telink semiconductor smart lighting solutions

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Telink Confidential Telink Semiconductor Smart Lighting Solutions High Performance, Ultra-Low-Power Connectivity Solutions

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Page 1: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 1

Telink Semiconductor Smart Lighting SolutionsHigh Performance, Ultra-Low-Power Connectivity Solutions

Page 2: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 2

Telink’s Lighting Solution Has Been Adopted by Tier 1 Lighting Companies

Technology Innovation

Solution Maturity

Customer Recognition

Telink proprietary BLE Mesh technology enters MP two years before SIG Mesh standards

Mature solution developed with key features, protected by patents worldwide

Telink solution adopted by Tier 1 Customers worldwide

Page 3: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 3

Telink’s Flexible Smart Lighting Product Offering

Telink’s multi-standard ultra-low-power IC features flexible configuration variations that are tailored to meet the diverse requirements of clients’ lighting products in a cost-effective way. These variations offer different options for supported protocols, memory size, number of PWM channels, and operating temperature range.

Clients who are looking for simple BLE Mesh applications may choose our 8253 or 8273 chip, which feature the most cost-effectivesolution. Those who want their products to be compatible with multiple protocols may choose the more advanced 8258 or 8278 chip.

On Telink’s latest B91 platform, aka the TLSR9 Series, the SIG Mesh SDK incorporates keyword spotting and command recognition algorithm. It features quick response to voice commands and low latency, especially suitable for devices with simple control.

Part Number Protocol SRAM FLASH PWM Temperature

TLSR8258F1KET32 BLE Mesh + Zigbee + HomeKit 64K 1M 6 -40℃~+85℃

TLSR8258F512ET32/AT32 BLE Mesh + Zigbee + HomeKit 64K 512K 6ET32: -40℃~+85℃AT32: -40℃~+125℃

TLSR8253F512ET32/AT32 BLE Mesh 48K 512K 6ET32: -40℃~+85℃AT32: -40℃~+125℃

TLSR8278F1KET48 BLE Mesh + Zigbee 64K 1M 6 -40℃~+85℃

TLSR8273F512ET48 BLE Mesh 64K 512K 6 -40℃~+85℃

TLSR921xBLE Mesh + Zigbee + HomeKit

+ Local Keyword Spotting and Command Recognition256K 1M 6 -40℃~+85℃

Page 4: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 4

Performance

Telink’s solutions deliver great RF performance, ultra-low power consumption, and exceptional protocol flexibility, which are fundamental to lighting manufacturers to build products that win out in a competitive market.

The Telink DifferenceTelink is built upon four central pillars that underpin our commitment to helping clients achieve their goals: performance, BOM cost, complete solutions, and innovation.

Complete Solutions

From evaluation kits and reference designs to local field application engineer support, Telink’s clients get more than high-performing, low-cost chips. They get a robust support infrastructure that helps them address development issues quickly, accelerating their time-to-market.

Innovation

Telink continue to invest in supporting the latest versions of the most popular technologies so our clients are able to produce the high-functioning lighting products consumers demand. This includes expanding our capabilities to deep integration into major ecosystems and to location based services.

BOM Cost

Telink’s highly-integrated SoCsreduce the number of external components manufacturers need to include in their lighting products, significantly lowering total system costs. Further, because we own our protocol stack, we don’t pay any licensing fees — savings we pass on to our clients.

Page 5: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 5

Exceptional RF Performance

Telink’s chips support a link budget of over 105dBm

Maximum Tx output power 10dBm

Rx sensitivity -96dBm @ BLE 1Mbps

Great connection range and stability

BOM savings generated by the lack of need for a dual antenna

Telink Link Budget

Tran

smis

sion

Pow

er

Con

nect

or L

oss,

etc

.

Ant

enna

gai

n

Ant

enna

gai

n

Con

nect

or L

oss,

etc

.

Rec

eivi

ng P

owerFree Space Path Loss and Fading

Receiver Sensitivity

P(dBm)

-100

0

10Tx

Rx

TLSR82xx

TLSR82xx

Pillar #1: Performance

typical connection range greater than 100 meters*

Notes:*see Appendix II for details

Page 6: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 6

Performance Competitive Analysis

Pillar #1: Performance

PERFORMANCE Competitor R Competitor C Competitor S TLSR825x TLSR827x

Standard BLE Mesh BR / BLE Mesh BLE Mesh / Zigbee BLE Mesh/Zigbee/HomeKit BLE Mesh/Zigbee

BLE 5.0 5.0 5.0 5.0 5.1

Core Spec 32bit M4F 32bit M4 32bit M4 32bit Telink MCU 32bit Telink MCU

SRAM 160K 512K 64K 64K 64K

Flash 2M 1M 512K 512K (upgradable to 1M) 512K (upgradable to 1M)

Package QFN48 / QFN40 QFN40 QFN48 / QFN32 QFN48 / QFN32 / QFN24 QFN48 / QFN32 / QFN24

GPIO 34 16 31 32 32

PWM 8 6 4 6 6

ADC 12bit 10bit 12bit 14bit 14bit

Tx output power 4dBm 4dBm 19dBm 10dBm (max) 10dBm (max)

Rx sensitivity -97dBm -95.5dBm -94.8dBm -96dBm -96dBm

Power Supply 1.8 ~ 3.6V 1.9 ~ 3.63V 1.8 ~ 3.8V 1.8 ~ 3.6V 1.8 ~ 3.6V

Whole chip Rx power w/ DCDC 6.8mA 5.9mA 9,5mA 5.3mA 4.6mA

Whole chip Tx Power@0dBm w/ DCDC 8.4mA 5.6mA 8.5mA 4.8mA 4.9mA

Operating Temperature -40℃~+105℃ -30℃~+85℃ -40℃~+125℃ -40℃~+125℃ -40℃~+85℃

Telink Advantage

Page 7: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 7

Multiple Levels of BOM Savings

Pillar #2: BOM Cost

Telink chips minimize BOM costs for lighting solutions:

Due to their smaller die size (1), manufacturing costs for Telink products are much lower than costs for competitors’ products at the same process node

Unique architecture and system-level design optimization

Fewer external BOM components (2) than the industry average due to high level of on-chip integration and system-level design methodology

Integrated RF matching components

On-chip 32 kHz RC oscillator

Embedded DCDC and LDO

Integrated PA loading inductor

Inductorless operation in LDO only mode

External

Components

PCB

IC

(2)

(1)

Page 8: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 8

Providing the Support to Accelerate Time-to-Market

Pillar #3: Complete Solutions

To that end, Telink’s support infrastructure includes:

A sprawling repository of SDKs, datasheets, application notes, user guides, and reference design schematics – all available on Telink wiki

A Technical Forum where clients can raise technical questions and get answers from fellow developers and/or Telink employees

A force of local field application engineers who are available to answer clients’ technical questions

A set of fully customizable protocol stack, which makes it easy for us to help clients with customizations

Telink’s goal is to not only provide the hardware and protocol stack for high-performing mesh/lighting products, but to remove any development obstacles our clients may face to accelerate their time-to-market.

Voice Remote, Smart Lighting, etc…

LL/MAC Firmware + RF Driver

RF Transceiver

Modem

Telink Protocol Stack

ApplicationAPI

MAC/LLAPI

MAC orLL/PHY

PHY/RF

ZHA/ZLLZRC/MSO

BLE Profiles Thread

ZigbeePro/RF4CE

BLE Stack 6LoWPAN

Interrupt FIFO/DMA Registers

LL/MAC Hardware

Baseband IP

HardwareDrivers

(PWM, ADC, 12C, SPI, USB,

etc.)

Page 9: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 9

One-Stop Support Throughout the Entire Product Development Cycle

Pillar #3: Complete Solutions

TechnologyEvaluation Prototyping Product

DevelopmentCompliance Certification

Trial Production

Mass Production

Demo kit

Telink generic dev kit

PCB references

PCB design guide and consultation

Telink SDK and binary

Telink SDK

Development and debug tools

Android/Linux platform adaptation source code

iOS/Android mobile apps source code

Compliance test tuning guide and consultation

Manufacturing JIG

PC software tool

Consultation and troubleshooting

Troubleshooting

FA and RMA

FW OTA update

Additional Telink Resources:

FAE and solution partner

Developer’s section and technical forum

Documentations (datasheets, application notes, handbooks, user guides)

Telink Resources for Entire Development Cycle:

Field application engineers and solution partners

Developer’s wiki site and technical forum

Documentations (datasheets, application notes, handbooks, user guides)

Page 10: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 10

Telink Smart Lighting Ecosystems

Pillar #3: Complete Solutions

Telink reference hardware/stack/firmware

Module schematic and PCB (Easy interface to all types of LED drivers)

Remote control schematic and PCB

Zigbee/BLE/2.4Ghz stack, profiles, and UIs

Free Android and iOS App references

IDH and LED System Providers

Light control modules based on Telink reference

Remote control ID and PCBA based on Telink reference

Gateway: Integrated solution with Telink Zigbee/BLE/2.4Ghz RF SoCs

Free Android and iOS Apps

Android/iOS Phones/Pads

Page 11: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 11

Lighting SDK Roadmap

Pillar #4: Innovation

2014 2015 2016 2017 2018 2019 2020

Zigbee

Routing-based Mesh

BLE Mesh

Flooding Mesh

Apple HomeKit

Thread

CHIP

2021

Telink Proprietary

Mesh

Zigbee Pro Zigbee 3.0 +ZHA/ZLL

SIG Mesh SIG Mesh +Tmall/ Mi-Eco, Indoor

Positioning

Direct Forwarding

Zigbee 3.0 +Greenpower

BLE Mesh +Zigbee Dual-mode Selection

BLE/Zigbee Concurrent,

WWAH

HomeKit R9 HomeKit R10 HomeKit R14 HomeKit R15

OpenThreadv1.0.0

CHIP Initial SDK and Demos

ADK Native Support

Page 12: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 12

Multi-Mode Support

Pillar #4: Innovation

Since day one, Telink has led the charge on IoT connectivity technology innovation. Depending on a client’s product needs, Telink’s multi-mode hardware can be configured with different types of firmware during the software preprogramming and manufacturing process, including SIG Mesh, Telink Mesh, Zigbee, HomeKit, or Thread. Telink’s chips can also be used to produce the following three types of multi-mode devices:

Dual-boot mode:

Both types of firmware are burned at different sections for Flash during manufacturing (e.g. SIG Mesh and Zigbee)

Boot settings determine which image to boot from, and the device can switch to the other protocol after reboot

External triggers such as special key combinations can be used to initiate reboot

Dual-pair mode:

Devices are shipped from the factory with support for both protocols in unified firmware (e.g. BLE and Zigbee)

When powered up, the device automatically searches for either protocol to pair with

Once paired, the device works in the paired mode until it is factory reset

Concurrent mode:

Devices are shipped with unified firmware

When powered up, devices can pair with a BLE device and can also join another network (e.g. Zigbee)

Devices can maintain BLE connection and perform other tasks at the same time*

Notes:*see Appendix III for supported concurrent modes

Page 13: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 13

Telink supports innovative application cases like positioning via Mesh

Positioning beacon interleaved with Mesh traffic

AoA/AoD packets interleaving with Mesh traffic

The next generation of Telink ICs will also feature High Accuracy Distance Measurement

A Smarter Lighting System

Telink partners with industry leaders to provide solutions featuring voice control and interaction

Telink can provide customized SDKs to those qualified clients, enable products to connect to the ecosystems

Major IoT ecosystems includes Amazon, Google, Alibaba, Mi, etc

Telink also can provide SIG Mesh + Local Keyword Spotting and Voice Command solution featuring low latency control

Telink partners with industry leaders to provide energy harvesting solutions for sensors and low-power devices within a Mesh network

Prototype is ready for early customer evaluation

Reference design is also available

Pillar #4: Innovation

Page 14: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 14

Incorporate the Local Voice Control Algorithm to Deliver Better User Experience

Pillar #4: Innovation

Voice control the smart lighting/home system via cloud is the most popular way at present. However, there are a few shortcomings such as relatively long delay and complicated voice commands.

As a supplementary solution, local voice control can simplify the way of voice control and improve user experience.

On Telink’s latest B91 platform, aka the TLSR9 Series, the SIG Mesh SDK incorporates keyword spotting andcommand recognition algorithm.

One Keyword + 8 ~ 20 command words: standard reference provided, customized keyword and command word can be trained with NRE cost

No extra hardware needed

Works with single mic, extensible to 2 mics with noise reduction

Features quick response to voice commands and low latency, especially suitable for devices with simple control

Page 15: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 15

Add Location Services to the Smart Lighting System

Pillar #4: Innovation

For years, location services solutions have played an important role in driving efficiencies for a range of global facilities, tracking key assets and staff for manufacturers, hospitals, and warehouses.

Location services also supported new proximity marketing tools for retailers and are being used to enhance security in commercial and industrial environments.

The ready smart lighting system is very suitable for integrating location services

Location Services offers following exciting features:

Asset Management

Personnel Tracking

Access Control

Shopping Mall Interior Navigation

Proximity Marketing

Car Finding

Page 16: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 16

To Get Started: Mesh Starter KitTelink offers ready-to-use Mesh demo kits for immediate evaluation:

TLSR8258F512ET48/TLSR8258F512ET32

Generic Development Board

Multiple USB dongles for emulating mesh nodes or gateways

Remote control PCBA for emulating remote controller and wall switch and for demonstrating group controls

FCC certification

Contact Telink sales or reps for ordering information

Reference Design is also available on Telink Wiki site

Page 17: Telink Semiconductor Smart Lighting Solutions

Telink Confidential 17

WE BUILD CHIPS FOR A SMARTER IOT

Get in touch:

Email: [email protected]

Website: www.telink-semi.com