6.772sma5111 - compound semiconductors lecture 8 - epitaxy ... · etching technology 1. wet etches...

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6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy cont.; Device Processing - Outline Epitaxy techniques (concluding discussion from Lecture 6) Liquid phase epitaxy Gas phase epitaxy 1. Vapor phase epitaxy; 2. Metallorganic chemical vapor deposition Molecular beam epitaxy 1. Solid source; 2. Gas source; 3. Metalloganic; 4. Chemical beam Device processing Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping technology 1. Diffusion 2. Ion implantation Device isolation Ohmic contacts C. G. Fonstad, 2/03 Lecture 8 - Slide 1

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Page 1: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

6.772SMA5111 - Compound Semiconductors

Lecture 8 - Epitaxy cont.; Device Processing - Outline

• Epitaxy techniques (concluding discussion from Lecture 6)

Liquid phase epitaxyGas phase epitaxy

1. Vapor phase epitaxy; 2. Metallorganic chemical vapor deposition Molecular beam epitaxy

1. Solid source; 2. Gas source; 3. Metalloganic; 4. Chemical beam

• Device processing Etching technology

1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches

2. Dry etching

Doping technology1. Diffusion2. Ion implantation

Device isolation

Ohmic contacts

C. G. Fonstad, 2/03 Lecture 8 - Slide 1

Page 2: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Mismatched epitaxy - letting layers relax

Graded lattice constant structures

Linear grading Step grading•

• There is no general agreement on which approach is superior andthe choice often one of convenience and/or practicality.

• Because the last layer is often not fully relaxed, it is common tograde to a certain level and then step back, as seen in the structureon the left. In this way a fully relaxed top structure can be realized.

Relaxed, mismatched layers are termed "metamorphic" C. G. Fonstad, 2/03 Lecture 7 - Slide 2

Page 3: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Liquid Phase Epitaxy -Explode view of an LPE "boat"

Machined pyrolytic graphite Material:

Growth ambient: Purified hydrogen at atmospheric pressure Within a quartz tube in a resistance heated furnace

C. G. Fonstad, 2/03 Lecture 7 - Slide 3

Page 4: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Liquid Phase Epitaxy - Melt calculation

Ternary phase Binary phase diagram, In-P diagram, A-B-C

As T is reduced the binary (or ternary) solidifies from the melt: - In the case of the binary shown on the left the liquid is In1-xP , andx

the solid is InP. - In the case of the ternary shown on the right, the situation is more

complicated. The liquid is AyB C1-y-z and the solid is AxB1-xC,zbut the relationship between the liquid composition and x is notshown in the diagram. (cont. next foil)

C. G. Fonstad, 2/03 Ref: P. Whitney, Ph.D. Thesis, DMSE, MIT, 1986 Lecture 8 - Slide 4

Courtesy P. Whitney. Used with permission.

rkutty
Text Box
Courtesy of Peter Whitney PhD.
rkutty
Text Box
Courtesy of Peter Whitney PhD.
Page 5: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Melt calculation, cont.

Projected isotherm and tie line for In-Ga-As system

Liquid Phase Epitaxy -

Equilibrium liquidus for InGaAs lattice-matched to InP

The relationship between the ternary liquid composition and theternary solid composition is displayed by a tie line between aprojected isotherm and ternary solid line, as shown on the left,

Or by a plot of liquid composition verses temperature for a specificsolid composition of interest, as shown on the right.

C. G. Fonstad, 2/03 Ref: P. Whitney, Ph.D. Thesis, DMSE, MIT, 1986 Lecture 8 - Slide 5

Courtesy P. Whitney. Used with permission.

rkutty
Text Box
Courtesy of Peter Whitney PhD.
rkutty
Text Box
Courtesy of Peter Whitney PhD.
Page 6: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Metalorganic Chemical Vapor Deposition - MOCVD

A group III precursor bubbler:

Operation: Bubbler held in constant-temperature bath Hydrogen "carrier" saturated with precursor (group

III metalorganic) at fixed T Precursor transported through heated lines as a

"gas" Flow controlled by mass flow meters

C. G. Fonstad, 2/03 Lecture 7 - Slide 6

Page 7: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Courtesy of Yoon Soon Fatt. Used with permission.

Schematic diagram ofsolid source molecular beam epitaxy

Courtesy of Yoon Soon Fatt. Used with permission.

C. G. Fonstad, 2/03 Courtesy Prof. Yoon Soon Fatt, NTU Lecture 8 - Slide 7

Page 8: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Solid source molecular beam epitaxysystem (NTU)

Courtesy of Yoon Soon Fatt, NTU.

Base pressure: 10-11 Torr (with cryogenic cooling)

Pressure during epitaxial growth: 10-8 to 10-7 TorrC. G. Fonstad, 2/03 Courtesy Prof. Yoon Soon Fatt, NTU Lecture 8 - Slide 8

Page 9: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Sample loading and manipulationin the MBE system (NTU)

Courtesy of Yoon Soon Fatt, NTU. Courtesy of Yoon Soon Fatt, NTU.

Samples are loaded and out-gassed in UHV transferchamber prior to epitaxial growth in main chamber.

C. G. Fonstad, 2/03 Courtesy Prof. Yoon Soon Fatt, NTU Lecture 8 - Slide 9

Page 10: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Single filament effusion cell(In, Ga and Al)

Crucible

Thermocouple

Heating element

Heat screenMounting flange

Courtesy of Yoon Soon Fatt, NTU.

C. G. Fonstad, 2/03 Courtesy Prof. Yoon Soon Fatt, NTU Lecture 8 - Slide 10

Page 11: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Valved arsenic and phosphorus crackersource (NTU)

Courtesy of Yoon Soon Fatt, NTU. Courtesy of Yoon Soon Fatt, NTU.

Valved arsenic cracker Valved phosphorus cracker

For fast interruption and abrupt change of As or P flux.

C. G. Fonstad, 2/03 Courtesy Prof. Yoon Soon Fatt, NTU Lecture 8 - Slide 11

Page 12: 6.772SMA5111 - Compound Semiconductors Lecture 8 - Epitaxy ... · Etching technology 1. Wet etches a. Selective etches; b. Anisotropic etches; c. Isotropic etches 2. Dry etching Doping

Radio frequency (r. f.) nitrogen plasmaand valved antimony cracker source (NTU)

Courtesy of Yoon Soon Fatt, NTU. Courtesy of Yoon Soon Fatt, NTU.

Radio frequency nitrogen Valved antimony cracker

plasma source source

C. G. Fonstad, 2/03 Courtesy Prof. Yoon Soon Fatt, NTU Lecture 8 - Slide 12