GLD-CAL and MPPC

Based on talks by T. Takeshita and H. Matsunaga @Snowmass2005

K. Kawagoe / Kobe-U2005-Sep-16MPPC mini-workshop@Kyoto-U

GLD “concept”To identify and measure particles in jets

The largest detector concept for ILC

Large super conducting magnet

ECAL/HCAL inside coil (3.5m radius)

Large TPC (Tracker : 2m radius)

GLD-Calorimeterfar from IP ~ separate particles in a jet

minimum geometrical overlap

1 cm granularity : PFA

Large <=> cost = number of channels

flexibility in the component size

reliability in large area

small dead space

GLD-Calorimeterdetector modelScintillator strip CAL.

flexible in length (WLS Fiber R/O)

effective segmentation 1 x 1 cm2

small photon sensor

1cm

GLD-Calorimeterglobal design

sandwich of absorber and active material

IP

GDL-CAL layers at 90deg.

ECAL : R = 2.1 ~ 2.3 m (0.2m) :

6 mm/layer ( 3 + 2 + 1)mm

33 layers 28X0

HCAL : R = 2.3 ~ 3.5 m (1.2m) :

26 mm/layer ( 20 + 5 + 1)mm

46 layers 5.5 int

GLD-CAL layerECAL HCALEM-Scintillator-layer model

TT 10Aug05

particles

T-Layer

X-Layer

Z-Layer

4cmx4cmx2mm

1cmx4cmx2mm

1cmx4cmx2mm

MPC R/O with WLSF

MPC R/O with WLSF

MPC R/O with WLSF

absorber plate

HCAL-Scintillator-layer model

TT 11Aug05

particles

T-Layer

X-Layer

Z-Layer

4cmx4cmx2mm

1cmx20cmx2mm

1cmx20cmx2mm

MPC R/O with WLSF

MPC R/O with WLSF

MPC R/O with WLSF

absorber plate

GLD-CAL layerEM-Scintillator-layer model

Cross section

R/O chip

MPC

X-Layer

Z-Layer

Tungsten3mm

2mm

1mm

3mm

WLSFscintillator

Flex-sheet

Tungsten

Tungsten

Tile-

Layer

particle

2mm

1mm

3mm

2mm

1mm

1cm

4cm

4cm

MPC

MPC

HCAL-Scintillator-layer model

Cross section

R/O chip

MPC

X-Layer

Z-Layer

20mm

5mm

1mm

20mmMPC

WLSFscintillator

Flex-sheet

Lead

Tile-

Layer

particle

5mm

1mm

20mm

5mm

1mm

1cm

4cm

4cm

Lead

Lead

MPCHCAL cross

ECAL cross

GLD-CAL parameters

absorber

activematerial

Layersbarrel/ec

striplength

N. R/O

ECALW

3mmscintillator

2mm33/33

4cm?~6Mch

HCALPb

20mmscintillator

5mm46/48

20cm?~30M

ch

GLD-CAL R/D’s ECAL test with MAPMT

GLD-CAL R/D’s cont’dA typical event

L1

L2

L3

L4

L5

L6

Integrated lateral shower profile

GLD-photon sensor MPPC R/D

laser beam spot

single photon eq.MPPC10

0

GLD-CAL R&D’s cont’dPhoton sensor R&D

MPPC of Hamamatsu100 pixels

1,2,3,4,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,60pixels

GM at each pixel

GLD-CAL R&D’s cont’dBeam Test at Fermilab

2007

R&D needed for R/O electronics of MPPC

Scinti. 2mm W 3mm

MPC R/O33layers

1cm

2mm

to verify this ideaand PFA

GLD-CAL collaborators

Kyongpook (D.Kim) : Scintillator

JINR (P.Evtoukhovitch): SiPM

Kobe (K.Kawagoe) : MPPC

Niigata (H.Miyata) : MPPC pixel

Tsukuba (S.H.Kim, H.Matsunaga) : Sim.

KEK (A.Miyamoto, K.Fujii) : Sim.

Shinshu (T.Takeshita) : BT

GLD-CAL Open issues for ECAL

strip is sufficient enough for fine segmentation? <> PFA results which optimize the length of a strip

options

real 1cm x 1cm or smaller cell

if problem in photon finding

GLD-CAL

Open issues for HCAL

again strip length for hadronic interactions (neutral hadron)

PFA studies

neutron hits >>> delayed hits

electronics timing

GLD-HCAL a pion event digitized hits

GLD-CAL engineering issuessupport for HCAL by coil

support for ECAL by HCAL

cabling

installation

Summary:GLD-CAL

largest calorimeter

fine segmented & optimized for PFA

scintillator strip based

technique is proved

photon sensor R&D

electronics R&D

detailed design

Requirements for MPPC

To get 10 photons for MIP per ECAL strip (2mm-thick)

– PDE ~ 50%– Effective area suitable for 1.6mm fiber

Gain = 10^6 or more (no amplification needed) Dynamic range for ECAL

– At least 50xMIP signal (=500photons) => Number of pixels > 1000– More number of pixels is desired…

Good timing resolution for – Bunch ID (trivial?)– Detection/removal of slow neutron component– TOF at the innermost ECAL layer ?

Requirements for Readout

• Readout between bunch trains (199ms)–Assuming 1Gbit/sec transfer rate,

• ~25 Mbytes at maximum• 4 bytes/event x ~6k events/train is possible

–Zero suppression–Buffers

199ms

1ms

377ns (150?

) 2820b(5600?)

train

Bunch structure

Requirements for Readout (cont’d)

• Number of pixels: ~1000 -> 10~12 bit dynamic range

• Good timing resolution– Bunch ID– Slow neutron detection?– TOF at the innermost layer of ECAL ?

• Dark hit-rate: < 1MHz tolerable ?

• Low power consumption:– ~20mW/ch may be possible– Power loss in cable should be small

Some issues on sensors

• Operational voltage range is narrow–~0.1 V for MPC

• Accurate bias voltage control (and also modest temperature control) is necessary

• Power supply is also the key issue

• Probably, operational voltage of MPC varies from device to device–How to know the best voltage for huge number of

devices ?

–How to provide various bias voltages to them ?

Solution by CALICE group

• Talk by Felix Sefkow (DESY) in Calorimeter session

• This is just for testbeam; may need better method for production– Number of sensors: a few

thousands

– SiPMs with ~1000 pixels

– During testbeam, they will be monitoring sensor gain with LED, without temperature control

Bias voltage adjustment

• Bias voltages are determined at test bench in advance for all sensors– 15 SiPMs under

monitored LED source

– Adjust working point (bias voltage) to 15 pixels/MIP

– Up to 500 / week

LED

Fiber to PMT

SiPMs

WLS fibers

Voltage variation

• Two clusters for bias voltage setting:– 33~41V, 60~67V

• Sensors are grouped in modules according to bias voltage– 108 / half module– +- 2V / module

Front-end Electronics

• ILC-SiPM chip: 18ch Pre-amplifier, shaper, track and hold, mux –based on CALICE

SiW ECAL chip

100nF

10pF

Variable Gain Charge Preamplifier

Variable Shaper CR-RC²

12kΩ

4kΩ 24pF

12pF

3pF

in

8pF 4pF 2pF 1pF

40kΩ

8-bit DAC0-5V

ASIC

10kΩ 50Ω

100MΩ

2.4pF

1.2pF

0.6pF

0.3pF

0.1pF

0.2pF

0.4pF

0.8pF

6pF

SiPM bias adjustment ASIC

Our plan

• ECAL beamtest: ~2007 (FNAL / DESY) ?–Front-end electronics and DAQ

• DAQ system might be shared with other groups?

–Mass production and quality control

• Beyond testbeam–???

• Manpower:–Manobu Tanaka (KEK) : ASIC development–Patrick LeDu is interested …–Others?

Basic idea of FE board

• SQV: Synchronous Current Integrator for Q-to-V conversion

By M. Tanaka (KEK)

Photon sensor

Ethernet controller

SQV-TEG & Ethernet board

• Prototype boards already exist

• Bias voltage controller should be added