1 of 23 introduction to ltcc for engineers how to manufacture 3d circuits for microtechnique...
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![Page 1: 1 of 23 Introduction to LTCC for engineers How to manufacture 3D circuits for microtechnique applications? With LTCC ! Yannick.Fournier@epfl.ch Monday](https://reader035.vdocument.in/reader035/viewer/2022081421/56649d575503460f94a3675c/html5/thumbnails/1.jpg)
1 of 23Introduction to LTCC for engineers
How to manufacture 3D circuits for microtechnique applications?
With LTCC !
Monday 4 September 2006Thick-film Technology Group, Prof. P. Ryser Laboratoire de Production Microtechnique
http://lpm.epfl.ch/ltcc
Introduction for engineers
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2 of 23Introduction to LTCC for engineers
The LTCC ?
Low-Temperature, Cofired Ceramic
•Sheets of sintered ceramics (blue, white or black)
•You’re carrying it unaware (mobile phone, car ignition)
•Relatively new material (<20 yrs)
•Developed for highly integrated electronics
raw sheets of LTTC (micro-reactor)
micro-flow sensor assembled
fluidic circuit, management of valves with SMD
electronics
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Objectives
•Objectives of my thesisTo integrate in a circuit:- sensors (pressure, temperature, flow)- actuators (electrovalves)- electronics (SMD)by an industrially viable process.
•Objectives of this presentationTo make you discover the LTCC technologyand its multiples possibilities.
Hybrid micro-reactor in LTCC and alumina
Modular gas viscosity sensor
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Content
1. The principle of LTCC
2. Properties
3. Realisations at the LPM
4. Concurrent methods
5. State of the art
6. In practice
7. Conclusion
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5 of 23Introduction to LTCC for engineers
1.1) The principle of LTCC
1. Raw sheets easily cut(laser, punch tool)
2. Layers individually printed(multilayer circuits )
3. Stacking of layers to geta 3D structure
4. Firing-> sintering, monolithic circuit
5. Individualisation and post-firing(assembly by soldering)
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1.2) Types of realisations
Circuits:
• fluidic
• electronic
• mechanical
Hybrid micro electrovalve in LTCCM. Gongora-Rubio et al., 2001
M. Gongora-Rubio et al., 1999
www.ltcc.de
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1.3) Acronym
The LTCC is dissociated from HTCC:
•Low- LTCC 875°C
•Temperature HTCC 1400-1600°C
•Cofired co-firing of (di)electric pastesLTCC: precious metals (Au, Ag, Pd,
Cu)HTCC: refractory metals (W, Mo,
MoMn)
•Ceramic mix of:- alumina Al2O3
- glasses SiO2 - B2O3 - CaO - MgO- organic binders
- HTTC: essentially Al2O3
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1.4) Processing
Raw material comes as:
•sheets or rollsthickness 50-320μm5-6 big manufacturers:DuPont, ESL, Ferro, Heraeus…
•powder: to mix oneself, proprietary LTCC (mass production like automotive, military etc.)
•Simple, yet complex process
•Incompressible times :- lamination 5-15 min- firing 2-8 hrs- post-firings 45 min each www.ltcc.de
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2) Physical properties
1. Chemically stable, inert to HCl, NaOH…
2. Thermically stable (>600°C)
3. Low thermal conductivity (3 W/mK)
4. High hardness (8 Mohs)
5. Very good dielectric (low losses at high frequencies, application for GHz antennas)
6. rupture=320 MPa, E=120 GPa, density=3.1
7. High reliability and hermeticity
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3) Realisations at the LPM
1. Flow sensor and micro-reactor
2. Gas viscosity sensor Wobbe
3. Force sensor Millinewton
4. Circuit for managing pneumatic valves
5. Hermetic case for sealing tests
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3.1) Flow-sensor and micro-reactor
1. Flow sensor- 3 layers of LTCC- principle of the hot-wire anemometer- channel 1 to 2 mm wide
2. Micro-reactor- 2 reactants- 2 flow sensors- 1 calorimeter
Microreactors and micro flowsensor (bottom)Hybrid micro-reactor
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3.2) Gas viscosity sensor Wobbe
Modular sensor measuring the Wobbe index:
- 1 base plate- 1 heating module- 1 membrane pressure sensor module
Application: optimisation of combustion in oil-fired boilers
Sensor with its external modules disassembled
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3.3) Force sensor Millinewton
Alumina version (200..2000 mN)
• rectangular beam soldered on base plate
• double-side serigraphy (4 R in Wheatstone bridge)
LTCC version (10..100 mN)
• Optimised T-shaped beam
• Young modulus 2.6x smaller
• Better sensitivity
• Half-bridge version(single-sided)
• Easier manufacturing
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3.4) Circuit for electrovalves
• Up to 22 layers of LTCC
• 2 levels of interconnections
• Channels 0.3..3 mm wide
• Piloting by SMD electronics
• Brass adapters
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3.5) Hermetic case for sealing tests
• Base plate in LTCC, glass lid
• Co-fired electric tracks
• Sn-Pb soldered tungsten wires
• Post-fired sealing cord
• Sn-Bi 138°C solder for the lid
• From drawing board to assembled product: 2 weeks
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4.1) Concurrent methods
• SLS (Selective Laser Sintering)- slow- piece by piece prototyping- more for forms than for circuits- porous
• Alumina + classical thick-films- mono-substrate (assembly by sealing)- multilayer, but sequential process- less advantageous for numerous layers- 1400°C (HTCC)
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4.2) Concurrent methods
• PCB- Tmax 150°C- difficult machining for fluidics- losses in high frequencies- not hermetic- cheaper for a simple electric circuit
• Alu and epoxy resin- easier processing- only for fluidics
• Silicon- clean room- heavy and complicated processes- partial concurrency because Si ~ m, LTCC ~ 0.1mm-> to use in complement
Stacked fluidic mini-PCB of Fraunhofer IZM Berlin
Pneumotech
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5.1) State of the art
M. Gongora-Rubio et al., 1999
J. Kita, Bayreuth, Germany, 2005Peterson, Sandia National Lab, 2005
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5.2) State of the art
Fraunhofer IZM Berlin
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6.1) Technological problems
In practice one must take into account of:
• Variations of final dimensions due to shrinkage variability (batches + inherent)
• Shrinkage different than announced by manufacturer (10..15% in X-Y, 15-40% in Z)
• Crushing of cavities when following manufacturer’s lamination recommendations
• Delamination of layers at edgeswhen reducing lamination pressureor temperature
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6.2) Experimental setup at the LPM
pre-conditioningdrying oven 30min-
120°C
LTCC sheetsthick. 50-320μm6”x6”
laser cutting +air blowing
stackingpin
alignment fixture
lamination uniaxial press 5min - 70°C -
200bar
removal of protection
firingair furnace
8hrs - 875°C
ready for screenprinting and post-
firings
serigraphy of pastes
on raw layers
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7) Conclusions
•Robust and reliable technology
•Mature for electronics; under development for fluidics
•Automatisable
•Moderate costs and investments (semi-clean room)
•Infinite possibilities of forms and combinations
•Quasi-unlimited number of layers
•Price for industrial quantities : 1€ / dm2 / layer
•Finesse of structures ~ 50 m
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The end
Thank you for your attention!
More information onhttp://lpm.epfl.ch/ltcc
http://personnes.epfl.ch/yannick.fournier
All images without legend are copyrighted from LPM-EPFL.
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Appendix – air furnace temperature profile
LTTC Oven Temperature Profile "Yannick 16"
0
100
200
300
400
500
600
700
800
900
1000
000 060 120 180 240 300 360 420
Time [min]
Te
mp
era
ture
[°C
]
burnoutdwell 450°C
100 min(LTCC is at 440°C)
sinteringdwell 895°C
30 min
sinteringramp 895°C
2.5K/min
ramp 200°C-20 K/min
for the LTCC samples to reach a peak temp of 875°C, the oven must be higher ->
ramp 450°C2.4K/min
ramp 230°Cslope 8K/min
ramp 400°C-16 K/min
ramp 660°C10 K/min
Duration [h:min]
Total time
[h:min]
Final temp [°C]
Slope [K/min]
1 Fast ramp 00:25 00:25 230 82 Ramp to 440°C 01:30 01:55 450 2.43 Burnout dwell 100 mins 01:39 03:34 450 04 Fast ramp 00:21 03:55 660 105 Sintering ramp to 875°C 01:35 05:30 895 2.56 Sintering dwell 30 mins 00:30 06:00 895 07 Natural furnace cooling 00:30 06:30 400 -16.58 Fast cooling 00:10 06:40 200 -209 Back to ambiant 00:10 06:50 70 -13
Step
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Appendix – comparison of properties
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Appendix – specs of two common pastes