ultra high reliable lead free alloy to meet high...
TRANSCRIPT
Ultra high reliable lead free alloy to meet high reliability requirement
(90iSC)
Henkel Loctite Corporation
AE Adhesive Electronics
South China
Technical Engineer
Forrest Lin
Cell Phone: + 86 13923738177
Email: [email protected]
August 27, 20142
Agenda
• Background
• Alloy research
• Theory
• Element selection
• Optimization
• Alloy property
• Physical property
• Reliability
• Questions
• Summary
August 27, 20143
Background
• Electronics industry implemented lead free, lead and lead alloy
forbidden
• Traditional lead free material SAC alloy facing challenges at high
reliable field, such as, aerospace, military , medical and automotive
etc..
August 27, 20144
Background continued
• As professional supplier Henkel Loctite fully recognized these issues
• From 2006, partner with customers, material suppliers and academy
together developing the new alloy.
• Definition new alloy CTQ
• Lead free
• Can withstand continuous 150 + Celsius
• Bear ultra high thermal shock (-55 ~ 150 Celsius)
• Reflow peak lower than 230 Celsius
• Meet ROHS
August 27, 20145
Partners
• Initiative • Siemens Berlin (central lab)
• Academy
• University of Bayreuth
• Fraunhofer inst. IZM
• Industrial customers
• Siemens
• Bosch
• Motorola
• Suppliers
• Henkel (Multicore)
• Stannol
• Cookson (Alpha Metals)
• Seho
• Infineon (Munich)
• TI (Munich)
• Epcos (Munich)
• Ruwel
August 27, 20146
Research
August 27, 20147
Theory
.constN plcf (Coffin/Manson)
pl = pl = pl reliability
SnAgCu 90iSCSnPb(Ag)
120°C 150°C80°C
equal cycles to failure N f
Hypothesis: Reducing plastic strain per cycle pl by increasing creep
resistance will increase cycles to failure N f
August 27, 20148
Alloy selection
Improving the creep strenth
Solid solution hardening
Disperse solution hardening
Grain refinement
Element selection
Bi Solid solution hardening, lower the
melting point.
Sb Solid solution hardening, increase
the alloy melting point.
Ni Disperse solution hardening
Elements RejectedIn Cost, slight toxicity
Cs toxic
Te highly toxic, Tm
Ce toxic, Eutectic 220 °C
Ba Compounds toxic, Tm
Fe Tm
August 27, 20149
Optimization
• Compression creep test
• Cylindrical samples
• 6mm diameter
• 9mm height
• Temperature range: - 40C to 175C
• Strain rates: 10-1 to 10-4 s-1
• Creep stress σ (N/mm2 plateau stress) is measured as a function of
strain rate
• Exponent n is slope in log-log plot
August 27, 201410
Optimization
True Stress:
1w
True Strain:
)1ln( w
Different alloy creep property
0
40
80
120
160
0 40 80 120
wahre Dehnung [%]
wa
hre
Sp
an
nu
ng
[N
/mm
²]
SAC SAC+Ni0,2
SAC+Sb5 SAC+Bi8
13105,5 s
T = 25 °C
K: Creep stress
(SAC=SnAg3.8Cu0.7)
Tru
e S
tres
s
True Strain
August 27, 201411
Optimization
• Different alloy creep property
Ambient
]/[ mmN
][ 1s
150C
0,0001
0,001
0,01
0,1
1
10 100 300
SnPb n=9
SAC n=10
6-part n=13
10 100
0,0001
0,001
0,01
0,1
1
5
SnPb n=5
SAC n=7
6-part n=7][ 1s
]/[ mmN
(SAC=SnAg3.8Cu0.7,
6 part = SAC+Bi3Sb1.5Ni0.2)
August 27, 201412
Optimization
80
100
120
140
160
180
180 200 220 240 260 280
Soldering temperature [°C] (Wetting tests)
Maxim
um
op
era
tin
g t
em
pera
ture
[°
C]
(Cre
ep
resis
tan
ce)
SnPb37
SAC
SAC+Ni0,2
SAC+Sb2,5
SAC+Sb3,75
SAC+Sb5
SAC+Bi4
SAC+Bi6
SAC+Bi8
SAC
+Bi+Sb+Ni
SAC+Bi+Sb+Ni
SnPb37
SnAg3,8Cu0,7Bi-addition
Ni-addition
Sb-addition
• Different alloy with different melting point:
August 27, 201413
Optimization
• 90iSC melting point range within 209 – 218℃.
-1.6
-1.2
-0.8
-0.4
0.0
150 175 200 225 250
Temperature [°C]
DS
C-S
ign
al
[mW
/mg
]
SnAg3,8Cu0,7
SnAgCu+Bi+Sb+Ni
Tsol = 217 °C
Tsol = 209 °C
Heating rate: 10 K/min
Potential for lowered reflow
temperature?
+ Thermal load component /PCB
+ Interface properties
90iSC Alloy Composition Solution: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15
Real running DSC
August 27, 201414
August 27, 201415
United States of America Patent
August 27, 201416
Alloy Performance
August 27, 201417
Physical property
• Alloy melting point range from 209 Celsius to 218 Celsius
• Other properties close to SAC 387
August 27, 201418
Metallergy
Structure of Standard lead-
free solder (SnAg3,8Cu0,7)
Sn-Matrix
Ag3Sn
Cu6Sn5
Structure of 6 component solder
(SnAgCu+Bi+Sb+Ni)
Sn-Matrix
(Sb,Bi)
Ag3Sn
(Cu,Ni)6Sn5
August 27, 201419
SEM
Structure of 6-part alloy
(SnAgCu+Bi+Sb+Ni)
Sn-Matrix
(Sb,Bi)
Ag3Sn
(Cu,Ni)6Sn5
Ag3SnBi
Ag3Sn
Bi
1 µm
10 µm
2 µm
20 µm
August 27, 201420
Reliability testing
August 27, 201421
90iSC, SAC387 and SN63 Thermal cycling
40 Chip-components from CR0402 -
CR2512 per Board, no failures on
TO263, QFP and SO16
TBG4
Electronical failure with thermal cycle
August 27, 201422
90iSC,SAC387 and SN63 thermal cycling comparison
Structure after
1000 Cycles
SnPb
SnAgCu
Innolot
(90iSC)
micro structure after 1k cycle
90iSC Solder SEM
August 27, 201423
90iSC Solder SEM
August 27, 201424
90iSC Solder SEM
August 27, 201425
90iSC EDX
August 27, 201426
90iSC IMC by EDX SEM Element Image
August 27, 201427
90iSC IMC EDX
August 27, 201428
Alloy Element EDX Quantification
August 27, 201429
Alloy micro shape and Angular
August 27, 201430
August 27, 201431
90iSC , SAC387 and SN63 Thermal cycling
Shear strength
1206 resistor
TBG1 / TCT –40/+125°C Solder alloy
August 27, 201432
90iSC and SAC387 Shear strength
Example: 0201 Chip resistor
Shows that 90iSC
alloy at –40 +150C
is equivalent to SAC
at –40 to +125C
Reliability
Hypothesis
Sh
ea
r S
tren
gth
90iSC solder
SAC+Bi3Sb1.5Ni0.2
August 27, 201433
Vibration testing
August 27, 201434
90iSC and SAC387 Vibration testing
Failure characteristics in vibration testing with/without thermal cycling (TCT), 0603 resistor
SAC alloy,
0 temperature cycles
90iSC alloy,
0 temperature cycles
SAC alloy,
500 temperature cycles
90iSC alloy,
500 temperature cycles
August 27, 201435
Vibration testing
Table vibrates vertically. Inertia
gives alternating stress in joint
Solder joints in a copper rod
clamped into a stainless steel
holder
Source: N. Barry PhD thesis
(Goodrich, Birmingham Univ.)
August 27, 201436
Vibration testing
Source: N. Barry PhD thesis
(Goodrich, Birmingham Univ.)
Vibration testing 2 FEA
August 27, 201437
August 27, 201438
Vibration test result
90iSC performs
similarly to SnPb
Clearly outperforms
SAC 305 & SnCu (Sn100C)
From Nathan Barry PhD
Thesis “Lead-free solders for
high-reliability applications:
high-cycle fatigue studies"
(Metallurgy and Materials
Dept, University of
Birmingham, October 2008).
Raw data
August 27, 201439
August 27, 201440
August 27, 201441
Drop test
August 27, 201442
Drop test result
August 27, 201443
Drop test result
OSP NiAu Combined
August 27, 201444
X-ray Analysis
Cu OSP / Voiding
QFN SO20
August 27, 201445
X-ray Analysis
Cu OSP / Voiding
CC1206 CR1206
August 27, 201446
Issues
• 90iSC alloy not compatible with Tin-lead surface finish of PCB and
component
• SnPbBi easily form low temperature eutectic (98C)
• 90iSC ONLY suitable for lead free process
• 90iSC slight lower spreading capability, solder wire difficult to
manufacture however Henkel developed well the halogen free – 0
halogen 90iSC C400 solder wire
August 27, 201447
Summary
• Within -40 to 150 Celsius thermal cycling found, 90iSC alloy
obviously better than SAC387
• Found after 500 cycling of vibration, 90iSC obviously better than
SAC387
• Very close performance at drop testing
• 90iSC uncompatible with tin lead surface finish and component metal
Thank you!