trak microwave catalog preface

コーンズドッドウェル株式会社第二営業本部　デバイス営業部東京:03-5774-9978大阪:06-6532-1012E-mail:[email protected]:http://www.cornes-dodwell.co.jp/

-Table of Contents

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Product Type Description Model Page # Company Preamble 1 - 4 Comb Generators Preamble 5-6 Comb Generators Catalog, Passive & Active, 100,250,500,1000 MHz COM 20-000 Series 7-9 Comb Generators S-Level Comb Generators, 0.1-4.75 GHz COM072 10 Comb Generators Comb Generator, 0.7-18 GHz COM073 11 Control Devices Preamble 12 Control Devices Switch Filter, 10-20 GHz SWF001 13 Control Devices Five Channel Switched Filter Assembly SWF002 14 Multi-Function Assemblies Preamble 15 Multi-Function Assemblies Multi-Mode Dual Channel Converter Assembly, 6-6.5 GHz MFC114 16 Multi-Function Assemblies X-Band Down Converter Assembly, 10 GHz MFC115 17 Multi-Function Assemblies SHF Band Up and Down Converter Assembly, 7.9-8.4 GHz MFC119 18 Multi-Function Assemblies Upconverter-Modulator, 16.5 GHz MFC131 19 Multi-Function Assemblies Downconverter-Demodulator, 16.5 GHz MFC132 20 Multi-Function Assemblies Multi-Output PLCO Assembly, 5-160 MHz MFS023 21 Multi-Function Assemblies Multi-Output Reference Oscillator Assembly, .125-2 GHz MFS025 22 Multi-Function Assemblies S-Level Beacon Source Assembly, 4 GHz MFS027 23 Multi-Function Assemblies Comb Source Assembly, 1.8-5.4 GHz MFS074 24 Multi-Function Assemblies Tunable Up-Converter Assembly, 300-2900 MHz MFS075 25 Multi-Function Assemblies Multi-Output COHO Assembly, 7.9-8.4 GHz MFS098 26 Multi-Function Assemblies Seven Output Local Oscillator Assembly, 1.65-2.9 GHz MFS116 27 Multi-Function Assemblies Dual Crystal Based Source Assembly, 1020 & 5100 MHz MFS127 28 Multi-Function Assemblies Multi-Output COHO Assembly, 0.1, 0.15, 1.4, 14.75-15.25 GHz MFS129 29 Multi-Function Assemblies ATR Package, .65-.95 GHz MFS130 30 Multi-Function Assemblies S-Level Multiplied OCXO Assembly, 375 & 3000 MHz MFS133 31 Multi-Function Assemblies Microwave Altimeter Assembly, C-Band MFX128 32 Multipliers Preamble 33-34 Multipliers S-Level SMT Multipliers, 250,300,312.5 MHz MUL056 35 Multipliers SMT X5 Multiplier, 5.1 GHz MUL057 36 Multipliers X 11 Frequency Multiplier, 10.56 GHz MUL058 37 Multipliers X7 Multiplier, 10 GHz MUL059 38 Multipliers X7 Multiplier, 12.18 GHz MUL061 39 Multipliers X80 Multiplier, 16 GHz MUL062 40 Multipliers X2 Multiplier, 100 to 500 MHz MUL063 41 Oscillators Preamble 42-45 Oscillators Catalog, AT-Cut Crystal Oscillators OSC 10-000 & 10-100 Series 46-47 Oscillators Catalog, Miniature AT-Cut Crystal Oscillators OSC 10-001 & 10-101 Series 48-49 Oscillators Catalog, SC-Cut Ovenized Crystal Oscillators OSC 10-400 & 10-450 Series 50-51 Oscillators Catalog, CRO’s and DRO’s OSC 10-500 & 10-600 Series 52-53 Oscillators Catalog, Phase Locked CRO’s and DRO’s OSC 10-700 & 10-750 Series 54-55 Oscillators High Stability OCXO, 100 MHz OSC020 56 Oscillators Vibration Isolated XO, 125 MHz OSC021 57 Oscillators Miniature VCXO, 150 MHz OSC022 58 Oscillators S-Level Beacon Transmitter, 4 GHz OSC027 59 Oscillators S-Level OCXO, 10.3 GHz OSC029 60 Oscillators Crystal Oscillator, 16 GHz OSC030 61

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Product Type Description Model Page # Oscillators Space Qualified PLO Family, 2,10,12,14 GHz OSC036 62 Oscillators Low Noise Phase Locked DRO, 6.6 GHz OSC037 63 Oscillators Hybrid PLO, 12 GHz OSC038 64 Oscillators Miniature PLDRO, 5.2 GHz OSC039 65 Oscillators Voltage Tuned DRO, 26.5 GHz OSC040 66 Oscillators Ultra Low Noise Crystal Oscillators, 100 MHz OSC044 67 Oscillators Miniature Oscillator, 1 GHz OSC045 68 Synthesizers Preamble 69-72 Synthesizers Application Note: Ping-Pong APN102 73-75 Synthesizers Application Note: Specifying Synthesizers APN104 76-81 Synthesizers Catalog, Indirect Synthesizers 0.4-4.95 GHz SYN 60-000 Series 82-83 Synthesizers Fast Indirect Frequency Synthesizer, 0.55-1.85 GHz SYN085 84 Synthesizers Fast Indirect Synthesizer, 0.6-1 GHz SYN086 85 Synthesizers Minature Indirect Synthesizer, 0.725-1.275 GHz SYN087 86 Synthesizers Indirect Synthesizer, 1-2.5 GHz SYN089 87 Synthesizers Dual Indirect Synthesizer "Ping-Pong", 1.5-1.8 GHz SYN090 88 Synthesizers Small Step Indirect Synthesizer, 1.6-2.7 GHz SYN091 89 Synthesizers Modulated Synthesizer, 2.9-3.1 GHz SYN093 90 Synthesizers Direct Synthesizer, 3.25-4.75 GHz SYN094 91 Synthesizers Direct Synthesizer, 7-9 GHz SYN096 92 Synthesizers X to Ku Band Synthesizer "In-Bands", 8-15 GHz SYN099 93 Synthesizers Wideband Frequency Synthesizer, 10-20 GHz SYN101 94 Synthesizers Multi-Output STALO Synthesizer, X-Band SYN110 95 Synthesizers Ultra Wideband Synthesizers 2-18 GHz SYN111 96 Synthesizers Wideband YIG Synthesizers, 5-10 GHz SYN112 97 Synthesizers Dual Module Synthesizers, 9.5-10.9 GHz SYN145 98 Synthesizers High Speed Direct Synthesizer, 9.25-19 GHz SYN146 99 Synthesizers Dual Output Synthesizer, 9-10 GHz SYN147 100 Synthesizers Quad Frequency Synthesizer, .65-.95 GHz SYN148 101

0904

This catalog has been prepared to make it easy for theprofessional user to find information about our various products.Wherever possible, we have included test data, performancecurves, mechanical drawings, color photographs and compre-hensive specifications for each product. More detailed technicaldata is available upon request. The catalog is organized byproduct type, featuring both standard and custom models.

Standard Products are specific models that are offered for saleexactly as specified in the catalog. Many of our "standard"models have been designed for specific customer applicationsand may perform outside thespecified limits. Custom prod-ucts are models that aredesigned to meet a specificsystem requirement. They areincluded to demonstrate gen-eral capability and productheritage, recognizing thatsome users may have theneed for similar components.

TRAK Microwave offers avariety of product literature to meet your specific needs. Customcatalogs and brochures targeted to your specific marketapplications may be ordered from TRAK Microwave by calling813-901-7200 or 888-283-8444, fax 813-901-7491, or email us [email protected].

All of the product information included in this catalog may also beviewed on our web site at www.trak.com. Our web site offers themost current product data, product type search options, datasheets (in pdf format), product news, application notes, atechnical terms dictionary, and contact information for the TRAKrepresentative in your area.

Company OverviewTRAK Microwave, a Smiths Group Company, is a world classsupplier of high reliability microwave and RF components,subsystems, and precise time and frequency systems. For morethan forty years, TRAK has been a major supplier of standard andcustom designed products for the world's most demandingapplications and environments. TRAK supplies worldwidemanufacturers of defense electronic products, satellites, naviga-tion systems and commercial communication systems. We have astrong and broad product base, customer base, and programheritage, as a result, we are able to build and maintain productquality and excellence.

The company is headquartered in Tampa, Florida, USA, on tenacres of land adjacent to Tampa International Airport, andoperates within a newly renovated 125,000 square footmanufacturing facility. In addition, TRAK has a design and man-ufacturing facility located in Dundee, Scotland, United Kingdom.TRAK has partnerships with manufacturers in Asia and thePhilippians, which provide high volume quality products whileinsuring cost efficiencies.

Our engineering experts combine the most advanced designtools and manufacturing techniques to ensure high qualityproducts with on-time deliveries. TRAK Microwave's philosophysupports consistent control of the product development process,which guarantees excellent performance specifications, costefficiencies, and timely deliveries to meet the critical demands ofour customers.

TRAK is specifically structured to provide customers with closetechnical support, fast product development and prototyping.Our operations capacity enables the efficient manufacture anddelivery of medium to high volume products and our philosophy

provides a consistent andcontrolled evolution ofapplied RF technology fromwhich all of our customersbenefit.

TRAK is a financially strongcompany whose philosophyis to fully understand the cus-tomer's requirements withtotal commitment to meet orexceed them. We accomplish

your goals by drawing on our extensive in-house capabilities andexperience. As each product line has access to all in-houseresources, TRAK is uniquely positioned to offer an extraordinaryvariety of engineering services and field support.

Product ApplicationsTRAK Microwave defense products are found in airborneelectronic warfare equipment, radar, communications equipment,and missile applications. Our commercial products are used inpoint-to-point radio, wireless base stations, private radio systems,collision avoidance systems, distance measuring equipment, andairborne weather radar. Space applications include for commu-nication, television broadcast, satellite payloads, meteorological,earth resources, and intelligence gathering satellites. These arethe primary applications of our products, however our standardand custom product portfolio is very broad and may be used in amyriad of high-tech electronic applications.

Subsystems andIntegrated AssembliesAnother of TRAK's longstand-ing areas of expertise centerson microwave sources andrelated products that providecost effective solutions fordefense, space and commer-cial applications. Major sub-systems currently producedinclude oscillators, multipli-ers, comb generators, syn-thesizers, and multi-function assemblies, such as frequency con-verters. We produce various types of microwave subsystems aswell as many of the components for such assemblies.

TRAK MicrowaveE-mail: [email protected] www.trak.com

4726 Eisenhower Blvd Dunsinane AvenueTampa, Florida 33634-6391 USA Dundee, DD2 3QF Scotland

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TRAK MICROWAVE Catalog Preface

This vertical integration benefitsour customers in size, cost anddelivery. TRAK also offersmicrowave "build to print and test"capability. Our "technical forte"centers on microwave sources andrelated products that provide costeffective product solutions tomilitary, space, and commercialapplications worldwide.

Filters and Delay LinesTRAK offers full capabilities of design, development and manufac-ture of quality custom super linear filters, cavity coupled resonatordiplexers, isolated signal combiners, directional couplers andtransmit redundancy systems. Delay Line products are primarilyfor multi-carrier power amplifier applications. TRAK’s integratedpassive assemblies integrate the following functions into a singlepackage:

♦ High Isolation Circulators ♦ VSWR Monitors♦ High Directivity Couplers ♦ Alarm Circuits

♦ High Power LoadsFerrites TRAK is renowned for its expertise in ferrite isolatordesign and is the world's largest supplier of ferriteproducts. Our ferrite product line includes isolatorsand circulators ranging from 130 MHz to >60 GHz.Each year we provide an increasing number ofdesigns for major commercial and defense systemsmanufacturers throughout the world. Ourcomprehensive line of high performance ferriteproducts may be packaged in coaxial, drop-in,surface mount, miniature, waveguide or microstripconfigurations, or integrated with other compo-nents.

RF and Signal Processing ComponentsTRAK designs and manufactures RF signal processing componentsfor medium to high volume applications that are used in wirelessinfrastructure, space and defense systems. Our signal processingcomponents include mixers, power splitters, couplers, hybrids, IQmodulators and demodulators, attenuators, phase shifters, andwaveguide switches. Our supercomponent technology includesthe combination of components into one device, providing effi-ciencies in cost, testing, and mechanical footprint. TRAK offershigher levels of component integration to reduce your overallproduct costs. Most products are available fully qualified to MILor S-level specifications.

Time and Frequency SystemsTRAK timing systems are used by government and commercialorganizations throughout the world. Some of the timing prod-ucts provide signals to time or initiate events by extracting timeinformation from the GPS (Global Positioning Systems) satellites.Our timing products are also used to synchronize communicationcarrier's signals between wireless base station sites.

Electrical DesignAll RF parameters, such as phase noise, isolation, and intermodu-lation are routinely tested on automated test stations within ourfacility, allowing quick analysis of large amounts of data. Weplace a heavy emphasis on packaging our components inindustry standard outlines but maintain the capability to providecustom packaging. Many of our products are simulated usingcommercially available or TRAK developed state-of-the-art testequipment hardware and software.

Electrical TestingIt is TRAK's objective to provide products that meet or exceed thecustomer specifications for electrical performance over the fullrange of environmental conditions. Electrical performance andrepeatability are demonstrated through design qualifications test-ing, LRIP (low rate initial production), and 100% electrical test ofcritical parameters in production. TRAK uses automated ormanual testing in accordance with standardized or custom writ-ten test procedures and software. Most equipment is calibratedin accordance with MIL-STD-45662A, ANSI/NCSL, Z540-1-1994,traceable to NIST, using our in-house calibration lab and qualified

outside calibration laboratories traceable to NIST.All equipment is calibrated in accordance with MILand ISO standards.

Mechanical DesignTRAK uses the latest CAD design and mechanicalfinite element analysis to ensure that structures arerobust. All package designs undergo rigorous test-ing to guarantee they are able to meet the envi-ronmental standards required of the industry, aswell as the processing environment the device willsee in the customer's assembly process. We alsospecialize in custom configurations where size,weight, thermal, and vibration considerations arecrucial. All of our products are designed using thelatest CAD software available.

ManufacturingOur assembly techniques have been developed and perfectedover many years and are continually monitored, revised, andupgraded to remain current with application demands. Some ofour components are built by hand, utilizing experienced assem-blers. While some of our products are assembled by experiencedassemblers, others products are produced using automatic pick-and-place assembly. TRAK uses the most current testing methodsand equipment available in the industry.

We design and fabricate our ownmanufacturing fixtures for use inassembly and test. Each productis tested and visually inspected toensure it was manufactured inaccordance with TRAK standards.The manufacturing process hasan employee involved SPC pro-gram where records are collected



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and analyzed on a regular basis to look for trends or variations inprocesses. This provides valuable feedback to the manufacturingstaff for improving process improvement plans. Our versatiledesign software allows custom units to be produced efficientlyand rapidly with a high confidence factor.

TRAK's internal design process and robotic manufacturing capa-bilities insure the most robust, flexible, cost-efficient, and high per-formance products are manufactured for optimum solutions.

Electrical Design♦ ANSOFT Serenade ® & HFSS♦ Libra ® Touchstone♦ HSS♦ Is-spice♦ In-house Software

Supporting♦ Machine shop with NC and

CNC mills, machining centers,wire EDM

♦ Sheet metal shop

Automated Assembly♦ Pick & Place Component♦ In-Line Solder Reflow♦ Automated Cleaners♦ Solder Deposition via

screenprinting♦ Component Placement

(Chips/Fine Pitch AFP/CGA)

Automated Test♦ Multi-parameter Test

Stations for VCO's♦ Phase noise Test Sets♦ Noise Figure & 1 dB

Compression♦ Custom Test-Sets♦ Automated IP3 Test-Sets♦ High Power Test Sets

StaffTRAK is committed to continuous training for all levels asassembly, technical, material planning and management staff.With a high percentage of employees with 10, 20, or more yearsof continuous service, TRAK offers recognizable stability to itscustomers - an added confidence factor on programs that spanover several years. We provide onsite continuous training for alllevels as assembly, technical, material planning, and managementstaff.

Development PlansTRAK constantly surveys theindustry for innovativeresearch and enhancedcomponent performance. Asa result, we continue toprovide products based onthe latest technology andmeet the evolving demandsof the system design. Aformal Research and Development budgeting process allocatesfunds for new technologies and product development. Customerinputs and market forecasts drive the technology developmentplan. Our annual budgets include funds for new technologiesand improved products.

Configuration ManagementTRAK maintains documentation controls consistent with industrystandards, or as required on individual contract basis. TRAKstandards include procedures for Engineering Change Notices,change to customer-controlled drawings, and generalconfiguration management. Customer review and approval ofmodifications can be supported, but may extend deliveries.

Reliability ProgramTRAK is ISO9001:2000 and AS9100 registered and generalreliability programs meet the requirements of MIL-STD-785. TRAKengineers review design approaches during initial developmentof products to provide early detection and corrections of issuesaffecting product reliability. If required, TRAK has complete in-house capability to rigorously test designs for, among manyothers, resistance to vibration, thermal cycling, aging, andhermeticity. Additional engineering services are available toprovide analytical reliability predictions when required.



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Environmental Testingand Screening♦ Two vibration machines

with slip table-complete sine and random testing

♦ Shock testers♦ Thermal shock chambers♦ Temperature test

chambers♦ Humidity chamber♦ Salt Fog♦ Burn-in racks♦ Cold plate testing♦ Acceleration♦ X-Ray inspection

equipment♦ Thermal Vacuum chamber

Mechanical Design♦ Thermal Finite Element

Analysis♦ Vibration and Modal Finite

Element Analysis♦ Static and Dynamic Stress

Finite Element Analysis♦ Modular Packaging♦ Weight Reduction♦ AutoCAD ®♦ ORCAD® Layout for PCB's♦ ORCAD® Schematic

CaptureHybrid MicroelectronicsFacility♦ Support labs: etching,

marking, and substratecutting and calibration labs

♦ Class 10,000 Clean Rooms♦ Class 100,000 Test Areas♦ Die Attach♦ Ball and Wedge Bonding:

.7 to 25 mil dia. wire1.5 to 80 mil ribbon

♦ Parallel gap welding

Special Process♦ Laser & Seam Welding♦ Fine & Gross Leak Tests♦ Housing Pinning♦ Laser Labeling♦ X-Ray Photography♦ Soldering Processes to J-STD-001♦ Die Attachment & Wire Bonding

Quality AssuranceTRAK's Quality Assurance System is based on ISO-9001 and meetsthe requirements of MIL-Q-9858A and MIL-I-45208A. TRAKfacilities are registered to ISO9001:2000 and AS9100 andcontinue to successfully passsemiannual audits. QualityAssurance operations addressincoming inspection, in-process and final inspections,including data analysis andcorrective action programs.In-process inspectors arestationed with each productline to monitor the manufacturing processes and ensure highquality products. Quality control is actively involved with manu-facturing operation to monitor SPC trends and determine effectivecorrective actions, facilitate material review boards, engineeringchange boards, and new product release boards. QualityAssurance provides the Failure Analysis and trends tracking forcustomer returns.

Quality PhilosophyTRAK Microwave Corporationmanufactures products thatconform to customer require-ments and expectations.Conformance to a require-ment is a direct responsibilityof all TRAK employees. TRAKemployees shall take immedi-ate and appropriate correc-tive action if any non-confor-mance condition is observed.

Ordering and QuestionsTRAK Microwave Corporation4726 Eisenhower Blvd.Tampa, FL USA 33634-6931Phone: +1 813-901-7200Fax: +1 813-901-7491Email: [email protected] Code Number: 12855

Shipping InstructionsShipments may be made by either air or surface carriers. If spe-cific shipping instructions do not accompany the order, TRAK willspecify the carrier to be used. Shipment terms will normally beagreed at the time of quotation or order. The default is F.O.B.Tampa, Florida, USA or Dundee, Scotland, United Kingdom,unless otherwise quoted prior to shipment.

Terms and ConditionsNet 30 days from date of invoice unless by prior agreement. Ifcredit has not been established with TRAK Microwave, terms willbe negotiated at the time of order. TRAK accepts VISA andMasterCard credit cards. Specifications published in this catalogare subject to change with notice.

Taxes The prices applicable to products ordered do not include anyallowance for US federal, state, or local or any other sales tax,which may apply. The amounts of such taxes shall be paid by thebuyer.

Inspection Buyer has the right and shall be given the opportunity to inspectthe goods at TRAK's facilities prior to shipping for a nominal fee.The inspection shall be conducted as to not interfere with TRAK'Snormal operations. Such inspection must be stated in thePurchase Order and have been previously quoted by TRAK.

Warranty/Returned MaterialTRAK Microwave Corporation warrants each product delivered tobe free of defects in materials and workmanship at the time ofdelivery, and to meet all published or agreed specifications.TRAK'S obligations under this warranty shall be limited to repair orreplacement, at TRAK's option, of any material found to be defec-tive. The warranty is in effect for a period of one year (unless oth-erwise noted) from the date of shipment. TRAK shall have no lia-bility for incidental or consequential damages resulting fromimproper use, negligence, or accident. Any complete or partialdisassembly of the device will void this warranty. Returned mate-rial must be accompanied with an RMA (Return MaterialAuthorization) number issued by TRAK Microwave. A fee to coverthe analysis costs on the returned components under this war-ranty may be changed to the buyer if, when after examination byTRAK, the returned products are found to be specification compli-ant or have failed for reasons not covered under this Warranty.Buyer shall not in any event be entitled to, and TRAK shall not beliable for indirect, special incidental, or consequential damages ofany nature, including and not limited to loss of profit, promotion-al or manufacturing expenses, overhead, injury to reputation orloss of customers. Buyer's recovery from TRAK for any claim shallnot exceed buyer's purchase price for the products, irrespective ofthe nature of the claim, whether in contract, tort, warranty, orotherwise. This warranty is exclusive and in lieu of other war-ranties expressed or implied.

Cancellation Buyer may cancel orders by written notification, provided that theagreed price of all products which are completed and allocated tothis order at the time of cancellation are paid to TRAK. Buyer willalso pay TRAK for all costs direct or indirect, which have beenincurred by TRAK for products that have not been completelymanufactured the time of cancellation. Whenever possible, TRAKwill make all efforts to divert completed parts or work in progressfrom cancelled orders to other orders. Orders for custom partsare non-cancelable.



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TRAK Microwave Ltd.Dunsinane AvenueDundee, Scotland UK DD2 3QFPhone: +44-1382-427200Fax: +44-1382-833599Email: [email protected]

© 2004 TRAK Microwave Corporation

Comb GeneratorsProduct Overview

TRAK MicrowaveE-mail: [email protected] � www.trak.com


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©TRAK Microwave Corp. 10/03

Specifications subject to change without notice.

TRAK offers standard comb generators and custom-designed comb source products to 20 GHz. Thesemodels convert the power of a single tone to a harmonicfrequency spectrum (n x fin), where the output tones arecoherent and evenly spaced through 20 GHz withdecreasing amplitude. (See Figure 1.) The driving sourcecan be external or internal.

Our comb product designs are used as stand-alonedevices and as “building blocks” for more complexassemblies. In fact, many comb products have been fieldtested and qualified for operation in high reliabilitycommercial, military or space environments.Consequently, if you need to extend your temperaturerange, or are moving from prototype to production units,it’s possible we can meet your request simply by usingdifferent parts selection criteria or including additionalend-item screening. All product grades are manufacturedin the same TRAK facility under one Quality AssuranceProgram.

Several of the comb products TRAK has manufacturedare detailed featured as custom specifications. Morecomplex versions are shown under the SynthesizersSection.

Use our Comb Product Specifier when you are readyto define a specific frequency plan, and be sure toinclude your unique requirements. Our goal is toprovide you with an integrated product that demonstratessuperior performance and improved reliability whileminimizing size, interfaces, power consumption and cost.

Internal view of Comb Generators

� 0.005 - 18 GHz Standard & Custom Products

� Stand-Alone Comb Generator Functions

� Comb Generators w/ Integrated Oscillators

� Low Residual Noise Designs

� Self-Biasing

� Surface Mount or Small Custom Packages

� Low Power Consumption

� Wide Operating Temperatures

� Integrated Functions -OscillatorsFiltersSwitchesAmplifiers

� Broadband Signal Calibration, B.I.T.

� Tone Generation for Phase Locking

� Frequency Translation

Typical Applications

Product Features

Comb GeneratorsProduct Overview



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Technical Considerations

Theory of Operation: The fundamental module consistsof a step recovery diode (SRD) with associatedmatching elements and a DC self-biasing network. TheSRD functions as a charge controlled switch where aforward bias stores the charge and a reverse biasdepletes this charge. When fully depleted, the SRDceases to conduct current.

It is this rapid depletion of charge that results in the characteristic voltage impulse with a pulsewidth much less than the input tone period. When driven at 250 to500 milliwatts, the impulse generated has a pulsewidth of approximately 120 picoseconds with an amplitude of 5 to 10 volts peak.

500 MHz Comb Generator

Lev

el (

dB

m)

+10

0

-10

-20

-300 2 4 6 8 10 12 14 16 18

Frequency (GHz)

Figure 1. Spectrum Graph

Figure 2. Time Domain Response Graph

Input Frequency: Any drive frequencies fromapproximately 5 MHz to 2 GHz can be accommodated;bandwidths up to 3% are acceptable.

Amplification: In broadband (full spectrum) applications,the output tones cannot be easily or practically amplifiedbecause of the high peak output voltage. (The timedomain voltage spike is equivalent to the sum of RFpower of all the present combs. See Figure 2.) In caseswhere the comb generator is combined with an outputresonant network, however, much of the spectrum energyis recombined into a single tone at a higher frequency;here, the filtered tones may be amplified to desired levels.

TRAK has units designed with and without driveramplifiers. Units with driver amplifiers are typicallydesigned using low flicker noise BJT power devices foroptimum phase noise performance. Furthermore, allTRAK standard units incorporate self-biasing networks toprovide predictable stable performance.

Spurious Enhancement: It is important to keep the inputsignal as clean as possible because spurious signalslocated in the input passband are increased by 20 log n,where n is the desired multiplication factor. Input filteringcan be provided to reduce spurious signals located out-side the passband, if required.

Phase Noise Degradation: Phase noise is increased bythe frequency multiplication process. Theoretically, thisenhancement is 20 log n, where n is the multiplicationfactor, although the circuitry within the comb generatorgenerally adds 3 dB more noise. Rather than specify theoutput phase noise of a comb generator, TRAK usuallyspecifies the maximum enhancement to the input phasenoise, which is typically 20 log n + 3 dB.

Residual Noise: Comb generators have residual phasenoise, which usually is much lower than the phase noiseof the driving signal source. At offsets very close to thecarrier, this is generally the case; however, at frequenciesfarther from the carrier, the residual noise can affect theoverall noise performance.

Comb GeneratorsCatalog, Passive & Active, 100, 250, 500, 1000 MHz

Model: COM 20-000 Series



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Electrical Specifications

Input Drive Power (max): 1 watt (passive)0.2 watt (active)

Input VSWR: 2:1, maxOutput Power: See Figures /Tables

Environmental Specifications

Standard Operating Temperature (Baseplate): - 54 to + 85 °C guaranteed

+ 105 °C, max

Mechanical Specifications

Drop-In or Coaxial: See Packages

Figure 1


100 MHz typ. 100 MHz spec.

Lev

el (

dB

m)

+50

-5-10-15-20-25-30-35-40

0 2 4 6 8 10 12 14 16 18Frequency (GHz)

Figure 2



Lev

el (

dB

m)

+10

0

-10

-20

-300 2 4 6 8 10 12 14 16 18

Frequency (GHz)

Figure 3

5 00 MHz Comb Generator


Lev

el (

dB

m)

+10

0

-10

-20

-300 2 4 6 8 10 12 14 16 18

Frequency (GHz)

Figure 4



Lev

el (

dB

m)

+ 10

0

-10

-20

-300 2 4 6 8 10 12 14 16 18

Frequency (GHz)

� Small SMT and Connectorized Packages

� Standard Models Accept Input Frequencies

Between 100 and 1000 MHz

� Internal SRD Bias Circuits

� Custom Designs Available

Features:

Model Number for Drop-In Models (Package C) 20-000-9100-000 20-000-9101-000 20-000-9102-000 20-000-9103-000

Model Number for Coaxial Models (Package D) 20-000-9110-000 20-000-9111-000 20-000-9112-000 20-000-9113-000

Input Frequency (MHz) 100 250 500 1000

Input Power at 25 °C (dBm, minimum) + 7 + 7 + 12 + 17

Output Power (dBm, minimum) See Figure 1 See Figure 2 See Figure 3 See Figure 4

Up to 4 GHz - 20 - 10 - 5 0

4 - 8 GHz - 20 - 10 - 5 0

8 - 12 GHz - 30 - 20 - 15 - 10

12 - 18 GHz - 40 - 30 - 25 - 20

Power Variation / Temperature (dB, typical) ± 2.5 ± 2.5 ± 2.5 ± 2.5

DC Current, Typical (mA) for V = + 9 V ± 3 % 120 120 120 120

Thermal θ J-C (°C / watt) 90 90 90 90

Model Number for Drop-In Models (Package A) 20-000-9000-000 20-000-9001-000 20-000-9002-000 20-000-9003-000

Model Number for Coaxial Models (Package B) 20-000-9010-000 20-000-9011-000 20-000-9012-000 20-000-9013-000

Input Frequency (MHz) 100 250 500 1000

Input Power at + 25 °C (dBm, minimum) + 27 + 27 + 27 + 27

Output Power (dBm, minimum) See Figure 1 See Figure 2 See Figure 3 See Figure 4

Up to 4 GHz - 20 - 10 - 5 0

4 to 8 GHz - 20 - 10 - 5 0

8 - 12 GHz - 30 - 20 - 15 - 10

12 - 18 GHz - 40 - 30 - 25 - 20

Power Variation / Temperature (dB, typical) ± 2 ± 2 ± 2 ± 2

Thermal θJ-C ( °C / watt ) 70 70 70 70

TABLE I – PASSIVE MODELS





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TABLE II – LOW PHASE NOISE, LOW POWER ACTIVE MODELS (WITH DRIVER AMPLIFIERS)

Note: Minimum drive level required to obtain output is + 24 dBm. However, specifications are not guaranteed at this level.

Note: The input power level may be 2 dB lower than indicated above; however the output power level is not guaranteed at the reduced drive level.

Ordering Information: Specify the required model number.





Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



2x .125

3x .063

.300 ±.005

.144 maxDOT ON INPUT

+9V.015 ±.002

PIN DIA.

.375 ±.005

.750 ±.005 * RF Pin Length = .060"

SMA STDGPO OPT

.570 ±.01

.110 ±.012 PLC

OUT IN

+9V

.180 ±.01

.750 ±.02

.650 ±.01

.400 ±.20

.480 ±.20

Package C

SMA STDGPO OPT

.350 ±.01

.110 ±.012PLC

OUT IN

.180 ±0.01

.480

.530 ±.02

.650 ±.01

.400 ±.20

.25 OUT

.06

DOT ON INPUT

.53

IN

.144 MAX

.063

.123

2X .015±.003

* RF Pin Length = .060"

Package A

Package DPackage B

Comb GeneratorsS - Level, 0.1 - 4.75 GHz

Model: COM072



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Electrical SpecificationsInput Unit A Unit B Unit COperating Freq.(MHz):31.25 ±1% 100 ±1% 250 ±1%Power Level:(typical) CMOS +23 dBm +12 dBm

OutputOperating Frequency:

Lower Limit (MHz) 875 100 1500 Upper Limit (MHz) 1187.5 3000 4750

Power Level:(dBm, typical)-17 to -27 -20 to -25 -20 to -30

Power Variation: (Adjacent Combs)3 dB,max. 3 dB,max. 3 dB,max.

DC Power: (V) +12 ± 1.5% none +12±1.5%Current: (nominal) 80 mA none 80 mAPower Consumption: (nominal)

0.96 W none 0.96 W

* Performance may vary over the extended operatingtemperatures.

Environmental SpecificationsOperating Temp.: - 10 to + 71 °C, baseplate*Extended Operating Temp.: - 34 to + 95 °C, baseplateMaximum Reflow Temp.: + 230 °C for 20 secondsEnvironment: Space

Mechanical SpecificationsUnit A Unit B Unit C

Package Drawing: A B AWeight: (nominal) 0.15 oz 0.25 oz 0.15 oz

4.3 g 7.1 g 4.3 gConnectors: Pins Pins Pins

2XO .012±.002

.375

.3752X.050

2X.188

.200

2X.078

9X.030

10X.015

12X.100

.400±.008

4X.1004X.025R MAX

INDEX MARK

.040INDEX TAB

1

.800±.010

.004EXCLUDING LEADS

V

.140+.002 -.001

20X.050±.008 REF

900±.010 REF

.500±.010 REF

IN

OU

T

.005

Package A Package B

� Small SMT or Drop-In Packages

� Optimized for Maximum RF Power

� Active and Passive Designs

� Tape and Reel Compatible

� Good Phase Noise

� Withstand + 230 °C for Reflow

� Low DC Power Consumption

� Input Amplifier on Active Designs

Features:

Comb GeneratorsComb Generator, 0.70 - 18 GHz

Model: COM073



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Electrical SpecificationsInput (J1) Output (J2)

Operating Frequency: 100 MHz 0.70 - 18 GHzPower Level: (typical) + 12 dBm ± 1.5 dB + 5 to - 35 dBm

(See Plot)VSWR:(input & output) 1.5:1, typicalSSB Phase Noise: (dBc/Hz, typical) Note 1

Offset100 Hz - 130 - 110

1 kHz - 150 - 13010 kHz - 165 - 145

100 kHz - 165 - 145Output Spurious: Input Spurious Level + 20 log NDC Power: + 15 ± 0.4 V @ 120 mA, nominalPower Consumption: 1.8 W, nominal

Note 1: The output SSB phase noise is referenced to the provided inputlevels and an output frequency of 700 MHz.Sideband noise levels for other frequencies can be calculated as the sum of input levels, residual noise, and 20 log n enhancement where n is the ratio of output to input frequencies.

Environmental SpecificationsOperating Temperature: - 55 to + 85 °C, baseplateEnvironment: Ground and Airborne

Mechanical SpecificationsSize (excluding connectors): 1.09 x 0.9 x 0.23 inches

28 x 23 x 6 mmWeight: 3 oz (85 g), maximumRF Connectors: SMA (F) (removable)DC Connectors: Pins

� Small Size: < 0.23 cubic inches

� Removable Connectors

� Low Current: 120 mA, nominal

� Wide Operating Temperature: - 55 to + 85 °C

� Low Residual Noise

� Minimum DC (<2W)

� Bipolar Silicon Power Transistor

� Kovar Housing


Features:

+10

0

-10

-20

-30

-40

1 2 3 4 5 6 7 8

Typical OutputPower (dBm) vs. Frequency (GHz)

9 10 11 12 181716151413

.90

.22 MAX

1.09

.230 MAX

+15VGND4X O.093 THRU

SMACONNECTOR

Control DevicesProduct Overview



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599



TRAK Microwave offers a wide range ofsolid state microwave control devicesincluding switches, limiters, phase shiftersand attenuators.

Product TypesSwitches- Standard Offerings Include

SPST, SP2T, SP3T and SP4T. Higher

Order Designs Available.

Limiters- PIN and Schottky Based

Phase Shifters- Single and Multi-Bit Digital

Attenuators- Linear and Digitally Controlled

Integrated Assemblies

Switched Filters

Typical ApplicationsEW and ECM Systems

Radar Systems

Missile Systems

Communications Systems

Product FeaturesSolid State Based Using Silicon PINs,GaAs PINs or GaAs FET Devices.

Broad Bandwidth, to 20 GHz

Low Insertion Loss

High Isolation

Reflective and Non-Reflective Designs

Fast Switching Speed

Broad Range of Options for DC Operating

Voltages and Control Logic.

Hermetically Sealed Packages

High Reliability

Technical ConsiderationsThe key factors in determining the best designapproach for solid state control devices areoperating frequency, switching speed and RFpower. Together these requirements determinethe optimum circuit topology and semiconductor type(s). With these parametersidentified, control devices can be configured tomeet a wide range of insertion loss and isolation requirements.

Operating Frequency- Specify either band limits or maximum operating frequency and bandwidth. For certain band limited applications; better loss to isolation ratios can be attained.

RF Power- Specify expected operating power levels and absolute maximum requirements. Separately specify CW conditions and pulsed conditions. For pulsed conditions specify maximum pulse width and pulse repetition parameters.

Switching Speed- Specify maximum allowable switching time. Better switching ratios and power handling are available with slower switching

Control DevicesSwitch Filters, 10 - 20 GHz

Model: SWF001



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Operating Temperature: - 54 to + 85 °CEnvironment: Airborne


Size (excluding connectors):3.5 x 1.6 x 0.48 inches89 x 41 x 12 mm

Weight: 3 oz (85 g), nominalConnectors: Field Removable SMA

Features:

� Single Pole, Triple Throw

� Good Sideband Rejection: > 60 dBc

� Excellent Switching Speed: Fast as 20 nsec

� Low Profile


Band 1 Band 2 Band 3Freq. Passband:

10 - 12.6 GHz 12.6 - 16 GHz 16 - 20 GHz60 dB Rejection:

DC - 7 GHz DC - 8 GHz DC - 10 GHz15 - 26 GHz 19 - 26 GHz 24 - 26 GHz

Insertion Loss: 6 dB, typicalVSWR: 2:1, typicalDC Power: + 5 VDC @ 60 mA

-15 VDC @ 20 mA

S

P

3

TT

3

P

S

-5V +15V

CONTROL

+15V-5V

Control DevicesFive Channel Switched Filter Assembly, C-Band

Model: SWF002



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599



Features:Ultra Miniature, Low Profile Design

Less Than 10 dB Pass Band Insertion Loss

60 dB Typical Stop Band Rejection at ±500 MHz

Fast Switching Speed - Less Than 100 nSec.

Hermetically Sealed, Laser Welded

Full Military Temperature Range

MTBF Better Than 350,000 Hours


Frequency: C-BandPass Band Frequencies: Every 500 MHzPass Band Insertion Loss: 6-10 dBPass Band VSWR: 1.8:1, maxStop Band Rejection: 60 dBr at ±500 MHzBroad Band Rejection: 50 dBr to 10.5 GHzGroup Delay: 10 nSec, maxSwitching Speed: 100 nSec, maxControl: TTL CompatibleRF Power (operating): +15 dBm, maxDC Power: ±5 VDC @ +80/-30 mA

Mechanical SpecificationsSize: 2.29” x 1.40” x 0.265”Weight: 0.8 oz. max.RF Connectors: Hermetic SMP (full detent)DC Connectors: EMI Filtered Solder Pins

Environmental SpecificationsOperating Temperature: -54 to +85 °CEnvironment: Airborne

Quality Assurance ProvisionsClass H Hybrid equivalent

-5

C5

C4

C3

C2

C1

+5

GN

D

J1

J2

.075

.410

.075

.980

2X .040 - .045.265 MAX.

.637 7X .145

4X .080

8X .065 - .095

2X 1.970

2X .1602X .095

2X 1.210

8X .125

4X .255

4X .125

Ø.023±.004 DC/CONTROL PIN

Measured Filter Characteristics for Five Channel Switch Filter

Multi-Function AssembliesProduct Overview



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



TRAK specializes in the design and manufacture ofMulti-Function Assemblies (MFAs) for use in defense, spaceand commercial applications. MFAs offer distinct advantagesover multiple, interconnected, discrete components, includingimproved overall performance and reductions in size and cost.They are well-suited for applications where the most demanding electrical performance and mechanical constraintsare required. They can also be implemented as form, fit andfunction replacements to older discrete products.

To meet your precise requirements, TRAK’s products can beintegrated into a multitude of custom designs from DC to 40GHz, or even higher. While TRAK’s MFA expertise is heavilyrooted in our diverse line of oscillators, comb generators,multipliers, control and synthesizer products, it extends to complex frequency converters and recievers.

To meet your unique frequency plan, mechanical constraints,reliability considerations and environmental requirements, ourdedicated team of electrical, mechanical, production andquality engineers place heavy emphasis on computer analysisand optimization, special process control, environmentalscreening and automated testing. In addition, TRAK has manyyears of experience in handling special design requirements;such as low residual noise, thermal management, weightreduction and integrity under vibration, which can beincorporated into your design.

Product Types

� Oscillator/Multiplier Assemblies

� Control Based Assemblies

� Synthesizer Based Assemblies

� Frequency Converters

� Specialized Frequency Generators

� Receivers

Typical Applications� Communications Subsystems

� EW Subsystems

� Missile Subsystems

� Radar Subsystems

� ELINT Subsystems

Product Features� DC to 40 GHz Operating Frequencies

� Excellent Spectral Performance

� Small Custom Packages



� Vibration Isolation

� S-Level Product Capabilities

� Integrated Functions can include:OscillatorsMultipliersSwitchesSynthesizersMixersFiltersIsolators/CirculatorsAmplifiersLimitersAttenuators

Radar Altimeter

Multi-Function AssembliesMulti-Mode Dual Channel Converter Assembly, 6 - 6.5 GHz

Model: MFC114



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Minimum output power @ 1 dB compressionNote 2: The 970 MHz IF signal has two selectable bandwidths:

wideband (WB) and narrowband (NB).Note 3: Referenced to 0 dB attenuation

DUAL CHANNELIF

FREQUENCYCONVERTER

IF

IFRF + LO(DUPLEXED)

CALIBRATIONMODE SIGNAL

LOCALOSCILLATORASSEMBLY

D.C. FILTERREGULATION

ANDF.P.G.A. LOGIC

ASSEMBLY

DC

720 MHz

1080 MHz

5 MHz

6282 ± 200 MHzand 5312 MHz

6400-7420 MHz

VMEINTERFACE

SWITCH CONTROLS

971 MHz ± 200 MHz (WB)± 3.5 MHz (NB)

70 MHz ± 2 MHz

5 MHz40 MHz100 MHz900 MHz

ATTENUATION CONTROLS

B.I.T.


Operating Temperature: 0 to + 65 °C, baseplate


Size: Single 9U x 160 mm VME cardWeight: 5 lbs (2.3 kg), nominal

Features:

� Combines: MMIC Amplifiers and TransistorMultipliers

� Dual IF Outputs: 70 MHz and 970 MHz� L.O. Frequency Generation: Five Tones� Over 40 dB AGC Control� Built-In-Test Functions� Field Programmable� VME Bus Interface� Low Noise Design


Reference InputFrequency: 5 MHzPower Level: + 2.5 dBm ± 2 dBDiplexed InputsFrequency: RF 6.1 - 6.5 GHz

LO 5.1 GHzPower Level: (RF) - 40 dBm ± 25 dBCalibration Mode InputFrequency: 6.4 - 7.4 GHz Power Level: + 8.5 dBm ± 2.5 dBFirst IF OutputFrequency: 70 ± 2 MHzPower Level: Note 1 + 20 dBm, minimumIF Gain: 22 dB ± 1.5 dBHarmonics: - 20 dBc, maximumSpurious: - 50 dBc (in-band)Second IF OutputFrequency:Note 2 (WB) 970 ± 200 MHz

(NB) 970 ± 3.5 MHzPower Level: Note 1 + 20 dBm, minimumIF Gain: Note 3 42 ± 2 dBIF Gain Control: 0 to - 62 dB

(2 dB steps)Harmonics: - 20 dBc, maximumSpurious: - 50 dBc (in-band)Fixed LO OutputsFrequencies: 5 MHz 900 MHzPower Level: + 10 dBm ± 2 dBHarmonics: - 35 dBc - 60 dBcSpurious: - 80 dBc - 60 dBc

ECL Outputs Freq.: 40 MHz 100 MHz

General

Impedance: 50 ohmsLoad VSWR: 1.5:1Tuning Control: VME Bus InterfaceBITE Scheme: Fault Status (“1” = Fault)DC Power (nominal): + 12 V ± 5 % @ 1550 A

+ 5 V ± 5 % @ 250 mA- 12 V ± 5 % @ 235 mA

Power Consumption: 22.7 W, nominal



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Multi-Function AssembliesX - Band Down Converter Assembly, 10 GHz

Model: MFC115

Note 1: The IF output has two overlapping, selectable bands providing a multiplication factor of either 288 or 296.

Note 2: Referenced to an offset of 10 kHz

TTL

IF OUTPUT(20-280 MHz)

HARMONICCONVERTER

ASSY(X288 OR X296)

REF IN(35 MHz)

RF IN(10.1-10.3 GHz)


Operating Temperature: - 20 to + 70 °C, baseplateEnvironment: Missile


Size: (see outline) < 3.5 cubic inchesWeight: 10 oz (284 g), nominalConnectors:

Ref. Input: SMA (F)RF In, IF Out: Feedthru Terminals

Features:

� Combines: Diode Doublers, Comb Multipliers,MMIC Switches, Mixer, Amplifiers and Filters

� Low Residual Noise: - 120 dBc/Hz @ 10 kHz

� Miniature Size: < 3.5 cubic inches

� Low Power Dissipation: 6.75 W

� Low Spurious: - 80 dBc typical


RF InputFrequency: 10.1 to 10.3 GHzPower Level: 0 dBm ± 2 dBInput VSWR: 2.0:1, maximum

Reference InputFrequency: 35 MHzPower Level: + 6 dBm ± 1.5 dBInput VSWR: 1.7:1, maximumMultiplication Factor: X288 or X296

IF OutputFrequency: Note 1 20 - 280 MHzPower Level: + 1.5 dBm ± 3.5 dBOutput VSWR: 2.5:1, nominalHarmonics: - 25 dBc, typicalSpurious: - 80 dBc, typicalResidual Noise: Note 2 - 120 dBc/Hz

GeneralControl Interface: 1 bit TTL (X288 or X296)DC Power: + 15 ± 0.4 V @ 450 mA

(nominal) - 5 ± 0.5 V @ 0.10 mAPower Consumption: 6.75 W, nominal

Multi-Function AssembliesSHF Band Up and Down Converter Assembly, 7.9 - 8.4 GHz

Model: MFC119



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



UPCONVERTERASSEMBLY

INDIRECTSYNTHESIZER

DOWNCONVERTERASSEMBLY

10 MHzREFOSC

∆ = 1 MHz

∆ = 1 MHz

BIT

BIT

BIT

BIT

MANUALGAIN ADJUST

7.25-7.75 GHzSHF

70 MHzIF

20 dB

DC POWER± 5 VDC

+12 VDC

7.9-8.4 GHzSHF

10 MHzREFERENCE

70 MHzIF

CMOS CONTROLBIT OUTPUT

Environmental SpecificationsOperating Temperature: + 20 to + 100 °FEnvironment: Ship and GroundMechanical SpecificationsSize (nominal) 7.34 x 5 x 1.8 inches

186 x 127 x 46 mmWeight: 10.2 lbs (4.6 kg), nominalDC Connector: MIL-C-83513, MMC D, 51 PinRF Connectors: OSSP and SMA

Features:

� Combines: Oscillator, Synthesizer, Multipliers,BIT Detectors and AGC Loop

� Integrated Half-Duplex Subsystem (Agile)

� Rugged Contruction

� Low Phase Noise: - 97 dBc/Hz @ 50 kHzoffset

� Low DC Consumption: 10 watts

Electrical SpecificationsUPCONVERTERIF Input:

Frequency 70 ± 20 MHzPower Level - 25 dBm ± 2 dBVSWR 1.5:1, maximum

SHF Output:Frequency 7.9 - 8.4 GHzPower Level + 17.5 dBm ± 2 dB

(AGC internal)VSWR 1.5:1, typical3rd Order Int. + 25 dBm, minimumSpurious - 55 dBc, maximumSSB Phase Noise (dBc/Hz, typical):

Offset100 Hz - 55

1 kHz - 6710 kHz - 83

10 MHz - 127DOWNCONVERTERSHF Input:

Frequency 7.25 - 7.75 GHzPower Level - 100 dBm ± 20 dB,

dynamic rangeVSWR 1.5:1, maximumPhase Noise - 132 dBm/Hz nominal

IF Output:Frequency 70 ± 20 MHzPower Level - 60 dBm ± 15 dB, adjustableSpurious - 110 dBm, in-band

- 90 dBm, out-of-bandNoise Figure: 10 dB, maximumGain: 40 ± 10 dB, minimum, adjustable

Reference OscillatorFrequency Output: 10 MHzPower Level: + 2 dBm, nominalGeneral SpecificationsSHF Resolution: 1 MHzTuning Speed: 60 ms to within 1 Hz and 15°

of final valueConverter Control: CMOS plus strobeOperational Modes: TX, RX, Stand-by, Idle or OffDC Power: (typical) + 12 V @ 760 mA

+ 5 V @ 170 mA- 5 V @ 15 mA

Power Consumption: 10 watts , typical

Multi-Function AssembliesUpconverter/Modulator, 16.5 GHz

Model: MFC131



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Input: 100 MHz ± 11 MHzInput Power: + 3 dBmVSWR: 1.5:1Pulse Control: TTL Pulse On/Off Ratio: 40 dB @ 16.5 GHzPulse Rise/Fall Time: 30 nsecPulse Duration:

Long - .5 µsecShort - .03 µsec

Spurious: - 50 dBcHarmonic: - 40 dBcFrequency Output: ± 16.25 - 16.75 GHzOutput Power: - 5 dBmDC Power: 15 W

Environmental SpecificationsOperating Temp.: -30 to 85 °CEnvironment: Missile


Size: 8.5 x 6 x .96 inchesWeight: (nominal) 2.90lbs. (1.3 Kg.)Connectors:

RF SMA (F)DC Sub-D 25 pin

� Internal Pulse Modulation

� Internal BIT Detection

� Dual Mode Modulation

� Small Package

Features:

.29

5.12

7X .38

8.47

.96

J8

J3J4J1 J2 J6 J7J5

VVA2VVA1

Multi-Function AssembliesDownconverter/Demodulator, 16.5 GHz

Model: MFC132



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Input: 16.25 - 16.75 GHz (Dual)Noise Figure: < 20 dBGain: - 25 dB or - 3 dBPhase Match: ± 10°Amplitude Match: ± 1.5 dBVSWR: 1.5:1Frequency Output: 100 MHz ± 11 MHz (Dual) VSWR: 1.5:1Phase Adjustment: ± 180°Spurious: - 50 dBcHarmonic: - 40 dBcDC Power: 20 W

Environmental SpecificationsOperating Temp.: -30 to 85 °CEnvironment: Missile


Size: 8 x 5.8 x .96 inchesWeight: (nominal) 2.9 lbs. (1.3 kg.)Connectors:

RF SMA (F)DC Sub-D 25 pin

� Dual Microwave Input

� Amplitude and Phase Matched

� Built-In RF Level Detection

� Two Gain Settings

Features:

5.12

.29

7X .38

8.03

.96

J8

J1 J3J2 J4 J5 J6 J7

SHIFT 2

Multi-Function AssembliesMulti-Output PLCO Assembly, 5 - 160 MHz

Model: MFS023



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



PLXO160 MHz

5 MHzREFERENCE

INPUT

PLXO100 MHz

70 MHz

100 MHz

125 OR160 MHz

64 MHz

SPDT

X 4

X 5

X 2

÷5

÷2

÷5

÷4


Operating Temperature: 0 to + 70 °C; baseplateEnvironment: Ground and Shipboard


Size (excluding connectors): 5.82 x 3.75 x 1.43 inches148 x 95 x 36 mm

Weight: 1.9 lbs (862 g), nominalRF Connectors: Blind MateDC Connector: M28754/35-02

Features:

� Five Frequency-Coherent Outputs� Two Phase Locked, AT-Cut Crystal Oscillators� Voltage Regulation� Mix and Divide Techniques� RF Power Level and Phase Lock Detection� Low Phase Noise: - 132 dBc/Hz @ 100 kHz offset� Low Spurious: ≤ - 80 dBc� Fast Switching: 300 nsec� Multiple Built-In-Test Points


Input Output Output Output Output P2 P4 P5 P7 P8

Operating Freq. (MHz):5 64 70 100 125 or 160

Power Level (dBm):+ 13 + 8 + 0.5 + 12 + 4

Power Level Tolerance (dB):± 3 ± 1.5 ± 1.5 ± 1.5 ± 1

Switching Speed (nanosec, typ.):n/a n/a n/a n/a 300

VSWR (maximum):1.3:1 1.5:1 1.5:1 1.5:1 1.5:1

Spurious (dBc, typical):DC to 500 MHz - 65 - 70 - 70 - 75 - 70Fc ± 20 MHz - 65 - 90 - 80 - 85 - 90Harmonics (dBc, typical):

- 40 - 45 - 45 - 45 - 45SSB Phase Noise (dBc/Hz, maximum, all ports):

Offset100 Hz - 106

1 kHz - 12010 kHz - 126

100 kHz - 132≥ 1 MHz - 156

BITE Scheme: Voltage, RF and Phase Lock DetectionDC Power: + 15 ± 0.8 V @ 550 mA, nominal

- 15 ± 0.8 V @ 10 mA, nominalPower Consumption: 8.4 W, nominal

Multi-Function AssembliesMulti-Output Reference Oscillator Assembly, .125 - 2 GHz

Model: MFS025



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: The value of σ2 (τ) is relative to operating vibration perMIL-STD-202, Method 214,Test Condition Ib @ Level = 0.04 g2/Hz and τ = 10 msec.

Note 2: Output power for Ports 4 and 5 is + 3 dBm and - 30 dBm,respectively.

Note 3: Static conditions only. See plot for typical values at 2 GHz.


Operating Temperature: - 55 to + 95 °C, baseplateEnvironment: Airborne


Size (excluding connectors):4.5 x 2.5 x 0.75 inches114 x 64 x 11.6 mm

Weight: 9.6 oz (300 g), nominalConnectors: GPO (RF); MIL-C-83513/2 (DC)

Features:

� 10 Output Channels: 0.125 - 2000 MHz

� Small Package: < 8.5 cubic inches

� Excellent Short Term Stability: < 0.1 ppm


� Excellant Vibration Performance

� Multiple Built-in-Test Points


Ports 2-5 Ports 6-7 Ports 8-11Operating Frequency: 2 GHz 1 GHz 125 MHzAccuracy: ± 0.5 ppm, typicalShort Term Stability: < 0.1 ppm / 10 secAllan Variance,

Under Vibration: Note 1 5 x 10 -11, typicalStatic Condition: 2 x 10 -11, typical

Long Term Stability: 10 ppm over 10 yearsOutput Power (dBm, nominal):

+16Note 2 -26 -4Output Power Tolerance:±1.5 dB ±3 dB ±2 dBSSB Phase Noise (dBc/Hz, typical): Note 3

Offset100 Hz - 95 - 101 - 119

1 kHz - 115 - 121 - 13910 kHz - 146 - 152 - 165

100 kHz - 146 - 152 - 1651 MHz - 146 - 152 - 165

Spurious (dBc, typical): - 80 - 40 - 70Harmonics (all ports): - 30 dBc, maximumOutput VSWR (all ports): 2.0:1, typicalFrequency Pushing: < 0.1 ppm per voltBITE Scheme: RF Power at each frequency (1 = Failure)DC Power: + 15 V ± 5 % @ 300 mA, nominal

+ 5 V ± 5 % @ 20 mA, nominal- 5 V ± 5 % @ 10 mA, nominal


Multi-Function AssembliesS-Level Beacon Source Assembly, 4 GHz

Model: MFS027



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



X NX M 4 GHz

UHFUHF

OCXO "1"

OCXO "2"

OSCSELECT

CONTROL {


Operating Temperature: - 20 to + 75 °C, baseplateEnvironment: Space


Size (excluding connectors): 4 x 3.6 x .88 inches102 x 91 x 22 mm

Weight: 12.5 oz (354 g), nominalRF Connectors: SMA-Female, RemovableDC Connector: DC Feedthroughs

Features:

� Excellent Long Term Stability:± 8 ppm over 18 years

� Good Temperature Stability:± 0.8 ppm per any + 25 °C Variation

� IF & RF Outputs: UHF & S-Band

� Fully Redundant OCXO Function

� Low Power Consumption: < 2 watts

� S - Level Design


RF OutputOperating Frequency: 4 GHzLong Term Stability: ± 8 ppm/18 yr lifeTemp. Stability: < ± 0.8 ppm over any 25 °C

variationPower Level: + 4 dBm, nominalPower Variation: ± 0.8 dB, maximumOutput VSWR: 1.68:1, maximumSpurious: - 65 dBc, nominalHarmonics: - 65 dBc, nominalSSB Phase Noise (dBc/Hz, typical):

Offset10 Hz - 501 kHz - 110

10 kHz - 1201 MHz - 124

DC Power:Surge + 9 ± 0.75 V @ 330 mA, nominalSteady State (Vacuum)

+ 9 ± 0.75 V @ 220 mA, nominal

Multi-Function AssembliesComb Source Assembly, 1.8 - 5.4 GHz

Model: MFS074



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



HEATER

100 MHzXO

BPF

LPF

100 MHz

1.8-5.4 GHz

SRD

X6


Operating Temperature: - 54 to + 85 °C, baseplateVibration: 20 grms (20 to 2000 Hz)Shock: 100 g, 11 msecAltitude: 70,000 ftEnvironment: Airborne


Size: (nominal) 2.2 x 1.6 x 0.5 inches56 x 41 x 13 mm

Weight: 2.1 oz (60 g), nominal Connectors: SMA Female (J1, RF)

Solder terminals (E2 and DC)

Features:

� Combines: Oscillator, Multiplier, and Comb Generator

� Low Noise: - 120 dBc/Hz @ 100 Hz(Fout @ 100 MHz)

� Low Vibration Sensitivity: 5 x 10 -10/g

� Small Integrated Package: 1.76 cubic inches

� Excellent Stability: ± 0.2 ppm


Reference Oscillator Output, E 2Frequency: 100 MHzPower Level: (typical) + 13 dBm ± 2 dBHarmonics: - 35 dBc, maximumSpurious: - 65 dBc, maximumPhase Noise (dBc/Hz, typical):

Offset100 Hz - 120

1 kHz - 14510 kHz - 155

100 kHz - 160RF Output, J1Frequency: 1.8 - 5.4 GHzComb Spacing: 600 MHz Power Level: - 3 dBm, minimumSpurious: > 60 dBc, typicalPhase Noise (@ 5.4 GHz; dBc/Hz, typical):

Offset100 Hz - 85

1 kHz - 11010 kHz - 120

100 kHz - 125GeneralTemperature Stability: ± 0.2 ppm, typicalVibration Sensitivity: 5 x 10-10 /g Port to Port Isolation: 50 dB, minimumDC Power (nominal):

(+ 25 °C) + 15 V @ 150 mA (2.25 W)(- 54 °C) + 15 V @ 210 mA (3.15 W)

Multi-Function AssembliesTunable Up-Converter Assembly, 300 - 2900 MHz

Model: MFS075



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



3X CONN. BLIND MATE

3X .36

5.80

5.00

P/NS/NCUST P/N

J1

J2

P1P2P3

.502X .063

COOLINGSURFACE

DOWEL PINCONN PANELJACK

.22

REV

SWITCHFILTERASSY

DECODER

200 MHz(REF. IN)

LOGICINPUT

300-500 MHz(UHF IN)

1600 MHz

600 MHz

1710-2900 MHz(RF OUT)

BIT

X8

X3

SPDT

SPDT

Note 1: Spurious over the range of 100-300 MHzNote 2: Phase noise at offsets ≥ 50 kHzNote 3: RF output has six contiguous, selectable bands.Note 4: Band-to-band switching speed.

Environmental SpecificationsOperating Temperature: 0 to + 60 °C, baseplateEnvironment: AirborneMechanical SpecificationsSize (nominal): 5.8 x 5 x 0.5 inches

147 x 127 x 13 mmWeight: 20 oz (567 g)Connectors: Miniature Blindmate

Features:

� Coherent Output: RF and Dual LOs


� Small Package: 14.4 cubic inches

� Fast Switching: 2 µs, maximum


Reference InputFrequency: 200 MHzPower Level: + 10 dBm ± 1.5 dBHarmonics: - 25 dBc, maximumSpurious: Note 1 - 106 dBc, maximumPhase Noise:

5 kHz offset - 115 dBc/Hz50 kHz offset - 165 dBc/Hz

UHF InputFrequency: 300 - 500 MHz Power Level: + 5 dBm ±1 dBHarmonics: - 25 dBc, maximumSpurious: - 85 dBc, maximumPhase Noise: Note 2 - 165 dBc/HzRF OutputFrequency (selectable): Note 3 1710 - 2900 MHzSwitching Speed: Note 4 2 µs, maximumPower Level: + 19 dBm ± 1.5 dBHarmonics: - 20 dBc, maximumSpurious:

In-band - 80 dBc, typicalOut-of-band - 85 dBc, typical

Phase Noise: Note 2 - 137 dBc/HzStability: Same as inputsOutput VSWR: 2.0:1, typicalBITE Scheme: RF OutputFixed LO OutputsFrequencies: 600 MHz 1600 MHzPower Level: + 11 dBm + 10 dBm

GeneralTuning Control: 3 bit TTL (Band selection)DC Power:(nominal) + 15 V ± 2.5% @ 460 mA

+ 5 V ± 2.5% @ 300 mA- 5.2 V ± 2.5% @ 70 mA

Power Consumption: 8.8 W, typical

Multi-Function AssembliesMulti-Output COHO Assembly, 7.9 - 8.4 GHz

Model: MFS098



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



IF RF

LO

20 MHz OUTPUT

60 MHz OUTPUT60 MHz

DISTRIBUTION

60 MHz XO

J360 MHz OUTJ420 MHz OUT

J51080 MHz OUT

J67.9-8.4 GHz OUT

LOGICASSEMBLY

PLLASSEMBLY

900-1400 MHz

PLDRO6.96 GHz PLO

1080 GHzSTROBE

D.C.POWER

TUNEWORD

÷3


Operating Temp.: - 35 to + 60 °C, baseplateEnvironment: Ground and Airborne


Size: 7 x 5.4 x 3 inches178 x 137 x 76 mm

Weight: 5 lbs 2 oz, nominal (2.3 kg)Connectors: Sub-D 44 Pin, 25 Pin and SMA (F)

Features:

� Four Coherent Outputs

� Low Phase Noise

� Fast Switching Speed: ≤ 30 µs

� Low DC Power Consumption: < 20 W

� Rugged, Modular Construction


J6 Output J5 Output J3 Output J4 OutputFrequency Range:

7.9-8.4 GHz 1080 MHz 60 MHz 20 MHzStep Size: 10 MHzSwitching Speed: Note 1 30 µs, maximum18 µs, typicalOutput Power (dBm):

+ 16 + 16 + 20 + 10Power Flatness (dB):

± 1.5 ± 1.5 ± 1.5 ± 1.5SSB Phase Noise (dBc/Hz, typical)

Offset100 Hz - 84 - 105 - 125 - 134

1 kHz - 98 - 120 - 140 - 15010 kHz - 105 - 125 - 155 - 160

100 kHz - 105 - 125 - 160 - 1601 MHz - 120 - 140 - 160 - 160

Spurious: (dBc, max.)- 60 - 70 - 90 - 40

Harmonics: (dBc, max.)- 70 - 40 - 40 - 40

Accuracy: ± 1 ppm (all outputs)Tuning Control:

7 bit TTL, Differential plus Strobe (RS-422A compatible)BITE Scheme:

Phase Lock bit (Logic “0” indicates loss of lock.)DC Power: + 15 V @ 1200 mA, typical

- 15 V @ 10 mA, typical+ 5 V @ 100 mA, typical

Power Consumption: 19 W, typical

Note 1: Switching speed is 30 microseconds to within 10 kHz of the final frequency.

Multi-Function AssembliesSeven Output Local Oscillator Assembly, 1.65 - 2.9 GHz

Model: MFS116



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



REFERENCESIGNAL

DISTRIBUTION

CALIBRATIONSYNTHESIZER

CALIBRATIONSYNTHESIZER

3 MHz

.01-30 MHz10 Hz STEPS

70-100 MHz10 Hz STEPS

20-1200 MHz100 Hz STEPS

1.7-2.9 GHz100 Hz STEPS

5 MHz

15 MHz70 MHz175 MHz

3 GHz

SYNTHESIZER

XO

XO

XO

XO

XO

SYNTHESIZER

5 MHz

5.22MAX

19.00

LED, BIT

SWITCHMOMENTARY

LED, A/C POWER

21.62

FAN

CIRCUIT BREAKER

A/C CONNMS3452W16S-1P

20X TNC CONN

RECEPTACLE, CN2IEEE 488 CONNECTOR


Operating Temperature: 0 to + 50 °CEnvironment: Shipboard


Size (nominal): 21.6 x 19 x 5.22 inches549 x 483 x 133 mm

Weight (maximum): 50 lbs (22.7 kg)Connectors: See Package Drawing

Features:

� Combines: Synthesizers, LO’s, ReferenceSignal Distribution Network

� Agile & STALO Outputs

� 7 Coherent Outputs

� Low Spurious: - 80 dBc, maximum

� Low Phase Noise: - 104 dBc/Hz @ 100 Hz

� 1 Hz Step Size Optional

� Rugged, Modular Construction

� 19” Rack Mount


Frequency Range: 1.65 - 2.9 GHz, Primary70 - 100 MHz, Secondary

Step Size: 100 Hz, Primary10 Hz, Secondary

Switching Speed: < 500 µs, typicalOutput Power: - 12 dBm ± 1 dB

(Calibration Ports) + 13 dBm ± 1 dBLocal Oscillators: 3, 5, 15, 70, 175 & 3000 MHzSSB Phase Noise (dBc/Hz, typical @ 100 MHz):

Offset100 Hz - 104

1 kHz - 110100 kHz - 123

1 MHz - 145Reference Input: 5 MHz at 0 dBmSpurious: - 80 dBc, typicalHarmonics: - 30 dBc, typicalTuning Control: IEEE-488 Bus plus StrobeBITE Scheme: AC Applied, Phase Lock,

Reference Failure bitsAC Power: + 120 V, 60 Hz (120 W)

Multi-Function AssembliesDual Crystal Based Source Assembly, 1020 & 5100 MHz

Model: MFS127



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Operating Temperature: -45 to + 85 °C baseplateEnvironment: Airborne


Size: 4” x 2” x 1”165 x 41 x 32 mm

Weight: 16 oz. nominal450 gms.

RF Connectors: SMA (F)

Features:

� Dual Frequency Output

� RF & DC Enabled Outputs

� Rugged Construction

� Low Phase Noise


Operating Frequency: 1020 & 5100 MHzFrequency Stability, Long Term: ± 25 ppmOutput Power:

1020 MHz 5100 MHz+ 5 dBm ± 2 dB + 13 dBm ± 2 dB

RF Enabled (1020 MHz):Speed: 1 µsIsolation 90 dB, typical

DC Power EnabledLogic “0” = ON (Normal Operation)Logic “1” = OFF (No DC Current)

VSWR: 1.5:1 nominalSSB Phase Noise:

Offset 1020 5100 MHz1 kHz - 108 - 95 dBc/Hz, typical10 kHz - 118 - 105 dBc/Hz, typical100 kHz - 133 - 120 dBc/Hz, typical1 MHz - 135 - 125 dBc/Hz, typical

Spurious: - 70 dBc, max Harmonics: - 35 dBc, maxDC Power:

+ 14 V 350 mA+ 5 V 350 mA

REG

X5

RF ENABLE

+14V

+5V

DC ENABLE

1020 MHz

5100 MHz

X8

Multi-Function AssembliesMulti-Output COHO Assembly, 0.1, 0.15, 1.4, 14.75 - 15.25 GHz

Model: MFS129



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



.29

.99

8.65

J1J2J3J4J5

J6J7

J8

5X .38

5.12


Operating Temp.: - 30 to + 85 °CEnvironment: Missile


Size: 8.7 x 5.8 x .99 inchesWeight: 2.9 lbs, nominal (1.3 kg)Connectors:

RF SMA (F)DC MDM 25 Pin (F)

Features:

� Fast Switching Speed (50 µs)

� Low Phase Noise

� Complete Coherent Local Oscillator System

� Small Package


CH1 CH2 CH3 CH4Frequency Range:

100 MHz 1400 MHz 14.75 - 15.25 GHz 150 MHzStep Size: 10 MHzSwitching Speed: 50 µsOutput Power (dBm):

+ 14 + 13 + 16 + 3Power Flatness (dB):

± 1.5 ± 2.0 ± 3.0 ± 1.5SSB Phase Noise (dBc/Hz, typical)Offset100 Hz - 116 - 93 - 69 - 1161 kHz - 136 - 111 - 90 - 13610 kHz - 145 - 114 - 98 - 145Spurious: (dBc)

< - 70 < - 65 < - 55 < - 65Harmonics: (dBc, max.)

< - 40 < - 35 < - 40 < - 40Accuracy:

± 1 ppm ± 1 ppm ± 1 ppm ± 1 ppmTuning Control:

6 bit TTL, Differential plus StrobeBITE Scheme: Phase LockDC Power: + 15 VDC ± 10%, 2.0 mA

+ 15 VDC ± 5%, 1.0 mA- 5 VDC ± 10%, 0.2 mA

Multi-Function AssembliesATR Package, .65 - .95 GHz

Model: MFS130



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Features:


Operating Temperature: - 5 to 55 °CEnvironment: Ground


Size (nominal): 19.5 x 10.5 x 7.7 inches495 x 267 x 195 mm

Weight: 97 lbs.44 kg.

Connectors: Various


Local Oscillator: 4 Independent OutputsFrequency Range: .65 -.95 GHzStep Size: < 1 kHzSwitching Speed: 65 µs, typicalOutput Power: 12 dBm ± 2 dBSSB Phase Noise:

Offset SSB Level100 Hz - 95 dBc/Hz typical1 kHz -110 dBc/Hz typical50 kHz -112 dBc/Hz typical1 MHz -125 dBc/Hz typical

Spurious: - 60 dBc, typicalHarmonics: - 50 dBc, typical

S - Band OutputFrequency Range: S - BandOutput Power: + 30 dBm ± 2 dBSSB Phase Noise:

Offset SSB Level100 Hz - 80 dBc/Hz typical1 kHz - 94 dBc/Hz typical50 kHz - 98 dBc/Hz typical1 MHz -118 dBc/Hz typical

Spurious: - 65 dBc, typicalHarmonics: - 50 dBc, typical

Techniques Generator (4 Independent Outputs)Frequency Range: C - BandStep Size: < 1 kHzModulation: VariousOutput Power: + 8 dBm, nominal

� Packaged in Standard ATR Chassis

� PC Based Controller for Man/Machine Interface

� 4 Local Oscillators and Four Channel TechniquesGenerator Outputs

Electrical Specifications(continued)

Reference Outputs:Frequency: 10 MHzOutput Power: + 13 dBm ± 2 dBSSB Phase Noise:

Offset SSB Level10 Hz -115 dBc/Hz typical100 Hz -140 dBc/Hz typical1 kHz -145 dBc/Hz typical50 kHz -150 dBc/Hz typical

Stability: ± 0.7 ppm

Tuning Control: Ethernet & Standard PC ComputerComputer: Pentium ClassOutput Power: 28 VDC @ 11 A

Multi-Function AssembliesS-Level Multiplied OCXO Assembly, 375 & 3000 MHz

Model: MFS133



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599

©TRAK Microwave Corp. 2004



S-Band VHFOperating Frequency: 3 GHz 375 MHz

(4 outputs) (4 outputs)Temperature Stability: ± 0.5 ppm, typicalAging Rate: 1 ppm/yrPower Level: + 4 dBm + 12 dBm

nominal nominalPower Variation: ± 0.5 dB ± 0.5 dB

typical typicalVSWR (maximum): 1.5:1 1.5:1Spurious (nominal): - 60 dBc - 60 dBcHarmonics (maximum): - 25 dBc - 25 dBcResidual Noise: < 0.03° rms, typical

(500 kHz to 750 MHz) 0.06° rms, maximumSSB Phase Noise (dBc/Hz, typical):

offset100 Hz - 99 - 120

1 kHz - 108 - 12910 kHz - 124 - 145

100 kHz - 127 - 14830 MHz - 139 - 164

Logic Control: TTLDC Power:

Electronics: + 15 ± 0.75 V @ 220 mA,nominal (3.3 W)

Heater (surge): + 15 ± 0.75 V @ 160 mA,nominal (2.4 W)

Heater Steady State (air): + 15 ± 0.75 V @ 100 mA,nominal (1.5 W) cold+ 15 ± 0.75 V @ 33 mA,nominal (0.5 W) hot

Environmental SpecificationsOperating Temp.: -10 to 55 °C, baseplateEnvironment: Space and Ground


Size: 185 cubic inchesWeight: (nominal) 7.7 lbs. (3.49 kg.), nominalConnectors: RF SMA (F)

DC Sub-D 15 pin

Quadruple Coherent Outputs at 375 MHz & 3 GHz

Fully Redundant RF Signal Generation

Low Residual Noise: < 0.03° rms

Good Stability: ± 0.5 ppm

Features:

X24 MULTIPLIER

X24 MULTIPLIER

HYBRID

HYBRID

REDUNDANT

PRIMARY

3 GHzOUTPUTS

375 MHzOUTPUTS

DUALOCXO

DUALOCXO

Multi-Function AssembliesMicrowave Altimeter Assembly, C-Band

Model: MFX128



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599



Features:Low Noise Figure

Wide Dynamic Range

RF & Video Agc

Compact Design

Fast Frequency Control for Phase Shifting ina Zero IF System

Selectable Video Bandwidths for S/NOptimization


Operating Temperature: -40 to + 85 °C


Size: 5.9” x 4.33” x 1.11”Weight: <1000 gms.


Frequency: C-Band ± 50 MHz

Transmitter:Power Output: + 30 dBmPower Control Range: 60 dB minPulse On - Off Ratio: 70 dB min

Receiver:Noise Figure: 5 dB max, 3 dB typicalInput VSWR: 14 dB return lossBlanking Ratio (stc): 60 dB minAgc Range: 40 dB minVideo Agc Range: 40 dB minVideo Bandwidths:

25 MHz ± 5 MHz5 MHz ± 1 MHz2 MHz ± 400 kHz1 MHz ± 200 kHz500 kHz ± 100 kHz

Noise Balance Between Bandwidths: 1 dBPower Consumption: 12 W

6.5 W, typical

AMP VIDEO OUTRx IN BLANKING AGC MIXER VIDEO SWITCHEDAGC FILTER/AMP

VIDEOOUTPUT

Tx OUTPOWER

AMPFILTER

ON/OFFCONTROL CONTROL

POWERSPLITTER VCO

CAL

STC AGC VIDEOAGC

BWSELECT

VCCPULSE

GATE POWERCONTROL CONTROL

FREQ

4

MultipliersProduct Overview



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



TRAK offers custom-designed frequency multiplierproducts to 28 GHz. We utilize both active and passivemultiplication techniques, combined with a wide range offilter technologies and, where needed, amplifier stages.

Our multiplier product designs are used in a variety of microwave products. So whether you are specifying astand-alone multiplier or multi-function assembly, many“building blocks” have been field tested and qualified foroperation in high reliability commercial, military or space environments.

If you need to extend your temperature range, or aremoving from prototype to production units, it’s possiblewe can meet your request simply by using different partsselection criteria or including additional end-itemscreening. All product grades are manufactured in thesame TRAK facility under one Quality AssuranceProgram.

Several of the multiplier products TRAK has manufactured are featured in this catalog as detailed,custom specification sheets. More complex versions are shown as integrated functions in the Oscillator andIntegrated Microwave Assembly Sections of this catalog.

Use our Multiplier Specifier when you are ready to definea specific frequency plan, and be sure to include yourunique requirements. Our goal is to provide you with anintegrated product that demonstrates superior perform-ance and improved reliability while minimizing size, inter-faces, power consumption and cost.

Product Features� Active & Passive Multipliers (0.5 to 28 GHz)

� Multiplication Factors from 2 to over 100

� Low Residual Noise Designs

� Surface Mount or Small Custom Packages



� Integrated FunctionsMultiple OutputsAmplifiers, Filters, Oscillators, SwitchesBuilt-In Test Circuitry

Product Types

Passive Multipliers - These are diode-based multipliers.They have operating bandwidths up to 15% and excellentnoise floors. Typically, a drive level of +27 dBm isnecessary for each high order multiplication stage. Widerbandwidth (octave) and better phase noise performancecan be achieved using balanced doubler configurations ifthe frequency plan allows.

Active Multipliers - These transistor or mixerdiode-based multipliers have operating bandwidths up to10% and good noise floors. Drive level is not criticalsince amplifiers are usually included.

Typical Applications� Radar

� Telecommunications

� EW, ECM

Custom Multiplier

MultipliersProduct Overview



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Operating Bandwidth: Most TRAK multipliers operate at 3 to 15% bandwidth; however, bandwidths can varyfrom single tone to as high as 40%. The bandwidth isdependent upon the multiplication factor, the type ofmultiplier used and the type of filtering required at theoperating frequency. As a general rule, the lowest inputfrequency (Hz) divided by the input bandwidth (Hz)should be greater than the required multiplication factor; otherwise, the output will contain high levels ofunwanted harmonics in the band of interest, making for difficult filtering.

Fl Fh - Fl

> n

Where,Fl = the lowest input frequencyFh = the highest input frequencyn = the multiplication factor

Amplification: Passive multipliers require no powersupply, but do require adequate input drive levels andhave an insertion loss typically a little greater than thereciprocal of the multiplication factor. Active multipliersgenerally include amplifier stages to minimize theinsertion loss or to provide overall power gain throughthe multiplier.

Spurious Enhancement: It is important to keep theinput signal as clean as possible because spurioussignals in the input passband are enhanced (increased)by 20 log n, where n is the desired multiplication factor.Input filtering can be provided to reduce spurious signalslocated outside the passband, if required.

Phase Noise Degradation: Phase noise is increased by the frequency multiplication process. Theoretically, thisdegradation is the power summation of the input phasenoise of the source plus the residual noise of the multi-plier itself. Input noise is ideally increased by the function P out(dBm)=P in(dBm) + 20 log n, where n is themultiplication factor. Multiplier internal residual noisemust be accounted for to determine the output noise in aparticular application. Multiplier noise can be properlyspecified in two ways-1) the required output noise powerspecified for a given input noise allowing margin forresidual noise and test tolerance (2 dB); or 2) themaximum output residual noise level specified assumingan ideal input source. Both methods are acceptable.

Residual Noise: Multipliers themselves have residualphase noise that is a result of 1/f device noise orupconverted voltage noise, which in most cases is muchlower than the phase noise of the driving signal sourceat offsets very close to the carrier. However, atfrequencies farther from the carrier, the residual noisecan affect the overall noise performance. TRAK’smultipliers are designed for low residual noise asdepicted by Figure 1.

Harmonic Content: Frequency multipliers not onlyprovide the desired multiple of the input signal, but alsoemit unwanted multiples (harmonics) of the input signal.These undesirable harmonics, which can be as highas -10 dBc, can be filtered using low pass or bandpassfilters at the output of the multiplier. TRAK incorporates avariety of filtering techniques including lumped element,combline and interdigital.

General Rules For Specifying Multipliers• Prime numbers above 11 should be avoided.• Spurious products and noise at the input are degraded

by 20 log n, where n is the multiplication factor.• The larger the output bandwidth the greater the cost.• Noise floor can be limited by the choice of multiplier

type.

Figure 1. Typical Phase Noise Performance of a X11 Multiplier@ 10.56 GHz

MultipliersS - Level SMT Multiplier, 250, 300, 312.5 MHz

Model: MUL056



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Performance may vary over the extended operatingtemperatures.

Features:

� Small SMT Package: < 0.05 cubic inches

� Low DC Power: 0.67 W

� Tape & Reel Compatible

� Withstands + 230 °C for Reflow



Operating Temperature: - 10 to + 71 °C, baseplateExtended Operating Temp.: Note 1

- 34 to + 95 °C, baseplateMaximum Reflow Temperature:

+ 230 °C for 20 secondsEnvironment: Space


Size (excluding pins): 0.8 x 0.4 x 0.14 inches20 x 10 x 4 mm

Weight: 0.15 oz (4.3 g), nominalConnectors: Pins


InputOperating Freq.: (MHz)

31.25 ± 1 % 50 ± 1 % 100 ± 1 %Power Level: (typical)

CMOS CMOS + 12 dBm

OutputMultiplication Factor:

X 10 X 5 X 3Operating Frequency: (MHz)

312.5 250 300Power Level: (dBm, typical)

+ 6 + 10 + 9 Adjacent Line Spurious: (typ)

- 24 dBc - 25 dBc - 30 dBcDC Power: (all units) + 12 V ± 1.5 %Current Consumption: 56 mA, nominalPower Consumption: 0.67 W, nominal

.50

.400

12X .100 TYP

.100TYP

RFOUT

RFIN

GND

+Vcc

.90

.800 ..14 MAX

.005 TYP

MultipliersSMT X5 Multiplier, 5.1 GHz

Model: MUL057



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Features:

� Small SMT Package: < .05 cubic inches


� Good Power Flatness vs Temperature:± 1.2 dB, typical

� 6% Operating Bandwidth




Size: 0.8 x 0.4 x 0.14 inches(nominal) 20 x 10 x 4 mmWeight: 0.09 oz (2.6 g), maximum


RF Input RF OutputOperating Freq.: 1020 ± 70 MHz 5.1 GHz, nominalPower Level (typical):

+ 13 dBm + 10 dBmPower Variation vs Temperature:

± 3 dB ± 1.2 dBVSWR: (max) 2.0:1 2.0:1Spurious: > 40 dBc, typicalHarmonics: > 40 dBc, typicalSSB Phase Noise:

17 dB maximum enhancement to input noise levelsDC Power: + 15 V ± 1% @ 120 mA, nominalPower Consumption: 1.8 W, nominal

.50

.400

12X .100 TYP

.100TYP

RFOUT

RFIN

GND

+Vcc

.90

.800 ..14 MAX

.005 TYP

MultipliersX 11 Frequency Multiplier, 10.56 GHz

Model: MUL058



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Features:

� Small Size: < 0.6 cubic inches

� Low Residual Noise Floor: - 140 dBc/Hz

� Low Spurious: > 90 dBc



Operating Temperature: - 40 to + 85 °C, baseplateOperating Vibration: 7.8 grms (5 to 2000 Hz)Environment: Airborne and Ground


Size: 2.1 x 0.7 x 0.4 inches53 x 18 x 10 mm

Weight: 0.9 oz (26 g), maximumRF/DC Connectors: Feedthrough pins


RF Input OutputOperating Freq.: 960 MHz 10.56 GHzPower Level: + 10 dBm ± 1 dB + 7 dBm ± 3 dBVSWR: 1.5:1, typical 1.5:1, maximumSpurious: - 90 dBc, typicalHarmonics: - 70 dBc, maximumSSB Phase Noise:

21 dB, typical, enhancement to input levels;20 log (11) + 3 dB

Residual Noise Floor: - 140 dBc/Hz, typ. @ 10.56 GHz DC Power: + 15 ± 0.5 V @ 70 mA, nominal Power Consumption: 1.1 W, nominal

MultipliersX 7 Multiplier, 10 GHz

Model: MUL059



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Actual input signal is switched between two tones covering a 3% bandwidth in L Band; the switch rate is 20 kHz.

Features:

� Combines Multiplier, Amplifier, BITE Comparators, and Voltage Regulators

� High Power Output: 1/2 watt

� Built-In-Test: RF Power

� Internal Voltage Regulation


Operating Temperature: - 20 to + 65 °C, baseplate Environment: Shipboard


Size (excluding connectors): 6 x 1.5 x 1.5 inches153 x 38 x 38 mm

Weight: 1.4 lbs, (635 g), nominalRF Connectors: SMA FemaleDC Connector: 9 pin D-Type


Input (J1) Output (J2)Operating Freq.: Note 1 L-Band X-BandMinimum Power Level: - 1 dBm + 26.5 dBmMaximum Power Level: + 5 dBm + 28.5 dBmVSWR: (typical) 1.3:1 1.5:1Phase Settling: Note 1 To within 5° of final phase in

less than 1 µsec, maximumOutput Power Settling: To within 90% of final output

power in 100 nsec, typicalSSB Phase Noise Enhancement: 19 dB, nominalSpurious: > - 65 dBc, typicalHarmonics: > - 40 dBc, typicalBITE Scheme: Input and Output Power

Monitors (TTL “1” = Failure)DC Power: + 15 ± 1 V @ 700 mA, nominal

- 15 ± 1 V @ 20 mA, nominalPower Consumption: 10.8 W, nominal

MultipliersX 7 Multiplier, 12.18 GHz

Model: MUL061



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: The unit has two identical outputs.

Features:

� Dual Channel Frequency Multiplication

� Low Profile Package: < 0.4” Height

� Low Power Consumption: < 3 W

� 50 dB Port to Port Isolation

� Wide Operating Temperature -54 to +100 °C


Operating Temperature: - 54 to + 100 °C, baseplateOperating Vibration: 7.9 grms (10 to 1000 Hz)Environment: Airborne


Size (excluding connectors): 5 x 1.8 x 0.38 inches127 x 46 x 10 mm

Weight: 11.8 oz (335 g), maximumRF Connectors: SMA (F)DC Connector: Feedthrough pin


RF Input Dual Outputs Note 1

Operating Freq.: 1740 MHz 12.18 GHzPower Level: + 1 dBm ± 1 dB + 8 dBm ± 2 dBVSWR (maximum):1.5:1 1.5:1Spurious: - 70 dBc, typicalHarmonics: - 70 dBc, typicalPhase Noise Enhancement: 20 dB, maximumPort to Port Isolation: 50 dB, minimumDC Power: + 15 ± 1.5 V @ 190 mA, nominalPower Consumption: 2.85 W, nominal

MO

UN

TIN

GS

UR

FAC

E

4.50

3X .380

3X CONN., SMA FEMALE

2X .190.3801.200

.500

5.00 MAX

+15

VR

F IN

1.80 MAX

.120

.150

RF

OU

T 2

RF

OU

T 1

MultipliersX 80 Multiplier, 16 GHz

Model: MUL062



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: The dual outputs have a signal amplitude balance of ± 0.5 dB.

Features:

� Low DC Power: < 3 watts

� Dual Outputs @ + 12 dBm




Operating Temperature: - 55 to + 85 °C, baseplateMoisture Resistance: Meets MIL-STD-202,

Method 112 andMIL-STD-202, Method 104

Operating Vibration: Meets MIL-STD-202,Method 204

Environment: Airborne and Ground



Weight: 4.5 oz (128 g), nominalRF Connectors: SMA (F)


RF Input Dual OutputsOperating Freq.: 200 MHz 16 GHzPower Level:

Note 1+ 2 dBm ± 2 dB + 12 dBm ± 2 dB

VSWR (max): 1.5:1 1.5:1Spurious: - - > 60 dBc, typicalHarmonics: - - - 10 dBc, maximumSSB Phase Noise: 41 dB maximum enhancement of

input noise levels;20 log (80) + 3 dB

Noise Floor: - 148 dBc/Hz @ offsets ≥ 70 MHzDC Power: + 15 ± 0.5 V @ 200 mA, nominalPower Consumption: 3 watts, nominal

.51.29

3X .38

2X 1.3

1.13

3X SMAFEMALE

2X .43 TYP

1.55

J3RF OUT

J2RF OUT

4.75

+15V

J1

GND

RF IN

MultipliersX2 Mulitiplier, 100-250, 200-500 MHz

Model: MUL063



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599

©TRAK Microwave Corp. 2004


Features:Input Drive Level: +22 dBm (nominal)

Hermetically-Sealed Package

Low Residual Phase Noise

Designed For High Vibration Environments

.15

.10 [2.5]

[3.8]

.08 [2.0]

IN

.016

[9.8].38[12.3]

.48

.51 [13.0].17 [4.3]

OUT

[0.41]


Input Frequency: 100 to 250 MHzOutput Frequency: 200 to 500 MHzConversion Loss:

Fin = 100 to 250 MHz 9.3 dB (typical)-54°C to +85° C 10.8 dB (maximum)

Fundamental Suppression:Fin = 100 to 250 MHz 38 dB (typical)

-54° C to +85° C 25 dB (minimum)Third Harmonic Suppression:

Fin = 100 to 250 MHz 45 dB (typical)-54° C to +85° C 30 dB (minimum)

Input VSWR:Fin = 100 to 250 MHz 1.5:1

OscillatorsProduct Overview



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Crystal Oscillators� 60 MHz - 28 GHz Product Capabilities� High Stability, ± 0.2 to 30 ppm� Excellent Phase Noise� XO, TCXO, OCXO, VCXO, PLXO

Coaxial Resonator Oscillators� 500 MHz - 3 GHz Product Capabilities� Typical Stability 20 ppm/°C� Very Good Phase Noise� CRO, VTCRO

Dielectric Resonator Oscillators� 3 - 28 GHz Product Capabilities� Typical Stability 5 ppm/°C� Very Good Phase Noise� DRO, VTDRO

Phase Locked CRO/DROs� 500 MHz to 28 GHz Product Capabilities� Excellent Phase Noise� Stability As Good As ± 0.5 ppm (internal reference)� PLCRO, PLDRO

AbbreviationsThroughout this section, we refer to oscillators by acombination of the abbreviations noted below:

CR - Coaxial Resonator

DR - Dielectric Resonator

O - Oscillator

OC - Oven Controlled

PL - Phase Locked

TC - Temperature Controlled

VT - Voltage Tuned

X - Crystal

TRAK offers an extensive line of standard models aswell as custom oscillators to 28 GHz. Because of our“building block” design approach, we have integratedand qualified many fundamental oscillator circuits in awide variety of active microwave products. From standalone sources to multi-function assemblies, ouroscillators are used in commercial-industrial, military andspace environments.

Consequently, if you need to extend your temperaturerange, or are moving from prototype to production units,it is possible we can meet your requirements by simplyusing different parts selection criteria or includingadditional end-item screening. All product grades aremanufactured in the same TRAK facility under oneQuality Assurance Program.

Standard ProductsTRAK’s standard products are designed to satisfy avariety of applications—quickly and cost effectively.

Custom ProductsIf your system requires a totally custom subassembly ora modified version of a standard TRAK model, oneoffering better phase noise, multiple outputs or a uniquepackage shape, for example, just ask! TRAK’s electricaland mechanical engineering staff is prepared, equippedand experienced to meet your precise requirements.

Use our Oscillator Specifier when you are ready todefine a specific frequency plan, and be sure to includeyour unique requirements. Our goal is to provide youwith an integrated product which demonstrates superiorperformance and improved reliability while minimizingsize, interfaces, power consumption and cost.


Performance Comparison Matrix



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Legend:

✔ Indicates standard unit performance with options.$ $$ $$$ Indicates performance offered with increasing cost factors for

custom devices.* Indicates performance depends on reference signal parameters.

Notes: 1) 2.3 GHz is the maximum frequency for an XO with +30 dBm output.2) Set accuracy applies at +25 degrees Celsius.

General: Performance variations beyond the limits shown are offered as custom products, including improved phase noise and stability, or reduced package size.

Performance XO Mini-XO OCXO CRO PLCRO DRO PLDROCharacteristic Value (AT-Cut) (AT-Cut) (SC-Cut)

Frequency 60 MHz ✔ ✔ ✔Range 1 GHz ✔ ✔ ✔ ✔ ✔

2 GHz ✔ ✔ ✔ ✔ ✔ ✔ ✔4 GHz $ $ $ ✔ ✔ ✔ ✔8 GHz $ $ $ ✔ ✔12 GHz $$ $$ $$ ✔ ✔28 GHz $$ $$ $$ $ $

Output + 10 dBm ✔ ✔ ✔ ✔ ✔ ✔ 4Power + 20 dBm ✔ $ ✔ $ $ $ $

Note 1 + 30 dBm $

Power ± 1 dB $$ $$ $$ $$ $$ $$ $$Flatness ± 1.5 dB $ $ $ $ $ $ $

± 2 dB ✔ ✔ ✔ ✔ ✔ ✔ ✔

Frequency Set ± 0.5 ppm ✔ ✔ ✔Accuracy ± 1 ppm $ ✔ ✔ ✔

± 10 ppm ✔ ✔ ✔Note 2 ±1 MHz ✔ ✔ ✔ ✔ ✔

Frequency ± 0.1 ppm $Stability ± 0.5 ppm ✔ ✔ ✔

± 5 ppm ✔ ✔± 30 ppm ✔ ✔ ✔

± 375 ppm ✔ ✔ ✔ ✔± 5 MHz ✔ ✔ ✔ ✔

± 20 MHz ✔ ✔ ✔ ✔

Vibration 5 x 10E-10/g ✔Sensitivity 2 x 10E-9/g ✔ ✔

Tuning Electrical $ $ ✔ ✔ ✔Mechanical ✔ $ ✔ $ ✔ ✔

SSB Phase 1 kHz offset -112 -112 -128 -70 -110*Noise (dBc/Hz) 10 kHz offset -130 -130 -142 -101 -115*

Fc = 1 GHz 100 kHz offset -135 -135 -142 -121 -1201 kHz offset -88 -105 -40 -95*10 kHz offset -105 -118 -70 -102*

Fc = 12 GHz 100 kHz offset -110 -118 -100 -102

Spurious -80 dBc ✔ ✔ ✔ ✔ $(Non-Harmonic) -70 dBc ✔ ✔ ✔ ✔ ✔ ✔ ✔

-50 dBc ✔ ✔ ✔ ✔ ✔ ✔ ✔

Harmonics/ -70 dBc $$ $$ $$Subharmonics -40 dBc $ $ $ $$$ $$$ $$$ $$$

-35 dBc $ $ $ $$ $$ $$ $$-30 dBc ✔ ✔ ✔ $ $ $ $-25 dBc ✔ ✔ ✔ $ $ $ $-15 dBc ✔ ✔ ✔ ✔ ✔ ✔ ✔

Power Supply 50 mA ✔ ✔ ✔ ✔Current 100 mA ✔ ✔ ✔ ✔

150 mA200 mA + ✔ ✔ ✔

Operating Standard 0/+70 0/+70 0/+70 0/+70 0/+70 0/+70 0/+70Temperature (°C) Extended -54/+85 -54/+85 -54/+85 -54/+85 -54/+85 -54/+85 -54/+85

Size @ 1(12) GHz cubic inches 0.88 0.39 1.68 3.19 3.19 (3.19) (3.19)

Catalog Page 14 16 18 32 34 32 34




Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



The electrically induced mechanical motion of a quartzcrystal serves as the resonating element in the basic XOdesign. At frequencies up to about 30 MHz, thefundamental frequency of the crystal is used; atfrequencies up to 200 MHz, operation occurs at oddharmonics (overtones) of the fundamental frequency;above 200 MHz, frequency multipliers are incorporated.TRAK XO products utilize mostly AT and SC-cut crystals.

XO (10-100 Series) and Miniature XO (10-001 & 10-101 Series) - These families of fundamental or

multiplied crystal oscillators do not include temperaturecompensation. They are useful in applicationsrequiring moderate frequency precision or stability.

TCXO - Available as custom products, they include circuitry which offsets the changes in frequency of the crystal over temperature. Useful where the need for small size, low cost and lower power dissipation outweigh the need for the highest stability offered by the OCXO.

OCXO (10-400 & 10-450 Series) - These fundamental and multiplied XOs incorporate an oven to maintain a constant operating temperature for the crystalresonator and pertinent oscillator circuitry for the beststability performance. Warm-up is typically less than five minutes.

VCXO - This custom product includes circuitry for electrical tuning over bandwidths of typically + 100 ppm.

PLXO - This type oscillator can be phase locked to a system clock, such as a rubidium oscillator, providing the super stability of clock and the improved phase noise of the crystal. Available as a custom product.

16 GHz Oscillator

� 60 - 1440 MHzStandard XO & OCXO Products

� 60 MHz-28 GHzCustom Products (XO, TCXO, OCXO, VCXO, PLXO)

� Excellent Stability

� Excellent Close-In Phase Noise


� Small Packages

� Low Vibration Sensitivities

� Custom Capabilities-

Space Qualified Designs

Electrical Or Mechanical Tuning

High Order Frequency Multiplication

Multiple & High Power Outputs

Built-In-Test Circuitry

� LO for Frequency Translation

� Radar

� Telecommunications

� General Purpose Signal Sources

Typical Applications

Product Types Product Features




Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Stability: If stability of + 30 ppm will satisfy your requirements, usually no oven control is needed and AT-cut XOs can be used. For low phase noiseapplications where an SC-cut crystal is necessary,unheated stability would be closer to + 60 ppm and heated stability to + 0.2 ppm.Temperature compensating designs are available for AT-cut crystals to + 2 ppm.

Warm-Up Time: The warm-up period is driven by the heater assembly mass and turn-on time requirements.It should be carefully specified as stability can be affected.

Phase Noise: The oscillator circuit, buffer design and crystal selection are the primary determinants in a source’s noise performance.

Vibration Sensitivity: Typical values are listed.AT-cut crystal: 1 x 10-9 to 3 x 10-9/gSC-cut crystal: 1 x 10-10 to 1 x 10-9/g

Voltage Regulation: When using unregulated DC power supplies and low spurious and phase noise areessetial, voltage regulation should be incorporated. All TRAK standard oscillators include voltage regulation.

Packaging: TRAK offers a variety of packaging styles,including custom configurations. In applications where both size and stability are important, some technical trade-offs may be necessary.

OscillatorsCatalog, AT-Cut Crystal OscillatorsModel: OSC 10-000 & 10-100 Series


Frequency Range: 60 to 1440 MHzFrequency Set Accuracy (+ 25 °C): ± 10 ppmFrequency Stability vs Temp.: ± 30 ppmAging Rate: 5 ppm first yearPower Output: See TablesPhase Noise: See Figure 1Spurious: - 80 dBc, typicalHarmonics & Sub-harmonics: Note 1

+ 8 to + 10 dBm Output: Note 2 - 30 dBc, maximum+ 16 to + 19 dBm Output: Note 2 - 25 dBc, maximum

Output VSWR: 1.5:1, typicalSupply Voltage: + 12 to 18 voltsDC Current: 80 mA, typical


Standard Operating Temperature: 0 to + 70 °C


See Outlines

Options- 002 Extended Operating Temperature: - 54 to + 85 °C

- 010 Frequency Trim:Adds a mechanical adjustment for trimming thefrequency to within ± 1 ppm at room temperature.

- 100 Fast Gating: Note 3

Oscillator remains on at all times.All other active stages are gated on and off.

On/Off Ratio: 40 dB, typical Turn On/Off Time: 100 ns, maximumGate: TTL (“1” ON, “0” OFF)

- 200 High Isolation Gating: Note 3

All active stages are gated on and off.

On/Off Ratio: Infinite Turn On/Off Time: 5 ms, maximumGate: TTL (“1” ON, “0” OFF)

Typical Phase Noise

100 MHz 1000 MHz

SS

B L

evel

(dB

c/H

z)

-50

-70

-90

-110

-130

-150

-1700.01 0.1 1 10 100 1000

Offset Frequency (kHz)

Features:

� Fundamental and Multiplied Crystal Oscillators

� Wide Frequency Range Available

� Extended Temperature Range Option

� Frequency Trim Option

� RF Gating Option



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: “Sub-harmonics” refers to the unwanted multiples of the fun-damental crystal used.

Note 2: See Tables III and IV for models with - 60 dBc harmonics andsub-harmonics.

Note 3: Options -100 and -200 cannot be combined.

Frequency Range Model Number Output Power(MHz) (dBm, min.)

60 - 120 10-000-9100-000 + 10121 - 360 10-100-9200-000 + 10361 - 720 10-100-9300-000 + 10721 - 1440 10-100-9400-000 + 1060 - 120 10-000-9500-000 + 19121 - 360 10-100-9600-000 + 19361 - 720 10-100-9700-000 + 19721 - 1440 10-100-9800-000 + 18

OscillatorsCatalog, AT-Cut Crystal OscillatorsModel: OSC 10-000 & 10-100 Series



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Example:Model Number 10-000-9100-112, 100.0000 MHz is a 100 MHzconnector-type oscillator with fast gating, frequency trim, and extendedoperating temperature. If the only option required is frequency trim,the Model Number is 10-000-9100-010, 100.0000 MHz.

Options:Options are designated by the last three digits of the model number,with - 000 indicating no options.Ordering Information:Specify the model number, options (if any), and the exact operatingfrequency in MHz to the fourth decimal place.

Package B

Package C

Package D

Package A

Table I Connector Versions (Package A)

Table II PCB Versions (Package B)

Frequency Range Model Number Output Power(MHz) (dBm, min.)60 - 120 10-000-9111-000 + 8121 - 360 10-100-9211-000 + 8361 - 720 10-100-9311-000 + 8721 - 1440 10-100-9411-000 + 860 - 120 10-000-9511-000 + 17121 - 360 10-100-9611-000 + 17361 - 720 10-100-9711-000 + 17721 - 1440 10-100-9811-000 + 16

Table IV PCB Versions (Package D)

Models with Improved Harmonics & Sub-Harmonics(- 60 dBc from DC to three times the output frequency)

Table III Connector Versions (Package C)

.26.81

.13

1.58

1.85

.05

.50

1.33

.26

1.33

.66

P/N

S/N

D/C

FRE

Q

V+

GN

D

GAT

E

SMA FEMALE CONNECTOR

FEEDTHRU IS REMOVEDIF GATING IS NOT PURCHASED

.106 DIA THRU4 PLACES

NOTE: FOR PROPER RF GROUNDING, A GROUND PLANE SHOULD BE PROVIDED UNDER THE COMPONENT AND SECURED USING THE 2 MOUNTING HOLES PROVIDED.

1.33

1.33

P/NDC

RFS/N

FREQGATE

D/C

.50 .16

2X 0-80 UNF-2B.09 MIN. DEPTHSEE NOTE

.665

.175

.350

RFOUT

GATE

DC

1.015 .160

.09

1.15

.091.15

.570

.380

O.03TYP.

4X 2-56 UNC-2B.13 MIN. DEPTH

1.33 .26 .81

.13

2.112.38

.26

1.85

.66

P/N

S/N

FR

EQ

V=

GN

D

GA

TE

D/C

.05

.50FEEDTHRU IS REMOVEDIF GATING IS NOT PURCHASED




1.85

1.33

P/NDC

RFS/N

FREQGATE

D/C

.50 .16


.665

.175

.350

RFOUT

GATE

DC

1.530 .160

.09

1.15

.091.67

.570

.380

O.03TYP.



60 - 120 10-000-9101-000 + 10121 - 360 10-100-9201-000 + 10361 - 720 10-100-9301-000 + 10721 - 1440 10-100-9401-000 + 1060 - 120 10-000-9501-000 + 19121 - 360 10-100-9601-000 + 19361 - 720 10-100-9701-000 + 19721 - 1440 10-100-9801-000 + 18


60 - 120 10-000-9110-000 + 8121 - 360 10-100-9210-000 + 8361 - 720 10-100-9310-000 + 8721 - 1440 10-100-9410-000 + 860 - 120 10-000-9510-000 + 17121 - 360 10-100-9610-000 + 17361 - 720 10-100-9710-000 + 17721 - 1440 10-100-9810-000 + 16

OscillatorsCatalog, Miniature AT - Cut Crystal Oscillators

Model: OSC 10-001 & 10-101 Series


Frequency Range: 60 to 1440 MHzFrequency Set Accuracy (+ 25 °C): ± 10 ppmFrequency Stability vs Temperature: ± 30 ppmAging Rate: 5 ppm first yearPower Output: + 10 dBm, minPhase Noise: See Figure 1Spurious: - 80 dBc, typicalHarmonics & Sub-harmonics: Note 1 - 30 dBc, max Output VSWR: 1.5:1, typicalSupply Voltage: + 12 to 18 voltsDC Current: 80 mA, typical



Options

- 002 Extended Operating Temperature: - 54 to + 85 °C

- 100 Fast Gating:Oscillator remains on at all times.All other active stages are gated on and off.

On/Off Ratio: 40 dB, typical Turn On/Off Time: 100 ns, maximumGate: TTL ( “1” ON, “0” OFF )

- 200 High Isolation Gating:All active stages are gated on and off.

On/Off Ratio: Infinite Turn On/Off Time: 5 ms, maximum

Typical Phase Noise

100 MHz 1000 MHz

SS

B L

evel

(dB

c/H

z)

-50

-70

-90

-110

-130

-150

-1700.01 0.1 1 10 100 1000


Features:

� Fundamental and Multiplied Crystal Oscillators

� Wide Frequency Coverage

� Extended Frequency Range Option

� RF Gating Option



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: “Sub-harmonics” refers to the unwanted multiples of thefundamental crystal used.

Note 2: For non-gated units the gate terminal must be left open(no connection).

Note 3: Options -100 and -200 cannot be combined.

Figure 1

OscillatorsCatalog, Miniature AT - Cut Crystal Oscillators




Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Options:Options are designated by the last three digits of themodel number, with - 000 indicating no options.

Ordering Information:Specify the model number, options (if any), and theexact operating frequency in MHz to the fourth decimalplace.

Example:Model Number 10-001-9100-102, 100.0000 MHz is a100 MHz PCB mount oscillator with fast gating andextended operating temperature.

.16 2X .190

2X .335

3X O.04

GN

D

GN

D

GN

DB

+

GAT

ER

FO

UT

2X .190

.50

.67

1.173X.880

3X .145

3X O.03

1.300

2X.650

D/CS/NP/N

.650

1.300

.065 MAX

RF OUT

B+.100 TYP

.060 TYP.060 TYP

.120 TYP

.310 MAX

TTL GATE

.700TYP

.120 TYP

.060 TYP

RF OUT

TTL GATE

+12V

.120TYP .060

TYP

.100TYP

Package A

Package B

Layout for Printed Circuit Design

PCB Versions ( Package A) Surface Mount Versions ( Package B)

Frequency Range Model Number Frequency Range Model Number(MHz) (MHz)

60 - 120 10-001-9100-000 60 - 120 10-001-9500-000121 - 360 10-101-9200-000 121 - 360 10-101-9600-000361 - 720 10-101-9300-000 361 - 720 10-101-9700-000721 - 1440 10-101-9400-000 721 - 1440 10-101-9800-000

OscillatorsCatalog, SC-Cut Ovenized Crystal Oscillators




Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Standard Operating Temp.: 0 to + 70 °CSee Options

Vibrational Sensitivity: 5 x 10-10/g, typical

Mechanical Specifications See Packages

Options

- 002 Extended Operating Temperature:- 54 to + 85 °C (± 1 ppm frequency stability)

- 010 Frequency Trim:A mechanical adjustment for trimming thefrequency to within ± .05 ppm at room temperature.

- 020 Electronic Tuning:± 2 ppm, minimum

- 090 Combines Options - 010 and - 020

- 300 Phase Noise Test with Guaranteed PhaseNoise Performance Note 3

Note 1: “Sub-harmonics” refers to the unwanted multiples of thefundamental crystal used.

Note 2: See Tables III and IV for models with - 60 dBc harmonics andsub-harmonics.

Note 3: Option - 300 is only available on orders for two or moreidentical oscillators that incorporate option - 090.

SS

B L

evel

(d

Bc/

Hz)

-60-70-80-90

-100-110-120-130-140-150-160-170


0.01 0.1 1 10 100 1000

100 MHz 1000 MHzTypical Phase Noise

Figure 1

Features:

� Fundamental and Multiplied

� Wide Frequency Range

� Good Temperature Stability

� Excellant Vibration Performance

� Frequency Trim Available

� Electronic Tuning Available

� High Performance Applications


� Improved Spurious & Harmonic Performance


Frequency Range: 60 to 1440 MHzFrequency Set Accuracy (+ 25 °C): ± .05 ppmFrequency Stability vs Temperature: ± .25 ppmAging Rate: 2 ppm first yearPower Output: See TablesPhase Noise: See Figure 1Spurious: - 80 dBc, typicalHarmonics & Sub-harmonics: Note 1

+ 8 to +10 dBm output:Note 2 - 30 dBc, max + 16 to 19 dBm output:Note 2 - 25 dBc, max

Output VSWR: 1.5:1, typicalSupply Voltage: + 12 to 18 voltsDC Current:

60 to 120 MHz (less heater): 60 mA, typical120 to 1440 MHz (less heater): 90 mA, typicalHeater turn-on current: 350 mA, typicalHeater current, steady state: 150 mA, typical

Frequency Range Model Number Output Power Package(MHz) (dBm, min.)60-120 10-400-9100-000 + 10 A

121 - 360 10-450-9200-000 + 10 B-1361 - 720 10-450-9300-000 + 10 B-1721 - 1440 10-450-9400-000 + 10 B-160 - 120 10-400-9500-000 + 19 A121 - 360 10-450-9600-000 + 19 B-1361 - 720 10-450-9700-000 + 19 B-1721 - 1440 10-450-9800-000 + 18 B-1

OscillatorsCatalog, SC-Cut Ovenized Crystal Oscillators




Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Example:Model Number 10-400-9100-012, 100.000000 MHz is a standard 100MHz oscillator with connector, frequency trim, and extended operatingtemperature options.Model Number 10-400-9110-012, 100.000000 MHz is the same as theabove example except that it also has improved harmonics andsub-harmonics.

Options:Options are designated by the last three digits of the model number, with - 000 indicating no options.Ordering Information:Specify the model number, options (if any), and the exact operating frequency in MHz to the sixth decimal place.

Package B

Package C

Package D

Package A

Table I Connector Versions

Frequency Range Model Number Output Power Package(MHz) (dBm, min.)60-120 10-400-9101-000 + 10 C

121 - 360 10-450-9201-000 + 10 D-1361 - 720 10-450-9301-000 + 10 D-1721 - 1440 10-450-9401-000 + 10 D-160 - 120 10-400-9501-000 + 19 C121 - 360 10-450-9601-000 + 19 D-1361 - 720 10-450-9701-000 + 19 D-1721 - 1440 10-450-9801-000 + 18 D-1

Frequency Range Model Number Output Power Package(MHz) (dBm, min.)60-120 10-400-9110-000 + 8 B-1

121 - 360 10-450-9210-000 + 8 B-2361 - 720 10-450-9310-000 + 8 B-2721 - 1440 10-450-9410-000 + 8 B-260 - 120 10-400-9510-000 + 17 B-1121 - 360 10-450-9610-000 + 17 B-2361 - 720 10-450-9710-000 + 17 B-2721 - 1440 10-450-9810-000 + 16 B-2

Table II PCB Versions

Frequency Range Model Number Output Power Package(MHz) (dBm, min.)60-120 10-400-9111-000 + 8 D-1

121 - 360 10-450-9211-000 + 8 D-2361 - 720 10-450-9311-000 + 8 D-2721 - 1440 10-450-9411-000 + 8 D-260 - 120 10-400-9511-000 + 17 D-1121 - 360 10-450-9611-000 + 17 D-2361 - 720 10-450-9711-000 + 17 D-2721 - 1440 10-450-9811-000 + 16 D-2

Table IV PCB Versions

Models with Improved Harmonics & Sub-Harmonics(- 60 dBc from DC to three times the output frequency)

Table III Connector Versions


.75


FREQUENCY TRIM

GNDRF

VT

.09.09

1.50

1.32

P/N

1.50

.75

FREQ

S/N

D/CRF OUT

1.32

DC

DC

GND

VT

-1 A = 2. 25, B = 2.07



RF OUT

.09 .09

- 2 A = 2.75, B = 2.57

.75

1.50

.75

BA

1.32GNDRF

VT

P/N

FREQ FREQADJ

S/N

D/C

DCDC

GND

VT


1.50

1.50

P/NDC

VT

RFS/N

FREQ

D/C

.75 .16

.750

.240

.480

RFOUT

VT

DC

1.190.160

.09

1.32

.09 1.32

.570

.470

O.04TYP.


FREQUENCY TRIM


-1 A = 2.25, B = 2.07, C = 1.94 - 2 A = 2.75, B = 2.57, C = 2.44

1.50

A .75

O .04 TYP

.162X 0-80 UNF-2B

.09 MIN. DEPTHSEE NOTE

B

C

.09

.160

RF

VT

P/N

FREQ

S/N

D/C

DC

FREQADJ

RFOUT

VT

DC1.32.570

.470

.09

.750.240

.480

OscillatorsCatalog, CROs and DROs




Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range:CRO and VTCRO: 0.5 to 3 GHzDRO and VTDRO: 3 to 12 GHz

Output Power: + 10 dBm, minimumFrequency Drift vs. Temp:

CRO and VTCRO: 20 ppm / °C, typicalDRO and VTDRO: 5 ppm / °C, typical

Frequency Pushing: 5 kHz / volt, typical (± .5 volts)Frequency Pulling 1 MHz p/p, typical (2:1 load)Phase Noise: See Figure 1Spurious: - 80 dBc, typicalHarmonics: - 15 dBc, maximumOutput VSWR: 1.5:1, typicalSupply Voltage: + 12 to 18 voltsDC Current: 80 mA, typical




See Packages

Options


Typical Phase Noise

1 GHz 12 GHz

SS

B L

evel

(dB

c/H

z)

0-20-40-60-80

-100-120-140-160-180

0.1 1 10 100 1000 10000Offset Frequency (kHz)

Features:

� GaAs FET and Bipolar CROs and DROs

� Voltage Tuned Option Included

� Extended Temperature Range Option


Figure 1

Frequency Range Model Number Type Package(GHz)

0.5 to 1.5 10-500-9000-000 CRO A1.5 to 3.0 10-500-9100-000 CRO A3.0 to 5.0 10-550-9000-000 DRO B5.0 to 8.0 10-550-9100-000 DRO B8.0 to 12.0 10-550-9200-000 DRO B

Frequency Range Model Number Type Package(GHz)

0.5 to 1.5 10-600-9000-000 CRO C1.5 to 3.0 10-600-9100-000 CRO C3.0 to 5.0 10-650-9000-000 DRO D5.0 to 8.0 10-650-9100-000 DRO D8.0 to 12.0 10-650-9200-000 DRO D

OscillatorsCatalog, CROs and DROs




Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Option:For extended operating temperature range, change thelast digit in the model number to “2”.

Ordering Information:Specify the model number, option (if required), and theexact operating frequency in GHz to the fourth decimalplace.

Example:Model Number 10-650-9000-002, 3.1521 GHz is a voltagetuned unit with extended operating temperature, operatingat 3.1521 GHz.

Standard Unit

Voltage Tuned UnitNote 1


2.07

2.25

1.10

2X 2.07.09

.09

2X .09

2X .09

2X .092X .37

.63MAX

2.252-56UNC-2BX .20 DEEP4 PLACES


.53

GND

+15

VR

F O

UT

2X .21


.25 NOM

2.07

2.25

1.10

2X 2.07

FREQADJ

.09.09

2X .09

2X .09

2X .092X .37

.63MAX



.53

GND

+15

VR

F O

UT

2X .21


2.07

2.25

1.10

2X 2.07.09

.09

2X .09

2X .09

2X .092X .37

.63MAX



.53

GND+15V

VT

RF

OU

T

2X .21


.25 NOM

2.07

2.25

1.10

2X 2.07

FREQADJ

.09.09

2X .09

2X .09

2X .092X .37

.63MAX



.53

GND

VT

+15V

RF

OU

T

2X .21

Package A

Package B

Package C

Package D

Note 1: Voltage tuning will be sufficient to overcome any temperaturedrift with an input voltage between + 1 and 9 volts applied to thevotage tune port.

OscillatorsCatalog, Phased Locked CROs and DROs



Frequency Range:PLCRO: 0.5 to 3 GHzPLDRO: 3 to 12 GHz

Output Power: + 10 dBm, minimumExternal Reference Freq.: Note 1, 2 5 to 150 MHzExternal Reference Input Power: 0 dBm ± 3 dBPhase Noise: See Figure 1Output VSWR: 1.5:1, typicalLoad VSWR: 3.0:1, maximumHarmonics: - 15 dBc, maximumSpurious: - 70 dBc, maximumPower Supply: + 12 to 18 voltsDC Current: See TablesLock BIT: TTL (“1” for Lock)




Size: See Packages

Options


- 030 5 MHz Phase Locked External Reference

- 040 10 MHz Phase Locked External Reference

- 300 Phase Noise Test with Guaranteed PhaseNoise Performance Note 3

Typical Phase Noise

3 GHz 10 GHz

SS

B L

evel

(dB

c/H

z)

-50

-70

-90

-110

-130

-150

-1700.1 1 10 100 1000 10000


Features:

� GaAs FET and Bipolar PLOs

� Wide Range of Frequency Source Applications

� Low Phase Noise Internal Reference Option



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Reference frequencies below 25 MHz are only available onPLCROs.

Note 2: If the output frequency cannot be evenly divided by thereference, please contact the factory.

Note 3: Option - 300 is only available on orders for two or moreidentical oscillators.

Figure 1

OscillatorsCatalog, Phased Locked CROs and DROs




Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: See Options - 030 and - 040 for phase locking the internalreference to an external 5 or 10 MHz signal. These options areuseful when the stability of an external source, such as a rubidiumoscillator, and the close-in phase noise of a crystal oscillator arerequired.

Options:Options are designated by the last three digits of the modelnumber, with - 000 indicating no options.

Ordering Information:Specify the model number, options (if any), and the exactoperating frequency in GHz to the most significant digit.

Example:Model Number 10-700-9000-002, 1.055 GHz is a standard unitoperating at 1.055 GHz, with the - 002 extended operatingtemperature option.

Model Number 10-700-9600-040, 1.450 GHz is a 1.45 GHzPLCRO with a ± 0.5 ppm stability internal reference that is phaselocked to an externally supplied 10 MHz signal. The ModelNumber for the same unit with the extended operating temperatureoption - 002 included would be 10-700-9600-042, 1.450 GHz.

Frequency Range Model Number External Reference Package(GHz) Frequency (MHz)

0.5 to 1.5 10-700-9000-000 5 to 100 A1.5 to 3.0 10-700-9100-000 10 to 100 A3.0 to 5.0 10-750-9000-000 25 to 150 B5.0 to 8.0 10-750-9100-000 50 to 150 B8.0 to 12.0 10-750-9200-000 50 to 150 B

Standard Unit (+ 15 V @ 180 mA, Typical)

Frequency Range Model Number Phase Lock Package(GHz) Frequency (MHz)

(Option) Note 1

0.5 to 1.5 10-700-9300-000 5 or 10 C1.5 to 3.0 10-700-9400-000 5 or 10 C3.0 to 5.0 10-750-9300-000 5 or 10 D5.0 to 8.0 10-750-9400-000 5 or 10 D8.0 to 12.0 10-750-9500-000 5 or 10 D

Internal Reference ± 30 ppm Stability(+ 15 V @ 330 mA, Typical)

Frequency Range Model Number External Reference Package(GHz) Frequency (MHz)

(Option) Note 1

0.5 to 1.5 10-700-9600-000 5 or 10 C1.5 to 3.0 10-700-9700-000 5 or 10 C3.0 to 5.0 10-750-9600-000 5 or 10 D5.0 to 8.0 10-750-9700-000 5 or 10 D8.0 to 12.0 10-750-9800-000 5 or 10 D

Internal Reference ± 0.5 ppm Stability(+ 15 V @ 500 mA, Typical)

SMA FEMALE CONNECTORS2 PLACES

2X .21

.53

2.252X 2.07


2.07

2.25

1.10

.09.09

2-56UNC-2BX .20 DEEP4 PLACES

.63MAX

2X.372X .09

2X .09

2X .09

P/N

S/N

1.19

RF

OU

TR

EF

IN

ØV

+15

V

LA GN

D

FREQ


2X .21

.53

2.252X 2.07

FREQADJ


2.07

2.25

1.10

.09.09


.63MAX

2X .372X .09

2X .09

2X .09

P/N

S/NFREQ

.25 NOM

1.19

RF

OU

TR

EF

IN

øV

+15

V

LA GN

D

NOTE: FOR PHASE LOCKED INTERNAL REFERENCE ONLY.


1.07

2.252X 2.07

.109 DIA THRU

2.07

2.25

1.10

.09.09


2X 1.041.30

2X .532X .76

2X .25

4X .09

2X .09

P/N

S/NFREQ

3 PLACES

1.72

RF

OU

T

RF

OU

TR

EFI

N

OV

+15

V

RE

F IN

LAG

ND

GN

DLA

+15V

0

V

SEENOTE

1.19

.53

NOTE: FOR PHASE LOCKED INTERNAL REFERENCE ONLY.


1.07

2.252X 2.07

FREQADJ

.109 DIA THRU

2.07

2.25

1.10

.09.09


2X 1.04.25 NOM

1.30

2X .532X .76

2X .25

4X .09

2X .09

P/N

S/NFREQ

3 PLACES

1.72

RF

OU

T

RF

OU

TR

EFI

N

OV

+15

V

REF

IN

LAG

ND

LA

+15V

0

V

SEENOTE

1.19

.53

GN

D

Package A

Package B

Package C

Package D

OscillatorsHigh Stability OCXO 100 MHz

Model: OSC020


Operating Frequency: 100 MHzStability: ± 1 ppm / year, maximumTemperature Stability: ± 0.2 ppm, typicalWarm-Up Time: 6 minutes, typicalSet Accuracy: ± 0.1 ppmOutput Power: + 6 dBm ± 1.5 dB, typicalOutput VSWR: 2.0:1, typicalSSB Phase Noise (dBc/Hz, typical): Note 1

Offset10 Hz - 90

100 Hz - 1201 kHz - 147

10 kHz - 160Spurious: Note 1 > - 80 dBc, typicalHarmonics: - 50 dBc, typicalVibration Sensitivity: 5 x 10 -10/g , typicalDC Power: + 15 V ± 2%

Ripple 200 mVpp (10 Hz to 100 kHz);all spurious within specified levels

Steady-State 180 mA, nominal (- 54 °C);45 mA, nominal (+ 85 °C)

Warm-Up 300 mA, nominalPower Consumption: 2.7 W, nominal (- 54 °C)


Operating Temperature: - 54 to + 85 °C, baseplateOperating Vibration: 6 grmsEnvironment: Airborne and Ground


Size (excluding connectors): 2 x 2 x 0.75 inches51 x 51 x 19 mm

Weight: 3 oz (85 g), nominalRF Connectors: SMA (Female)

SMA RFCONNECTOR

.75MAX

2X O .030

4X 6-32 UNC-2A

4X .45

2.00

.140MAX

2.00FR

EQ

AD

J

Features:

� SC - Cut Crystal

� Excellent Stability: ± 0.2 ppm, typical

� Low Vibration Sensitivity: 5 x 10 -10/g


� Excellant Ripple Voltage Rejection for EMISuppression

� DC Regulated & Filtered

Note 1: Static conditions only.



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



OscillatorsVibration Isolated XO, 125 MHz

Model: OSC021



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Static conditions only. See plot.


Operating Freq.: 60 - 125 MHz, customer specifiedAccuracy: ± 25 ppm, typicalWarm-Up Time: 2 milliseconds to within ± 50 ppmFrequency Drift: 0.25 ppm/sec, maximumOutput Power: + 15 dBm ± 3 dB (Port 1)

+ 2 dBm, nominal (Port 2, test port)VSWR: 1.6:1, typicalSSB Phase Noise (dBc/Hz, typical): Note 1

Offset10 Hz - 70

100 Hz - 1051 kHz - 140

10 kHz - 1650.1 to 1 MHz - 170

Spurious: - 85 dBc, maximumHarmonics: - 30 dBc, typical; - 20 dBc, maxDC Power: + 15 ± 0.2 V @ 50 mA, nominalPower Consumption:0.75 W, nominal


Operating Temperature: - 54 to + 80 °C, baseplateOperating Vibration: up to 15 grmsEnvironment: Airborne



Weight: 5.29 oz (150 g), nominalRF and DC Connectors: Blindmate GPO® series.

Features:

� Very Low Vibration Sensitivity

� Low Phase Noise: - 170 dBc/Hz @ 100 kHz

� Includes Vibration Damping System


� DC Regulated for Excellant Ripple Rejection

� Blindmate Connections


OscillatorsMiniature VCXO, 150 MHz

Model: OSC022


Operating Frequency: 150 MHz Note 1

Electrical Tuning Range: ± 30 kHz (200 ppm)Tuning Voltage Range: ± 5 VFrequency Settling Time:

300 µsec to within 10 Hz of the finalvalue for a 5 V change

Temperature Stability:less than 0.625 Hz/sec after warm-up

Warm Up Time: less than 3 minutes from - 32 °COutput Power: + 10 dBm ± 1 dB, typicalSSB Phase Noise (dBc/Hz, typical):

Offset10 Hz - 60

100 Hz - 921 kHz - 120

10 kHz - 142Spurious: - 80 dBc, maximum @ offsets < 10 MHz

- 60 dBc, maximum @ offsets ≥ 10 MHzHarmonics: - 50 dBc, typicalOutput VSWR: 2.0:1 maximumFrequency Pulling:

0.3 kHz, typical; 2 kHz, maximum Note 2

Frequency Pushing:< 0.1 kHz/V, typical; 2 kHz/V, maximum Note 2

Vibration Sensitivity:2.5 x 10-9/g, typical; 5 x 10-9/g, maximum

DC Power: + 15 V ± 10% @ 100 mA, nominalPower Consumption: 1.5 W, nominal




Size (excluding pins): 1.5 x 0.8 x 0.56 inches38 x 20 x 14 mm

Weight: 0.73 oz (20.7 g), nominalDC & RF Connectors: Pins

GND CONT

B+ GND

GND

P/N

S/N

D/C

1.50

RF

.56

.25

RF OUT

GND

CONTROL

GND

B+

GND

.80

Features:

� Pin Mount Package: < 0.7 cubic inches

� Low Spurious: > - 80 dBc

� Low Vibration Sensitivity: < 2.5 x 10 -9/g, typical

Note 1: Other operating frequencies are available.Note 2: Pushing and pulling requirements are referenced to 10 dB

return loss at all phases.



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



OscillatorsS-Level Beacon Transmitter Source, 4 GHz

Model: OSC027



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




RF OutputOperating Frequency: 4 GHzLong Term Stability: ± 8 ppm/18 yr lifeTemperature Stability:

< ± 0.8 ppm over any 25 °C variationPower Level: + 4 dBm, nominalPower Variation: ± 0.8 dB, maximumOutput VSWR: 1.68:1, maximumSpurious: - 65 dBc, nominalHarmonics: - 65 dBc, nominalSSB Phase Noise (dBc/Hz, typical):

Offset10 Hz - 501 kHz - 110

10 kHz - 1201 MHz - 124

DC Power:Surge

+ 9 ± 0.75 V @ 330 mA, nominalSteady State (Vacuum)

+ 9 ± 0.75 V @ 220 mA, nominal




Size (excluding connectors): 4 x 3.6 x .88 inches102 x 91 x 22 mm

Weight: 12.5 oz (354 g), nominalRF Connectors: SMA-Female, RemovableDC Connector: DC Feedthroughs

X NX M 4 GHz

UHFUHF

OCXO "1"

OCXO "2"

OSCSELECT

CONTROL {

Features:

� Excellent Long Term Stability:± 8 ppm over 18 years

� Good Temperature Stability:± 0.8 ppm per any + 25 °C

� IF & RF Outputs: UHF & S-Band

� Fully Redundant OCXO Function

� Low Power Consumption: < 2 watts

OscillatorsS-Level OCXO, 10.3 GHz

Model: OSC029


Operating Frequency:10.3 GHzFreq. Stability, Long Term:

± 1.2 ppm over 10 year lifeShort Term Frequency Drift:

± 0.2 ppm (- 15 to + 65 °C)Output Power:

+ 9 dBm ± 1 dB (Port 1)Output Power, Test Port:

- 5 dBm, nominal (Port 2)VSWR: 1.5:1, nominalSSB Phase Noise (dBc/Hz, typical):

Offset10 Hz - 40100 Hz - 821 kHz - 902 - 10 kHz - 950.1 - 1 MHz - 117

Spurious (typical): - 95 dBc @ offsets ≤ 500 MHz- 70 dBc @ offsets ≥ 500 MHz

Harmonics: - 30 dBc, maximumDC Power: Note 1

Oscillator+ 15 ± 0.2 V @ 80 mA, nominal (1.2 W)

Heater, Steady State+ 16 ± 0.6 V @ 120 mA, nominal (1.92 W)

Heater, Turn-on+ 16 ± 0.6 V @ 300 mA, maximum

Power Consumption: Note 1

3.12 W, nominalIn-Orbit Life: 10 years





Weight: 16 oz (450 g), nominalRF Connectors: SMA Female

10.3 GHz+9 dBm

TEST PORT-5 dBm

11.44 MHzOCXO

X900

HEATER

Features:

� Excellent Long Term Stability: ± 1.2 ppm over 10years


� Low Phase Noise: - 95 dBc/Hz @ 2 kHz offset

� Space Qualified: 10 Years In-Orbit Life

Note 1: These measurements are based on + 25 °C baseplate andvacuum conditions. Standard pressure measurements vary.



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



OscillatorsCrystal Oscillator, 16 GHz

Model: OSC030



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Operating Frequency: 16 GHz Stability: ± 50 ppm over temperature Note 1

Output Power: + 13 dBm ± 1.5 dB, maximumVSWR: 1.3:1, typical; 2.0:1, maximumSSB Phase Noise (dBc/Hz, typical)

Offset100 Hz - 70

1 kHz - 10010 kHz - 115

100 kHz - 120Spurious (.01-22 GHz):- 70 dBc, typical; - 60 dBc, maxHarmonics: - 30 dBc, typical; - 20 dBc, maxDC Power: + 15 ± 0.6 V @ 170 mA, nominalPower Consumption: 2.55 W, nominal


Operating Temperature: - 54 to + 90 °C, baseplateVibration Sensitivity: ≤ 2 x 10 -10/g, typicalEnvironment: Missile


Size: See OutlineWeight: 3 oz (85 g), nominalDC & RF Connectors: GPO Interconnect

D/C

2X .67

3.35.5

2X .60

4.35

RF CONN

.50J1

1.45R

F

2X .18

S/N

Features:

� Low Vibration Sensitivity: 5 x 10 -10/g, max.

� Custom Low Profile Package

� DC Regulation & Filtering

� Blindmate Connections


Note 1: Unit does not have temperature compensation or heater circuitry.

OscillatorsSpace Qualified PLO Family, 2, 10, 12, 14 GHz

Model: OSC036



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Close-in phase noise is relative to the input noise levels of the reference oscillator.

Note 2: Performance may vary over the extended operatingtemperatures.


Operating Frequency: 2, 10, 12 or 14 GHzReference Input: 100 MHz @ - 1 dBm ± 2 dBFrequency Stability: Same as input reference signalOutput Power: + 16 dBm ± 1 dB, nominalLoad VSWR: 1.6:1, maximumSSB Phase Noise (dBc/Hz, typical): Note 1

Offset 2 GHz Output10 Hz - 40

100 Hz - 901 kHz - 115

100 kHz - 1201 MHz - 1452 MHz - 148

Output Integrated Noise:DSB -10 Hz to 10 MHz 2.7 degrees rms, maximum

0.8 degrees rms, typicalSpurious: > - 80 dBc, typicalHarmonics: > - 40 dBc, typicalBITE Scheme:

Phase Lock (Analog Output,Varactor Tuning Voltage)DC Power:

+ 16.5 ± 1 V @ 95 mA, nominal+ 9 ± 0.75 V @ 200 mA, nominal



Operating Temperature: + 10 to + 60°C, baseplateExtended Operating Temp.: Note 2 - 31 to + 85°C, baseplateEnvironment: SpaceRandom Vibration: 80 grms, without damageMechanical Shock: 1500 g, without damageLife: 12+ years


Size: (excluding projections) 2.25 x 2.25 x 0.625 inches57 x 57 x 16 mm

Connectors: Feedthrough PinsWeight: 4 oz (113 g), maximum

.625 MAX

.250 MAX4X

.150 MIN2.25

2.25

REF IN

Vt

+16.5V

+9V

GNDRF OUT

P/N

S/N

Features:

� Internal Voltage Regulation

� Low Noise

� Small Size: 3.2 cubic inches

� Withstands 80 grms Vibration

� Phase Locked to External 100 MHz Oscillator

OscillatorsLow Noise Phase Locked DRO, 6.6 GHz

Model: OSC037


Operating Frequency: 6.6 GHzInput Reference Signal: 5 MHz @ + 2 dBm ± 3 dBOutput Power: + 10 dBm ± 2 dBSSB Phase Noise (dBc/Hz, typical):

Offset Free-Running Phase Locked10 Hz - 27 - 43

100 Hz - 60 - 551 kHz - 95 - 84

10 kHz - 118 - 114100 kHz - 138 - 122

Spurious: - 75 dBc, maximumHarmonics: - 25 dBc, maximumVSWR: 1.25:1BITE Scheme:

Phase Lock Indication, TTL “1” = locked conditionDC Power:

+ 12 V ± 1.5 % @ 160 mA, nominal+ 5 V ± 1.5 % @ 15 mA, nominal- 12 V ± 1.5 % @ 85 mA, nominal



Operating Temperature: 0 to + 70 °C, baseplateEnvironment: Defense and Commercial


Size: (excluding connectors) 0.91 x 0.91 x 0.27 inches23 x 23 x 7 mm

Weight: 0.17 oz (4.7 g), approx.

Features:Low Noise: - 138 dBc/Hz @ 100 kHz offset

Dual Loop Design

Suitable for Low Cost, High Volume Applications



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599



Note 1: Unit does not have temperature compensation or heater circuitry.

OscillatorsHybrid PLO, 12 GHz

Model: OSC038


Operating Freq.: 11.95 GHzReference Input: 50 MHz @ + 7 dBm, minimumFrequency Stability: Same as input reference signalWarm-Up Time: 1 second, maximumOutput Power: + 10 to + 13 dBm, typicalVSWR: 1.5:1, nominalSSB Phase Noise (dBc/Hz, typical):

Offset10 Hz - 40

100 Hz - 701 kHz - 95

10 kHz - 105100 kHz - 10510 MHz - 145

Spurious: > - 60 dBc, typicalHarmonics: > - 30 dBc, typicalBITE Scheme: Phase Lock (TTL “1” = Lock)DC Power: + 12 V ± 5 % @ 130 mA, nominal

- 5 V ± 5 % @ 10 mA, nominalPower Consumption: 1.6 W, nominal


Operating Temperature: - 30 to + 85 °C, baseplateEnvironment: Ground


Size: (excluding connectors) 2 x 1 x 0.4 inches51 x 25 x 10 mm

Weight: 2.3 oz (65.2 g), nominal

Features:Small Size: 0.8 cubic inches and 2.3 ounces

Low Power Dissipation: 1.4 W

Low Phase Noise: - 105 dBc/Hz @ 10 kHz

Wide Operating Temperature: - 30 to + 85 °C



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599



1.00

.100

2.00

RF

OU

T

E1:

+ 1

2V

E2:

- 5

V

E4:

GN

D

E3:

LO

CK

ALA

RM

RF

IN

SE

RN

OX

XX

OscillatorsMiniature PLDRO, 5.2 GHz

Model: OSC039


Operating Freq.: 5.2 GHzReference Input: 100 MHz @ 0 dBm ± 3 dBFrequency Stability: Same as input reference signalOutput Power: + 16 dBm ± 1 dBVSWR: 2:1, nominalSSB Phase Noise (dBc/Hz, typical):

Offset20 Hz - 40

100 Hz - 801 kHz - 95

20 kHz - 113100 kHz - 117

1 MHz - 14210 MHz - 149

AM Noise: 0.12 % rms, max (20 to 3000 Hz)FM Noise: 2.7 Hz rms, max (20 to 3000 Hz)Spurious: > - 80 dBc, typicalHarmonics: > - 40 dBc, typicalBITE Scheme: Phase Lock (CMOS “1” = Lock)DC Power: + 15.5 V ± 4 % @ 237 mA, nominal

- 15.5 V ± 4 % @ 80 mA, nominalPower Consumption: 5 W, nominal




Size: (excluding projections)2.125 x 1.5 x 0.95 inches54 x 38 x 24 mm

Connectors: GPO typeWeight: 4.5 oz (128 g), maximum

.95

2.125 MAX .26

.350

.850

1.200 1.27

.625MIN

.23

1.50

+ 15V

-15V

L/I

GND

Features:

� Small Size: 3 cubic inches

� + 16 dBm Output Power

� Low Spurious and Harmonics

� Rugged Construction: Airborne Environment

� Phase Locked to External 100 MHz Source



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



OscillatorsVoltage Tuned DRO, 26.55 GHz

Model: OSC040



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Operating Frequency: 26.55 GHzOutput Power: + 10 dBm, typicalTuning Voltage: + 1 to 7 VTuning Sensitivity: 2 MHz / V, minimumTuning Sensitivity Variation:

1.5:1, nominalTemperature Stability: ± 2 MHz, typicalHarmonics: - 15 dBc, typicalSub-Harmonics: - 30 dBc, minimumSpurious: - 70 dBc, typicalSSB Phase Noise:

Offset10 kHz - 85, typical100 kHz - 110, typical1 MHz - 125, maximum

Pushing: < 0.25 MHz / V, typicalPulling: < ± 25 kHz, typical (4:1 VSWR)DC Power: + 12.5 ± 2.5 V @ 122 mA, nominalRipple: 1.2 V peak to peakPower Consumption: 183 mW, nominal


Operating Temperature: - 35 to + 75 °C, baseplateEnvironment: Commercial (Ground)


Size: (excluding pins) 1.6 x 1.6 x 0.75 inches41 x 41 x 19 mm

Connectors: Gilbert (Male)Weight: 2.35 oz (67 g)

Features:

� Low Phase Noise: - 85 dBc/Hz @ 10 kHzoffset

� Good Power Flatness: Less than ± 0.5 dB, typical


� Phase Locking Capability

OscillatorsUltra Low Noise Crystal Oscillators, 100 MHz

Model: OSC044



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Operating Frequency: 60 - 125 MHz customer specifiedAccuracy: ± 25 ppm, typicalWarm-Up Time: 2 milliseconds to within ± 50 ppmFrequency Drift: 0.25 ppm/sec, maximumOutput Power: + 23 dBm ± 3 dBVSWR: 1.6:1 typical

SSB Phase Noise : Note 1

offset10 Hz - 95 dBc/Hz, typical100 Hz - 125 dBc/Hz, typical1 kHz - 155 dBc/Hz, typical10 kHz - 177 dBc/Hz, typical0.1 to 1 MHz <- 179 dBc/Hz, typical

Spurious: - 85 dBc, maximumHarmonics: - 30 dBc, typical

- 20 dBc, maximumDC Power: +16 V @ 100 mA, nominalPower Consumption: 1.6 W, nominal


Operating Temperature: - 54 to + 80 °C baseplateOperating Vibration: up to 15 grmsEnvironment: Airborne


Size (excluding connectors): 3.0 x 1.13 x 0.93 inches76.2 x 28.7 x 24 mm

Weight: <3.6 oz nominal100 gms

RF and DC Connectors: Blindmate GPO® series.

-70

-80

-90

-100

-110

-120

-130

-140

-150

-160

-170

-180

-190 10 100 1K 10K 100K 1M 10M

Carrier = 100 MHz

£ [ f ] [ dBc/Hz ] vs f [Hz]

Features:

� Low Noise -179dB/Hz @100 kHz

� Excellant Performance Under Vibration

� Wide Temperature Range

� DC Regulation and Filtering Included

Note 1: Static conditions only. See plot.

OscillatorsMiniature Oscillator, 1 GHz

Model: OSC045



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Operating Freq.: ≈ 1 GHzAccuracy: ± 50 MHzRx Output Power: 0 dBm ± 2 dBTx Output Power: + 17 dBm ± 2.5 dBVSWR (Tx & Rx): 1.5:1Tx & Rx Phase Noise (dBc/Hz, typical):

Offset50 kHz - 77

100 kHz - 86500 kHz - 10725 MHz - 135

Spurious: < - 60 dBcHarmonics: - 10 dBc, maxTx On/Off Isolation: > - 25 dBTx Switch Rise/Fall Time: <10 nsecDC Power: + 15 V @ 350 mA, max

- 15 V @ 40 mA, max


Operating Temperature: - 40 to + 85 °C, baseplateEnvironment: Missile


Size: (excluding projections)2.125 x 1.5 x 0.95 inches54 x 38 x 24 mm

Connectors:RF Blindmate GPO® SeriesDC Pins (.03”)

4X .030

6X .066±.002

.175±.010

THIS PIN IS GROUND ANDIS TIED TO THE CASE.

.496 5X .100=.500

2X .056

2X .255

2X GILBERT GPPORF CONNECTORSP/N 0118-915-1OR EQUIVALENT.

.110

.0946X

2X .700±.002

2X .0902X .180

.700

2X .880

.090

2X .180

1.300±.002

6X ROUNDED ORCHAMFERED

.090

.180

1.480

1.660±.002

1.840±.010

.099

.105

SEE VIEW A

VIEW ASCALE: 10/1

2 PL

.150

.150

FIDUCIAL HOLE

.002.023

6X .0234X

E3

E2

E1

J1

E4

E5

E6

J2

Features:

� Very Small Package

� Switched Transmit Output


� Dual RF Outputs

TRAK manufactures high reliability standard and customdesigned synthesizers over the frequency range of 0.1 to20 GHz. Our products typically settle in frequency inmuch less than 250 µs and are ideal for military andcommercial applications needing both highperformance and small size.

Because our synthesizers have a long heritage indefense applications, our electrical and mechanicaldesigns offer superior performance over the toughestenvironments, including both shipboard and highvibration airborne.In addition, our engineering staff is specially trained andexperienced in handling requirements for super fastsettling, low phase noise, integrity under vibration,thermal management, and size and weight reduction.

By drawing upon a library of established designs, all ofTRAK’s synthesizer products demonstrate repeatableperformance and good producibility.

TRAK’s synthesizers are used in data links,communication systems, radar decoys, fire control radar,direction finding equipment, ground penetrating radar,reconnaissance systems and EW receiver processors.Evidence of TRAK’s international reputation is indicatedby our numerous positions as sole-source-supplier onhigh profile and technically challenging programs forcommercial and defense applications. Common to all ofour customers is a paramount demand for performance,quality and long term program commitment.

Frequency SynthesizersProduct Overview



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Product Features� 0.1 to 20 GHz Operating Frequencies

� Standard and Custom Products

� 5% to Multi-Octave Bandwidths

� Fast Switching< 1 µs for Direct Synthesis< 250 µs for Indirect Synthesis

� Low Phase Noise Designs

� Excellent Environmental Performance,High VibrationWide Operating Temperatures

� High ReliabilityMilitary Qualified Products & Space Capabilities

� Small, Modular Packaging

� Integrated FunctionsCoherent LO OutputsMultiple & High Power OutputsTracking OffsetsBuilt-In-Test CircuitryModulationRF DistributionComplete Radar Systems

Product Types

Standard (60-000 Series) - Designed for quick delivery,these 1.7 in3 indirect VCO-based synthesizers offer up to650 MHz bandwidth from 400 MHz to almost 5 GHz.

Custom - TRAK specializes in custom designedsynthesizers; we offer a variety of synthesis techniquesin unique electrical and mechanical configurations. Ourgeneral capabilities are indicated by the product listingand custom specification sheets included in this section.Use our Synthesizer Specifier to help define yourproduct.

Typical Applications� Radar Subsystems

� Communications Subsystems

� Receiver Subsystems

� EW Subsystems

Low Phase Noise Synthesizers Used For Data Links




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Technical ConsiderationsTRAK considers synthesizers to be major subsystems rather than “off-the-shelf” components. With over 35 years ofdigital and analog subsystem design and manufacturing experience, our technical staff understands and correlates therelationships among the end-item, system usage, performance limitations and cost-driving factors of various synthesistechniques. From the program onset, we encourage engineering dialogue between users and our engineers; in thisway, we can jointly analyze the technical parameters that drive subsystem complexity and cost to produce a cost-effec-tive, high performance product. Whether your application requires a retrofit, state-of-the-art performance for a currentjob, or flexibility for an IR & D project, TRAK’s architectures, by design, complement system-level performance, quality,and reliability standards without compromise.

Please see our Application Notes, “Specifying Synthesizers: The Performance/Cost Relationship” and “Ping Pong Systems”.

Use our Synthesizer Specifier to help define your product.

IF RF

LO

20 MHz OUTPUT

60 MHz OUTPUT60 MHz

DISTRIBUTION

60 MHz XO

J360 MHz OUTJ420 MHz OUT

J51080 MHz OUT

J67.9-8.4 GHz OUT

LOGICASSEMBLY

PLLASSEMBLY

900-1400 MHz

PLDRO6.96 GHz PLO

1080 GHzSTROBE

D.C.POWER

TUNEWORD

÷3

At TRAK, we do. TRAK offers a variety of products that are spin-offs of established, fundamental synthesis techniques.In the above example, by adding an offset oscillator for upconversion and optimizing loop parameters, we provide X-Bandoperation and switching speeds under 30 microseconds. Then we combine up and down converters, BIT & AGC into onepackage, providing for a fully-integrated, agile half-duplex subsystem.

At TRAK, performance does evolve by design.

UPCONVERTERASSEMBLY

INDIRECTSYNTHESIZER

DOWNCONVERTERASSEMBLY

10 MHzREFOSC

∆ = 1 MHz

∆ = 1 MHz

BIT

BIT

BIT

BIT

MANUALGAIN ADJUST

7.25-7.75 GHzSHF

70 MHzIF

20 dB

DC POWER± 5 VDC

+12 VDC

7.9-8.4 GHzSHF

10 MHzREFERENCE

70 MHzIF

CMOS CONTROLBIT OUTPUT

VCO

800-1300 MHz1 MHz STEPS

10 MHzREFERENCE

SIGNAL

SERIALINTERFACE

÷1010 ÷N

Design Evolution

Can you Really Design Evolution?

� 800 - 1300 MHz

� 1 MHz Steps

� 3 ms Speed

� -117 dBc/Hz @ 100 kHz

� 3.65˝x 2.2˝x 0.67˝

� 7.9 - 8.4 GHz

� 10 MHz Steps

� 30 µs Speed

� -105 dBc/Hz @ 100 kHz

� 7˝ x 5.4˝ x 3˝

� 7.9 - 8.4 GHz

� 1 MHz Steps

� 60 msec

� -97 dBc/Hz @ 50 kHz

� 7.34˝ x 5˝ x 1.8˝

� Single Loop Synthesis

� Agile Source for COMMSYS

� Moderate Switching

� Low Phase Noise

� Small Size

� Single Loop w/Offset

� LO for Radar

� Fast Switching

� Low Phase Noise

� STALO Outputs

� Single Loop w/ Offset

� Half-Duplex Subsystemfor SATCOMM

� Integrated SHF Converter

� Low Phase Noise




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DDS

PLL

SPDT

REFSIGNAL

DIGITALCONTROL

DIGITALCONTROL

plo's

X4

INDIRECT SYNTHESISIndirect synthesizers utilize tunable oscillators,digital dividers and phase lock loop circuitry. Withthis architecture, performance is limited by a tun-able source (VCO or YIG) or the digital divider. Ingeneral, the indirect approach offers switchingspeeds less than one millisecond and moderateto good phase noise.

DIRECT ANALOG SYNTHESISDirect analog synthesizers are based on thearithmetic combination of multiple oscillators;crystal, dielectric resonator, or SAW typeoscillators are traditionally used. Theseoscillators are fixed frequency so agility isachieved by mixing, dividing, or switching fromone oscillator to another. The direct approachoffers fast switching speeds – typically less than500 nanoseconds – and very low phase noiseclose to the carrier.

DIRECT DIGITAL SYNTHESISUsing a phase accumulator, ROM look-up table,and digital-to-analog converter, a Direct DigitalSynthesizer (DDS) literally constructs a sinu-soidal (analog) waveform from the input (digital)tune word and clock. While direct digital synthe-sizers have operating frequency and spuriouslimitations, they do have very fast switchingspeeds and excellent phase noise.

COMBINATION SYNTHESISCombination synthesis integrates the bestfeatures of the indirect and direct architectures.For example, while TRAK is not a DDS chipmanufacturer, we do utilize DDS technology inhigher level synthesizer assemblies in order toachieve fine resolution or complex modulationcapabilities.

SYNTHESIS TECHNIQUES

There are four basic methods of frequency synthesis:� Indirect Synthesis� Direct Analog Synthesis� Direct Digital Synthesis� Combination Synthesis

Each synthesis technique has inherent performancecharacteristics dictated by the types of devicesimplemented in the architecture. TRAK’s broad expertiseincludes single loop indirect synthesizers to combinationsynthesizers which, for optimum performance, requirethe integration of several synthesis techniques.

X4SWITCHMATRIX

DIGITAL CONTROL

F0

F1

F2

F3

÷N

VCO

DIGITALCONTROL

REFERENCESIGNAL

DIGITALTUNE

WORD

CLOCK

Fo = Ck * TW

WHERE Ck = CLOCK FREQUENCYTW = TUNE WORDN = NUMBER OF BITS INTO PHASE ACCUMULATOR

2 N

PHASEACCUMULATOR

SINELOOK-UP

TABLE

D TO ACONVERTER

Frequency Step Switching Phase Noise (dBc/Hz) Spurious Harmonics Output DC Size Synthesis

Range (GHz) Size Speed 1 kHz 10 kHz 100 kHz 1 MHz (dBc) (dBc) Power Power (Inches) Technique

0.1 to 2.9 1 100 Hz 1 msec - 110 - 113 - 123 - 145 - 80 - 30 - 12 dBm 120 W 23 x 19 x 5.25 Indirect, Direct & Fixed Sources

0.325 - 0.425 10 kHz 750 nsec - 125 - 135 - 140 - 140 - 50 - 30 7 dBm 15 W 8 x 8 x 1.5 Direct Analog & Digital

0.55 - 1.85 2,3 1 MHz 80 (35) µsec - 90 - 90 - 95 - 126 - 65 - 15 15 dBm 6.2 W 4.5 x 2.5 x 0.8 Indirect, Dual Mode Operation

0.5 - 2 2 MHz 100 µsec - 75 - 80 - 90 - 123 - 40 - 10 15 dBm 12 W 6.6 x 5.4 x 1.75 Indirect

0.5 - 2 2 MHz 200 µsec - 70 - 75 - 85 - 120 - 40 - 10 10 dBm 11 W 5.4 x 5.1 x 1.6 Indirect

0.58 -0.59 4 160 kHz 25 µsec - 85 - 90 - 90 - 112 (- 84) - 40 - 30 17 dBm 19 W 7 x 6 x 1.2 Indirect

0.58 - 1.08 4 25 MHz 95 nsec - 110 - 130 - 130 -132 (-65) - 50 -60 10 dBm 7.6 W 6.5 x 4.6 x .95 Direct Analog

0.6 - 1.05 4 50 MHz 200 nsec - 125 – - 125 - 125 (- 60) - 55 - 20 20 dBm 5.6 W 5 x 5 x 1.5 Direct Analog

0.7 - 1.28 5 MHz 25 µsec -103 - 103 - 100 - 118 - 60 - 25 10 dBm 4.6 W 2.4 x 1.5 x 0.46 Indirect

0.8 - 1.3 1 MHz 3 msec - 60 - 84 - 117 - 141 - 70 - 20 10 dBm .82 W 3.7 x 2.2 x 0.6 Indirect

1 - 2.5 2 MHz 175 µsec - 85 - 95 - 100 - 130 - 60 - 15 10 dBm 9 W 5.4 x 5 x 1.6 Indirect

1 - 3 5 MHz 200 µsec - 85 - 90 - 98 - 115 - 50 - 12 10 dBm 13 W 6.6 x 5.4 x 1.75 Indirect

1.5 - 1.8 2 MHz 500 nsec - 112 - 115 - 125 - 140 - 60 - 40 12 dBm 23 W 9 x 6 x 1.5 PING PONG

1.5 - 2.5 1 MHz 250 nsec - 100 - 110 - 110 - 120 - 45 - 30 17 dBm 39 W 8 x 6 x 3.4 Direct Analog

1.5 - 2.5 1 MHz 250 nsec - 100 - 110 - 110 - 120 - 45 - 30 17 dBm 130 W 8 x 6 x 11 Direct Analog with Quad Output

1.6 - 2.7 100 Hz 350 µsec - 93 - 100 – - 130 - 80 - 45 5 dBm 28 W 7.5 x 7.3 x 5.3 Indirect

2 - 4.5 5 MHz 150 µsec - 72 - 72 - 92 - 121 - 60 - 15 12 dBm 20 W 7.75 x 6.2 x 1.5 Indirect

2 - 18.2 1 MHz 250 µsec - 60 - 65 - 80 - 110 - 50 - 15 11 dBm 40 W 8.5 x 7.9 x 5.0 Indirect

2 -18 1 MHz 6 msec - - -65 -95 -60 -30 24dBm 45 W 6 x 5 x 2 Indirect

2.8 - 3.2 10 MHz 25 µsec - 64 - 75 - 92 - 116 - 45 - 20 12 dBm 25 W 6.95 x 4.2 x 1.8 Indirect

2.9 - 3.1 250 kHz 500 µsec - 80 - 85 - 100 - 120 - 50 - 45 30 dBm 23 W 9 x 6.1 x 1.8 Indirect w/ Complex Modulation

3 - 3.5 10 MHz 100 µsec - 80 - 80 - 90 - 115 - 65 - 45 18.5 dBm 15 W 9 x 5.4 x 1.6 Indirect

3.25 - 4.75 5 500 MHz 1 µsec - 105 - 108 - 113 - 122 - 70 - 15 15 dBm 4.35 W 4.5 x 2.5 x 0.8 Direct Analog

3.5 - 16.5 5 MHz 750 µsec - 60 - 75 - 85 - 115 - 60 - 20 3 dBm 38 W 9 x 5.5 x 4.5 Indirect

4.0 - 4.64 1 MHz 1 µsec - 90 - 110 - 125 - 130 - 60 - 40 24 dBm 60 W 8 x 8 x 7.5 Direct Analog

4 - 86 1 MHz 10 msec - -60 -75 -110 -60 -30 17 dBm 30 W 6 x 6 x 2 Indirect

4.44 - 5.46 4 1 MHz 60 µsec - 80 - 90 - 100 - 108 (- 60) - 50 - 60 4 dBm 9 W 10 x 5.4 x 1.6 Indirect

4.5 - 4.7 16 MHz 50 µsec - 100 - 100 - 100 - 110 - 70 - 40 14 dBm 22 W 10 x 5.4 x 1.6 Indirect with Fixed Sources

4.9 - 5.4 125 kHz 200 nsec - 80 - 85 - 100 - 120 - 60 - 60 10 dBm 20 W 10 x 5.4 x 2.6 PING PONG

7 - 9 6 1 MHz 500 nsec - 100 - 110 - 115 - 120 - 60 - 60 19 dBm 85 W 15 x 8.5 x 5 Direct with AC Power Input

7.25 - 11.75 5 MHz 1 msec - 50 - 60 - 75 - 110 - 60 - 30 13 dBm 23 W 5.4 x 5 x 3.1 Indirect

7.9 - 8.4 10 MHz 30 µsec - 98 - 105 - 105 - 120 - 60 - 70 16 dBm 19 W 7 x 5.4 x 3 Indirect with Fixed Sources

8 - 18 5 MHz 100 µsec - 65 - 75 - 86 - 106 - 40 - 20 0 dBm 38 W 7 x 6.2 x 6.2 Indirect with Pulse Modulation

8 - 18 625 kHz 250 µsec - 78 - 80 - 88 - 115 - 55 - 40 10 dBm 40 W 7 x 6.2 x 3.6 Indirect

8.1 - 8.4 36 MHz 10 µsec -100 -110 -110 -112 -60 -60 16 dBm 30 W 4.6 x 4.0 x 1.5 Indirect with 3 Fixed Sources

8.45 - 8.79 5 MHz 250 µsec – - 90 - 105 - 125 - 60 - 30 10 dBm 14 W 6 x 3.6 x 1.4 Indirect

8.47 - 9.13 10 MHz 15 µsec - 90 - 92 - 100 - 124 - 60 - 20 10 dBm 13 W 9 x 5.4 x 1.6 Indirect


10 - 20 5 MHz 150 µsec - 70 - 70 - 75 - 115 - 60 - 15 5 dBm 35 W 8 x 5 x 2 Indirect


13.13 - 14.3 10 MHz 40 µsec - 80 - 100 - 100 - 130 - 60 - 60 17 dBm 42 W 10 x 5.4 x 3.1 Indirect, Dual Output w/ L.O.s


GENERAL:• PING PONG synthesis utilizes two indirect synthesizers operating in parallel.• All specification values are to be considered typical.

Note 1: Performance is referenced to an output of 100 MHz.Note 2: This unit has two modes of operation. Mode 1: 80 µsec speed, 1 MHz steps.

Mode 2: 35 µsec speed, 4 MHz steps.Note 3: Phase noise listed is relative to input reference oscillator, and is based on Mode 1 operation.Note 4: In-band spurious are denoted separately, in parentheses.Note 5: Phase noise listed is relative to the input reference oscillator.Note 6: 1 GHz bandwidth, maximum.




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Subset of TRAK Synthesizer Experience

Frequency SynthesizersApplication Note: Ping Pong

Model: APN102



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FINALOUTPUT

TUNE

TUNE

WORD 1

WORD 2

HOPCOMMAND

SYNTHESIZER#1

SYNTHESIZER#2

SP2T

Improve System Size, Weight and Efficiency withPING PONG Synthesizers

Pulse doppler frequency agile radars requiresynthesizers with fast switching and low phase noise.When the radar bandwidth covers tens or hundreds ofchannels, direct analog synthesizers are commonly usedas the frequency generating source because traditionalindirect synthesis techniques have proven to be too slow.Switching speeds less than one microsecond allow forsignificantly reduced radar processing time lines whenhigh range resolution doppler data collection is needed.When using a traditional single loop, indirect synthesizer,the speed requirement is in direct conflict with thesimultaneous need for low gated phase noise whichdictates a wider loop bandwidth. In many cases,however, where the radar’s Pulse Repetition Rate (PRR)is 50 kHz or lower, TRAK Microwave’s indirect, dualchannel, or “PING PONG” architecture, can satisfy thecritical switching requirements while offering smallervolume, improved efficiency, better reliability and lowercost compared to direct analog types.

The term, “PING PONG,” refers to toggling between two complete and separate indirect frequencysynthesizers operating in a parallel configuration. Asshown in Figure 1, the Hop Command activates theswitch to select one of the units as the final output of thesubsystem. For example, with Synthesizer No. 1 tuned tothe desired output frequency, the Hop Command is setto select Synthesizer No. 1 while the next frequency tuneword is simultaneously applied to Synthesizer No. 2. Atthe appropriate time (equivalent to the next pulseinterval), the Hop Command is changed to selectSynthesizer No. 2, which has already settled to withinthe acceptable frequency tolerance (or phasecoherency). Consequently, from the perspective of thesubsystem final output, the time between the change infrequencies or channels is much less than onemicrosecond while the actual tuning speed of theindividual synthesizers is some 20 to 30 times slower.This allows the individual phase lock loops to beoptimized for the best phase noise performance whileonly requiring phase settling during the Pulse RepetitionInterval. Figure 1. PING PONG Synthesizer Block Diagram

TRAK PING PONG Synthesizer

Using the PING PONG approach, the switching time isequivalent to that of the RF switch, which is on the orderof 20 to 500 nanoseconds, depending on the type ofswitch used. The settling time of the VCO-based,indirect synthesizer is more complicated; it is driven byseveral interrelated factors including the loop bandwidthof the phase lock loop, the switching speed specificationand phase noise requirements. TRAK, a leadingmanufacturer of high speed indirect synthesizers, offerstypical switching speeds as fast as 20 microseconds,corresponding to the suggested PRR threshold of 50kHz. The model shown in Table 1 and Figures 2 and 3exemplifies the effective use of the PING PONGtechnique in a radar application.


Model: APN102



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236 MHz

232 MHz

5 µsec. to within 500 kHz18 µsec to Phase setting

228 MHz

0 µsec. 20 µsec.

In this particular case the system gated phase noise (asummation of noise from multiple PRF spectral lines inthe (sin x)/x pulsed waveform) is dramatically improvedby optimizing the control loop bandwidth, therebyincreasing the sub-clutter visibility of the radar. Only byusing the more costly direct analog approach can oneachieve further reduction of the synthesizer phase noiseclose to the carrier. Smaller noise improvements can bemade by slowing the synthesizer speed whichcorresponds to a lower PRR. Thus, the noiseperformance of the synthesizer is a determining factor inthe selection of a synthesizer architecture.

Given that the system switching speed and noiserequirements can be met with a PING PONG synthesizer, let us now consider the advantages of thisapproach over the direct analog approach. First, we willbriefly review the differences in architecture and methods of implementation between the two types.

Direct analog synthesizers (See Figure 4) are based ona combination of fixed frequency sources, usingarithmetic operations to achieve resolution andconversion to the final output frequency. Typically, theparts count is high, consisting of multiple crystaloscillators; complex switch matrices; and multiple mixing,dividing, multiplying, amplifying and filtering stages.

PING PONG synthesizers use one or more VCOs perchannel, followed by a common frequency conversionscheme. Unlike single-tone crystal oscillators, VCOshave frequencies and bandwidths from 10 MHz to 10GHz. Consequently, indirect synthesis requires a lesscomplex frequency conversion scheme. In general, itrequires fewer components, most of which operate atlower frequencies and, therefore, costs less.

Figure 3. PING PONG Synthesizer Typical SSB Noise

Figure 2. Synthesizer Switching Time Curve

Table 1. Synthesizer Specifications

Specifications

Frequency Range: 1500-1800 MHzFrequency Step Size: 2 MHzSwitching Speed:

Between Channels: 500 nanosecondsSingle Channel: 25 microseconds

Output Power: +12 dBmSpurious: -60 dBcHarmonics: -40 dBcReference: L BandSize: 6” x 9” x 1.5”


Model: APN102



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REF.Signal

REF.Signal

VOC

VOC

SYNTHESIZER #2

SYNTHESIZER #1

÷N

÷NX 2

SPDT

SPDT

SPDT

Now, let us consider how this affects the issues of size,power consumption, reliability and cost.

Size - The size of the final assembly is directly related to the parts count, the size of the frequency generatingsource(s), and the number of upconversion stages. Mostsignificantly, the size of a single multiplied crystaloscillator may be equivalent to that of a single,multi-octave VCO. This means a direct analog synthesizer can have ten crystal oscillators versus aPING PONG synthesizer with two VCOs (one perchannel). Consequently, the size of the PING PONGversion may be one-third to one-tenth that of theequivalent direct version.

DC Power - Consider again that a direct analogsynthesizer may require ten crystal oscillators, ratherthan two VCOs, and that the number of upconversionstages in the direct analog synthesizer may be two orthree times that of the indirect version. As a result, thepower dissipation of the direct analog type will be threeto ten times greater than the PING PONG synthesizer.

Reliability - The MTBF is a function of parts count,power dissipation, architecture complexity, and platform.Because the PING PONG design is less complex thanthe direct analog design, it is a more reliable unit. TheMTBF of the PING PONG type may be up to ten timesbetter than the direct analog version.

Cost - The cost is driven mostly by the complexity of thearchitecture, component operating frequency and thetotal parts count. Since the direct analog type uses moreoscillators and upconverting stages, its cost may be asmuch as five times that of the PING PONG approach.

In summary, the PING PONG synthesizer providesdistinct volume, weight, efficiency, reliability and costadvantages over direct analog versions when the systemPRR and phase noise requirements permit the use ofthis approach. TRAK Microwave has designed andmanufactured this architecture for commercial andmilitary radar applications. We invite system designers toconsider this architecture.

Figure 5. PING PONG Synthesizer Block Diagram

Figure 4. Direct Analog Synthesizer Block Diagram

BIT

BIT

BIT

BIT

BIT

“No RF”10 X 3SWITCHMATRIX

X N

X 5

X 4÷ 2

÷ 10

Frequency SynthesizersApplication Note: Specifying Synthesizers

Model: APN104



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I. IntroductionMajor subsystems such as frequency synthesizersshould be defined in terms of both the system levelrequirements and the limitations of the available and/orselected synthesis techniques. System levelrequirements, including performance, maintainability andcost, can be directly and significantly driven by asynthesizer’s architecture and its inherent performanceor size limitations. Consequently, defining exactly howmuch performance is necessary (or even possible)becomes a multi-faceted task, requiring an understand-ing of interrelated parameters. In support of the systemengineer, TRAK addresses the advantages anddisadvantages of different synthesizer architectures andidentifies major cost-drivers. Then we discuss thesynthesizer performance in terms of the systeminterface, covering issues such as multi-mode operationand built-in test.

These general concepts are presented here as a guideto writing a synthesizer specification that details the bestoverall performance while remaining cost-effective.

II. Architectural CritiqueAs discussed on page 80, there are essentially fourtypes of synthesis techniques: indirect; direct analog;

direct digital (DDS); and a combination of two or more ofthese types. As shown in the chart below, stand-alonedirect and indirect techniques have unique, intrinsicperformance advantages as well as limitations.

III. COST DRIVERSWhen judging which architecture is best suited for aspecific application, a system designer should firstcarefully address the four most critical performancecharacteristics that determine a synthesizer’sarchitecture: operating bandwidth, phase noise,switching speed, and step size. These characteristics notonly dictate the type of synthesis technique utilized butalso affect the cost of the overall unit.

Operating Bandwidth - Bandwidth is the mostsignificant cost driver for any synthesizer design. Basedon current technology, the typical DDS bandwidth isseverely limited because of its inverse relationship to thespurious content. Commonly, a 15 MHz bandwidth DDScan have -70 dBc spurious while a typical 300 MHzbandwidth DDS has a poor -40 dBc spurious level. Usingvarious conversion techniques, direct digital designs canbe configured to cover wide operating bandwidths;however, the complexity of the subsystem increases

Note 1: Speeds < 1 µsec are achievable using PING PONG configuration which can be construed as acombination synthesis technique. See the PING PONG application note.

SYNTHESIZER ARCHITECTUREIndirect Direct Analog Direct Digital

Advantages Advantages Advantages

Broad Band Operation Speeds < 1 µsec easily achieved Speeds < 1 µsec easily achieved

Low Spurious Very Low Phase Noise Very Low Phase Noise

Low Phase Noise Versions: Switching is phase coherent &

• Multi-Loop phase continuous.

• Frational N Resolution is Sub-Hertz

Superb Modulation Capabilities

Minimum number ofmicrowave components

Low DC Dissipation

MIL Grade Parts Available

Disadvantages Disadvantages Disadvantages

Speeds < 1 µsec not possible Note 1 Narrow Band Operation typical Narrow Band Operation typical

Phase Noise close-in is limited Wideband versions are complex: Wideband versions use

• Size becomes large combination synthesis:

Limited Modulation Capabilities • Spurious hard to reject • Size becomes large

No Phase Continuous Switching • Spurious hard to reject

High DC Dissipation

Low MTBF

Limited Modulation Capabilities

output frequency (phase) at 10 GHz. See Figure 1.For the sake of general comparison, the bar graph below(Figure 2) shows how the switching speed can varydepending on the particular synthesis architecture. Thereference point is defined as settling time to within 1 MHzof the final frequency. The wide range of performancerepresents synthesizers designed for specificapplications.

The speed of the DDS is typically limited by logic andpipeline delays multiplied by the clock period.Direct analog synthesizer speeds are a function of RFswitch speeds. Because these fundamental switchingmechanisms are so fast, post filtering – subsequent filterbandwidths – may degrade the speed of either the DDSor the direct analog synthesizer. The slower, indirectsynthesizer speeds are a function of the phase lock loopcharacteristics and depend on step size and phase noiserequirements as previously mentioned. Indirectsynthesizer settling can be on the order of severalmilliseconds, as fast as tens of microseconds, or using aPING PONG configuration under 1 microsecond. (Seethe PING PONG Application Note on APN102.)


Model: APN104



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10 nsec

DDS

500 nsec 1 µsec 1 msec 10 msec10 µsec

Direct Analog Indirect

Ping-Pong

+20 kHz

+10 kHz

-10 kHz

< 50 msec to within 10 kHz

10 GHz

-20 kHz400 µsec

CH1STROBE

CH2

0 50 µsec 200 µsec

dramatically. Direct analog designs are also limited inoperating bandwidths; as the number of channelsincreases, the number of sources or the complexity ofconversion schemes can become so great they becomeimpractical. Indirect synthesizers, based on tunable,broadband oscillators such as VCOs, are best-suited formulti-octave applications. In any case, the wider thebandwidth, the more complex, larger and costly thesynthesizer becomes.

Phase Noise - The phase noise performance of afrequency synthesizer is primarily a function of the typeof fundamental oscillator utilized in each architecture.Direct digital and direct analog synthesizers haveexcellent noise, while VCO-based indirect types havecomparatively moderate-to-good phase noiseperformance.

DDS noise is essentially that of the input clock, but notlower than the logic family noise floor. The noise of adirect analog synthesizer is that of the fundamentaloscillator degraded by 20 log n, where n is themultiplication factor used to reach the highestsynthesizer output frequency. The phase noise perform-ance of the indirect synthesizer is a function of severalfactors: the noise of the reference oscillator and VCO(s);the 20 log n degradation, where n represents the maxi-mum division ratio in the PLL; the effects of the phasedetector and loop bandwidth; and, indirectly, the switch-ing speed and step size requirements. Fast switchingspeeds imply wider loop bandwidths which can degradenoiseperformance at offsets far from the carrier; small stepsimply higher division ratios which also degrade noise.Alternative multi-loop or fractional-n type designs doimprove the noise performance, within the loopbandwidth of the indirect synthesizer, but at the cost ofincreased complexity and spurious, respectively.

Assuming a moderate bandwidth of 5% or greater, thelower the phase noise, the more complex, larger andcostly the frequency synthesizer becomes.

Switching Speed - Switching speed is defined as thetime it takes the synthesizer to reach the final frequencywithin a specified frequency or phase tolerance,measured from 50% of the “switch” command. Forexample, a synthesizer may settle in 50 microseconds towithin 10 kilohertz (or even a few degrees) of the final

Figure 1. Switch Speed Management

Figure 2. Switch Speed vs. Synthesis Technique


Model: APN104



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Overall, as the frequency bandwidth and the switchingspeed increase the more complex, larger and costly thefrequency synthesizer becomes.

Step Size - Direct analog synthesizers achieveresolution through a combination of source selection andcomplex arithmetic manipulation. Indirect synthesizersstep in frequency simply by changing the frequencydivision ratios in the PLL, although small steps – inconjunction with fast switching – can limit thesynthesizer’s phase noise performance. For example,assuming a coarse stepping indirect synthesizer and60 dBc reference signal suppression, the stepsize/speed relationship can be summarized as follows:

For phase settling to within 5°:Switching Speed (seconds, max.) = 200/Step Size (Hz)For frequency settling to within approximately onestep size:Switching Speed (seconds, max.) = 50/Step Size (Hz)

This relationship is driven by the value of the loopbandwidth, which is no more than 1/20 of the step sizefor 60 dBc suppression.

With direct digital synthesizers, the step size is a functionof the clock frequency and number of phaseaccumulator bits. Sub-hertz resolution is achievable oversmall bandwidths and DDS integration into a morecomplex direct analog or indirect subsystem is always anoption for achieving fine resolution at higher frequenciesor over broad bandwidths, but with probably higherspurs.

In general, as the operating bandwidth increases and thestep size decreases, the more complex, larger and costlythe synthesizer becomes.

To illustrate the magnitude of performance (and cost)variations for synthesis techniques, the performance of ahypothetical 500 MHz bandwidth X-Band synthesizerusing various synthesis techniques, is compared in Table2. Figures 3 - 7 represent possible designs for each ofthe five techniques presented.

IV. SYSTEM CONSIDERATIONSWhile Table 2 clearly shows the performance/costrelationship, it also calls attention to the significance ofprioritizing performance parameters in terms of thesystem application. Consider that as synthesizerarchitecture grows in complexity, it also increases inparts count. This implies larger size and increasedpower consumption, which are counter to requirementsfor low weight and high reliability. In other words, anoverspecified unit may force a design which does notmeet all the system objectives. Consequently, prioritizingperformance parameters becomes extremely important.What is most critical to the system? Is it speed, singlesideband phase noise, MTBF, form-fit replaceability, or acombination of these factors?

Prioritizing synthesizer performance and understandingdesign trade-offs can aid the system designer to identifyand weigh design alternatives so that the best possibleperformance is achieved with minimum hardware.

For instance, a customer required a synthesizer for asystem where size, noise and speed—in decreasingorder of importance—were the most critical performance parameters.

The small size dictated a single loop indirect synthesizerdesign so, in order to achieve the noise and speedrequirements simultaneously, a compromise wasrequired.

During discussions with the customer, it was determinedthat the system could operate in two modes. One modeoffered optimized switching speed at the sacrifice ofphase noise levels far from the carrier while in thesecond mode, the converse was true: phase noiseperformance had to be optimized at the cost of speed.TRAK was able to provide a solution by usingmode-selectable fractional synthesis techniques as wellas variable loop parameters.


Model: APN104



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Accordingly, when defining the synthesizer performance,a system designer should ask questions such as:

Operating Bandwidth:Is the operating band necessarily continuous? Are there default operating frequencies for particular modes of operation?

Phase Noise:Is noise important only at specific offsets, such asclose-in vs. far-out? Can switching speed be reduced in order to providebetter noise? Is the actual requirement an integrated noisespecification?

Switching Speed:Can the noise be relaxed in order to achieve faster switching?Can the unit settle in different speeds during different modes of operation?

Is it a radar application, and is the PRR 50 kHz or lower? (This allows for use of PING PONG synthesis.)

Step Size:Is the step size continuous across the entire band? Is the next output frequency a “known” frequency? (Necessary for PING PONG.)

Coherency:Is it necessary to have phase coherency with anexternal reference? Is phase repeatability necessary?Must frequency steps be phase continuous?

Table 2. Comparative Analysis of Synthesizer Techniques

Notes:1. Based on X-Band unit with ≤ 500 MHz BW. All other parameters held at typical values listed in chart. Also, assume internal reference @ 100 MHz with following SSBphase noise:

- 155 dBc/Hz @ 1 kHz offset - 165 dBc/Hz @ 100 kHz offset 160 dBc/Hz @ 10 kHz offset - 165 dBc/Hz @ 1 MHz offset2. Quantity indicates increasing cost factor. Estimates based on Note 1 above, and - 60 dBc spurious.3. TRAK offers resolution as small as 1 Hz. Typical values for comparison only.

Architecture Indirect Combination PING PONG Direct DirectParameter (VCO-Based) (Indirect & Direct) (Dual Indirect) (XO-Based) (Comb-Based)

Frequency .1 - 28 GHz .1 - 28 GHz .1 - 28 GHz .1 - 28 GHz .1 - 28 GHzRange

Typical 500 MHz thru 500 MHz thru 0.1 - 1 GHz 0.1 - 1 GHz 1 GHzBandwidth Multi-Octave Multi-Octave

Switching < 5 msec, max. < 500 µsec, max. < 10 µsec, max. < 10 µsec, max. < 10 µsec, max.Speed < 500 µsec, typ. < 100 µsec, typ. < 500 nsec, typ. < 500 nsec, typ. < 500 nsec, typ.

Step Size Note 3 1 MHz, typ. 1 MHz, typ. 5 MHz, typ. 10 MHz, typ. 100 MHz, typ.

SSB Phase Noise Note 1

1 kHz offset - 40 dBc/Hz - 95 dBc/Hz - 106 dBc/Hz - 112 dBc/Hz - 110 dBc/Hz10 kHz offset - 40 dBc/Hz - 100 dBc/Hz - 108 dBc/Hz - 122 dBc/Hz - 118 dBc/Hz100 kHz offset - 60 dBc/Hz - 95 dBc/Hz - 108 dBc/Hz - 125 dBc/Hz - 120 dBc/Hz1 MHz offset - 100 dBc/Hz - 125 dBc/Hz - 130 dBc/Hz - 130 dBc/Hz - 120 dBc/Hz

DC Power Note 1 10 W 25 W 25 W 70 W 15 W

Size Notes 1, 2 5.4˝ x 5˝ x 1.6˝ 8˝ x 5.4˝ x 3.1˝ 9˝ x 8˝ x 1.3˝ 7˝ x 6˝ x 4˝ 5˝ x 5˝ x 1˝

Cost Notes 1, 2 * ** *** **** **

Applications Satcom, Comm, EW, ECM, Radar, EW, ECM, Radar, EW, EW, Simulators,Data Link, Converters Converters, Receivers Simulators, Receivers, Simulators, Receivers, Receivers, Converters

Converters Converters

Special Notes Lower cost with good Moderate cost & very Alternative to Direct Fast, although, Moderate cost withperformance; good performance; Analog Synthesis. large and costly. fast speed and goodfractional synthesis fractional synth. can PRR ≤ 50 kHz. noise. Coarse steps.can be used. be used.

See Figure 3 See Figure 4 See Figure 5 See Figure 6 See Figure 7

V. PERIPHERAL CONSIDERATIONSBeyond the major performance specifications, there aremany “minor” factors that, when properly defined, canenhance the overall performance, integration andmaintainability of a synthesizer subsystem, withoutsignificant cost impact.

Consider the Interface:Is tight output flatness necessary, or is theresubsequent system-level compression? Is decoded logic available? Is BITE beneficial for maintainability reasons?

Consider the Environment:Does wide temperature performance necessarily meanmilitary-grade parts are needed? Is the unit in a shielded or shock mountedenvironment? What performance variations are tolerable undervibration, if any?

Consider Other Cost Factors:Parts Selection - MIL screened piece parts vs. ceramicand/or plastic parts screened at the system level. (Inlight of the recent industry trends in reducing themanufacturing and availability of MIL grade parts,end-item screening can significantly reduce cost.)

Test Data - Is extensive electrical testing required? Isextensive environmental testing necessary? (UsingTRAK standard test procedures may be less costly.)

VI. SUMMARYThe key to providing the best-suited custom synthesizerdesign is to fully understand the system application andestablish a hierarchy of performance requirements. Thisrequires open dialogue between the customer andmanufacturer in which both parties are challenged toachieve state-of-the-art performance withoutcompromising the overall system technical or costrequirements.

By understanding the limitations of various synthesistechniques, recognizing the key cost-driving parameters,and addressing alternative modes of operation, thesystem engineer can better define the fundamental andperipheral performance parameters so technical andbudgeting concerns can be met.

Please use our Synthesizer Specifier and give us a callso we may assist you in your system design.


Model: APN104



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



÷N ÷8

÷8

1 MHz

TUNINGCONTROL

VCO

10-10.5 GHz1 MHz STEPSSPEED ≤ 1msec

L-BANDINDIRECT

SYTH.

L-BANDINDIRECT

SYTH.

TUNINGCONTROL

REF.

REF.

REF.

REF.

100 MHz

SP2T SP2T

SP2T

X95 X98

10-10.5 GHz1 MHz STEPSSPEED = 200 nsec(100 µsec, SINGLE CHANNEL)

General Specifications for Comparitive X-BandArchitectures

� 10 - 10.5 GHz

� 60 dBc Spurious

� All Other Parameters Per Typical Values Listed In Table 2.

Figure 4. Combination Synthesis

Figure 5. PING PONG Synthesis

Figure 3. Indirect: VCO-Based Synthesis

÷NX115

÷10

FRACTIONALDIVISION

1/10

10-10.5 GHz1 MHz STEPSSPEED = 200 µsec

100 MHz

TUNINGCONTROL


Model: APN104



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



÷8 ÷8SWITCHFILTERBANK

8X4SWITCHMATRIXASSY.

8CHANNELSOURCE

BANKD=64 MHz

TUNINGCONTROL 64 MHz STEPS

1 MHz STEPS8 MHz STEPS

10-10.5 GHz1 MHz STEPSSPEED = 200 nsec

100 MHz

COMB

10-10.5 GHz100 MHz STEPSSPEED = 200 nsec

SPDT

MULTIPLEXER

Figure 6. Direct Analog Synthesis: XO-Based

Figure 7. Direct Analog Synthesis: Comb Generator-Based

Note 1: K is a ratio of the input reference signal divided by theselected step size as defined below:Group A: K = Ref. Signal

Step SizeGroup B: K = 1/2 [Ref. Signal/Step Size)Group C: K = 1/4 [Ref. Signal/Step Size)K must be an even divisible and be a number over therange of 1 to 1023.The output noise will degrade if K < 10.

SynthesizersCatalog, Indirect Synthesizers 0.4 - 4.95 GHz

Model: SYN 60-000 Series



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range: 0.4 to 4.95 GHzOperating Bandwidth: See Table 1Output Power: + 8 dBm, minimumFrequency Stability: Same as Ref. inputInput Reference: Note 1

Frequency – 10 to 100 MHzPower – + 3 to + 9 dBm

(Sine or TTL, 50 ohm)Step Size: 200 kHz to 50 MHzSwitching Speed: See Table IIPhase Noise: See Figure 1Output VSWR: 2.0:1, typicalHarmonics: - 15 dBc, maximumSpurious: See Table IIPower Supply: + 14 to 18 voltsDC Current: See Table IBITE Scheme: Phase Lock (“0” = lock)Digital Control: Parallel, TTL


Standard Operating Temperature: 0 to + 70 °C(See Options)


Size: See PackagesRF Connectors: SMA or GPO

Options

- 002 Extended Operating Temp.: - 54 to + 85 °C

Typical Phase Noise @ 1.0 GHz

10 MHz Step 200 kHz Step

SS

B L

evel

(d

Bc/

Hz)

-50

-70

-90

-110

-130

-150

-1701 5 10 100 1000 10000


Figure 1

Features:

� Small Size

� Versitile Design

� Wide Range of Options

Pin No. Description

1 BIT 12 BIT 23 BIT 34 BIT 45 BIT 86 No Connection7 BIT 108 No Connection9 No Connection10 No Connection11 BIT 1212 + 15 Vdc13 Ground14 BIT 015 LOCK (Logic 0 = Lock)16 BIT 517 BIT 618 BIT 719 BIT 920 BIT 1121 BIT 13

Frequency Range Model Number Current Group(GHz) (mA, maximum)

0.4 to .6 60-000-9X00-000 320 A.6 to .9 60-000-9X01-000 320 A

.9 to 1.25 60-000-9X02-000 320 A1.25 to 1.6 60-000-9X03-000 320 A1.6 to 2.1 60-000-9X04-000 340 B2.1 to 2.5 60-000-9X06-000 340 B2.2 to 2.8 60-000-9X07-000 380 C2.7 to 3.25 60-000-9X08-000 380 C3.1 to 3.75 60-000-9X09-000 380 C3.75 to 4.35 60-000-9X10-000 380 C4.35 to 4.95 60-000-9X11-000 380 C

SynthesizersCatalog, Indirect Synthesizers 0.4 - 4.95 GHz

Model: SYN 60-000 Series



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Ordering Information:Specify the Model Number from Table I by replacing the “X” with the desired step size designation number from Table II. Designate extended operating temperature option by

changing the last three digits of the model number from -000 to -002. Example: Model 60-000-9100-002 is a .4 to .6 GHz synthesizer with 0.2 MHz step size and extended

operating temperature option.

TABLE I – MODEL NUMBER SELECTION GUIDE TABLE III - PIN Descriptions

Step Size Switching Speed Spurious Designator(MHz) (µs, maximum) (dBc, maximum) Number

Group A Group B Group C

.2 1200 2400 4800 - 55 1

.5 600 1200 2400 - 55 21 300 600 1200 - 55 32 150 300 600 - 60 45 100 200 400 - 60 510 50 100 200 - 60 620 25 50 100 - 65 750 25 50 100 - 65 8

TABLE II – STEP SIZE DESIGNATOR

1.500±.005

REF IN2X.74

J1

J2

4X.25

4X.25

2.400±.005

THRU4XO .104+.005 -.002

2X.125 2X 1.250

RF OUT

MATES WITHMDM 21 SOCKET

MDM 21P

2X 2.150

2X .125

4X.15

.82

0

.460 MAX

8X.32.25

P/NSY

NT

HE

SIZ

ER

S/N

MF

G D

AT

E

SynthesizersFast Indirect Frequency Synthesizer, 0.55 - 1.85 GHz

Model: SYN085

Note 1: Resolution as fine as 500 kHz is available, although otherperformance parameters may vary.

Note 2: Phase noise listed is relative to the phase noise of the input reference oscillator and is based on Mode 1 operation.



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range: 0.55 - 1.85 GHz, approximateStep Size: Note 1 1 MHz (Mode 1)

4 MHz (Mode 2)Switching Speed: 80 µs, max to within 1 MHz

(Mode 1)35 µs, max to within 1 MHz(Mode 2)

Output Power: + 15 dBm ± 1 dB, nominalSSB Phase Noise (dBc/Hz, typical): Note 2

Offset1 kHz - 90

10 kHz - 90100 kHz - 95

1 MHz - 12610 MHz - 142

Reference Input: 100 MHz @ - 5 dBm, nominalSpurious: - 65 dBc, maximumHarmonics: - 15 dBc, maximumTuning Control: Custom parallel TTL, LatchedBITE Scheme: RF Power & Lock bitsDC Power: + 15 V @ 325 mA, typical

- 15 V @ 55 mA, typical+ 5 V @ 410 mA, typical

Power Consumption: 6.2 W, typical; 7.75 W, max




Size: (nominal) 4.5 x 2.5 x 0.8 inches114 x 64 x 20 mm

Weight: 10 oz (284 g) nominalRF Connectors: GPO

SPDT

PLLASSY

FPGALOGICASSY

VARATT

AMP AMP10dB

DET

RF BIT

550-1850 MHzSTEP SIZE 1 OR 4 MHz

100 MHz

TUNEWORD

Features:

� Fast Switching: < 35 µs


� Low Spurious: ≤ 65 dBc

� Wide Temperature Range: - 55 to + 95 °C

SynthesizersFast Indirect Synthesizer, 0.6 - 1 GHz

Model: SYN086



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Switching speed is measured to within 100 kHz of the finalfrequency.

Note 2: Output noise performance is relative to the noise level of the input reference signal.


Synthesizer Output, J1Frequency Range: 575 - 1075 MHzStep Size: 25 MHzSwitching Speed: Note 1 95 ns, typicalOutput Power: + 10 dBm ± 2 dBSSB Phase Noise (dBc/Hz, typical): Note 2

Offset Fout @ 1075 MHz100 Hz - 80

1 kHz - 11010 kHz - 130

100 kHz - 1301 MHz - 132

10 MHz - 140≥ 100 MHz - 143

Reference Input: 100 MHz @ + 9.5 dBm, nominalAccuracy: Same as reference inputSpurious (maximum) :- 65 dBc (in-band)

- 50 dBc (out-of-band)Harmonics: - 60 dBc, typicalVSWR (maximum): 2.0:1Tuning Control: 6 bit TTL, ParallelDC Power (typical): + 15.5 V @ 385 mA

+ 5 V @ 325 mAPower Dissipation: 7.6 W, typical

Features:

� Fast Switching: < 100 ns, typical


� Low Phase Noise: - 130 dBc @ 10 kHz offset

� Small Size: < 30 cubic inches

RF

SW

RF

SW

RF

SW

RF

SW

RF

SW

RF

SW

575-1075 MHz

∆ = 100 MHz

100 MHz

∆ = 25 MHz

4•


Operating Temp.: - 20 to + 85 °C, baseplateEnvironment: Airborne and Ground


Size (no connectors): 6.5 x 4.6 x 0.95 inches165 x 117 x 24 mm

Weight: 2 lbs (907 g), maximumConnectors: 26 Pin “Sub-D”, SSMA - Female

SynthesizersMiniature Indirect Synthesizer, 0.725 - 1.275 GHz

Model: SYN087



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range: 725-1275 MHzStep Size: 5 MHzSwitching Speed: 25 µs maximum to within 100 kHz

of the final frequencyOutput Power: + 10 dBm ± 1 dB, typicalSSB Phase Noise @ 725 MHz (dBc/Hz, typical):

Offset100 Hz - 80

1 kHz - 10310 kHz - 103

100 kHz - 1001 MHz - 118

10 MHz - 142100 MHz - 150

Reference Signal: 100 MHz input @ 0 dBm, nominalAccuracy: Same as Reference InputSpurious: - 60 dBc, maximumHarmonics: - 25 dBc, max; - 30 dBc,typicalTuning Control: 7 bit Parallel (not decoded)BITE Scheme: Phase Lock BIT

(TTL “0” = lock indicated)DC Power: + 15 V @ 310 mA, nominalPower Consumption: 4.65 W, nominal

Features:

� Low Phase Noise Under Vibration

� Fast Switching: ≤ 25 µs

� Small Size: < 1.7 cubic inches & < 3 ounces


� BIT for Phase Lock


Operating Temp.: - 20 to + 85 °C, baseplateEnvironment: Airborne


Size (no connectors): 2.4 x 1.5 x 0.46 inches61 x 38 x 12 mm

Weight: 2.4 oz (68 g), maximumRF Connectors: GPO (or Field Replaceable SMA)DC Connector: Feedthru Pins

SynthesizersIndirect Synthesizer, 1 - 2.5 GHz

Model: SYN089



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Step sizes as low as 1 MHz are available.


Frequency Range: 1 - 2.5 GHzStep Size: 2 MHz, typicalSwitching Speed: 175 µs, typicalOutput Power: + 10 dBm ± 2 dBSSB Phase Noise (dBc/Hz, typical):

Offset10 kHz - 95

100 kHz - 100 1 MHz - 130

Reference Signal: External @ 10 MHzStability: Follows Input ReferenceSpurious: - 60 dBc, maximumHarmonics: - 15 dBc, maximumOutput VSWR: 2.0:1, typicalTuning Control: 16 BIT, TTL, plus strobeBITE Scheme: Phase Lock & RF bitsDC Power: ± 15 V, + 5 V (< 9 W)

1.0-2.5 GHz2 MHz STEPS

VCO

VCO

10 MHz REFSIGNAL INPUT

PLL

SPDT

Features:

� Wide Bandwidth

� Fast Switching: 175 µs, typical

� Small, Modular Package

� Second Tray Option up to 18 GHz


Operating Temperature: - 30 to + 70 °CEnvironment: Ground


Size (excluding connectors): 5.4 x 5 x 1.6 inches137 x 127 x 41 mm

Connectors: SMA

SynthesizersDual Indirect Synthesizer “Ping-Pong”, 1.5 - 1.8 GHz

Model: SYN090



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Performance variations offered in the same volume may affect other specifications.

Note 2: Switching speed is specified to within ± 5° of the finalfrequency. See application note on Page 104.


Output, Ref. Input, LO Input,Port 1 Port 2 Port 3

Frequency Range: 1.5 - 1.8 GHz 64 MHz 1920 MHzStep Size: 2 MHz, typicalSwitching Speed: Note 2

Channel to Channel 500 ns, maximumSingle Channel 25 µs, typical

Output Power: + 12 dBm, typ ECL + 10 dBmPower Flatness: ± 2 dB ± 2 dBSSB Phase Noise (dBc/Hz, typical):

Offset1 kHz - 110 - 150 - 117

10 kHz - 112 - 155 - 127100 kHz - 123 - 155 - 127

1 MHz - 140 - 155 - 137Accuracy: Same as Reference InputSpurious: - 60 dBc, maximumHarmonics: - 40 dBc, maximumVSWR: 1.5:1, typical Tuning Control: 9 bit TTL, Parallel plus StrobeBITE Scheme: Amplitude & Phase Lock bitsRF Monitor Outputs: Port 5 & Port 6; 0 dBm ± 3dBDC Power: + 15 V @ 800 mA, typical

- 15 V @ 100 mA, typical+ 5 V @ 1500 mA, typical- 5 V @ 300 mA, typical



Operating Temperature: - 54 to + 55 °C, baseplateOperating Vibration: 20 grmsVibration Sensitivity: 5 x 10-10/gEnvironment: Various


Size (no connectors): 9 x 6 x 1.5 inches229 x 153 x 38 mm

Connectors: 44 Pin “D”, Blind Mate RFWeight: 4 lbs (1814 g), approximate

Features:

� Ultra Fast Switching: ≤ 500 ns

� Low Phase Noise

� High Vibration Operation: 20 grms

� Ping-Pong for Radar Applications

SynthesizersSmall Step Indirect Synthesizer, 1.6 - 2.7 GHz

Model: SYN091



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range: 1.6 - 2.7 GHzStep Size: 100 HzSwitching Speed: 350 µs to phase stabilityOutput Power: + 5 dBm ± 1.5 dB, typicalSSB Phase Noise (dBc/Hz,typical):

Offset10 kHz - 10050 kHz - 102

150 kHz - 112Reference Input: 5 MHz @ 0 dBmStability: Follows Input Reference SignalSpurious: - 80 dBc, maximumHarmonics: - 45 dBc, maximumTuning Control: 40 bit DifferentialBITE Scheme: Phase Lock bits & LEDsDC Power: ± 15 V, + 5 V ( 28 W) PLL3 PLL4

SP

DT

SP

DTPLL2

PLL6PLL5

SP6T

SP6T

PLL1

5 MHz 5 MHz 5 MHz

5 MHz

∆=5 MHz∆=200 MHz

5 MHz

50-54.9999 MHz=100 Hz

=100 Hz5.000-5.099 MHz

=1 KHz

5.00-5.09 MHz=10 KHz

TUNEWORD(÷N) (÷N) (÷N)

(÷N)

(÷N)

TUNEWORD

TUNEWORD

TUNEWORD

TUNEWORD

SWITCHEDFILTER BANK

1.6-2.7 GHz100 Hz STEPS

SWITCHEDFILTER BANK

PHASELOCKED

VCXO200 MHz

5 MHz

÷10÷10÷10

∆

5.0000-5.0999 MHz∆

∆

∆

Features:

� Small Step Size: 100 Hz

� Low Phase Noise: - 112 dBc/Hz @ 150 kHz offset

� Low Spurious: - 80 dBc

� Iterative Design





Weight: 14 lbs (6.35 kg), max

SynthesizersModulated Synthesizer, 2.9 - 3.1 GHz

Model: SYN093



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Measurements without heat sink


Frequency Range: 2.9 - 3.1 GHzStep Size: 250 kHzSwitching Speed: 500 µs, typicalOutput Power: + 32.0 dBm ± 1 dBSSB Phase Noise (dBc/Hz, typical):

Offset1 kHz - 80

10 kHz - 85100 kHz - 100

1 MHz - 12010 MHz - 145

Modulation Clock: 10 MHz, Differential TTLTest Output: 480 MHzSpurious: - 50 dBc, maximumHarmonics: - 45 dBc, maximumOutput VSWR: 1.3:1, maximumTuning Control: 10 bit Parallel, Differential TTLBITE Scheme: Failure Alarm & Parity bitsPulse On/Off Ratio: 60 dB, minimumModulation: Continuous Shift Quadraphase,

13 bit Barker CodeDC Power: ± 15 V, + 5 VPower Consumption: 23 W (Pulsed)

2.6 GHz 3.0 GHz 3.1 GHz

< 1 dB VARIATION

+75 ˚C

-51 ˚C

+25 ˚C+33 dBm

+32 dBm

+31 dBm

Features:

� Variable Modulation Schemes

� High Power Output: 1 W minimum

� Bit Detection

LOGICDECODEDDS

PLL

CONTROL

2.9 GHz - 3.1 GHz250 KHz STEPS

BITS

RF BIT

10 MHzREF IN

480 MHz

TCXO480 MHz

TUNEWORD

Environmental SpecificationsOperating Temperature: - 54 to + 75 °C, baseplateEnvironment: Various

Mechanical SpecificationsSize (no connectors): Note 1 9 x 6.1 x 1.8 inches

229 x 155 x 46 mmWeight: Note 1 3 lbs (1.36 kg)RF Connectors: SMA FemaleDC Connector: 50 pin Type D

Power Output vs. Frequency and Temperature

SynthesizersDirect Synthesizer, 3.25 - 4.75 GHz

Model: SYN094



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Phase noise listed is relative to the phase noise of the input reference oscillator. See plot of typical SSB levels.


Frequency Range: 3.25 - 4.75 GHzStep Size: 500 MHzSwitching Speed: 1 µs, maxOutput Power: + 15 dBm ± 2 dB

(dual output), nominalSSB Phase Noise (dBc/Hz, typical): Note 1

Offset1 kHz - 105

10 kHz - 108100 kHz - 113

1 MHz - 122Reference Input: 125 MHz @ - 5 dBm,

nominalSpurious: - 70 dBc, maxHarmonics: - 15 dBc, maxTuning Control: Custom parallel TTLBITE Scheme: RF Power bitDC Power: + 15 V @ 240 mA, max

+ 5 V @ 115 mA, max- 5 V @ 35 mA, max.

Power Consumption: 4.35 W, max

Features:


� Low Spurious: - 70 dBc


� Low DC Power: 4.35 watts

SP4T

SP4T

BIT

3.25-4.75 GHz500 MHz STEPS

125 MHzREFERENCE

INPUTSRD

X2





Weight: 10 oz (283.5 g), maxRF Connectors: GPODC Connector: MDM 15 pin

SynthesizersDirect Synthesizer, 7 - 9 GHz

Model: SYN096



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range: 7 - 9 GHz, 1 GHz BandwidthStep Size: 1 MHzSwitching Speed: 500 ns, maximumOutput Power: + 19 dBm ± 2 dBOutput Attenuation: - 60 dB for “No RF” stateVSWR: 1.5:1, maximumSSB Phase Noise (dBc/Hz, typical):

Offset10 kHz - 110

100 kHz - 1151 MHz - 120

Spurious: - 60 dBc, maximumHarmonics: - 60 dBc, maximum Tuning Control: 8 bit TTL plus Strobe BITE Scheme: AC Applied, RF Power,

Failure & Parity bitsAC Power: + 115 V, 400 Hz (85 W)

3X .00 - .30

CONN PERMIL-C-28840 5.00

MAX

15.00

DS

4

J3

CA

UT

ION

HIG

H V

OL

TAG

E

DS

3 A.C

. PO

WE

R

S1

BIT

DS2

SYNTH

DS1

SYNTHNO RF F

RE

Q M

HZ

CONN SMAFEMALE

CONNECTOR PERM24308/4-53X 10-32 UMF-2A

CAPTIVE MTG SCREW

CAPTIVE MOUNTINGSCREW-8PL

8.50 TYP

Features:

� Fast Switching: 500 ns, maximum

� Good Close-In Phase Noise

� Modular Construction

� Built-in Power Supply

BIT

BIT

BIT

BIT

BIT

“No RF”10 X 3SWITCHMATRIX

X N

X 5

X 4÷ 2

÷ 10




Size: (nominal) 15 x 8.5 x 5 inches381 x 216 x 127 mm

Connectors: M28840 & M24308 types

SynthesizersX to Ku Band Synthesizer “In Bands”, 8 - 15 GHz

Model: SYN099



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Note 1: Step sizes as low as 1 MHz are available.

PLL100 MHzREFERENCE

INPUT

8-15 GHz500 MHz BW5 MHz STEPS

LOGIC BIT

PLDRO

Features:

� Low Phase Noise


� Low DC Power Consumption: < 14 watts

� BIT for Phase Lock

� Small Size: < 31 cubic inches

� Low Weight: < 2 lbs


Operating Temperature: - 40 to + 85 °C, baseplateEnvironment: Airborne and Ground


Size (no connectors): 6 x 3.6 x 1.4 inches152 x 91 x 36 mm

Weight: 2 lbs (0.9 kg), maximumConnectors: Sub-D, 25 pin and SMA (F)


Frequency Range: 8 - 15 GHzBandwidth: 500 MHz, maximumStep Size: 5 MHz Note 1

Switching Speed: 250 µs to within 10 kHzof the final frequency

Output Power: + 10 dBm ± 2 dB, nominalSSB Phase Noise (dBc/Hz, typical):

Offset10 kHz - 90100 kHz - 1051 MHz - 125

Reference Signal: 100 MHz input @ 0 dBm, minAccuracy: Same as Reference InputSpurious: - 60 dBc, maximumHarmonics: - 30 dBc, maximumTuning Control: 8 bit Parallel plus StrobeBITE Scheme: Phase Lock bit

(TTL “1” = lock indicated)DC Power: + 28 V @ 180 mA, typical

+ 15 V @ 500 mA, typical+ 5 V @ 100 mA, typical

Power Consumption: 14 W, typicalMTBF: 25,000 hrs (+ 85 °C )

SynthesizersWideband Frequency Synthesizer, 10 - 20 GHZ

Model: SYN101



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range: 10 - 20 GHz, approximateStep Size: 5 MHz, typicalSwitching Speed: 150 µs, typicalOutput Power: + 5 dBm ± 2 dBSSB Phase Noise (dBc/Hz, typical):

Offset10 kHz - 70

100 kHz - 751 MHz - 115

10 MHz - 140Stability: ± 2 ppm, maxi; 0.2 ppm, typ.Reference Output: 100 MHz @ + 2 dBm ± 2 dBSpurious: - 60 dBc, max; - 65 dBc, typ.Harmonics: - 15 dBc, max; - 25 dBc, typ.Tuning Control: 11 bit Parallel TTL & StrobeBITE Scheme: RF Power & Phase Lock bitsOutput VSWR: 1.5:1DC Power: ± 15 V, + 5 V (35 W) 5.674.89

2X SMA CONNFEMALE

CONN, FEMALE, 37 PINPER M83513/04-FOIC

7.942.00

Features:

� Octave Frequency Coverage

� Small Package: 80 cubic inches

� Fast Switching Speed

� Suitable for High Vibration




Size: (nominal) 8 x 5 x 2 inches203 x 127 x 51 mm

Weight: 4.8 lbs (2.2 kg), maximumRF Connectors: SMA FemaleDC Connector: 37 Pin MDM

SynthesizersMulti Output STALO Synthesizers, X-Band

Model: SYN110



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599




LO 1 LO 2 LO 3 Freq. Range: X-Band L-Band 60 MHzStep Size: 36 28 MHzSwitching Speed: 10 10 µs, maxOutput Power: +16 +16 +3 dBmPower Flatness: ± 3 ± 3 ± 1.5 dBSSB Phase Noise

Offset dBc/Hz, typical100 Hz - 44 - 63 - 1001 kHz - 100 - 112 - 12510 kHz - 110 - 120 - 140100 kHz - 110 - 120 - 1401 MHz - 112 - 120 - 140

Spurious: - 60 - 60 - 60 dBc, maxHarmonics: - 60 - 60 - 50 dBc, max

Accuracy: ± 50 ppm (all outputs)Tuning Control: 4 bit TTLBITE Scheme: Phase Lock Bit (Logic “0” indicates loss of lock.)

DC Power: + 15 V @ 1600 mA, max- 15 V @ 350 mA, max+ 5 V @ 500 mA, max


Environmental SpecificationsOperating Temperature: - 54 to + 85 °C, baseplateEnvironment: Ground and Airborne

Mechanical SpecificationsSize: 4.31” x 7.125” x 1.5”

109 x 181 x 39 mmWeight: 5 lbs, nominal

2.3 kgConnectors: 9 Pin Sub-D, SMA

J3

J2LO

2

J1LO

1

J4COHO

+5V+15V

-15VG

ND

2X .195±.020[5±.5]

2X 6.730±.020[171±.5]

4.000±.020[101.5±.5]

2X .155±.020[4±.5]

.430±.020[11±.5]

7.125±.020[181±.5]

.395±.020[10±.5]

3.520±.020[89.5±.5]

2X .430±.020[11±.5]

2X R .235±.020[6±.5]

1.500±.020[38.1±.5]

4X .650±.050[16.5±1.3]

1.100±.050[28.0±1.3]

.420±.050[10.7±1.3] 1.140±.050

[29.0±1.3]1.220±.050[31.0±1.3]

CONN, 9 PIN D-SUB, PLUGPER MIL-C-24308.RETAINER, SLIDE LOCK

4.310±.020[109.5±.5]

.250±.050[6.35±1.30]

1.100±.050[27.9±1.3]

2X

.810±.050[20.5±1.3]

2.51±.050[63.75±1.30]

3.81±.050[96.75±1.30]

3X CONN, SMA, JACKPER MIL-C-39012

2X

3.64±.050[92.45±1.30]

.250±.050[6.35±1.30]

4X .177 THRU+.020-.005

[ 4.5 THRU]+.5-.1

.120±.020[3±.5]

(CANNON PN DE51224-1)

Features:Low Phase Noise

Fast Switching Speed

Small Package Design

Multiple RF Outputs

250 MHz Bandwidth on X-Band Output

SynthesizersUltra Wideband Synthesizers 2 - 18 GHz

Model: SYN111



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Features:

� 2.0 - 18 GHz Frequency Range

� 1 MHz Step Size


� Military Environments


Frequency Range: 2.0 -18.0 GHzSwitching Speed: 6 msTuning Resolution: 1 MHzHarmonics: - 25 dBc, maxSpurious: - 60 dBc, maxPhase Noise (max):

Offset SSB Level100 kHz - 65 dBc/Hz700 kHz - 90 dBc/Hz

Output Power: 25 dBm, minOutput Power Variation: ± 3 dBmInternal Reference: 16 MHz, ±50 ppmPower Supply:

Option 1: Option 2:26 [email protected] +5 [email protected]

+15 [email protected] [email protected]+26 VDC@100mA

Digital Inputs: TTL, 3 wire 19 bitWarm-up Time: 1 minute


Temperature Range:Operating: -40 to 90 °CNon-Operating -54 to 100 °C

Environment: Airborne


Size:Option 1: 6” x 5” x 2.7”Option 2: 6” x 5” x 2.0”

Weight:Option 1: 4 lbs.Option 2: 3 lbs.

RF Connectors: SMA(F)

DC & Control:Option 1: Cannon D, 21 pinsOption 2: MDM, 37 pins

SynthesizersWideband YIG Synthesizers, 5 - 10 GHz

Model: SYN112



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



Features:


Operating Temperature: - 40 to 85 °CEnvironment: Airborne


Size (nominal): 5.45” x 5.45” x .95”Weight: 3 lbs.

1.36 kg.RF Connectors: GPODC Connector: 37 pin, MDM


Frequency Range: 5 -10 GHz, approximateStep Size: 500 kHzSwitching Speed: 350 µs, steps up to 10MHzOutput Power: 17 dBm ±3 dB typicalSSB Phase Noise:

Offset SSB Level10 kHz - 48 dBc/Hz typical @10 GHz100 kHz -85 dBc/Hz typical @10 GHz1 MHz -125 dBc/Hz typical @10 GHz

Stability: ± 50 ppmSpurious: - 60 dBc, maximumHarmonics: - 30 dBc, maximumTuning Control: 14 bit TTL & StrobeBITE Scheme: Phase Lock BitDC Power: ± 14 V, ± 5 V (40W)Temperature Sensors: 10 µA/°C

� Octave Bandwidth

� Fine Frequency Resolution

� Built-In Test Function

SynthesizersDual Module Synthesizers, 9.5 - 10.9 GHz

Model: SYN145



Ph: 813-901-7200 Fx: 813-901-7491 Ph: 44-1382-427200 Fx: 44-1382-833599



Features:

10.03X R.260

Dimensions: Inches


Operating Temperature: 0 to 70 °CEnvironment: Ground


Size: 10” x 5” x 1.2”RF Connectors: SMA (F)DC Interface: 40 pin Santec


Frequency Range: 9.5 -10.9 GHzStep Size: 0.125 MHzOutput Power: 10 to 15 dBmSwitching Speed: 4 msStability: ± 3 ppmInternal Reference YesOutput VSWR 2.0:1Harmonics: - 25 dBcSpurious: - 65 dBcSSB Phase Noise:

Offset SSB Level10 kHz - 95 dBc/Hz100 kHz -115 dBc/Hz1 MHz -138 dBc/Hz

DC Power Voltage: ± 5, + 8.5, +20 VCurrent: 620, 1300, 15 mA

Two Independent X-Band Source Outputs forTX/RX

Adaptable Serial Interface

125 kHz Frequency Stepsize

Integrated Phase Noise (DSB) <0.2 deg ms

Low Cost and High Performance

Configurable in any 700 MHz Band

SynthesizersHigh Speed Direct Synthesizer, 9.25 - 19 GHz

Model: SYN146



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range: 9.25 - 19 GHzStep Size: ≈ 33 kHzSwitching Speed: < 500 nsecOutput Power: + 11 dBm, nominalSSB Phase Noise (dBc/Hz @ 19 GHz):

Offset100 Hz - 601 kHz - 9010 kHz - 112

Accuracy: ± 60 ppmSpurious: - 60 dBc, typicalHarmonics: - 50 dBc, maxTuning Control: 18 BIT parallel binary, TTLDC Power: + 15 VDC @ 1 A

+ 8 VDC @ 3 A- 8 VDC @ 0.6 A

Power Consumption: 43 W, max

Features:

� High Speed Switching <500 nsec

� Wide Bandwidth

� Small Size: <2400 cc

� Step Size As Small As: < 1 Hz


Operating Temperature: - 54 to + 95 °CEnvironment: Airborne


Size (nominal): 6.69 x 5.24 x 4.18 inches170 x 133 x 106.2 mm

Weight: 12 lbs (5.44 kg)RF Connectors: SMA (F)DC Connector: MDM 37



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599



SynthesizersDual Output Synthesizer, 9 - 10 GHz

Model: SYN147


CH1 CH2Frequency Range: 8.995 - 9.995 GHz 9.0 - 10.0 GHzStep Size: 5 MHz 20 MHzSwitching Speed: 1 msec 1 msecPulse Modulation: 1 µsOutput Power: + 10 dBm + 8 dBmPower Flatness: ± 2 dB ± 2 dBSSB Phase Noise (dBc/Hz, typical):

Offset0.1 kHz - 65 -701 kHz - 72 -7210 kHz - 72 -721 MHz -120 -120

Temp. Stability: ± 60 ppm ± 60 ppmSpurious: - 60 dBc, max - 60 dBc, maxHarmonics: - 55 dBc, max - 55 dBc, maxVSWR: 1.5:1 1.5:1Tuning Control: 3 Wire Serial 3 Wire SerialBITE Scheme: Phase Lock Phase LockDC Power: + 15 V @ 350mA, typical

- 15 V @ 50mA, typical+ 5 V @ 350mA, typical


Features:

� Dual Output

� Pulse Modulation Input

� Designed For Rugged Environment

� Low Phase Noise Under Vibration


Operating Temperature: - 40 to + 75 °, baseplateVibration Sensitivity: 1x10-9/g, typicalEnvironment: Missile



Weight: 2.2 lbs (1 kg) approx.Connectors: MDM - 25F, SMA RF

SynthesizersQuad Frequency Synthesizer, .65 - .95 GHz

Model: SYN148



Ph: 813-901-7200 � Fx: 813-901-7491 Ph: 44-1382-427200 � Fx: 44-1382-833599




Frequency Range: .65 - .95 GHzStep Size: < 1 kHzSwitching Speed: 65 µs, typicalOutput Power: + 13 dBm, ± 2.0 dBSSB Phase Noise (dBc/Hz, typica):

Offset100 Hz - 961 kHz - 10250 kHz - 1121 MHz - 125

Reference Signal: External @ 300 MHzStability: Follows Input ReferenceSpurious: - 60 dBc, typicalHarmonics: - 50 dBc, maxOutput VSWR: 2.0:1, typicalTuning Control: Parallel w/ Select & StrobeBITE Scheme: Phase Lock, RF PowerDC Power: + 15, -12, +5 V (36 Watts)

Features:

� 4 Independent Channels

� Fast Switching Speed: 65 µs

� Fine Step Size: < 1 kHz

� Small Package


Operating Temperature: - 30 to + 70 °CEnvironment: Ground



Weight: 4.7 lbs (21.32 kg)Connectors: SMA, Sub-D

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