[15:8] of the last good sector transferred Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred

BBK UNC MC IDNF MCR ABRT TK0NF AMNFError

V V V V V V

Page 94: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 93/139 0605V4

10.27 Write Multiple without Erase – CDH This command is similar to the Write Multiple command with the exception that an implied erase before using this command. Please note that before using this command it is required to erase the respective sectors using the Erase Sector command.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Sector Count Sector Number Sector[7:0] or LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LB[27:24] of the starting

sector/LBA Command CDH

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V

Sector Count Bit-0 if the command proceeded successfully, other – untransferred sectors countSector Number Sector[7:0] or LBA[7:0] of the last good sector transferred Cylinder Low Cylinder[7:0] or LBA[15:8] of the last good sector transferred Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred

BBK UNC MC IDNF MCR ABRT TK0NF AMNFError

V V V V V V

Page 95: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 94/139 0605V4

10.28 Write Sector(s) - 30H or 31H This command allows the host to write the specified number (1 to 256) of sectors in the Sector Count Register. A sector count of 0 indicates a write request of 256 sectors. The write operation starts from the sector specified in the Sector Number register. The command ends execution by placing the cylinder, head and sector number of the last written sector in the Task File registers.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Sector Count Sector Number Sector[7:0] or LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the starting

sector/LBA Command 30H or 31H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V

Sector Count Bit-0 if the command proceeded successfully, other – untransferred sectors countSector Number Sector[7:0] or LBA[7:0] of the last good sector transferred Cylinder Low Cylinder[7:0] or LBA[15:8] of the last good sector transferred Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred

BBK UNC MC IDNF MCR ABRT TK0NF AMNFError

V V V V V V

Page 96: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 95/139 0605V4

10.29 Write Sector(s) without Erase - 38H This command is similar to the Write Sector command with the exception that an implied erase before using this command. Please note that before using this command it is required to erase the respective sectors using the Erase Sector command.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Sector Count Sector Number Sector[7:0] or LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the starting

sector/LBA Command 38H

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V

Sector Count Bit-0 if the command proceeded successfully, other – untransferred sectors countSector Number Sector[7:0] or LBA[7:0] of the last good sector transferred Cylinder Low Cylinder[7:0] or LBA[15:8] of the last good sector transferred Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred

BBK UNC MC IDNF MCR ABRT TK0NF AMNFError

V V V V

Page 97: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 96/139 0605V4

10.30 Write Verity - 3CH This command is similar to the Write Sector command with the exception that each sector is verified immediately after writing.

INPUTS

Register 7 6 5 4 3 2 1 0 Features N/A Sector Count Sector Count Sector Number Sector[7:0] or LBA[7:0] of the first sector/LBA to transfer Cylinder Low Cylinder[7:0] or LBA[15:8] of the first sector/LBA to transfer Cylinder High Cylinder[15:8] or LBA[23:16] of the first sector/LBA to transfer Device/Head LBA DEV H[3:0] or LBA[27:24] of the starting

sector/LBA Command 3CH

OUTPUTS

Register 7 6 5 4 3 2 1 0 BSY DRDY DWF DSC DRQ CORR IDX ERR

Status V V V V V V

Sector Count Bit-0 if the command proceeded successfully, other – untransferred sectors countSector Number Sector[7:0] or LBA[7:0] of the last good sector transferred Cylinder Low Cylinder[7:0] or LBA[15:8] of the last good sector transferred Cylinder High Cylinder[15:8] or LBA[23:16] of the last good sector transferred

BBK UNC MC IDNF MCR ABRT TK0NF AMNFError

V V V V

Page 98: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 97/139 0605V4

11. Error Posting Command Error Register Status Register BBK UNC IDNF ABRT AMNF DRDY DWF DSC CORR ERRCheck Power Mode Execute Drive Diagnostic Erase Sector(s) Format Track Identify Drive Idle Idle immediate Initialize Drive Parameter Read Buffer Read Multiple Read Long Sector Read Sector(s) Read Verify Sectors Recalibrate Request Sense Security Disable Password Security Erase Prepare Security Erase Unit Security Freeze Lock Security Set Password Security Unlock Seek Set Features Set Multiple Mode Set Sleep Mode Stand By Stand By Immediate Translate Sector Wear Level Write Buffer Write Long Sector Write Multiple Write Multiple w/o Erase

Page 99: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 98/139 0605V4

Write Sector(s) Write Sector w/o Erase Write Verify Invalid command Code

Page 100: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 99/139 0605V4

12. Identify Drive Information Word Data Description

0 848AH General configuration bit-significant information 1 Note 1 Number of Cylinders 2 0000h Reserved 3 Note 1 Number of Heads 4 0000H Obsolete 5 XXXXH Obsolete 6 Note 1 Number of sectors per track 7-8 XXXXH Number of sectors per card (Word 7= MSW, Word 8= LSW ) 9 XXXXH Obsolete 10-19 XXXXH 20 ASCII char serial number. 20 0002H Obsolete 21 0002H Obsolete 22 0004H ECC bytes passed on Read/Write Long Commands 23-26 XXXXH Firmware revision in ASCII chars. 27-46 XXXXH Model Number (Vendor Unique) 47 0001H Maximum Block Count=1 for Read/Write Multiple command 48 0000H Reserved 49 2F00H Capabilities: LBA supported (bit 9).

Capabilities: LBA supported (bit 9). 15 0= interleave DMA not supported 14 0=command queuing not supported 13 1=overlap operation supported 12 0=ATA software reset required (Obsolete) 11 0=IORDY not supported 10 0=IORDY maybe enable 9 0=LBA not supported 8 0=DMA not Supported 7-0 Vendor specification

50 0000H Reserved 51 0200H PIO data transfer cycle timing mode 52 0000H Obsolete 53 0003H Translation Parameters Vaild (bit0:Word54 to 58 are valid,

bit1:Word 64 to 70 are valid) 15-3 Reserved

Page 101: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 100/139 0605V4

Word Data Description 2 1= the field reported in word 88 are valid 0= the field reported in word 88 are not valid 1 1= the field reported in word 64-70 are valid 0= the field reported in word 64-70 are not valid 0 1= the field reported in word 54-58 are valid 0= the field reported in word 54-58 are not valid

54 Note 1 Number of Current Cylinders 55 Note1 Number of Current Heads 56 Note 1 Number of Current Sectors Per Track 57 Note 1 LSW of the Current Capacity in Sectors 58 Note1 MSW of the Current Capacity in Sectors 59 0100H Multiple sector setting

If bit 8 is set to one, bits 7-0 reflect the number of sector currently set to transfer on a READ/WRITE MULTIPLE command. This filed may default to the preferred value for the device. Command Code: C6h

60 Note 1 LSW of the total number of user addressable LBA’s 61 Note 1 MSW of the total number of user addressable LBA’s 62 0000H Reserved 63 0001H 15-11 Reserved

10 1=Multiword DMA mode 2 is selected 0=Multiword DMA mode 2 is not selected 9 1= Multiword DMA mode 1 is selected 0=Multiword DMA mode 1 is not selected 8 1= Multiword DMA mode 0 is selected 0=Multiword DMA mode 0 is not selected 7-3 Reserved 2 0= Multiword DMA mode 2 and below are not supported 1 0= Multiword DMA mode 1 and below are not supported 0 1= Multiword DMA mode 0 is supported Multiword

DMA mode selected. 64 0003H Advanced PIO Modes supported (bit0: PIO-3,

bit1:PIO4,supported) 15-8 Reserved 7-0 Supported Bits 7 through 0 of word 64 of the Identify Device parameter information is defined as the PIO data and register transfer supported field. If this field is supported, bit 1 of word 53 shall

Page 102: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 101/139 0605V4

Word Data Description be set to one.

Of these bits, bits 7 through 2 are Revered for future PIO modes. Bit 0, if set to one, indicated that the device supports PIO mode 3. All device except CFA and PCMCIA device shall support PIO mode 3 and shall set bit 0 to one. Bit 1, if set to one, indicated that the device support PIO mode 4.

65 01E0H (DMA 2) 0000H (PIO 4)

Minimum Multiword DMA transfer cycle time per word 15-0 Cycle time in nanoseconds

If this field is supported, bit 1 of word 53 shall be set to one.Any device that supports Multiword DMA mode 1 or above shall support this field, and the value in word 65 shall not be less than the minimum cycle time for the fastest DMA mode supported by the device.

If bit 1 of word 53 is set to one because a device supports a field in words 64-70 other than this filed and the device does not support this filed, the device shall return a value of zero in this field.

66 01E0H 0000H (PIO 4)

Manufacturer’s recommended Multiword DMA transfer cycle time 15-0 Cycle time in nanoseconds

If this field is supported, bit 1 of word 53 shall be set to one, Any device that supports Multiword DMA mode 1 or above shall support this field, and the value in word 66 shall not be less than the value in word 65.

67 0078H Minimum PIO transfer cycle time without flow control 15-0 Cycle time in nanoseconds

68 0078H Minimum PIO transfer cycle time with IORDY flow control 15-0 Cycle time in nanoseconds

69-79 0000H Reserved (for feature command overlap and queuing) 80-81 0000H ... Reserved for CFA 82 0000H Features/Command sets supported 83 0000H Feature/Command sets supported 84 0000H Features/Command sets supported 85 0000H Features/Command sets supported 86 0000H Feature/Command sets supported 87 0000H Features/Command sets supported 88 0700H 15-14 Reserved

13 1= Ultra DMA mode 5 is selected

Page 103: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 102/139 0605V4

Word Data Description 0=Ultra DMA mode 5 is not selected 12 1= Ultra DMA mode 4 is selected 0=Ultra DMA mode 4 is not selected 11 1= Ultra DMA mode 3 is selected 0=Ultra DMA mode 3 is not selected 10 1= Ultra DMA mode 2 is selected 0=Ultra DMA mode 2 is not selected 9 1= Ultra DMA mode 1 is selected 0=Ultra DMA mode 1 is not selected 8 1= Ultra DMA mode 0 is selected 0=Ultra DMA mode 0 is not selected 7-6 Reserved

5 0= Ultra DMA mode 5 and below are not supported 4 1= Ultra DMA mode 4 and below are supported 3 1= Ultra DMA mode 3 and below are supported 2 1= Ultra DMA mode 2 and below are supported 1 1= Ultra DMA mode 1 and below are supported 0 1= Ultra DMA mode 0 is supported

89 0000H Time required for Security erase unit completion 90 0000H Time required for Enhanced security erase unit completion 91 XXXXH Current Advanced power management value 92 - 127 0000H Reserved 128 0000H Security status 129 - 159 0000H Vendor unique bytes 160 0000H Power requirement description 161 0000H Reserved 162 0000H Key management schemes supported 163 - 255 0000H Total 166 Bytes Reserved Note1: Variable by capacity

Page 104: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 103/139 0605V4

13. ATA Protocol Overview Command classes are grouped according to protocols described for command execution. For all commands, the host must first check for BYS=0 before proceeding further. For most commands, the host should not proceed until DRDY=1.

13.1 PIO Data In Commands Execution includes one more 512 bytes data-sector drive-to-host transfer. If the drive presents error status, it prepares to transfer data at the host's discretion. The host writes parameters to the Feature, Sector Count, Sector Number, Cylinder, and Drive/Head register. The host writes the Command Register's command code. The drive sets BSY and prepares for data transfer when a data sector is available; the drive sets DRQ, clears BSY, and asserts interrupt. At interrupt, the host reads the Status register, the drive negates interrupt, and the host reads one data-sector from Data Register. The drive clears DRQ. If another sector is required, the drive sets BSY and repeats the data transfer from 4.

13.2 PIO Data Out Commands Execution includes one or more 512 bytes host-to-drive data-sector transfers. The host writes parameters to the Features, Sector Count, Sector Number, Cylinder, and Drive/Head Registers. The host writes the Command register's command code. The drive sets DRQ when it can accept the first sector of data

The host writes one sector of data to the Data register. The Drive clears DRQ and sets BSY. At sector processing complete, the drive clears BSY and asserts interrupt. If another sector transfer is required, the drive also sets DRQ. The host reads the Status register after detecting interrupt. The drive negates the interrupt if another sector transfer is required, the sequence repeats from 4.

13.3 Non Data Commands Command execution involves no data transfer. The host writes parameters to the Features, Sector Count, Sector Number, Cylinder, and Drive/Head registers. The host writes the Command register's command code. The Drive sets BSY. When the drive completes sector processing, it clears BSY and asserts interrupt. The host reads the Status register after detecting interrupts the drive negates the interrupt.

Page 105: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 104/139 0605V4

14. Ultra DMA data-in commands

14.1. Initiating an Ultra DMA data-in burst The following steps shall occur in the order they are listed unless otherwise specified.

a) The host shall keep DMACK- in the negated state before an Ultra DMA burst is initiated.

b) The device shall assert DMARQ to initiate an Ultra DMA burst when DMACK- is negated. Afterassertion of DMARQ the device shall not negate DMARQ until after the first negation of DSTROBE.

c) Steps (c), (d), and (e) may occur in any order or at the same time. The host shall assert STOP.

d) The host shall negate HDMARDY-.

e) The host shall negate CS0-, CS1-, DA2, DA1, and DA0. The host shall keep CS0-, CS1-, DA2, DA1, and DA0 negated until after negating DMACK- at the end of the burst.

f) Steps (c), (d), and (e) shall have occurred at least tACK before the host asserts DMACK-. The host shall keep DMACK- asserted until the end of an Ultra DMA burst.

g) The host shall release DD(15:0) within tAZ after asserting DMACK-.

h) The device may assert DSTROBE tZIORDY after the host has asserted DMACK-. Once the device has driven DSTROBE the device shall not release DSTROBE until after the host has negated DMACK- at the end of an Ultra DMA burst.

i) The host shall negate STOP and assert HDMARDY- within tENV after asserting DMACK-. After negating STOP and asserting HDMARDY-, the host shall not change the state of either signal until after receiving the first negation of DSTROBE from the device (i.e., after the first data word has been received).

j) The device shall drive DD(15:0) no sooner than tZAD after the host has asserted DMACK-, negated STOP, and asserted HDMARDY-.

k) The device shall drive the first word of the data transfer onto DD(15:0). This step may occur when the device first drives DD(15:0) in step (j).

l) To transfer the first word of data the device shall negate DSTROBE within tFS after the host has negated STOP and asserted HDMARDY-. The device shall negate DSTROBE no sooner than tDVS after driving the first word of data onto DD(15:0).

14.2. The data-in transfer The following steps shall occur in the order they are listed unless otherwise specified.

a) The device shall drive a data word onto DD(15:0).

b) The device shall generate a DSTROBE edge to latch the new word no sooner than tDVS after changing the

Page 106: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 105/139 0605V4

state of DD(15:0). The device shall generate a DSTROBE edge no more frequently than tCYC for the selected Ultra DMA mode. The device shall not generate two rising or two falling DSTROBE edges more frequently than t2cyc for the selected Ultra DMA mode.

c) The device shall not change the state of DD(15:0) until at least tDVH after generating a DSTROBE edge to latch the data.

d) The device shall repeat steps (a), (b), and (c) until the Ultra DMA burst is paused or terminated by the device or host.

14.3. Pausing an Ultra DMA data-in burst The following steps shall occur in the order they are listed unless otherwise specified.

14.3.1. Device pausing an Ultra DMA data-in burst a) The device shall not paused an Ultra DMA burst until at least one data word of an Ultra DMA burst has been transferred.

b) The device shall pause an Ultra DMA burst by not generating additional DSTROBE edges. If the host is ready to terminate the Ultra DMA burst.

c) The device shall resume an Ultra DMA burst by generating a DSTROBE edge.

14.3.2. Host pausing an Ultra DMA data-in burst a) The host shall not pause an Ultra DMA burst until at least one data word of an Ultra DMA burst has been transferred.

b) The host shall pause an Ultra DMA burst by negating HDMARDY-.

c) The device shall stop generating DSTROBE edges within tRFS of the host negating HDMARDY-.

d) When operating in Ultra DMA modes 2, 1, or 0: If the host negates HDMARDY- within tSR after the device has generated a DSTROBE edge, then the host shall be prepared to receive zero or one additional data words; or, if the host negates HDMARDY- greater than tSR after the device has generated a DSTROBE edge, then the host shall be prepared to receive zero, one or two additional data words. While operating in Ultra DMA modes 4 or 3 the host shall be prepared to receive zero, one, two or three additional data words after negating HDMARDY-. The additional data words are a result of cable round trip delay and tRFS timing for the device.

e) The host shall resume an Ultra DMA burst by asserting HDMARDY-.

14.3.3. Terminating an Ultra DMA data-in burst

14.3.3.1. Device terminating an Ultra DMA data-in burst

Burst termination is completed when the termination protocol has been executed and DMACK- negated. The

Page 107: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 106/139 0605V4

device shall terminate an Ultra DMA burst before command completion.

The following steps shall occur in the order they are listed unless otherwise specified.

The device shall initiate termination of an Ultra DMA burst by not generating additional DSTROBE edges.

The device shall negate DMARQ no sooner than tSS after generating the last DSTROBE edge. The device shall not assert DMARQ again until after DMACK- has been negated.

The device shall release DD(15:0) no later than tAZ after negating DMARQ.

The host shall assert STOP within tLI after the device has negated DMARQ. The host shall not negate STOP again until after the Ultra DMA burst is terminated.

The host shall negate HDMARDY- within tLI after the device has negated DMARQ. The host shall continue to negate HDMARDY- until the Ultra DMA burst is terminated. Steps (d) and (e) may occur at the same time.

The host shall drive DD(15:0) no sooner than tZAH after the device has negated DMARQ. For this step, the host may first drive DD(15:0) with the result of the host CRC calculation (see 9.15);

If DSTROBE is negated, the device shall assert DSTROBE within tLI after the host has asserted STOP. No data shall be transferred during this assertion. The host shall ignore this transition on DSTROBE. DSTROBE shall remain asserted until the Ultra DMA burst is terminated.

If the host has not placed the result of the host CRC calculation on DD(15:0) since first driving DD(15:0) during (f), the host shall place the result of the host CRC calculation on DD(15:0) (see 9.15).

The host shall negate DMACK- no sooner than tMLI after the device has asserted DSTROBE and negated DMARQ and the host has asserted STOP and negated HDMARDY-, and no sooner than tDVS after the host places the result of the host CRC calculation on DD(15:0).

The device shall latch the host’s CRC data from DD(15:0) on the negating edge of DMACK-.

The device shall compare the CRC data received from the host with the results of the device CRC calculation. If a miscompare error occurs during one or more Ultra DMA bursts for any one command, at the end of the command the device shall report the first error that occurred (see 9.15).

The device shall release DSTROBE within tIORDYZ after the host negates DMACK-.

The host shall not negate STOP nor assert HDMARDY- until at least tACK after negating DMACK-.

The host shall not assert DIOR-, CS0-, CS1-, DA2, DA1, or DA0 until at least tACK after negating DMACK.

14.3.3.2. Host terminating an Ultra DMA data-in burst

The following steps shall occur in the order they are listed unless otherwise specified.

a) The host shall not initiate Ultra DMA burst termination until at least one data word of an Ultra DMA burst has been transferred.

b) b) The host shall initiate Ultra DMA burst termination by negating HDMARDY-. The host shall continue to negate HDMARDY- until the Ultra DMA burst is terminated.

Page 108: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 107/139 0605V4

c) The device shall stop generating DSTROBE edges within tRFS of the host negating HDMARDY-.

d) When operating in Ultra DMA modes 2, 1, or 0: If the host negates HDMARDY- within tSR after the device has generated a DSTROBE edge, then the host shall be prepared to receive zero or one additional data words; or, if the host negates HDMARDY- greater than tSR after the device has generated a DSTROBE edge, then the host shall be prepared to receive zero, one or two additional data words. While operating in Ultra DMA modes 4 or 3 the host shall be prepared to receive zero, one, two or three additional data words after negating HDMARDY-. The additional data words are a result of cable round trip delay and tRFS timing for the device.

e) The host shall assert STOP no sooner than tRP after negating HDMARDY-. The host shall not negate STOP again until after the Ultra DMA burst is terminated.

f) The device shall negate DMARQ within tLI after the host has asserted STOP. The device shall not assert DMARQ again until after the Ultra DMA burst is terminated.

g) If DSTROBE is negated, the device shall assert DSTROBE within tLI after the host has asserted STOP. No data shall be transferred during this assertion. The host shall ignore this transition on DSTROBE. DSTROBE shall remain asserted until the Ultra DMA burst is terminated.

h) The device shall release DD(15:0) no later than tAZ after negating DMARQ.

i) The host shall drive DD(15:0) no sooner than tZAH after the device has negated DMARQ. For this step, the host may first drive DD(15:0) with the result of the host CRC calculation .

j) If the host has not placed the result of the host CRC calculation on DD(15:0) since first driving DD(15:0) during (9), the host shall place the result of the host CRC calculation on DD(15:0).

k) The host shall negate DMACK- no sooner than tMLI after the device has asserted DSTROBE and negated DMARQ and the host has asserted STOP and negated HDMARDY-, and no sooner than tDVS after the host places the result of the host CRC calculation on DD(15:0).

l) The device shall latch the host’s CRC data from DD(15:0) on the negating edge of DMACK-.

m) The device shall compare the CRC data received from the host with the results of the device CRC calculation. If a miscompare error occurs during one or more Ultra DMA burst for any one command, at the end of the command, the device shall report the first error that occurred.

n) The device shall release DSTROBE within tIORDYZ after the host negates DMACK-.

o) The host shall neither negate STOP nor assert HDMARDY- until at least tACK after the host has negated DMACK-.

p) The host shall not assert DIOR-, CS0-, CS1-, DA2, DA1, or DA0 until at least tACK after negating DMACK.

Page 109: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 108/139 0605V4

14.4. Ultra DMA data-out commands

14.4.1. Initiating an Ultra DMA data-out burst The following steps shall occur in the order they are listed unless otherwise specified.

a) The host shall keep DMACK- in the negated state before an Ultra DMA burst is initiated.

b) The device shall assert DMARQ to initiate an Ultra DMA burst when DMACK- is negated.

c) Steps (c), (d), and (e) may occur in any order or at the same time. The host shall assert STOP.

d) The host shall assert HSTROBE.

e) The host shall negate CS0-, CS1-, DA2, DA1, and DA0. The host shall keep CS0-, CS1-, DA2, DA1, and DA0 negated until after negating DMACK- at the end of the burst.

f) Steps (c), (d), and (e) shall have occurred at least tACK before the host asserts DMACK-. The host shall keep DMACK- asserted until the end of an Ultra DMA burst.

g) The device may negate DDMARDY- tZIORDY after the host has asserted DMACK-. Once the device has negated DDMARDY-, the device shall not release DDMARDY- until after the host has negated DMACK- at the end of an Ultra DMA burst.

h) The host shall negate STOP within tENV after asserting DMACK-. The host shall not assert STOP until after the first negation of HSTROBE.

i) The device shall assert DDMARDY- within tLI after the host has negated STOP. After asserting DMARQ and DDMARDY- the device shall not negate either signal until after the first negation of HSTROBE by the host.

j) The host shall drive the first word of the data transfer onto DD(15:0). This step may occur any time during Ultra DMA burst initiation.

k) To transfer the first word of data: the host shall negate HSTROBE no sooner than tUI after the device has asserted DDMARDY-. The host shall negate HSTROBE no sooner than tDVS after the driving the first word of data onto DD(15:0).

14.4.2. The data-out transfer The following steps shall occur in the order they are listed unless otherwise specified.

a) The host shall drive a data word onto DD(15:0).

b) The host shall generate an HSTROBE edge to latch the new word no sooner than tDVS after changing the state of DD(15:0). The host shall generate an HSTROBE edge no more frequently than tCYC for the selected Ultra DMA mode. The host shall not generate two rising or falling HSTROBE edges more frequently than t2cyc for the selected Ultra DMA mode.

c) The host shall not change the state of DD(15:0) until at least tDVH after generating an HSTROBE edge to latch the data.

Page 110: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 109/139 0605V4

d) The host shall repeat steps (a), (b), and (c) until the Ultra DMA burst is paused or terminated by the device or host.

14.4.3. Pausing an Ultra DMA data-out burst The following steps shall occur in the order they are listed unless otherwise specified.

14.4.3.1 Host pausing an Ultra DMA data-out burst

a) The host shall not pause an Ultra DMA burst until at least one data word of an Ultra DMA burst has been transferred.

b) The host shall pause an Ultra DMA burst by not generating an HSTROBE edge. If the host is ready to terminate the Ultra DMA burst.

c) The host shall resume an Ultra DMA burst by generating an HSTROBE edge .

12.4.3.2. Device pausing an Ultra DMA data-out burst

a) The device shall not pause an Ultra DMA burst until at least one data word of an Ultra DMA burst has been transferred.

b) The device shall pause an Ultra DMA burst by negating DDMARDY-.

c) The host shall stop generating HSTROBE edges within tRFS of the device negating DDMARDY-.

d) When operating in Ultra DMA modes 2, 1, or 0: If the device negates DDMARDY- within tSR after the host has generated an HSTROBE edge, then the device shall be prepared to receive zero or one additional data words; or, if the device negates DDMARDY- greater than tSR after the host has generated an HSTROBE edge, then the device shall be prepared to receive zero, one or two additional data words. While operating in Ultra DMA modes 4 or 3 the device shall be prepared to receive zero, one, two or three additional data words after negating DDMARDY-. The additional data words are a result of cable round trip delay and tRFS timing for the host.

e) The device shall resume an Ultra DMA burst by asserting DDMARDY-.

14.4.4. Terminating an Ultra DMA data-out burst

14.4.4.1 Host terminating an Ultra DMA data-out burst

The following steps shall occur in the order they are listed unless otherwise specified.

a) The host shall initiate termination of an Ultra DMA burst by not generating additional HSTROBE edges.

b) The host shall assert STOP no sooner than tSS after the last generated an HSTROBE edge. The host shall not negate STOP again until after the Ultra DMA burst is terminated.

c) The device shall negate DMARQ within tLI after the host asserts STOP. The device shall not assert DMARQ again until after the Ultra DMA burst is terminated.

d) The device shall negate DDMARDY- within tLI after the host has negated STOP. The device shall not

Page 111: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 110/139 0605V4

assert DDMARDY- again until after the Ultra DMA burst termination is complete.

e) If HSTROBE is negated, the host shall assert HSTROBE within tLI after the device has negated DMARQ. No data shall be transferred during this assertion. The device shall ignore this transition on HSTROBE. HSTROBE shall remain asserted until the Ultra DMA burst is terminated.

f) The host shall place the result of the host CRC calculation on DD(15:0)

g) The host shall negate DMACK- no sooner than tMLI after the host has asserted HSTROBE and STOP and the device has negated DMARQ and DDMARDY-, and no sooner than tDVS after placing the result of the host CRC calculation on DD(15:0).

h) The device shall latch the host’s CRC data from DD(15:0) on the negating edge of DMACK-.

i) The device shall compare the CRC data received from the host with the results of the device CRC calculation. If a miscompare error occurs during one or more Ultra DMA bursts for any one command, at the end of the command, the device shall report the first error that occurred.

j) The device shall release DDMARDY- within tIORDYZ after the host has negated DMACK-.

k) The host shall neither negate STOP nor negate HSTROBE until at least tACK after negating DMACK-.

l) The host shall not assert DIOW-, CS0-, CS1-, DA2, DA1, or DA0 until at least tACK after negating DMACK.

14.4.4.2 Device terminating an Ultra DMA data-out burst

Burst termination is completed when the termination protocol has been executed and DMACK- negated. The device shall terminate an Ultra DMA burst before command completion. The following steps shall occur in the order they are listed unless otherwise specified.

a) The device shall not initiate Ultra DMA burst termination until at least one data word of an Ultra DMA burst has been transferred.

b) The device shall initiate Ultra DMA burst termination by negating DDMARDY-.

c) The host shall stop generating an HSTROBE edges within tRFS of the device negating DDMARDY-.

d) When operating in Ultra DMA modes 2, 1, or 0: If the device negates DDMARDY- within tSR after the host has generated an HSTROBE edge, then the device shall be prepared to receive zero or one additional data words; or, if the device negates DDMARDY- greater than tSR after the host has generated an HSTROBE edge, then the device shall be prepared to receive zero, one or two additional data words. While operating in Ultra DMA modes 4 or 3 the device shall be prepared to receive zero, one, two or three additional data words after negating DDMARDY-. The additional data words are a result of cable round trip delay and tRFS timing for the host.

e) The device shall negate DMARQ no sooner than tRP after negating DDMARDY-. The device shall not assert DMARQ again until after DMACK- is negated.

f) The host shall assert STOP within tLI after the device has negated DMARQ. The host shall not negate

Page 112: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 111/139 0605V4

STOP again until after the Ultra DMA burst is terminated.

g) If HSTROBE is negated, the host shall assert HSTROBE within tLI after the device has negated DMARQ. No data shall be transferred during this assertion. The device shall ignore this transition of HSTROBE. HSTROBE shall remain asserted until the Ultra DMA burst is terminated.

h) The host shall place the result of the host CRC calculation on DD(15:0).

i) The host shall negate DMACK- no sooner than tMLI after the host has asserted HSTROBE and STOP and the device has negated DMARQ and DDMARDY-, and no sooner than t DVS after placing the result of the host CRC calculation on DD(15:0).

j) The device shall latch the host’s CRC data from DD(15:0) on the negating edge of DMACK-.

k) The device shall compare the CRC data received from the host with the results of the device CRC calculation. If a miscompare error occurs during one or more Ultra DMA bursts for any one command, at the end of the command, the device shall report the first error that occurred.

l) The device shall release DDMARDY- within tIORDYZ after the host has negated DMACK-.

m) The host shall neither negate STOP nor HSTROBE until at least tACK after negating DMACK-.

n) The host shall not assert DIOW-, CS0-, CS1-, DA2, DA1, or DA0 until at least tACK after negating DMACK.

14.5. Ultra DMA CRC rules The following is a list of rules for calculating CRC, determining if a CRC error has occurred during an Ultra

DMA burst, and reporting any error that occurs at the end of a command.

1) Both the host and the device shall have a 16-bit CRC calculation function.

2) Both the host and the device shall calculate a CRC value for each Ultra DMA burst.

3) The CRC function in the host and the device shall be initialized with a seed of 4ABAh at the beginning of an Ultra DMA burst before any data is transferred.

4) For each STROBE transition used for data transfer, both the host and the device shall calculate a new CRC value by applying the CRC polynomial to the current value of their individual CRC functions and the word being transferred. CRC is not calculated for the return of STROBE to the asserted state after the Ultra DMA burst termination request has been acknowledged.

5) At the end of any Ultra DMA burst the host shall send the results of the host CRC calculation function to the device on DD(15:0) with the negation of DMACK-.

6) The device shall then compare the CRC data from the host with the calculated value in its own CRC calculation function. If the two values do not match, the device shall save the error. A subsequent Ultra DMA burst for the same command that does not have a CRC error shall not clear an error saved from a previous Ultra DMA burst in the same command. If a miscompare error occurs during one or more Ultra DMA bursts for any one command, the device shall report the first error that occurred. If the

Page 113: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 112/139 0605V4

device detects that a CRC error has occurred before data transfer for the command is complete, the device may complete the transfer and report the error or abort the command and report the error.

7) For READ DMA, WRITE DMA, READ DMA QUEUED, or WRITE DMA QUEUED commands: When a CRC error is detected, the error shall be reported by setting both ICRC and ABRT (bit 7 and bit 2 in the Error register) to one. ICRC is defined as the “Interface CRC Error” bit. The host shall respond to this error by re-issuing the command.

8) For a REQUEST SENSE packet command (see SPC T10/955D for definition of the REQUEST SENSE command): When a CRC error is detected during transmission of sense data the device shall complete the command and set CHK to one. The device shall report a Sense key of 0Bh (ABORTED COMMAND). The device shall preserve the original sense data that was being returned when the CRC error occurred. The device shall not report any additional sense data specific to the CRC error. The host device driver may retry the REQUEST SENSE command or may consider this an unrecoverable error and retry the command that caused the Check Condition.

9) For any packet command except a REQUEST SENSE command: If a CRC error is detected, the device shall complete the command with CHK set to one. The device shall report a Sense key of 04h (HARDWARE ERROR). The sense data supplied via a subsequent REQUEST SENSE command shall report an ASC/ASCQ value of 08h/03h (LOGICAL UNIT COMMUNICATION CRC ERROR). Host drivers should retry the command that resulted in a HARDWARE ERROR.

10) A host may send extra data words on the last Ultra DMA burst of a data-out command. If a device determines that all data has been transferred for a command, the device shall terminate the burst. A device may have already received more data words than were required for the command. These extra words are used by both the host and the device to calculate the CRC, but, on an Ultra DMA data-out burst, the extra words shall be discarded by the device.

11) The CRC generator polynomial is: G(X) = X16 + X12 + X5 + 1. Table 46 describes the equations for 16- bit parallel generation of the resulting polynomial (based on a word boundary).

NOTE Since no bit clock is available, the recommended approach for calculating CRC is to use a word clock derived from the bus strobe. The combinational logic is then equivalent to shifting sixteen bits serially through the generator polynomial where DD0 is shifted in first and DD15 is shifted in last.

NOTE If excessive CRC errors are encountered while operating in an Ultra mode, the host should select a slower Ultra mode. Caution: CRC errors are detected and reported only while operating in an Ultra mode.

Page 114: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 113/139 0605V4

15. Security CF

Page 115: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 114/139 0605V4

Page 116: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 115/139 0605V4

Page 117: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 116/139 0605V4

Page 118: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 117/139 0605V4

Page 119: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 118/139 0605V4

Page 120: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 119/139 0605V4

Page 121: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 120/139 0605V4

Page 122: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 121/139 0605V4

Page 123: Technical Specification Industrial Compact Flash Card

Card Industrial Application

TCADO-SCF-000018.4 122/139 0605V4

Page 124: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 123/139 0605V4

Page 125: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 124/139 0605V4

Page 126: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 125/139 0605V4

Page 127: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 126/139 0605V4

Page 128: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 127/139 0605V4

Page 129: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 1 2 8 / 1 3 9 0605V4

Page 130: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 129/139 0605V4

Page 131: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 130/139 0605V4

Page 132: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 131/139 0605V4

Page 133: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 132/139 0605V4

Page 134: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 133/139 0605V4

Page 135: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 134/139 0605V4

Page 136: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 135/139 0605V4

Page 137: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 136/139 0605V4

Page 138: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 137/139 0605V4

Page 139: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 138/139 0605V4

16.System Environmental Specifications

16.1 Temperature Test Flow

Page 140: Technical Specification Industrial Compact Flash Card

S-CN CompactFlash Card Industrial Application

TCADO-SCF-000018.4 139/139 0605V4

16.2Altitude Test

Altitude

Product

Altitude(relative to sea level)

Operating &Non- Operating

80,000 feet maximum