features description - diodes incorporated2.1 3 ps pll l-bw @ 2m & 4m 1st h3 2.38 3 ps pll h-bw...

1All trademarks are property of their respective owners. www.diodes.com 3/21/17

Features• PCIe®3.0complaint

→PCIe3.0Phasejitter:0.48psRMS(HighFreq.Typ.)

• LVDScompatibleoutputs

• Supplyvoltageof3.3V±5%

• 25MHzcrystalorclockinputfrequency

• HCSLoutputs,0.7VCurrentmodedifferentialpair

• Jitter40pscycle-to-cycle(typ)

• Spreadof-0.5%,-1.0%,-1.5%,andnospread

• Industrialtemperaturerange

• SpreadBypassoptionavailable

• Spreadandfrequencyselectionviaexternalpins

• Packaging:(Pb-freeandGreen)

→20-pin,173-milwideTSSOP

Description

ThePI6C557-05BisaspreadspectrumclockgeneratorcomplianttoPCIExpress®3.0andEthernetrequirements.ThedeviceisusedforPCorembeddedsystemstosubstantiallyreduceElectromagneticInterference(EMI).

The PI6C557-05B provides four differential (HCSL) or LVDSspreadspectrumoutputs.ThePI6C557-05Bisconfiguredtoselectspreadandclockselection.UsingPericom'spatentedPhase-LockedLoop(PLL)techniques,thedevicetakesa25MHzcrystalinputandproducesfourpairsofdifferentialoutputs(HCSL)at100MHzand200MHzclockfrequencies.Italsoprovidesspreadselectionof-0.5%,-1.0%,-1.5%,andnospread.

Block Diagram Pin Configuration

PLL

CrystalDriver

VDD

GND

X1/CLK

X2

25 MHzcrystal

Spread Spectrum/

Output clock

selection

S[2:0] 3

CLK1CLK1

Rr(IREF)

CLK2CLK2

2

2PullingCapacitors

SS Circuitry

CLK3CLK3

CLK0CLK0

OEPD

or clock

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

CLK0

CLK0

CLK1

CLK1

GNDODA

VDDODA

CLK2

CLK2

CLK3

CLK3

VDDXD

S0

S1

S2

X1

X2

PD

OE

GNDXD

IREF

PI6C557-05B

PCIe® 3.0 Clock Generator with 4 HCSL Outputs

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2All trademarks are property of their respective owners.

PI6C557-05B

www.diodes.com 3/21/17

Pin Description

Pin # Pin Name I/O Type Description1 VDDXD Power Connecttoa+3.3Vsource.2 S0 Input SpreadSpectrumSelectpin#0.SeeSpredSpectrumSelectable.Internalpull-upresistor.3 S1 Input SpreadSpectrumSelectpin#1.SeeSpredSpectrumSelectable.Internalpull-upresistor.4 S2 Input SpreadSpectrumSelectpin#2.SeeSpredSpectrumSelectable.Internalpull-upresistor.5 X1 Input Crystalconnection.6 X2 Output Crystalconnection.7 PD Input Powerdown.Internalpull-upresistor.8 OE Input Outputenable.Tri-statesoutput(High=enableoutputs);Low=disableoutputs).Internal

pull-upresister.9 GND Power Connecttodigitalcircuitground.10 IREF Output Precisionresistorattachedtothispinisconnectedtotheinternalcurrentreference.11 CLK3 Output Selectable100/200MHzSpreadSpectrumdifferentialcomplimentoutputclock3.12 CLK3 Output Selectable100/200MHzSpreadSpectrumdifferentialtrueoutputclock3.13 CLK2 Output Selectable100/200MHzSpreadSpectrumdifferentialcomplimentoutputclock2.14 CLK2 Output Selectable100/200MHzSpreadSpectrumdifferentialtrueoutputclock2.15 VDDODA Power Connecttoa+3.3Vanalogsource.16 GND Power OutputandAnalogcircuitground17 CLK1 Output Selectable100/200MHzSpreadSpectrumdifferentialcomplimentoutputclock1.18 CLK1 Output Selectable100/200MHzSpreadSpectrumdifferentialtrueoutputclock1.19 CLK0 Output Selectable100/200MHzSpreadSpectrumdifferentialcomplimentoutputclock0.20 CLK0 Output Selectable100/200MHzSpreadSpectrumdifferentialtrueoutputclock0.

Table 2: Spread Selection TableS2 S1 S0 Spread % Spread Type Output Frequency0 0 0 -0.5 Down 1000 0 1 -1.0 Down 1000 1 0 -1.5 Down 1000 1 1 NoSpread NotApplicable 1001 0 0 -0.5 Down 2001 0 1 -1.0 Down 2001 1 0 -1.5 Down 2001 1 1 NoSpread NotApplicable 200

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Application InformationDecoupling CapacitorsDecouplingcapacitorsof0.01μFor0.1μFmustbeconnectedbetweeneachVDDpinandthePCBgroundplaneandplacedasclosetotheVDDpinaspossible.

PI6C557-05Bmustbeisolatedfromsystempowersupplynoisetoperformoptimally.

CrystalUsea25MHzfundamentalmodeparallelresonantcrystalwithlessthan30PPMoferroracrosstemperature.

Current Source (Iref) Reference Resistor - RRIfboardtargettraceimpedanceis50-Ohm,thenRR=475-OhmprovidinganIREFof2.32mA.Theoutputcurrent(IOH)is6*IREF.

Output TerminationThePCI-ExpressdifferentialclockoutputsofthePI6C557-05Bareopensourcedriversandrequireanexternalseriesresistorandaresistortoground.Theseresistorvaluesandtheirallow-ablelocationsareshownindetailinthePCI-ExpressLayoutGuidelinessection.

ThePI6C557-05BcanbeconfiguredforLVDScompatiblevoltagelevels.SeetheLVDSCompatibleLayoutGuidelinessection.

R R =475

6*IREF =2.3mA IREF

See Output Termination Sections Ω

Output Structures

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PCI-Express Layout GuidelinesCommon Recommendations for Differential Routing Dimension or Value UnitL1length,routeasnon-coupled50-Ohmtrace. 0.5max inchL2length,routeasnon-coupled50-Ohmtrace. 0.2max inchL3length,routeasnon-coupled50-Ohmtrace. 0.2max inchRS 33 OhmRT 49.9 Ohm

R S

R S

R T R T

PCI-Express Load or

Connector

L1 L2

L3’

L4

L1’ L2’

L3

L4’

PI6C557-05Output Clock

0.175 V 0.52 V

0.175 V 0.52 V

t OR t OF 500 ps 500 ps

700 mV

0

PCI-Express Device Routing

Typical PCI-Express (HCSL) Waveform

Differential Routing on a Single PCB Dimension or Value UnitL4length,routeascoupledmicrostrip100-Ohmdifferentialtrace. 2minto16max inchL4length,routeascoupledstripline100-Ohmdifferentialtrace. 1.8minto14.4max inch

Differential Routing to a PCI Express connector Dimension or Value UnitL4length,routeascoupledmicrostrip100-Ohmdifferentialtrace. 0.25minto14max inchL4length,routeascoupledstripline100-Ohmdifferentialtrace. 0.225minto12.6max inch

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Application Information

LVDS Recommendations for Differential Routing Dimension or Value UnitL1length,routeasnon-coupled50-Ohmtrace. 0.5max inchL2length,routeasnon-coupled50-Ohmtrace. 0.2max inchRP 100 OhmRQ 100 OhmRT 150 OhmL3length,routeas100Ωdifferentialtrace.L3length,routeas100Ωdifferentialtrace.

LVDS Device Routing

Typical LVDS Waveform

L1

L2’

L3

L1’

L2

L3’ R Q R P

LVDS Device Load

PI6C557-05Clock Output

R T R T

1150 mV 1250 mV

t OR t OF 500 ps 500 ps

1325 mV

1000 mV

1150 mV 1250 mV

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SupplyVoltagetoGroundPotential......................................................... 5.5VAllInputsandOutputs..................................................... -0.5VtoVDD+0.5VAmbientOperatingTemperature................................................ -40to+85°CStorageTemperature................................................................. -65to+150°CJunctionTemperature............................................................................125°CESDProtection(Input)................................................... 2000Vmin(HBM)

Electrical Specifications

Maximum Ratings

Recommended Operation ConditionsParameter Min. Typ. Max. UnitAmbientOperatingTemperature -40 +85 °CPowerSupplyVoltage(measuredinrespecttoGND) 3.135 3.465 V

DC Characteristics(VDD=3.3V±5%,TA=-40°Cto+85oC)Symbol Parameter Conditions Min. Typ. Max. Unit

VDD SupplyVoltage 3.135 3.3 3.465 VVIH InputHighVoltage(1) 2.0 VDD+0.3 VVIL InputLowVoltage(1) GND-0.3 0.8 V

IIL InputLeakageCurrent 0<Vin<VDD Withoutinputpull-upandpull-downs -5 5 µA

IDD OperatingSupplyCurrentRL=50Ω,CL=2pF@100MHz 105 120 mA

IDDOE OE=LOW 40 50 mAIDDPD NoloadPD=LOW 60 100 µACIN InputCapacitance Inputpincapacitance 7 pF

COUT OutputCapacitance Outputpincapacitance 6 pFLPIN PinInductance 5 nHROUT OutputResistance CLKOutputs 3.0 kΩ

Note:StressesgreaterthanthoselistedunderMAXIMUMRAT-INGSmaycausepermanentdamagetothedevice.Thisisastressratingonlyandfunctionaloperationofthedeviceattheseoranyotherconditionsabovethoseindicatedintheoperationalsectionsofthisspecificationisnotimplied.Exposuretoabsolutemaximumratingconditionsforex-tendedperiodsmayaffectreliability.

Note:1.Singleedgeismonotonicwhentransitioningthroughregion.

AC Characteristics(VDD=3.3V±5%,TA=-40°Cto+85oC)Symbol Parameter Conditions Min. Typ. Max. UnitFIN InputFrequency 25 MHz

VOUT OutputFrequencyHCSLterminal

200

MHzLVDSterminal 100

VOH OutputHighVoltage(1,2) @VDD=3.3V 660 700 850 mVVOL OutputLowVoltage(1,2) -150 0 27 mVVCPA CrossingPointVoltage(1,2) Absolute 250 350 550 mVVCN CrossingPointVoltage(1,2,4) Variationoveralledges 140 mVJCC Jitter,Cycle-to-Cycle(1,3) 40 60 ps

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PI6C557-05B


Notes:1.RL=50-OhmwithCL=2pFandRR2.Single-endedwaveform3.Differentialwaveform4.Measuredatthecrossingpoint5.CLKpinsaretri-statedwhenOEisLOW

Thermal CharacteristicsSymbol Parameter Conditions Min. Typ. Max. UnitθJA ThermalResistanceJunctiontoAmbient Stillair 93 °C/WθJB ThermalResistanceJunctiontoBoard 54 °C/WθJC ThermalResistanceJunctiontoCase 20 °C/W

Recomended Crystal Specification

Pericom recommends: a) GC2500003 XTAL 49S/SMD(4.0 mm), 25M, CL=18pF, +/-30ppm http://www.pericom.com/pdf/datasheets/se/GC_GF.pdf b) FY2500081, SMD 5x3.2(4P), 25M, CL=18pF, +/-30ppm http://www.pericom.com/pdf/datasheets/se/FY_F9.pdf c) FL2500047, SMD 3.2x2.5(4P), 25M, CL=18pF, +/-20ppm http://www.pericom.com/pdf/datasheets/se/FL.pdf

Symbol Parameter Conditions Min. Typ. Max. UnitJRMS2.0 PCIe2.0RMSJitter PCI-SIGjittertestmethod 3.1 ps

JRMS3.0 PCIe3.0RMSJitter

PLLL-BW@2M&5M1stH3 2.1 3 ps

PLLL-BW@2M&4M1stH3 2.38 3 ps

PLLH-BW@2M&5M1stH3 0.48 1 ps

PLLH-BW@2M&4M1stH3 0.47 1 ps

MF ModulationFrequency SpreadSpectrum 30 31.5 33 kHztOR RiseTime(1,2) From0.175Vto0.525V 175 332 700 pstOF FallTime(1,2) From0.525Vto0.175V 175 344 700 ps

TSKEW Skewbetweenoutputs AtCrossingPointVoltage 50 psTDUTY-CYCLE DutyCycle(1,3) 45 55 %

TOE OutputEnableTime(5) Alloutputs 10 μsTOT OutputDisableTime(5) Alloutputs 10 μs

tSTABLE Frompower-uptoVDD=3.3V FromPower-upVDD=3.3V 3.0 ms

tSPREADSettingperiodafterspreadchange

Settingperiodafterspreadchange 3.0 ms

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Ordering Information(1-3)

Ordering Code Package Code PackageTypePI6C557-05BLE L 20-Pin,173milWide(TSSOP)PI6C557-05BLEX L 20-Pin,173milWide(TSSOP),Tape&ReelNote:1. Thermalcharacteristicsandpackagetopmarkinginformationcanbefoundathttp://www.pericom.com/packaging/2. E=lead-freeandgreenpackaging3. AddinganXsuffix=tape/reel

Packaging Mechanical: 20-pinTSSOP(L)

Note: For latest package info, please check: http://www.pericom.com/support/packaging/packaging-mechanicals-and-thermal-characteristics/

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IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incor-porated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determina-tive format released by Diodes Incorporated.

LIFE SUPPORTDiodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user.B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incor-porated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2016, Diodes Incorporatedwww.diodes.com

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features description - diodes incorporated2.1 3 ps pll l-bw @ 2m & 4m 1st h3 2.38 3 ps pll h-bw...

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