bbi-services-v3_2017

1
PCB Design (Analog, Digital, High Speed, Power) Electrical & Mechanical Engineering Thermal, Signal & Power Analysis Failure Mode & Root Cause Analysis MTBF Calculations Power Die Repackaging In House Assembly In House Reflow In House Rework Product Development Firmware Development Reverse Engineering Vendor Qualification Temperature, Humidity and Vibration Testing PCB Design and Engineering Services Board Fabrication Board Reviews and BOM Scrubs Better Boards Inc Confidential 2017 www.betterboards.com

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Page 1: BBI-Services-v3_2017

PCB Design (Analog, Digital, High Speed, Power)

Electrical & Mechanical Engineering Thermal, Signal & Power Analysis Failure Mode & Root Cause Analysis MTBF Calculations Power Die Repackaging

In House Assembly In House Reflow In House Rework

Product Development Firmware Development Reverse Engineering Vendor Qualification Temperature, Humidity

and Vibration Testing

PCB Design and Engineering Services

Board Fabrication Board Reviews and BOM Scrubs

Better Boards Inc Confidential 2017

www.betterboards.com